CN206164983U - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
- Publication number
- CN206164983U CN206164983U CN201621117152.0U CN201621117152U CN206164983U CN 206164983 U CN206164983 U CN 206164983U CN 201621117152 U CN201621117152 U CN 201621117152U CN 206164983 U CN206164983 U CN 206164983U
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- CN
- China
- Prior art keywords
- pad
- sub
- circuit board
- test point
- pin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012360 testing method Methods 0.000 claims abstract description 84
- 241000826860 Trapezium Species 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 12
- 230000005611 electricity Effects 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The utility model provides a circuit board, it is including setting up pad, test point and first signal line on the circuit board, the pad is including the first sub-pad and the second sub-pad that are used for welding paster electronic components's same pin, first sub-pad with the second sub-pad is each other not continuous and all sets up on the same face of circuit board, first sub-pad with the test point electricity is connected, the second sub-pad with first signal line electricity is connected. The utility model also provides an electronic equipment. The utility model discloses can test out paster electronic components's pin with thereby the welding quality of pad makes more comprehensive to the test of circuit board.
Description
Technical field
This utility model is related to circuit board technology field, more particularly, to a kind of circuit board and electronic equipment.
Background technology
In the test process of circuit board, in order to improve testing efficiency, can be on circuit boards when board design is carried out
Be provided with the test point electrically connected with measured signal line, and on measured signal line and circuit board for patch electronics components
Pin welding pad electrical connection；When testing to circuit board, the thimble for obtaining test signal passes through test point
It is connected with measured signal line, when thimble gets test signal, shows pad and the pad being connected with the measured signal line
The pin of corresponding patch electronics components be contact with each other (can be with i.e. between pad and the pin of patch electronics components
It is powered).But whether the pin that this test mode can only measure patch electronics components is contacted with pad, can not be tested out
(whether the pin of such as patch electronics components is welded completely the welding quality of the pin of patch electronics components and pad with pad
Connect or whether be rosin joint etc.) so that the test of circuit board is not comprehensive enough.
Utility model content
For the problems referred to above, the purpose of this utility model is that offer is a kind of can test out drawing for patch electronics components
The welding quality of foot and pad is so as to the test of circuit board more comprehensive circuit board and including the circuit board
Electronic equipment.
To achieve these goals, on the one hand this utility model provides a kind of circuit board, and which includes being arranged on the electricity
Pad, test point and the first holding wire on the plate of road, the pad include drawing for the same of soldering surface mounted electronic devices and components
The first sub- pad and the second sub- pad of foot, the first sub- pad are mutually not attached to the described second sub- pad and are arranged at institute
State on the same face of circuit board, the first sub- pad is electrically connected with the test point, the second sub- pad and described first
Holding wire is electrically connected.
Further, secondary signal line, the secondary signal line are provided between the described first sub- pad and the test point
One end connect the first sub- pad, the other end of the secondary signal line connects the test point.
Further, the described first sub- pad and the test point are at least two, the first sub- pad with it is described
Test point is corresponded and is corresponded to and is mutually not attached between electrical connection, and the described first different sub- pads.
Further, the described first sub- pad is provided with multiple raised points with the card of the described second sub- pad, adjacent
The distance between two raised points are identical.
Further, the pad is circular configuration or rectangular configuration.
Further, the described first sub- pad and the second sub- pad are rectangular configuration or trapezium structure.
This utility model still further aspect additionally provides a kind of electronic equipment, and which includes circuit board as above.
