CN109342933A - A kind of test fixture - Google Patents
A kind of test fixture Download PDFInfo
- Publication number
- CN109342933A CN109342933A CN201811553424.5A CN201811553424A CN109342933A CN 109342933 A CN109342933 A CN 109342933A CN 201811553424 A CN201811553424 A CN 201811553424A CN 109342933 A CN109342933 A CN 109342933A
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- connector
- pad
- chip
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 161
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 18
- 238000003466 welding Methods 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Abstract
The invention discloses a kind of test fixtures.The test fixture includes: first circuit board, and the first circuit board includes the first chip bonding pad, the first connector bonding pad and test pin bonding pad；First chip bonding pad is for being arranged chip；The electrical connection corresponding with the pad of first chip bonding pad of the pad of first connector bonding pad, the electrical connection corresponding with the pad of first chip bonding pad of the pad of the test pin bonding pad；First connector, first connector are welded in first connector bonding pad；Test pin, the test pin are welded in the test pin bonding pad.The present invention is not necessarily to weld lead-out wire on test circuit board, but is drawn the signal of chip pin by test pin, improves the stability of chip testing.
Description
Technical field
The present embodiments relate to technical field of circuit board detection more particularly to a kind of test fixtures.
Background technique
During carrying out chip testing to test circuit board, the chip on test circuit board is needed to be replaced frequently.For
Replacement chip is convenient, and the prior art uses the scheme that test bench is welded on test circuit board, and test bench when in use, needs
Test bench, which is welded on, to be needed then chip to be connected on test bench, on test circuit board to be tested without welding chip
On test circuit board.
However, when testing chip, it is also necessary to weld lead-out wire on chip pin and be carried out to the signal of chip
Detection.The chip more for pin, for example, packing forms are the chip of TSOP48, the pad of test bench is in test bench
Bottom, therefore, lead-out wire are needed from cabling is carried out between pad, and since the distance between pad is smaller, lead-out wire is arranged in this way
It is be easy to cause short circuit phenomenon, so that the prior art has the stability difference of test.
Summary of the invention
The present invention provides a kind of test fixture, to promote the stability of chip testing.
The embodiment of the invention provides a kind of test fixture, which includes:
First circuit board, the first circuit board include that the first chip bonding pad, the first connector bonding pad and test are drawn
Foot bonding pad；First chip bonding pad is for being arranged chip；The pad of first connector bonding pad and described first
The corresponding electrical connection of the pad of chip bonding pad, the pad of the test pin bonding pad and the pad of first chip bonding pad
Corresponding electrical connection；
First connector, first connector are welded in first connector bonding pad；
Test pin, the test pin are welded in the test pin bonding pad.
Optionally, the first connector bonding pad includes: the first subregion and the second subregion；
Spacing between first subregion and second subregion is matched with the size of the chip.
Optionally, the lead pin pitch of the connector is equal with the lead pin pitch of the chip.
Optionally, the first circuit board further include: multiple resistance bonding pads, the resistance bonding pad are connected in series in institute
It states between the pad of the first chip bonding pad and the pad of the test pin bonding pad.
Optionally, two pad solders of the resistance bonding pad are together；
Alternatively, the test fixture further includes multiple resistance, the multiple resistance is corresponding to be welded in the multiple resistance company
Meet area.
Optionally, test fixture further include: test bench, the test bench are welded in first chip bonding pad, institute
Test bench is stated for installing the chip.
Optionally, the test fixture further include:
First connector bonding pad and first chip bonding pad are located at the two sides of the first circuit board；
The test fixture further includes second circuit board and row's needle, and the second circuit board is set to the first circuit board
One side close to first chip bonding pad；The second circuit board includes that the second chip bonding pad is connected with second row needle
Area；Second chip bonding pad is set to one side of the second circuit board far from the first circuit board；The second row
The electrical connection corresponding with the pad of second chip bonding pad of the pad of needle bonding pad；
The first circuit board further includes first row needle bonding pad, the pad of first row needle bonding pad and described first
The corresponding electrical connection of the pad of chip bonding pad；First row needle bonding pad and second row needle bonding pad pass through row's needle
Electrical connection；
The test bench is welded in second chip bonding pad.
Optionally, test fixture further include: the second connector, second connector are matched with first connector
Grafting.
