CN113905503B

CN113905503B - Circuit board structure, circuit board test structure and electronic equipment

Info

Publication number: CN113905503B
Application number: CN202110739383.4A
Authority: CN
Inventors: 曲林; 李二亮
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2022-12-09
Anticipated expiration: 2041-06-30
Also published as: CN113905503A

Abstract

The application discloses circuit board structure, circuit board test structure and electronic equipment relates to electron technical field, and this circuit board test structure can solve the test between circuit board and survey test panel and walk the line and cut off the back, prevents that naked line and other conducting material contact from leading to the problem that the circuit board takes place the short circuit on the circuit board. The circuit board structure comprises a circuit board, wherein the circuit board comprises a plurality of devices to be tested, each device to be tested is connected with a test line, and each test line is provided with a control switch. The circuit board test structure comprises a test board and the circuit board structure, wherein the test board is provided with a plurality of test points, and a test line on each device to be tested is electrically connected with one test point.

Description

Circuit board structure, circuit board test structure and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of electronics, in particular to a circuit board structure, a circuit board testing structure and electronic equipment.

Background

Along with the development of science and technology, the kind of electronic product is more and more abundant, and its inside circuit structure is more and more complicated, and on the general integrated circuit board of most circuit structure and electronic component, because the form of terminal electronic product is different, the inside circuit board of different electronic product also has certain difference, when testing different circuit boards, its test position is also different, when designing test structure, in order to reduce development cost and avoid repetitive design, generally carry out the design of normalizing to test structure.

In the normalization design of the test structure, a device or a circuit to be tested on a circuit board is connected to a board dividing strip through a routing, test points originally designed on the circuit board are moved to the board dividing strip outside the board, and the normalization design of the test points is carried out on the board dividing strip. After the test is finished, the sub-strip is cut off from the circuit board, and because the internal test wiring is exposed at the edge of the circuit board after the test is finished, the exposed wiring is easy to cause the circuit board to be contacted with an external conductive material in the subsequent product installation process, so that the short circuit problem is caused, and the product failure is caused. In addition, after the test wiring between the circuit board and the board dividing strip is cut off, the problem of difficult positioning exists when the circuit board needs to be repaired subsequently.

Disclosure of Invention

The application provides a circuit board structure, circuit board test structure and electronic equipment, this circuit board test structure can solve the test wire between circuit board and survey test panel and be cut off the back, prevents that exposed line and other conducting material contacts on the circuit board and leads to the problem that the circuit board takes place the short circuit.

In a first aspect, the present application provides a circuit board structure, which includes a circuit board, wherein the circuit board includes a plurality of devices to be tested, each device to be tested is connected with a test line, and each test line is provided with a control switch. Wherein, the test wire includes first test wire and second test wire, and control switch includes first paster and second paster. One end of the first test wire is electrically connected with the device to be tested, and the other end of the first test wire is electrically connected with the first patch; one end of the second test line is electrically connected with the second patch, and the other end of the second test line is electrically connected with the test point. A conducting piece is arranged between the first patch and the second patch, and when the conducting piece is connected with both the first patch and the second patch, the control switch is in a conducting state; when the conducting piece is disconnected with any one of the first patch and the second patch, the control switch is in a disconnected state.

On this basis, through set up control switch on the test wire, control switch can be through switching its self state: and the on state and the off state are used for controlling the test line to be on or off. Specifically, the test circuit can be controlled to be a through circuit in the test process, and the test circuit is controlled to be an open circuit after the test is completed, so that the problem that the circuit board is short-circuited due to the fact that the end of the test wire exposed at the edge of the circuit board is in contact with other conductive materials after the test wire is cut off is solved.

Through setting up first paster, second paster and leading to the piece as control switch's essential element, can control switch's state through the control connection state that leads to between piece and first paster and the second paster, whole simple structure, easily control and the cost is lower. In addition, because the first patch and the second patch are arranged on the circuit board, when the test line is cut along the edge of the circuit board and a device to be tested on the circuit board needs to be maintained and retested, the first patch and the second patch which are arranged on the circuit board can be used as interface positions of the test path to test functions in the circuit board, so that the circuit board can be retested after the circuit board is separated from the test board, and the problem of difficulty in maintenance or retest positioning after the circuit board is separated from the test board is solved.

In a possible embodiment of the first aspect, the plurality of first patches are arranged side by side and the plurality of second patches are arranged side by side.

On this basis, because all contain a first paster and a second paster in every control switch, through setting up a plurality of first pasters side by side, and a plurality of second pasters set up side by side, be favorable to switching on simultaneously or breaking off first paster and the second paster in each control switch to be favorable to realizing the unified control to a plurality of control switch's state.

In a possible design manner of the first aspect, the conducting piece is a welding piece, and the welding piece is welded between the first patch and the second patch to conduct the first patch and the second patch; and melting the welding part to disconnect the first patch and the second patch. The embodiment of the application provides a specific example of the conducting part.

In a possible design of the first aspect, the conducting element is a conducting wire, one end of the conducting wire is connected to the first patch, and the other end of the conducting wire is connected to the second patch. The embodiment of the application provides a specific example of the conducting piece.

In a possible design manner of the first aspect, the first patch and the second patch in each control switch are patch groups, a pressing block is arranged on the patch groups, a plurality of independent conducting wires are arranged on the pressing block, and each patch group is conducted by at least one conducting wire.

On this basis, through set up many independent lead-through lines on a briquetting, be favorable to turning on simultaneously a plurality of paster groups, perhaps break off simultaneously a plurality of paster groups to be favorable to realizing the unified control to a plurality of control switch.

In a possible design manner of the first aspect, the conduction lines are uniformly distributed on the pressing block, the number of the conduction lines is an integral multiple of the number of the patch groups, and the number of the conduction lines on each patch group is equal. The embodiment of the application provides a specific example of the arrangement of the conducting wires.

In a possible design manner of the first aspect, the conducting member is a conductive film, the conductive film is located above the first patch and the second patch and is in a non-contact state with the first patch and/or the second patch, and when the conductive film is pressed to make contact with both the first patch and the second patch, the first patch and the second patch are conducted. The embodiment of the application provides a specific example of the conducting piece.

In a possible design manner of the first aspect, the conducting piece is an elastic piece, one end of the elastic piece is connected to the first patch, the other end of the elastic piece is suspended above the second patch, and when the other end of the elastic piece is pressed down to be in contact with the second patch, the first patch is conducted with the second patch; or one end of the elastic sheet is connected to the second patch, the other end of the elastic sheet is suspended above the first patch, and when the other end of the elastic sheet is pressed down to be in contact with the first patch, the first patch and the second patch are conducted. The embodiment of the application provides a specific example of the conducting part.

In a possible design of the first aspect, the first patch and the second patch are each provided with a contact feed. On this basis, through be provided with the contact and present the point on first paster and second paster, be favorable to increasing the connection stability between leading to piece and first paster and the second paster.

In a possible design of the first aspect, the first patch and the second patch are both located on a surface of the circuit board. On this basis, through setting up first paster and second paster on the surface of circuit board, can regard as the interface position of test route when carrying out maintenance or retest to the circuit board with first paster and second paster, be favorable to the test location.

The second aspect, this application provides a circuit board test structure, including surveying test panel and circuit board structure, wherein, survey and be provided with a plurality of test points on the test panel, circuit board structure includes the circuit board, includes a plurality of devices that await measuring on the circuit board, is connected with a test point electricity through a test line on every device that awaits measuring, is provided with control switch on every test line. The test line includes first test line and second test line, and control switch includes first paster and second paster. One end of the first test wire is electrically connected with the device to be tested, and the other end of the first test wire is electrically connected with the first patch; one end of the second test line is electrically connected with the second patch, and the other end of the second test line is electrically connected with the test point. A conducting piece is arranged between the first patch and the second patch, and when the conducting piece is connected with both the first patch and the second patch, the control switch is in a conducting state; when the conducting piece is disconnected with any one of the first patch and the second patch, the control switch is in a disconnected state.

In a possible embodiment of the second aspect, the plurality of first patches are arranged side by side and the plurality of second patches are arranged side by side.

In a possible design manner of the second aspect, the conducting piece is a welding piece, and the welding piece is welded between the first patch and the second patch to conduct the first patch and the second patch; and melting the welding part to disconnect the first patch and the second patch.

In a possible design of the second aspect, the conducting element is a conducting wire, one end of the conducting wire is connected to the first patch, and the other end of the conducting wire is connected to the second patch.

In a possible design manner of the second aspect, the first patch and the second patch in each control switch are a patch group, pressing blocks are arranged on the patch groups, a plurality of independent conduction lines are arranged on the pressing blocks, and each patch group is conducted by at least one conduction line.

In a possible design of the second aspect, the number of the conducting lines is an integral multiple of the number of the patch groups, and the number of the conducting lines on each patch group is equal.

In a possible design manner of the second aspect, the conducting member is a conductive film, the conductive film is located above the first patch and the second patch and is in a non-contact state with the first patch and/or the second patch, and when the conductive film is pressed down to be in contact with both the first patch and the second patch, the first patch and the second patch are conducted.

In a possible design manner of the second aspect, the conducting piece is an elastic piece, one end of the elastic piece is connected to the first patch, the other end of the elastic piece is suspended above the second patch, and when the other end of the elastic piece is pressed down to be in contact with the second patch, the first patch and the second patch are conducted; or one end of the elastic sheet is connected to the second patch, the other end of the elastic sheet is suspended above the first patch, and when the other end of the elastic sheet is pressed down to be in contact with the first patch, the first patch and the second patch are conducted.

In a possible embodiment of the second aspect, contact feed points are provided on both the first and the second patch.

In one possible design of the second aspect, the first patch and the second patch are both located on a surface of the circuit board.

In a third aspect, the present application provides an electronic device, comprising a body and a circuit board structure as provided in the first aspect and any one of the possible design manners described above, wherein the circuit board structure is disposed in the body.

It can be understood that, for the circuit board test structure according to the second aspect and the electronic device according to the third aspect, the beneficial effects of the first aspect and any possible design thereof may be referred to, and are not repeated herein.

Drawings

FIG. 1a is a schematic diagram of a circuit board testing structure in the prior art;

FIG. 1b is a second schematic diagram of a circuit board testing structure in the prior art;

FIG. 2 is a schematic diagram of a circuit board testing structure separated after testing in the prior art;

fig. 3 is a schematic diagram of an electronic device according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a circuit board structure according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a circuit board testing structure provided in an embodiment of the present application in an off state;

fig. 6 is a schematic view illustrating an installation of a control switch in a circuit board structure according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a circuit board test structure provided in an embodiment of the present application when the circuit board test structure is in a conducting state;

fig. 8 is a schematic structural diagram of a circuit board testing structure according to an embodiment of the present disclosure when a control switch is in a conducting state;

fig. 9 is a schematic structural diagram of a circuit board testing structure according to an embodiment of the present disclosure when a control switch is in an off state;

fig. 10 is a second schematic structural diagram illustrating a control switch in a circuit board testing structure according to a second embodiment of the present disclosure in an off state;

fig. 11 is a second schematic structural diagram illustrating a control switch in a circuit board testing structure according to an embodiment of the present disclosure in a conducting state;

fig. 12 is a third schematic structural diagram illustrating a control switch in a circuit board testing structure according to a third embodiment of the present disclosure in a conducting state;

fig. 13 is a schematic structural diagram of a conducting element of a control switch in a circuit board test structure according to an embodiment of the present disclosure;

fig. 14 is a second schematic structural diagram of a conducting element of a control switch in a circuit board testing structure according to an embodiment of the present application;

fig. 15 is a third schematic structural diagram of a conducting element of a control switch in a circuit board testing structure according to an embodiment of the present application;

fig. 16 is a second schematic structural diagram of a circuit board testing structure provided in the embodiment of the present application when the circuit board testing structure is in a conducting state;

fig. 17 is a fourth schematic structural diagram illustrating a control switch in a circuit board test structure according to an embodiment of the present disclosure in a conducting state;

fig. 18 is a fifth schematic structural view illustrating a control switch in a circuit board testing structure according to an embodiment of the present disclosure in a conducting state;

fig. 19 is a sixth schematic structural view illustrating a control switch in a circuit board test structure according to an embodiment of the present application when the control switch is in a conducting state;

fig. 20 is a third schematic structural diagram illustrating a control switch in an off state in a circuit board testing structure according to an embodiment of the present disclosure;

fig. 21 is a seventh schematic structural diagram illustrating a structure of a control switch in a circuit board testing structure according to an embodiment of the present disclosure in a conducting state;

fig. 22 is a fourth schematic structural diagram illustrating a control switch in a circuit board testing structure according to an embodiment of the present application in an off state;

fig. 23 is an eighth schematic structural diagram illustrating a control switch in a circuit board testing structure according to an embodiment of the present application in a conducting state;

fig. 24 is a schematic structural view of a circuit board separated from a test board in a circuit board test structure according to an embodiment of the present disclosure.

In the figure: 1-a circuit board; 2-test line; 21-a first test line; 22-a second test line; 3-control a switch; 4-a first patch; 5-a second patch; 6-testing the board; 7-test point; 8-welding a bridge; 9-heating the suction nozzle; 10-a conducting wire; 11-briquetting; 12-contact feed point; 13-a conductive film; 14-an elastic sheet; 15-weld groove.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

In the embodiments of the present application, the words "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

In the embodiments of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

It is to be understood that the terminology used in the description of the various described examples herein is for the purpose of describing particular examples only and is not intended to be limiting. As used in the description of the various illustrated examples, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

In this application, "at least one" means one or more, "a plurality" means two or more. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.

It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items. The term "and/or" is an associative relationship that describes an associated object, meaning that three relationships may exist, e.g., A and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" in the present application generally indicates that the preceding and following related objects are in an "or" relationship.

It is also to be understood that, in the present application, unless otherwise explicitly specified or limited, the term "coupled" is to be interpreted broadly, e.g., "coupled" may be a fixed connection, a sliding connection, a removable connection, an integral part, or the like; may be directly connected or indirectly connected through an intermediate.

It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should be appreciated that reference throughout this specification to "one embodiment," "another embodiment," "one possible design" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment of the present application" or "in another embodiment of the present application" or "in one possible design" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In order to solve the problem that after a test line of a circuit board test structure between a circuit board and a branch strip is cut off in the prior art, the circuit board is in the subsequent product installation process, the exposed test line is easy to contact with an external conductive material to cause short circuit, the embodiment of the application provides a circuit board structure, the circuit board test structure and electronic equipment, the circuit board structure is provided with a control switch, the test structure during testing is improved, the circuit board test structure and the electronic equipment comprising the circuit board structure are after testing is completed, and the problem that the short circuit is easily caused by the exposed test wiring after cutting off can be avoided. The following describes embodiments of the present application with reference to fig. 1a to 24.

In order to facilitate understanding of the technical solutions of the present application, prior art related to the technical solutions of the present application is briefly introduced before writing the embodiments of the present application.

Referring to fig. 1a, fig. 1a is a schematic structural diagram of a circuit board testing structure in the prior art. As shown in fig. 1a, the circuit board testing structure includes a circuit board 1 and a board divider, which may be a testing board 6. The circuit board 1 is provided with a device to be tested and a circuit structure (not shown in the figure) built in the circuit board 1, and the device to be tested may be a chip integrated on the circuit board 1, or may be an electronic component connected to the circuit board 1, for example, the electronic component may be a resistor, a capacitor, an inductor, or other components. In order to test the components to be tested on the circuit board 1, a plurality of test points 7 are arranged on the circuit board 1, each device to be tested is connected with the test points 7 on the circuit board 1 in a one-to-one correspondence mode through the test lines 2, and each device to be tested is tested on the test points 7.

In the technical solution shown in fig. 1a, when different circuit boards 1 are tested, since there may be a change in the component or structure configuration of each circuit board 1, the position of the test point 7 may change, and the test structure needs to be designed for different circuit boards 1, which increases the development cost. And set up test point 7 on circuit board 1 body, can occupy more space on circuit board 1, these test points 7 are less under non-test state's effect, cause the waste of circuit board 1 and electronic product inner space, also can cause the increase of circuit board 1 cost.

Referring to fig. 1b, fig. 1b is a second schematic structural diagram of a circuit board testing structure in the prior art. As shown in fig. 1b, the circuit board testing structure includes a circuit board 1 and a testing board 6, a device under test (dut) and a circuit structure (not shown) built in the circuit board 1 are disposed on the circuit board 1, and the device under test can be described with reference to the description in fig. 1 a. In the structure, a plurality of test points 7 are arranged on the test board 6, the devices to be tested on the circuit board 1 are correspondingly connected with the test points 7 on the test board 6 one by one through the test lines 2, and the devices to be tested on the circuit board 1 are tested through the test points 7 on the test board 6 during testing. After the test is completed, the test line 2 between the circuit board 1 and the test board 6 is cut off, and the circuit board 1 and the test board 6 are separated.

Referring to fig. 2, fig. 2 is a schematic diagram illustrating a circuit board testing structure separated after a test is completed in the prior art. As shown in fig. 2, after the test lines 2 are cut off, the test lines 2 connected to the device to be tested will be exposed at the edge of the circuit board 1, which is likely to cause short circuit, thereby causing product failure. If the test line 2 after the cutting is protected by adding a protector, the cost is increased.

In addition, after directly cutting off the test wire 2, the test wire 2 is attached to the edge of the circuit board 1, and subsequently, when the circuit board 1 is overhauled or retested, the cut-off test wire 2 has the problem of difficult positioning, which causes great troubles to overhaul or retest.

In order to solve the above problems in the prior art, an embodiment of the present application provides an electronic device. The electronic device may include a mobile phone (mobile phone), a tablet computer (pad), a television, an intelligent wearable product (e.g., a smart watch, a smart bracelet), an internet of things (IOT), a Virtual Reality (VR) terminal device, an augmented reality (augmented reality) terminal device, an electronic product such as an unmanned aerial vehicle, and the like, and an electronic product having a circuit board. The embodiment of the present application does not specifically limit the specific form of the electronic device.

Referring to fig. 3, fig. 3 is a schematic view of an electronic device according to an embodiment of the present disclosure. As shown in fig. 3, the electronic device in the embodiment of the present application is a mobile phone, the mobile phone includes a main body 100 and a circuit board structure 200, the circuit board structure 200 is disposed in the main body 100, specifically, the main body 100 may include a screen, a middle frame and a back plate, and the circuit board structure 200 may be disposed on the back of the screen or on the back plate.

Next, a circuit board structure in the embodiment of the present application will be described.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a circuit board structure according to an embodiment of the present disclosure. As shown in fig. 4, the present embodiment provides a circuit board structure, where the circuit board structure includes a circuit board 1, and the circuit board 1 includes a plurality of devices under test, where the devices under test may be chips and circuit structures integrated on the circuit board 1, or may be electronic components connected to the circuit board 1, for example, the electronic components may be resistors, capacitors, inductors, or other components soldered on the circuit board 1. Each device to be tested is connected with a test line 2, and each test line 2 is provided with a control switch 3. The test line 2 is used for connecting the device to be tested with an external test point 7, so that the device to be tested can be tested conveniently. As shown in fig. 4, one end (upper end) of the test line 2 in the figure is connected to a device to be tested (not shown in the figure), and the other end (lower end) is located at a board edge of the circuit board 1, and the state at this time is a state that the test line 2 connected to the test point 7 is exposed at the board edge after being cut off. By arranging the control switch 3 on each test line 2, the control switch 3 can control the connection and disconnection of the test line 2 between one end of the test line 2, which is positioned at the edge of the board, and the device to be tested. When a device to be tested needs to be tested, the control switch 3 is adjusted to be in a conducting state, so that the test wire 2 is in a conducting state; after the device to be tested is tested, the control switch 3 is adjusted to be in a disconnected state, so that the test wire 2 is in a disconnected state, and after the test wire 2 is cut off, the test wire 2 on the circuit board 1 is still in a disconnected state. When the test line 2 exposed at the edge of the circuit board 1 contacts with the conductive material, the test line 2 is in a disconnected state, so that short circuit of the device to be tested can not be caused.

Fig. 4 shows the state of the circuit board structure after the circuit board structure is separated from the test board 6, as shown in fig. 4, the control switch 3 divides the test line 2 into two segments because the control switch 3 is disposed on the test line 2, wherein the test line 2 between the device to be tested and the control switch 3 is a first test line 21, and the test line 2 between the control switch 3 and the test point 7 is a second test line 22. Wherein, control switch 3 includes first paster 4 and second paster 5, and the one end and the device electricity that awaits measuring of first test wire 21 are connected, and the other end and the first paster 4 electricity of first test wire 21 are connected. One end of the second test line 22 is electrically connected with the second patch 5, the other end of the second test line 22 is electrically connected with the test point 7, and a conduction piece is arranged between the first patch 4 and the second patch 5. When the conducting piece is connected with the first patch 4 and the second patch 5, the control switch 3 is in a conducting state; when the conducting member is disconnected from any one of the first patch 4 and the second patch 5, the control switch 3 is in an off state.

In the embodiment of the present application, the test line 2 may be a metal wire, such as a copper wire, an iron wire, or an aluminum wire, or may be a channel formed by solder on the circuit board 1. The first patch 4 and the second patch 5 are both metal patches, e.g. the first patch 4 and the second patch 5 are both copper patches. The first patch 4 and the second patch 5 may be the same size or different sizes; the shapes of the first patch 4 and the second patch 5 can be circular, rectangular, square, circular or other shapes, in this embodiment, the first patch 4 and the second patch 5 are copper patches with the same size and the same square shape, but this embodiment does not specifically limit the materials, shapes and sizes of the first patch 4 and the second patch 5, and can be set according to actual situations. The conducting part is a metal part and has conductivity, and the conducting part can be in contact connection with the first patch 4 and the conducting part can be in fixed connection with the second patch 5. The on state and the off state of the control switch 3 are controlled by controlling the connection state between the conducting piece and the first patch 4 and the second patch 5, so that the state of the test line 2 is controlled.

An embodiment of the present application further provides a circuit board test structure, and referring to fig. 5, fig. 5 is a schematic structural diagram of the circuit board test structure provided in the embodiment of the present application when the circuit board test structure is in a disconnected state. As shown in fig. 5, the circuit board testing structure includes the circuit board structure and the testing board 6 provided in the above embodiment, wherein the testing board 6 is provided with a plurality of testing points 7, the number of the testing points 7 may be more than the number of the devices to be tested, and the devices to be tested on the circuit board 1 are connected with the testing points 7 on the testing board 6 in a one-to-one correspondence manner through the testing lines 2. In testing, a test pin is placed at a test point 7 on a test board 6, and a device to be tested connected to the test point 7 is tested.

Because the circuit board 1 is generally provided with a plurality of devices to be tested, a plurality of test lines 2 are arranged between the circuit board 1 and the test board 6, and because each test line 2 is provided with one control switch 3, and the control switches 3 are arranged on the circuit board 1, a plurality of control switches 3 are arranged on the circuit board 1, namely, a plurality of first patches 4 and a plurality of second patches 5 are arranged, and the number of the first patches 4 and the number of the second patches 5 are equal to the number of the devices to be tested. When the first patch 4 and the second patch 5 are arranged on the circuit board 1, the first patch 4 and the second patch 5 in each control switch 3 are correspondingly arranged to form a patch set. The patch groups are arranged in the same area as much as possible, and the patch groups are arranged in a uniform shape as much as possible, for example, the patch groups are designed side by side.

As shown in fig. 5, in the embodiment of the present application, the first patch 4 and the second patch 5 in each patch set have the same shape and the same size, and the size and specification of any two patch sets are the same. A plurality of paster groups set up in a rectangular area, and a plurality of paster groups set up side by side, and the interval between two adjacent paster groups equals, and first paster 4 in a plurality of paster groups is located same row, and second paster 5 in a plurality of paster groups is located same row, sets up like this and is conveniently to carry out the switching of state simultaneously to a plurality of control switch 3.

When designing the size of first paster 4 and second paster 5, can set up according to the size of space or other components on the circuit board 1, in this application embodiment, the size of first paster 4 and second paster 5 all sets up 0.2mm, and the interval between first paster 4 and the second paster 5 is 0.1mm, and every paster group all can design according to above-mentioned standard.

The first patch 4 and the second patch 5 are both disposed on the circuit board 1, and since the circuit board 1 is generally disposed thereon with a layer of green oil (the green oil is a liquid photo solder resist, which is an acrylic oligomer) as a protective layer, the height of the green oil is generally higher than the thickness of the first patch 4 and the second patch 5, and therefore, the green oil between the first patch 4 and the second patch 5 easily affects the conduction between the first patch 4 and the second patch 5. When the first patch 4 and the second patch 5 are mounted, it is generally necessary to cut off a part of the green oil on the circuit board 1.

Referring to fig. 6, fig. 6 is a schematic view illustrating an installation of the control switch 3 in the circuit board structure according to an embodiment of the present application. As shown in fig. 6, the green oil is generally cut away at the site where the first patch 4 is installed, at the site where the second patch 5 is installed, and between the first patch 4 and the second patch 5. Forming a plurality of rectangular soldering grooves 15 on the circuit board 1, then placing a first patch 4 and a second patch 5 in one soldering groove 15, and soldering the first patch 4 and the second patch 5 with corresponding structures on the circuit board 1.

In the testing process, the first patch 4 and the second patch 5 in the same soldering bath 15 are conducted through the conducting piece, and the conduction of the testing path can be realized. Referring to fig. 7, fig. 7 is a schematic structural diagram of a circuit board testing structure in a conducting state according to an embodiment of the present disclosure. As shown in fig. 7, the first patch 4 and the second patch 5 in each control switch 3 are turned on by a conducting element, so that each control switch 3 is in a conducting state, and at this time, the test line 2 between each device under test and its corresponding test point 7 is in a conducting state. When the device to be tested needs to be tested, the control switch 3 is conducted, and then the test needle is connected to the corresponding test point 7 on the test board 6, so that the device to be tested can be tested. After the detection is completed, the test wire 2 between the circuit board 1 and the test board 6 can be cut off, so that the circuit board structure is separated from the test board 6, the conducting piece between the first patch 4 and the second patch 5 is disconnected, or the conducting piece is disconnected from any one of the first patch 4 and the second patch 5, so that the control switch 3 is in a disconnected state. Because the control switch 3 is in the off state, even after the test line 2 is cut off, the tested device will not generate short circuit phenomenon because the test line 2 exposed at the edge of the circuit board 1 contacts with the conductive material.

In the embodiment of the present application, the effect of the conducting element is mainly to conduct the first patch 4 and the second patch 5, but when the control switch 3 is turned off, the conducting element also needs to be separated from the first patch 4 and the second patch 5 relatively easily, so as to conveniently control the conducting state and the off state of the control switch 3. The form and the mode of conducting can set up according to actual conditions, but the piece that conducts needs satisfy and switches on first paster 4 and second paster 5 better, simultaneously more convenient with first paster 4 and the separation of second paster 5. The conducting member provided in the embodiments of the present application is briefly described below.

Referring to fig. 8, fig. 8 is one of schematic structural diagrams of a circuit board testing structure provided in an embodiment of the present application when the control switch 3 is in a conducting state, and fig. 8 shows a specific example of a conducting element. As shown in fig. 8, the conductive member is a welded member, which may be a shaped connecting member formed of a welding material. In this embodiment, adopt the first paster 4 of welding intercommunication and second paster 5, owing to need comparatively convenient realization to switch on the piece and the separation between first paster 4 and the second paster 5, consequently the welding should not adopt the higher material of melting point. When the solder member is used as the conductive member, a solder member formed of solder may be used.

As shown in fig. 8, when the first patch 4 and the second patch 5 need to be connected, a part of the soldering tin is placed in the soldering groove 15, and the soldering tin is located between the first patch 4 and the second patch 5, and then the soldering tin is melted, so that the soldering tin forms a solder bridge 8 shown in fig. 8 between the first patch 4 and the second patch 5, one end of the solder bridge 8 is soldered on the first patch 4, the other end of the solder bridge is soldered on the second patch 5, and the first patch 4 and the second patch 5 are conducted. Specifically, a steel mesh can be adopted, the steel mesh is laid on the first patch 4 and the second patch 5, then the steel mesh is penetrated, windows are formed at the position between the two patches and the position where the two patches are located, tin is printed, and then the conduction of the test path is realized through Surface Mounted Technology (SMT) reflow.

When it is desired to separate the solder part from the first and

second patches

4, 5, the solder bridge 8 connected between the first and

second patches

4, 5 may be heated so that part of the solder on the solder bridge 8 is vaporised or sucked away, thereby forming an open circuit between the first and

second patches

4, 5.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a circuit board testing structure according to an embodiment of the present disclosure when a control switch 3 is in an off state. Fig. 9 shows the situation where the solder bridge 8 between the first patch 4 and the second patch 5 is broken, as shown in fig. 8, and the solder bridge 8 is formed between the first patch 4 and the second patch 5, conducting the first patch 4 and the second patch 5. When the first patch 4 and the second patch 5 need to be disconnected, the welding bridge 8 between the first patch 4 and the second patch 5 can be subjected to laser heating, so that the welding bridge 8 between the first patch 4 and the second patch 5 is vaporized, the situation shown in fig. 9 is formed, some soldering tin still remains on the first patch 4 and the second patch 5, but the remaining soldering tin cannot be conducted, and the control switch 3 is in an off state. The first patch 4 and the second patch 5 are in an off state, so that the static electricity in the test board 6 can not directly form electric impact on the circuit in the circuit board 1 when the test board 6 is separated from the circuit board 1 in the follow-up process.

Furthermore, the solder bridge 8 between the first patch 4 and the second patch 5 may also be removed in other ways. Referring to fig. 10, fig. 10 is a second schematic structural diagram of a circuit board testing structure according to an embodiment of the present invention when the control switch 3 is in an off state. Fig. 10 shows the change from a via to an open circuit between the first patch 4 and the second patch 5 by means of heating of the suction nozzle 9. As shown in fig. 10, a heating suction nozzle 9 is disposed above the solder bridge 8, and the heating suction nozzle 9 heats the solder bridge 8, so that the solder bridge 8 connecting the first patch 4 and the second patch 5 is melted, and then the melted solder is sucked away, so that the first patch 4 and the second patch 5 are in an off state, and the control switch 3 is in the off state.

Through adopting the welding piece as switching on the state and the off-state between the piece of controlling first paster 4 and the second paster 5, the welding piece melts back recooling can form good contact with first paster 4 and second paster 5, but when the control switches on the piece and breaks off with first paster 4 and second paster 5, need heat fusing to every welding bridge 8, and overall efficiency is high-efficient inadequately.

Referring to fig. 11, fig. 11 is a second schematic structural diagram of a circuit board testing structure according to the second embodiment of the present disclosure when the control switch 3 is in an on state. As shown in fig. 11, the present embodiment provides another conducting member, and specifically, a conducting wire 10 is used as the conducting member. When the first patch 4 needs to be controlled to be conducted with the second patch 5, one end of the conducting wire 10 is connected to the first patch 4, and the other end of the conducting wire 10 is connected to the second patch 5, so that the control switch 3 can be adjusted to be in a conducting state. When the first patch 4 and the second patch 5 need to be controlled to be disconnected, the conducting wire 10 is disconnected from any one of the first patch 4 and the second patch 5, or the conducting wire 10 is disconnected from both the first patch 4 and the second patch 5, so that the first patch 4 and the second patch 5 can be changed from a closed circuit to an open circuit, and the control switch 3 is switched to a disconnected state.

When the first patch 4 and the second patch 5 are conducted by using the via 10 as a conducting member, when the via 10 has a certain radian, there may be a problem of poor contact between the via 10 and the first patch 4 or between the via 10 and the second patch 5. To avoid this problem, the present embodiment is provided with contact feed points 12 on the first patch 4 and the second patch 5.

Referring to fig. 12, fig. 12 is a third schematic structural diagram of a circuit board testing structure according to an embodiment of the present invention when a control switch 3 is in an on state. As shown in fig. 12, contact feeding points 12 are provided on both the first patch 4 and the second patch 5, and the contact feeding points 12 are a metal structure protruding upward, and are configured such that even if there is a certain bending of the via 10, the contact feeding points can make good contact with the via 10 due to a small contact area between the top and the via 10. In order to ensure good contact between the contact feed point 12 and the conductive member, the height of the vertex of the contact feed point 12 may be set to be higher than the height of the green oil on the circuit board 1. In the embodiment of the present application, the contact feed point 12 may be a metal prefabricated on the first patch 4 and the second patch 5, or may be a third patch welded on the first patch 4 and the second patch 5 by an SMT process, as shown in fig. 12, the third patch may be in a triangular prism shape, and the ridge of the third patch is in contact with the conducting line 10. The shape of the third patch is not limited in the embodiment of the present application, and it is preferable that the connection stability between the via 10 and the first patch 4 and the connection stability between the via 10 and the second patch 5 can be improved.

In addition, in order to improve the connection stability between the via 10 and the first and

second patches

4 and 5 and to facilitate separation of the via 10 from the first and

second patches

4 and 5, the via 10 may be fixed to a pressing block 11. As shown in fig. 11 and 12, when the lead wire 10 is fixed to the pressing block 11 and the first patch 4 and the second patch 5 need to be connected, the surface of the pressing block 11 on which the lead wire 10 is provided is placed on the first patch 4 and the second patch 5, the pressing block 11 presses one end of the lead wire 10 against the first patch 4 by its own weight, and the other end of the lead wire 10 against the second patch 5. The press block 11 prevents the lead wire 10 from moving freely and keeps it in good contact with the first patch 4 and the second patch 5. When the first patch 4 and the second patch 5 need to be disconnected, the pressing block 11 is taken away, the conducting wire 10 is separated from the first patch 4 and the second patch 5 at the same time, and the control switch 3 is in a disconnected state.

In the embodiment of the present application, the plurality of control switches 3 may be set to the same specification and in a form of being arranged side by side. In each control switch 3, the specifications of the first patch 4 and the second patch 5 may also be set to be the same, so that the patches in the plurality of control switches 3 are regularly arranged on the circuit board 1. When the conducting wire 10 is used as the conducting piece of the control switch 3, the conducting wire 10 with the same specification can be used for conducting in each control switch 3, so that the conducting wires 10 of a plurality of control switches 3 can be integrated on the same device, and the state switching of the plurality of control switches 3 can be uniformly controlled.

Referring to fig. 13, fig. 13 is a schematic structural diagram of a conducting element of a control switch 3 in a circuit board test structure according to an embodiment of the present disclosure. As shown in fig. 13, the conducting member includes a pressing block 11 and a plurality of conducting wires 10, the conducting wires 10 are uniformly distributed on the pressing block 11, and the distance between two adjacent conducting wires 10 is equal to the distance between two adjacent control switches 3, so that it can be ensured that one conducting wire 10 is provided for each of the first patch 4 and the second patch 5 in each control switch 3 to achieve conduction.

Referring to fig. 14, fig. 14 is a second schematic structural diagram of a conducting element of a control switch 3 in a circuit board testing structure according to an embodiment of the present application. As shown in fig. 14, the conducting element includes a pressing block 11 and a plurality of conducting lines 10, the conducting lines 10 are distributed on the pressing block 11 in parallel, every two conducting lines 10 form a conducting line group, the distance between two adjacent conducting line groups is equal to the distance between two adjacent control switches 3, so that it can be ensured that two conducting lines 10 are respectively arranged on the first patch 4 and the second patch 5 in each control switch 3 to realize conduction, and the adoption of two conducting lines 10 is beneficial to improving the connection stability between the conducting lines 10 and the first patch 4 and the second patch 5.

Referring to fig. 15, fig. 15 is a third schematic structural diagram of a conducting element of the control switch 3 in the circuit board testing structure according to the embodiment of the present application. As shown in fig. 15, the conducting element includes a pressing block 11 and a plurality of conducting wires 10, the conducting wires 10 are distributed on the pressing block 11 in parallel, every three conducting wires 10 form a conducting wire group, and the distance between two adjacent conducting wire groups is equal to the distance between two adjacent control switches 3, so that it can be ensured that three conducting wires 10 are provided for the first patch 4 and the second patch 5 in each control switch 3 to realize conduction, and the adoption of three conducting wires 10 is beneficial to further improving the connection stability between the conducting wires 10 and the first patch 4 and the second patch 5.

It should be noted that, in the embodiment of the present application, the specific number of the conducting lines 10 between each group of the first patches 4 and the second patches 5 is not limited, for example, the number of the conducting lines 10 in one group of conducting lines may be 3, and the number of the conducting lines 10 in another group of conducting lines may be 4, 5, 6, and so on. The conducting lines 10 in each conducting line group are not arranged in parallel.

The above embodiments exemplify several cases where the conduction lines 10 for conducting all the control switches 3 are provided on the same block 11. Next, a case where the conductive member is mounted on the circuit board structure to be turned on and off will be described by taking the conductive member shown in fig. 13 as an example.

Referring to fig. 16, fig. 16 is a second schematic structural diagram of a circuit board testing structure provided in the embodiment of the present application when the circuit board testing structure is in a conducting state. As shown in fig. 16, a plurality of control switches 3 are arranged on the circuit board 1 side by side, and when all the control switches 3 need to be turned on, the conducting member shown in fig. 13 is placed on the first patch 4 and the second patch 5 in the control switches 3, so that each conducting line 10 on the conducting member conducts a pair of the first patch 4 and the second patch 5, and all the control switches 3 are conducted by only one conducting member. When all the control switches 3 need to be switched off, the conducting pieces shown in fig. 13 are taken away, and all the conducting wires 10 are arranged on one pressing block 11, so that the pressing block 11 can be directly taken away, that is, all the conducting wires 10 can be separated from the first patch 4 and the second patch 5, and all the control switches 3 can be switched to the off state. Fig. 17 is a fourth schematic structural diagram of a circuit board testing structure in a conducting state according to an embodiment of the present application.

As shown in fig. 17, the conducting parts shown in fig. 14 are placed on the first patch 4 and the second patch 5 in the control switch 3, so that two conducting wires 10 are conducted on each pair of the first patch 4 and the second patch 5. When all the control switches 3 need to be switched off, the conducting part shown in fig. 14 is taken away, because all the conducting wires 10 are arranged on one pressing block 11, the pressing block 11 can be directly taken away, so that all the conducting wires 10 can be separated from the first patch 4 and the second patch 5, and all the control switches 3 can be switched to the off state.

The embodiment of the application also provides another conducting piece. Referring to fig. 18, fig. 18 is a fifth structural schematic diagram of a circuit board testing structure according to the present application when the control switch 3 is in an on state. As shown in fig. 18, the conducting element is a conductive film 13, the conductive film 13 is disposed directly above the first patch 4 and the second patch 5, and in a normal state, the conductive film 13 is not in contact with the first patch 4, or the conductive film 13 is not in contact with the second patch 5, or the conductive film 13 is not in contact with both the first patch 4 and the second patch 5. When it is desired to conduct the first patch 4 and the second patch 5, the conductive film 13 is pressed down so that the conductive film 13 is held in contact with both the first patch 4 and the second patch 5, thereby conducting the first patch 4 and the second patch 5. When it is desired to break the first patch 4 and the second patch 5, the conductive film 13 is pulled upwardly to bring the conductive film 13 into a separated state from either of the first patch 4 and the second patch 5, or to bring the conductive film 13 into a separated state from both the first patch 4 and the second patch 5. Further, the conductive film 13 may be provided to have a certain elasticity so that the conductive film 13 is automatically separated from the first patch 4 or the second patch 5.

In addition, it is also possible to provide a state in which the conductive film 13 is in contact with the first patch 4 and the second patch 5 in a normal state, and the first patch 4 and the second patch 5 are in a conductive state at this time; when the first patch 4 and the second patch 5 need to be controlled to be in a disconnected state, the conductive film 13 is torn off.

It should be noted that in order to increase the contact stability between the conductive film 13 and the first patch 4 and the second patch 5, contact feed points 12 may be provided on the first patch 4 and the second patch 5. As shown in fig. 19, fig. 19 is a sixth schematic structural view of a circuit board testing structure according to an embodiment of the present invention, in which a conductive film 13 is connected to a first patch 4 and a second patch 5 through a contact feed point 12, and the contact feed point 12 has a shape with a small top and a large bottom, and is easier to maintain good contact with the conductive film 13 compared to the first patch 4 and the second patch 5. For the description of the contact feed point 12, reference may be made to the description of the previous embodiments, which are not repeated herein.

Referring to fig. 20, fig. 20 is a third schematic structural diagram of a circuit board testing structure according to an embodiment of the present disclosure when the control switch 3 is in an off state. As shown in fig. 20, in this case, the conductive film 13 is disposed directly above the first patch 4 and the second patch 5, and in the normal state, the conductive film 13 is not in contact with both the first patch 4 and the second patch 5, and in order to ensure good contact between the conductive film 13 and the first patch 4 and the second patch 5, the conductive film 13 may be provided with the pressure block 11. As shown in fig. 21, fig. 21 is a seventh schematic structural diagram of the circuit board testing structure in which the control switch 3 is in a conducting state according to the embodiment of the present disclosure, a pressing block 11 is additionally disposed on the conductive film 13, the pressing block 11 presses down the conductive film 13 through its own gravity, so that the conductive film is in a contact state with both the first patch 4 and the second patch 5, and at this time, contact feed points 12 are further disposed on the first patch 4 and the second patch 5, so as to ensure good contact between the conductive film 13 and the first patch 4 and the second patch 5. The length of the presser piece 11 is preferably set longer than the farthest distance between the first patch 4 and the second patch 5 to ensure that the conductive film 13 to be pressed down covers the first patch 4 and the second patch 5.

In addition, another conducting piece is further provided in the embodiment of the application. Referring to fig. 22, fig. 22 is a fourth schematic structural diagram of a circuit board testing structure according to an embodiment of the present disclosure when the control switch 3 is in an off state. As shown in fig. 22, the conducting element is an elastic sheet 14, one end of the elastic sheet 14 is fixed on the first patch 4 or the second patch 5, and the other end of the elastic sheet 14 is suspended above the patch that is not fixedly connected with the elastic sheet 14, in the first patch 4 and the second patch 5. At this time, the first patch 4 and the second patch 5 are in an open state. When the first patch 4 and the second patch 5 need to be controlled to be in a conducting state, the suspended end of the elastic sheet 14 is pressed down to be in contact with the patch below, and then the conduction between the first patch 4 and the second patch 5 can be realized.

For example, one end of the elastic piece 14 is connected to the first patch 4, and the other end of the elastic piece 14 is suspended above the second patch 5, with the first patch 4 and the second patch 5 in a disconnected state. When the first patch 4 and the second patch 5 need to be controlled to be in a conducting state, one end of the elastic sheet 14 suspended above the second patch 5 is pressed downwards to be in contact with the second patch 5, and then the conduction between the first patch 4 and the second patch 5 can be realized. The off-state between the first patch 4 and the second patch 5 is restored by releasing the end of the flexible sheet 14 that is suspended above the second patch 5 and suspending it above the second patch 5.

For another example, one end of the elastic piece 14 is connected to the second patch 5, and the other end of the elastic piece 14 is suspended above the first patch 4, so that the first patch 4 and the second patch 5 are in a disconnected state. When the first patch 4 and the second patch 5 need to be controlled to be in a conducting state, one end of the elastic sheet 14 suspended above the first patch 4 is pressed down to be in contact with the first patch 4, and then the first patch 4 and the second patch 5 can be conducted. The cut-off between the first patch 4 and the second patch 5 is restored by releasing the end of the elastic piece 14 that is suspended above the first patch 4 and suspending it above the first patch 4.

Fig. 23 is an eighth schematic structural view illustrating a structure of a circuit board testing structure according to an embodiment of the present disclosure when a control switch 3 is in a conducting state, and as shown in fig. 23, a pressing block 11 may be added to make a suspended end of an elastic sheet 14 contact with a patch below the suspended end, so as to implement conduction between a first patch 4 and a second patch 5. To restore the disconnected state between the first patch 4 and the second patch 5, the pressing piece 11 pressing against the elastic piece 14 is removed. It should be noted that the present embodiment is not limited to the specific form of the elastic sheet 14, and may be an elastic strip or other elastic structure as long as the above-mentioned functions can be achieved.

Referring to fig. 24, fig. 24 is a schematic structural view illustrating a circuit board 1 separated from a test board 6 in a circuit board test structure according to an embodiment of the present disclosure. As shown in fig. 24, after the device under test on the circuit board 1 is tested, the test line 2 connecting the circuit board 1 and the test board 6 is cut off, so that the circuit board 1 and the test board 6 are separated. After the circuit board 1 is separated from the test board 6, the control switch 3 on the circuit board 1 is adjusted to be in an off state, so that the second test wire 22 with one end positioned at the edge of the circuit board 1 can be prevented from being short-circuited to damage a device to be tested. Because the control switch 3 includes the first paster 4 and the second paster 5, and the first paster 4 and the second paster 5 are all exposed on the surface of the circuit board 1, when needing to maintain and retest the device to be tested on the circuit board 1, can test the function in the circuit board 1 with the exposed first paster 4 and the exposed second paster 5 as the interface position of the test access, thereby having realized the circuit board 1 and having surveyed the board 6 after separating, still can retest the circuit board 1, has solved the problem of maintenance or retest the location difficulty after the circuit board 1 separates with surveying the board 6.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application.

The embodiments in the present specification are all described in a progressive manner, and each embodiment focuses on differences from other embodiments, and portions that are the same and similar between the embodiments may be referred to each other.

While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, the scope of protection of the present application includes the preferred embodiments and all variations and modifications that fall within the scope of the embodiments of the present application.

The above detailed description is given to the circuit board structure, the circuit board test structure and the electronic device provided by the present application, and specific examples are applied herein to explain the principle and the implementation of the present application, and the description of the above embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A circuit board structure is characterized by comprising a circuit board, wherein the circuit board comprises a plurality of devices to be tested, each device to be tested is connected with a test line, and each test line is provided with a control switch;

the test wires comprise a first test wire and a second test wire, and the control switch comprises a first patch and a second patch;

one end of the first test wire is electrically connected with the device to be tested, and the other end of the first test wire is electrically connected with the first patch;

one end of the second test wire is electrically connected with the second patch, and the other end of the second test wire is electrically connected with the test point;

a conducting piece is arranged between the first patch and the second patch, the conducting pieces are integrated, and the conducting piece conducts or disconnects the control switches at the same time;

when the conducting piece is connected with the first patch and the second patch, the control switch is in a conducting state;

when the conducting piece is disconnected with any one of the first patch and the second patch, the control switch is in a disconnected state.

2. A circuit board structure according to claim 1, wherein a plurality of the first patches are arranged side by side and a plurality of the second patches are arranged side by side.

3. The circuit board structure according to claim 1 or 2, wherein the via is a via, one end of the via is connected to the first patch, and the other end of the via is connected to the second patch.

4. The circuit board structure according to claim 3, wherein the first patch and the second patch in each control switch are a patch set, a plurality of patch sets are provided with a pressing block, the pressing block is provided with a plurality of independent conducting wires, and each patch set is conducted by at least one conducting wire.

5. Circuit board structure according to claim 4, characterised in that the through-going wires are evenly distributed over the press block, the number of through-going wires being an integer multiple of the number of patch groups, the number of through-going wires on each patch group being equal.

6. The circuit board structure according to claim 1 or 2, wherein the conducting member is a conductive film, the conductive film is located above the first patch and the second patch and is in a non-contact state with the first patch and/or the second patch, and when the conductive film is pressed to be in contact with both the first patch and the second patch, the first patch and the second patch are conducted.

7. The circuit board structure of claim 1 or 2, wherein the conducting member is an elastic sheet, one end of the elastic sheet is connected to the first patch, the other end of the elastic sheet is suspended above the second patch, and when the other end of the elastic sheet is pressed to contact with the second patch, the first patch and the second patch are conducted;

or one end of the elastic sheet is connected to the second patch, the other end of the elastic sheet is suspended above the first patch, and when the other end of the elastic sheet is pressed down to be in contact with the first patch, the first patch is conducted with the second patch.

8. A circuit-board structure according to claim 3, characterised in that contact feed points are provided on both the first and the second patch.

9. The circuit board structure of claim 1, wherein the first patch and the second patch are both located on a surface of the circuit board.

10. A circuit board test structure comprising a test board and the circuit board structure of any one of claims 1 to 9, wherein the test board is provided with a plurality of test points, and the test line on each device under test is electrically connected to one of the test points.

11. An electronic device, comprising a body and a circuit board structure according to any one of claims 1 to 9, wherein the circuit board is disposed in the body.