The circuit board and the electronic equipment including the circuit board that this utility model is provided, by by the pad
The first sub- pad is arranged on the same face of the circuit board with the described second sub- pad of the pad and described
One sub- pad is mutually not attached between the two with the described second sub- pad, and the described first sub- pad and the test point are electrically connected
Connect, and the described second sub- pad is electrically connected with first holding wire.So when the pin welding for having patch electronics components
On the pad and when the test point gets the test signal of first holding wire, show that the test signal can
The pin of the patch electronics components is flowed to the described second sub- pad by electrically connecting with first holding wire, and is led to
Cross the pin and flow to the described first sub- pad, electrically connect with the described first sub- pad finally by the described first sub- pad flow direction
The test point；Therefore, when the test signal can be obtained in the test point, show the pin with described the
One sub- pad shows that the pin of the patch electronics components is effectively to weld together with the described second sub- pad solder
On the pad；When the test point does not obtain the test signal, show that the test signal can not be from described
Second sub- pad flows to the described first sub- pad by the pin of the patch electronics components, that is, illustrate the patch electronics unit
The pin of device can not effectively with the pad solder.Therefore this utility model may determine that the patch electronics components
Pin whether effectively with the pad solder, you can to judge the pin of the patch electronics components with the pad
Welding quality so that the test to the circuit board can be more comprehensive.
Description of the drawings
In order to be illustrated more clearly that the technical solution of the utility model, below by to be used attached needed for embodiment
Figure is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present utility model, for
For those of ordinary skill in the art, on the premise of not paying creative work, can be obtaining other according to these accompanying drawings
Accompanying drawing.
Fig. 1 is a kind of structural representation of circuit board that this utility model embodiment is provided；
Fig. 2 is the structural representation of another kind of circuit board that this utility model embodiment is provided.
Specific embodiment
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only this utility model a part of embodiment, rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of this utility model protection.
Fig. 1 is referred to, on the one hand this utility model provides a kind of circuit board, and which includes being arranged on the circuit board
Pad 1, test point 2 and the first holding wire 3, the pad 1 include the same pin 4 for soldering surface mounted electronic devices and components
First sub- pad 5 and the second sub- pad 6, the first sub- pad 5 are mutually not attached to the described second sub- pad 6 and are arranged at institute
State on the same face of circuit board, the first sub- pad 5 is electrically connected with the test point 2, the second sub- pad 6 and described
One holding wire 3 is electrically connected.
Wherein, first holding wire 3 is used for the test signal for transmitting the circuit board, and the test point 2 is used to obtain
From the test signal that first holding wire 3 is transmitted；And first holding wire 3 is respectively provided with the test point 2
On the circuit board.Additionally, the pad 1 is welded for the pin 4 with patch electronics components, i.e. the pad 1
The described first sub- pad 5 and the described second sub- pad 6 be also to be welded for the pin 4 with the patch electronics components
Connect.Preferably, the pad 1 is circular configuration or rectangular configuration.It should be noted that the pad 1 can also be other
Structure, for example, trapezium structure or triangular structure etc., as long as the planform of the pad 1 can allow 1 energy of the pad
It is enough effectively to be welded with the pin 4 of the patch electronics components, then just protection domain of the present utility model it
It is interior.
In this utility model embodiment, by by the institute of the described first sub- pad 5 of the pad 1 and the pad 1
State the second sub- pad 6 to be arranged on the same face of the circuit board and 6 liang of the first sub- pad 5 and the described second sub- pad
Mutually it is not attached between person, and the described first sub- pad 5 is electrically connected with the test point 2, and by the described second sub- pad 6 and institute
State the first holding wire 3 to electrically connect.So when the pin 4 for having patch electronics components is welded on the pad 1 and works as the survey
When pilot 2 gets the test signal of first holding wire 3, show the test signal can by with first signal
Described second sub- pad 6 of the electrical connection of line 3 flows to the pin 4 of the patch electronics components, and flows to institute by the pin 4
The first sub- pad 5 is stated, the test point electrically connected with the described first sub- pad 5 is flowed to finally by the described first sub- pad 5
2；Therefore when the test signal can be obtained in the test point 2, show the pin 4 with the described first sub- pad 5
Weld together with the described second sub- pad 6, that is, show the patch electronics components pin 4 be effectively be welded on it is described
On pad 1；When the test point 2 does not obtain the test signal, show that the test signal can not be from described second
Sub- pad 6 flows to the described first sub- pad 5 by the pin 4 of the patch electronics components, that is, illustrate the patch electronics unit
The pin 4 of device effectively can not be welded with the pad 1.Therefore this utility model embodiment may determine that the paster electricity
Whether the pin 4 of sub- components and parts is effectively welded with the pad 1, you can to judge the pin of the patch electronics components
4 with the welding quality of the pad 1 so that the test to the circuit board can be more comprehensive.