Optionally, test fixture further include: tertiary circuit plate and third connector；
The tertiary circuit plate includes: the second connector bonding pad and cd-rom recorder bonding pad, the second connector connection
Weld the third connector in area；The pad of second connector bonding pad electricity corresponding with the pad of the cd-rom recorder bonding pad
Connection.
Optionally, which further includes flexible circuit board and the 4th connector, one end of the flexible circuit board with
The first connector connection, the other end of the flexible circuit board are connect with the 4th connector.
For the embodiment of the present invention by setting first circuit board, the first connector and test pin, first circuit board includes the
One chip bonding pad, the first connector bonding pad and test pin bonding pad, the pad of test pin bonding pad and the first chip
The corresponding electrical connection of the pad of bonding pad, test pin is welded in test pin bonding pad, compared with prior art, without testing
Lead-out wire is welded on circuit board, but is drawn the signal of chip pin by test pin, improves the stabilization of chip testing
Property.And lead-out wire is welded without using thinner soldering iron, welding difficulty is reduced, the damage to test circuit board is avoided,
To reduce the cost of chip testing.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of test fixture provided in an embodiment of the present invention；
Fig. 2 is a kind of overlooking structure diagram of first circuit board provided in an embodiment of the present invention；
Fig. 3 is a kind of present invention looks up structural representation of first circuit board provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of another test fixture provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of another test fixture provided in an embodiment of the present invention；
Fig. 6 is a kind of overlooking structure diagram of second circuit board provided in an embodiment of the present invention；
Fig. 7 is a kind of present invention looks up structural representation of second circuit board provided in an embodiment of the present invention；
Fig. 8 is the structural schematic diagram of another test fixture provided in an embodiment of the present invention；
Fig. 9 is a kind of overlooking structure diagram of tertiary circuit plate provided in an embodiment of the present invention；
Figure 10 is a kind of present invention looks up structural representation of tertiary circuit plate provided in an embodiment of the present invention；
Figure 11 is the structural schematic diagram of another test fixture provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
The embodiment of the invention provides a kind of test fixtures.Fig. 1 is a kind of test fixture provided in an embodiment of the present invention
Structural schematic diagram, Fig. 2 are a kind of overlooking structure diagram of first circuit board provided in an embodiment of the present invention, and Fig. 3 is the present invention
A kind of present invention looks up structural representation for first circuit board that embodiment provides.Referring to figures 1-3, which includes: the first electricity
Road plate 10, the first connector 20 and test pin 30.First circuit board 10 includes the first chip bonding pad 11, the first connector company
Meet area 12 and test pin bonding pad 13；First chip bonding pad 11 is for being arranged chip；The weldering of first connector bonding pad 12
Disk electrical connection corresponding with the pad of the first chip bonding pad 11, the pad of test pin bonding pad 13 and the first chip bonding pad 11
The corresponding electrical connection of pad.First connector 20 is welded in the first connector bonding pad 12.Test pin 30 is welded in test and draws
Foot bonding pad 13.
Wherein, connector is also known as connector, and connector may include male seat and base.Illustratively, the test fixture
Including two the first connectors 20, the first connector 20 can be welded on first circuit board 10 for the male seat in connector, male seat
On, it is electrically connected with the circuit realization on first circuit board 10.Base is welded on test circuit board, with the electricity on test circuit board
Realize electrical connection in road.It is that chip 40 is welded on the first of first circuit board 10 using the process that the test fixture is tested
The base grafting in the male seat and test circuit board of the test fixture of chip 40 will be welded, to circuit board in chip bonding pad 11
Power up test is carried out, test pin 30 is connected to the output signal for observing chip pin in measuring instrument.
The embodiment of the present invention passes through setting first circuit board 10, the first connector 20 and test pin 30, first circuit board
10 include the first chip bonding pad 11, the first connector bonding pad 12 and test pin bonding pad 13, test pin bonding pad 13
Pad electrical connection corresponding with the pad of the first chip bonding pad 11, test pin 30 is welded in test pin bonding pad 13, with
The prior art is compared, and without welding lead-out wire on test circuit board, but passes through test pin 30 for the signal of chip pin
It draws, improves the stability of the test of chip 40.And lead-out wire is welded without using thinner soldering iron, it is difficult to reduce welding
Degree avoids the damage to test circuit board, to reduce the cost of chip testing.
On the basis of the various embodiments described above, optionally, test fixture further include: the second connector, the second connector with
First connector 20 matches grafting.Wherein, the second connector for example can be base.The mistake tested using the test fixture
Second connector is welded on test circuit board by Cheng Wei, and the first chip that chip 40 is welded on first circuit board 10 is connected
Area 11 will be welded the base grafting in the male seat and test circuit board of the test fixture of chip 40, power on to circuit board
Test pin 30 is connected to the output signal that chip pin is observed in measuring instrument by test.
With continued reference to Fig. 2 and Fig. 3, on the basis of the various embodiments described above, optionally, the first connector bonding pad 12 packet
Include: the first subregion and the second subregion, the spacing between the first subregion and the second subregion are matched with the size of chip 40.It is exemplary
Ground, chip 40 can be (the single-level cell of single layer cell nand flash memory chip 40 that packing forms are TSOP48
NAND flash, SLC NAND flash), the number of pads of the first subregion is 24, and the number of pads of the second subregion is 24,
One first connector 20 is respectively welded on first subregion and the second subregion.Spacing between first subregion and the second subregion to seal
Dress form is that the pin of the chip 40 of TSOP48 can be directly welded on the pad of the first subregion and the second subregion.
It should be noted that in the above embodiments, being two with the quantity of the first connector 20 and being illustrated, not
Four the first connectors 20 can also be arranged in other embodiments in limitation of the invention, in practical applications can basis
It is set.
On the basis of the various embodiments described above, optionally, between the lead pin pitch of the first connector 20 and the pin of chip 40
Away from equal, correspondingly, the lead pin pitch of the second connector is equal with the lead pin pitch of chip 40, so that the second connector energy
It is enough welded on test circuit board, is welded on the pad for welding chip 40, is conducive to the welding of the second connector.
With continued reference to Fig. 2 and Fig. 3, on the basis of the various embodiments described above, optionally, first circuit board 10 further include: more
A resistance bonding pad 14, resistance bonding pad 14 are connected in series in pad and the test pin bonding pad 13 of the first chip bonding pad 11
Pad between.Wherein resistance bonding pad 14 avoids test pin 30 for welding kesistance to increase build-out resistor in circuit
Upper test signal overshoot it is excessive, to test signal be finely adjusted.
On the basis of the various embodiments described above, optionally, two pad solders of resistance bonding pad 14 are together；Alternatively,
Test fixture further includes multiple resistance, and multiple resistance correspondences are welded in multiple resistance bonding pads 14.Wherein, when test signal is not required to
When being finely adjusted, two pads for connecting resistance are shorted together, is equivalent between two pads and is connected by conducting wire.When
Test signal is when needing to be finely adjusted, in corresponding first chip bonding pad 11 pad and test pin bonding pad 13 in it is right
Build-out resistor is welded between two pads of the resistance bonding pad 14 between the pad answered.
Fig. 4 is the structural schematic diagram of another test fixture provided in an embodiment of the present invention, referring to fig. 4, in above-mentioned each reality
On the basis of applying example, optionally, the test fixture further include: test bench 50, test bench 50 are welded in the first chip bonding pad, survey
It tries seat 50 and is used for chip 40.Illustratively, if the packing forms of chip 40 are TSOP48, test bench 50 is the folder of TSOP48
Tool, when chip 40, chip 40 can be pressed on test bench 50, it is not necessary that chip 40 is welded on circuit boards, thus
Facilitate the replacement of chip 40.
Fig. 5 is the structural schematic diagram of another test fixture provided in an embodiment of the present invention, and Fig. 6 mentions for the embodiment of the present invention
A kind of overlooking structure diagram of the second circuit board supplied, Fig. 7 are a kind of facing upward for second circuit board provided in an embodiment of the present invention
Depending on structural schematic diagram.Referring to Fig. 5-Fig. 7, on the basis of the various embodiments described above, optionally, the first connector bonding pad 12 and
One chip bonding pad 11 is located at the two sides of first circuit board 10.Test fixture further includes second circuit board 60 and row's needle (figure
It is not shown in 5- Fig. 7), second circuit board 60 is set to first circuit board 10 close to the one side of the first chip bonding pad 11；Second
Circuit board 60 includes the second chip bonding pad 61 and second row needle bonding pad 65；Second chip bonding pad 61 is set to second circuit
One side of the plate 60 far from first circuit board 10；The pad of second row needle bonding pad 65 is corresponding with the pad of the second chip bonding pad 61
Electrical connection.Test bench 50 is welded in the second chip bonding pad 61.With continued reference to Fig. 2 and Fig. 3, first circuit board 10 further includes first
Arrange needle bonding pad 15, the electrical connection corresponding with the pad of the first chip bonding pad 11 of the pad of first row needle bonding pad 15；First row
Needle bonding pad 15 is electrically connected with second row needle bonding pad 65 by arranging needle.The embodiment of the present invention on first circuit board 10 by setting
It sets first row needle bonding pad 15 and second circuit board 60 is electrically connected, test bench 50 is welded on second circuit board 60, is not necessarily to core
Piece 40 welds on circuit boards, to facilitate the replacement of chip 40.
With continued reference to Fig. 6 and Fig. 7, on the basis of the various embodiments described above, optionally, the size of second circuit board 60 is greater than
The size of first circuit board 10, second circuit board 60 further include the second test pin bonding pad 63, the second test pin bonding pad
63 pad is electrically connected with the pad of the second chip bonding pad 61.The size that second circuit board plate 60 is arranged in the embodiment of the present invention is big
In the size of first circuit board 10, be conducive to test bench 50 and be welded on second circuit board plate 60, and on second circuit board 60
Second test pin bonding pad 63 is set, the test to test point is facilitated.
Fig. 8 is the structural schematic diagram of another test fixture provided in an embodiment of the present invention, and Fig. 9 mentions for the embodiment of the present invention
A kind of overlooking structure diagram of the tertiary circuit plate supplied, Figure 10 are a kind of facing upward for tertiary circuit plate provided in an embodiment of the present invention
Depending on structural schematic diagram.Referring to Fig. 8-Figure 10, on the basis of the various embodiments described above, optionally, which further includes third
Circuit board 70 and third connector 80.Tertiary circuit plate 70 includes: the second connector bonding pad 71 and cd-rom recorder bonding pad 72, and
Weld third connector 80 in two connector bonding pads 71；The pad of second connector bonding pad 71 and the weldering of cd-rom recorder bonding pad 72
The corresponding electrical connection of disk.
Wherein, illustratively, the first connector 20 is male seat, and third connector 80 is base.Using the test fixture into
The process of row burning is that will be welded with the third of the first connector 20 and tertiary circuit plate 70 of the first circuit board 10 of chip 40
Connector 80 is plugged in together, and tertiary circuit plate 70 is electrically connected with cd-rom recorder, and cd-rom recorder is to 40 recordable paper of chip.Test is controlled
Tool setting tertiary circuit plate 70 and third connector 80, it is not necessary that chip 40 is welded from first circuit board 10, the first circuit
Plate 10 is directly attached by tertiary circuit plate 70 with cd-rom recorder, is facilitated and is carried out burning text to chip 40 during the test
Part.
Figure 11 is the structural schematic diagram of another test fixture provided in an embodiment of the present invention.Referring to Figure 11, which is controlled
Tool further includes flexible circuit board 90 and the 4th connector 91, and one end of flexible circuit board 90 (does not show with the first connector in Figure 11
It connects out), the other end of flexible circuit board 90 is connect with the 4th connector 91.Illustratively, the 4th connector 91 can be flat
The male seat of ordinary telegram cable connector, base are welded on test circuit board.It is using the process that the test fixture is tested, by core
Piece 40 is welded on the first chip bonding pad 11 of first circuit board 10, and the male seat and test of the test fixture of chip 40 will be welded
Base grafting on circuit board carries out power up test to circuit board, test pin 30 is connected in measuring instrument and observes chip
The output signal of pin.
The embodiment of the present invention passes through setting first circuit board 10, the first connector 20 and test pin 30, first circuit board
10 include the first chip bonding pad 11, the first connector bonding pad 12 and test pin bonding pad 13, test pin bonding pad 13
Pad electrical connection corresponding with the pad of the first chip bonding pad 11, test pin 30 is welded in test pin bonding pad 13, with
The prior art is compared, and without welding lead-out wire on test circuit board, but passes through test pin 30 for the signal of chip pin
It draws, improves the stability of the test of chip 40.And lead-out wire is welded without using thinner soldering iron, it is difficult to reduce welding
Degree avoids the damage to test circuit board, to reduce the cost of chip testing.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of test fixture characterized by comprising
First circuit board, the first circuit board include that the first chip bonding pad, the first connector bonding pad and test pin connect
Meet area；First chip bonding pad is for being arranged chip；The pad of first connector bonding pad and first chip
The corresponding electrical connection of the pad of bonding pad, the pad of the test pin bonding pad are corresponding with the pad of first chip bonding pad
Electrical connection；
First connector, first connector are welded in first connector bonding pad；
Test pin, the test pin are welded in the test pin bonding pad.
2. test fixture according to claim 1, which is characterized in that the first connector bonding pad include: the first subregion and
Second subregion；
Spacing between first subregion and second subregion is matched with the size of the chip.
3. test fixture according to claim 1, which is characterized in that the lead pin pitch of the connector and the chip
Lead pin pitch is equal.
4. test fixture according to claim 1, which is characterized in that the first circuit board further include: multiple resistance connect
Area is met, the resistance bonding pad is connected in series in the pad of first chip bonding pad and the weldering of the test pin bonding pad
Between disk.
5. test fixture according to claim 4, which is characterized in that
Two pad solders of the resistance bonding pad are together；
Alternatively, the test fixture further includes multiple resistance, the multiple resistance correspondence is welded in the multiple resistance bonding pad.
6. test fixture according to claim 1, which is characterized in that further include: test bench, the test bench are welded in institute
The first chip bonding pad is stated, the test bench is for installing the chip.
7. test fixture according to claim 6, which is characterized in that further include:
First connector bonding pad and first chip bonding pad are located at the two sides of the first circuit board；
The test fixture further includes second circuit board and row's needle, and it is close that the second circuit board is set to the first circuit board
The one side of first chip bonding pad；The second circuit board includes the second chip bonding pad and second row needle bonding pad；Institute
It states the second chip bonding pad and is set to one side of the second circuit board far from the first circuit board；The second row needle connection
The electrical connection corresponding with the pad of second chip bonding pad of the pad in area；
The first circuit board further includes first row needle bonding pad, the pad of first row needle bonding pad and first chip
The corresponding electrical connection of the pad of bonding pad；First row needle bonding pad is electrically connected with second row needle bonding pad by row's needle
It connects；
The test bench is welded in second chip bonding pad.
8. test fixture according to claim 1, which is characterized in that further include: the second connector, second connector
Grafting is matched with first connector.
9. test fixture according to claim 1, which is characterized in that further include: tertiary circuit plate and third connector；
The tertiary circuit plate includes: the second connector bonding pad and cd-rom recorder bonding pad, the weldering of second connector bonding pad
Connect the third connector；The pad of second connector bonding pad is corresponding with the pad of the cd-rom recorder bonding pad to be electrically connected
It connects.
10. test fixture according to claim 1, which is characterized in that further include flexible circuit board and the 4th connector, institute
The one end for stating flexible circuit board is connect with first connector, the other end of the flexible circuit board and the 4th connector
Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811553424.5A CN109342933A (en) | 2018-12-18 | 2018-12-18 | A kind of test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811553424.5A CN109342933A (en) | 2018-12-18 | 2018-12-18 | A kind of test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109342933A true CN109342933A (en) | 2019-02-15 |
Family
ID=65304465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811553424.5A Pending CN109342933A (en) | 2018-12-18 | 2018-12-18 | A kind of test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109342933A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341677A (en) * | 2020-02-27 | 2020-06-26 | 广东安创信息科技开发有限公司 | Firmware modification system and method |
| CN112763754A (en) * | 2019-11-04 | 2021-05-07 | 航天科工惯性技术有限公司 | Connecting device |
| CN113671351A (en) * | 2021-08-24 | 2021-11-19 | 苏州乐芯科技有限公司 | Chip test substrate and chip test system |
| CN113866590A (en) * | 2021-09-03 | 2021-12-31 | 长江存储科技有限责任公司 | Detection piece and chip detection method |
| CN114552249A (en) * | 2022-01-17 | 2022-05-27 | 广东机电职业技术学院 | Debugging adapter plate and connector |
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| CN113671351A (en) * | 2021-08-24 | 2021-11-19 | 苏州乐芯科技有限公司 | Chip test substrate and chip test system |
| CN113866590A (en) * | 2021-09-03 | 2021-12-31 | 长江存储科技有限责任公司 | Detection piece and chip detection method |
| CN113866590B (en) * | 2021-09-03 | 2023-09-26 | 长江存储科技有限责任公司 | Detection part and chip detection method |
| CN114552249A (en) * | 2022-01-17 | 2022-05-27 | 广东机电职业技术学院 | Debugging adapter plate and connector |
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