Above-mentioned technical proposal is further improved, referring to Fig. 2, is set between the first sub- pad 5 and the test point 2
Have a secondary signal line 7, one end of the secondary signal line 7 connects the first sub- pad 5, the secondary signal line 7 it is another
End connects the test point 2.The secondary signal line 7 can cause the test point 2 without the need for sub because being arranged on described first
The side of pad 5 and be directly connected to the described first sub- pad 5, and can be to allow the test point 2 to arrange according to actual needs
On the circuit board away from the described first sub- pad 5 where.For example, because the pin 4 of the patch electronics components is counted
Amount is more, and spacing each other is little, and so as to the spacing each other of the pad 1 is also little, therefore the test point 2 is arranged on
Being possible to beside the first sub- pad 5 can be so that the pad 1 be directly connected to each other, so that on the pad 1
The pin 4 be also directly connected to each other, therefore can cause the test point 2 can be with by the secondary signal line 7
Where being arranged far from the pad 1 (i.e. away from the described first sub- pad 5) so that the set location of the test point 2 with
Set-up mode is more flexibly effectively.Wherein, the test point 2 obtains the course of work of the test signal of first holding wire 3
For：The test signal of first holding wire 3 can be transferred to patch electronics unit device by the described second sub- pad 6
The pin 4 of part, and the described first sub- pad 5 is transferred to by the pin 4, then by being connected with the described first sub- pad 5
The secondary signal line 7 be transferred to the test point 2.
Further, referring to Fig. 2, the first sub- pad 5 is at least two with the test point 2, and described first is sub
Pad 5 is corresponded with the test point 2 and corresponding electrical connection, and is mutually not attached between the described first different sub- pads 5.This
Sample can be transferred to the described first different sub- pads 5 respectively from the test signal that the described second sub- pad 6 is transmitted,
Then, when the test point 2 gets the test signal, the pin 4 of the patch electronics components and the test are shown
The welding of the 2 corresponding first sub- pads 5 of point and the second sub- pad 6 is good, otherwise then shows the patch electronics unit
The welding existing problems of the first sub- pad 5 corresponding with the test point 2 of pin 4 and the second sub- pad 6 of device.
Therefore, by the described at least two first sub- pad 5 with least two with the 5 corresponding test point 2 of the described first sub- pad,
The pin 4 of the patch electronics components and the welding quality of the pad 1 can preferably be judged.Wherein, the test
Point 2 directly can be connected with the described first sub- pad 5, it is also possible to be connected with the described first sub- pad 5 by the secondary signal line 7
Connect, here is not specifically limited.
Preferably, the described first sub- pad 5 and the second sub- pad 6 are rectangular configuration or trapezium structure.So may be used
So that the pad 1 that constituted with the described second sub- pad 6 each other of the first sub- pad 5 more efficiently with institute
The pin 4 for stating patch electronics components is welded.It should be noted that the first sub- pad 5 and the second sub- pad 6
Can also be other structures shape, as long as the planform of the first sub- pad 5 and the second sub- pad 6 can allow described
The pad 1 constituted each other by first sub- pad 5 and the second sub- pad 6 more efficiently with the patch electronics
The pin 4 of components and parts is welded, then just within the protection domain of the present embodiment.
Further, the described first sub- pad 5 is provided with multiple raised points with the card of the described second sub- pad 6 and (schemes not
Show), the distance between two adjacent described raised points are identical.By in the described first sub- pad 5 and the described second sub- pad 6
Card be provided with multiple raised points, the weldering of the described first sub- pad 5 and the card of the described second sub- pad 6 can be caused
Junction product is bigger, so that the first sub- pad 5 and the second sub- pad 6 and the patch electronics components are drawn
Foot 4 preferably welds together.
On the other hand this utility model additionally provides a kind of electronic equipment, and which includes circuit board as above.
In this utility model embodiment, by by the institute of the described first sub- pad 5 of the pad 1 and the pad 1
State the second sub- pad 6 to be arranged on the same face of the circuit board and 6 liang of the first sub- pad 5 and the described second sub- pad
Mutually it is not attached between person, and the described first sub- pad 5 is electrically connected with the test point 2, and by the described second sub- pad 6 and institute
State the first holding wire 3 to electrically connect.So when the pin 4 for having patch electronics components is welded on the pad 1 and works as the survey
When pilot 2 gets the test signal of first holding wire 3, show the test signal can by with first signal
Described second sub- pad 6 of the electrical connection of line 3 flows to the pin 4 of the patch electronics components, and flows to institute by the pin 4
The first sub- pad 5 is stated, the test point electrically connected with the described first sub- pad 5 is flowed to finally by the described first sub- pad 5
2；Therefore when the test signal can be obtained in the test point 2, show the pin 4 with the described first sub- pad 5
Weld together with the described second sub- pad 6, that is, show the patch electronics components pin 4 be effectively be welded on it is described
On pad 1；When the test point 2 does not obtain the test signal, show that the test signal can not be from described second
Sub- pad 6 flows to the described first sub- pad 5 by the pin 4 of the patch electronics components, that is, illustrate the patch electronics unit
The pin 4 of device effectively can not be welded with the pad 1.Therefore this utility model embodiment may determine that the paster electricity
Whether the pin 4 of sub- components and parts is effectively welded with the pad 1, you can to judge the pin of the patch electronics components
4 with the welding quality of the pad 1 so that the test to the circuit board of the electronic equipment can be more comprehensive.
The above, specific embodiment only of the present utility model, but protection domain of the present utility model do not limit to
In this, any those skilled in the art disclosed in this utility model in technical scope, the change that can be readily occurred in
Change or replace, should all cover within protection domain of the present utility model.Therefore, protection domain of the present utility model should be with described
Scope of the claims is defined.
Claims (7)
1. a kind of circuit board, it is characterised in that including the pad, test point and the first signal that are arranged on the circuit board
Line, the pad include the first sub- pad and the second sub- pad of the same pin for soldering surface mounted electronic devices and components, described
First sub- pad is mutually not attached to the described second sub- pad and is arranged on the same face of the circuit board, the first son weldering
Disk is electrically connected with the test point, and the second sub- pad is electrically connected with first holding wire.
2. circuit board according to claim 1, it is characterised in that be provided between the first sub- pad and the test point
Secondary signal line, one end of the secondary signal line connect the first sub- pad, the other end connection of the secondary signal line
The test point.
3. circuit board according to claim 1 and 2, it is characterised in that the first sub- pad is with the test point
At least two, the first sub- pad is corresponded with the test point and corresponding electrical connection, and different the first son welderings
Mutually it is not attached between disk.
4. circuit board according to claim 1, it is characterised in that the disk of the first sub- pad and the described second sub- pad
It is identical that face is provided with the distance between multiple raised points, two adjacent raised points.
5. circuit board according to claim 1 and 2, it is characterised in that the pad is circular configuration or rectangular configuration.
6. circuit board according to claim 1 and 2, it is characterised in that the first sub- pad and the second sub- pad
For rectangular configuration or trapezium structure.
7. a kind of electronic equipment, it is characterised in that include the circuit board as described in claim 1 to 6 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621117152.0U CN206164983U (en) | 2016-10-12 | 2016-10-12 | Circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621117152.0U CN206164983U (en) | 2016-10-12 | 2016-10-12 | Circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206164983U true CN206164983U (en) | 2017-05-10 |
Family
ID=58652984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621117152.0U Active CN206164983U (en) | 2016-10-12 | 2016-10-12 | Circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206164983U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905503A (en) * | 2021-06-30 | 2022-01-07 | 荣耀终端有限公司 | Circuit board structure, circuit board test structure and electronic equipment |
-
2016
- 2016-10-12 CN CN201621117152.0U patent/CN206164983U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905503A (en) * | 2021-06-30 | 2022-01-07 | 荣耀终端有限公司 | Circuit board structure, circuit board test structure and electronic equipment |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |