CN111341677A - Firmware modification system and method - Google Patents
Firmware modification system and method Download PDFInfo
- Publication number
- CN111341677A CN111341677A CN202010124113.8A CN202010124113A CN111341677A CN 111341677 A CN111341677 A CN 111341677A CN 202010124113 A CN202010124113 A CN 202010124113A CN 111341677 A CN111341677 A CN 111341677A
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- chip
- bonding pad
- pins
- firmware
- modification system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/61—Installation
- G06F8/63—Image based installation; Cloning; Build to order
Abstract
The invention discloses a firmware modification system and a realization method thereof, wherein the method comprises the following steps: step S1, taking down the memory chip to be modified from the chip bonding pad, and separating the memory chip from the chip bonding pad; step S2, processing the separated chip and chip bonding pad to obtain clean chip and chip bonding pad; step S3, selecting a burning seat corresponding to the type of the chip, wherein pins on the burning seat correspond to the pins of the chip on the bonding pad one by one; and step S4, selecting a low-resistance pure copper enameled wire or an insulated silver wire, and respectively and correspondingly welding the low-resistance pure copper enameled wire or the insulated silver wire on the chip bonding pad and the pins of the burning seat.
Description
Technical Field
The present invention relates to the field of electronic devices, and in particular, to a firmware modification system and method.
Background
In the electronic and computer arts, firmware refers to a particular class of software that provides the underlying control for particular hardware. Typical hardware devices that contain firmware include embedded devices, home appliances, computers, computer peripherals, and the like. The firmware is typically stored in the NVM of the hardware device, typically the NVM internal to the chip, or the NVM packaged with the chip.
In some cases, it may be necessary to modify the firmware in the device, and most devices perform corresponding security checks on the firmware, in which case, the modification of the firmware may be performed in two ways: 1. the firmware is modified after safety verification, because the modification of the firmware usually needs to be carried out for a plurality of times of modification test operation, each time of operation needs to be carried out safety verification one by one, and especially, the modification of the firmware often cannot be successful if the firmware is forgotten or has safety verification errors sometimes; 2. another method is to extract firmware by unsoldering a memory chip to modify the firmware, generally, when the firmware needs to be modified, the memory chip needs to be detached from a pad, the firmware is modified and then soldered to perform a test, if the test fails, the memory chip needs to be detached from the pad again to continue the firmware modification and then soldered to perform the test, and the process is repeated for many times.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a firmware modification system and a firmware modification method, which can effectively protect a pcb and a memory chip from being damaged, can repeatedly take down the memory chip for firmware burning, are convenient and quick, and greatly improve the working efficiency.
In order to achieve the purpose, the invention provides a firmware modification system which comprises a chip bonding pad and a burning seat corresponding to the model of a chip, wherein the chip bonding pad is taken off from the chip to be modified, pins on the burning seat correspond to chip pins on the chip bonding pad one by one, and low-resistance pure copper enameled wires or insulated silver wires are selected and are respectively and correspondingly welded on the chip bonding pad and the pins of the burning seat to form the firmware modification system.
Preferably, the line length of the low-resistance pure copper enameled wire or insulated silver wire is controlled within 10 CM.
Preferably, after removing the insulating layers at the two ends of the low-resistance pure copper enameled wire or the insulating silver wire, the processed wires are respectively and correspondingly welded on the chip bonding pad and the pins of the burning seat by adopting a spot welding mode.
Preferably, the welding temperature is controlled to be about 350 degrees.
Preferably, the low resistance pure copper enameled or insulated silver wire and solder joint are secured using a hot melt adhesive or other insulating adhesive.
Preferably, after the firmware modification system is completed, the corresponding pin of the chip with the modified firmware is placed on the corresponding pin of the burning seat, and the power-on test is performed.
In order to achieve the above object, the present invention further provides a method for implementing a firmware modification system, including the following steps:
step S1, taking down the memory chip to be modified from the chip bonding pad, and separating the memory chip from the chip bonding pad;
step S2, processing the separated chip and chip bonding pad to obtain clean chip and chip bonding pad;
step S3, selecting a burning seat corresponding to the type of the chip, wherein pins on the burning seat correspond to the pins of the chip on the bonding pad one by one;
and step S4, selecting a low-resistance pure copper enameled wire or an insulated silver wire, and respectively and correspondingly welding the low-resistance pure copper enameled wire or the insulated silver wire on the chip bonding pad and the pins of the burning seat.
Preferably, in step S1, a hot air gun and a welding gun are used, during the unsoldering, the components around the memory chip are protected by an insulating and heat-insulating tape, the temperature of the hot air gun is adjusted to be about 370 ℃, the air outlet is about one centimeter away from the top of the memory chip, the hot air gun is held by hand to uniformly heat the pins of the memory chip, and the memory chip is taken down from the chip pad.
Preferably, in step S4, a low-resistance pure copper enameled wire or an insulated silver wire is selected, the length of the wire is controlled within 10CM, the insulating layers at two ends of the wire are removed, the number of the wires is consistent with the number of the pins of the memory chip, and the processed wires are respectively and correspondingly welded on the chip bonding pad and the pins of the burning seat by adopting a spot welding method.
Preferably, after step S4, the method further includes the following steps:
and step S5, placing the corresponding pins of the chip with the modified firmware on the corresponding pins of the burning seat, and electrifying for starting up the test.
Compared with the prior art, the firmware modification system and the firmware modification method have the advantages that the welding spots of the chip welding pads are connected to the chip burning seats of the corresponding models in a flying line mode, so that the pcb and the storage chip can be effectively protected from being damaged, meanwhile, the chip can be repeatedly taken down from the burning seats for burning the firmware, the firmware is simply, conveniently and quickly burnt, the working efficiency is greatly improved, the hardware is protected from being damaged, and the cost is reduced.
Drawings
FIG. 1 is a system architecture diagram of a firmware modification system of the present invention;
FIG. 2 is a flowchart illustrating steps of a method for implementing a firmware modification system according to the present invention.
Detailed Description
Other advantages and capabilities of the present invention will be readily apparent to those skilled in the art from the present disclosure by describing the embodiments of the present invention with specific embodiments thereof in conjunction with the accompanying drawings. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention.
In the research, the risk of equipment damage can be effectively reduced by adopting an in-vitro culture mode, the bonding pads on the pcb and the pins of the corresponding chip burning seat are welded in a flying line mode through low-resistance pure copper enameled wires and are fixed by hot melt adhesive, so that the storage chip can be placed in the chip burning seat, the normal and stable work of the equipment can be ensured when the flying line distance does not exceed a certain range, the chip can also be taken out of the burning seat, the burning of the firmware is repeatedly carried out, the cost can be reduced, and a large amount of repeated unsoldering time is saved.
FIG. 1 is a system architecture diagram of a firmware modification system according to the present invention. As shown in fig. 1, a firmware modification system of the present invention includes: a chip bonding pad 1 and a burning seat 2 corresponding to the model of the chip.
The chip bonding pad 1 is a bonding pad corresponding to a chip to be subjected to firmware modification, and the chip is taken down from the chip bonding pad; the firmware modification system is characterized in that the burning seat 2 corresponds to the type of a chip to be modified, pins on the burning seat 2 correspond to pins of the chip on a chip bonding pad one by one, low-resistance pure copper enameled wires or insulated silver wires are selected and are correspondingly welded on the chip bonding pad of the pcb and the pins of the burning seat respectively, so that the firmware modification system is formed. After the firmware modification system is finished, the corresponding pins of the chip with the modified firmware can be placed on the corresponding pins of the burning seat, and the power-on test is carried out. Therefore, by the firmware modification system, when the firmware is modified, the memory chip does not need to be repeatedly welded on and taken off the chip bonding pad, so that not only is the hardware product protected, but also the firmware modification time is saved.
FIG. 2 is a flowchart illustrating steps of a method for implementing a firmware modification system according to the present invention. As shown in fig. 2, the method for implementing a firmware modification system of the present invention includes the following steps:
and step S1, taking the memory chip to be modified from the chip bonding pad, and separating the memory chip from the chip bonding pad.
In the specific embodiment of the invention, a hot air gun and a welding gun are utilized to remove a storage chip, the chip packaging system which can be generally used for flying line connection is TSSOP-8, TSSOP-16, TSOP-8, TSOP-16 and the like, the packaging of the types has the advantages of longer pins, less quantity, wide application range and lower operation difficulty, components around the chip can be protected by an insulating heat-insulating adhesive tape during welding disassembly, the hot air gun is prevented from blowing away, the temperature of the hot air gun is adjusted to be about 370 ℃, an air outlet is about one centimeter above the chip, the hot air gun is held by hand to rotate along the pins of the chip at a constant speed along the same direction, the pins of the chip are uniformly heated, and the other hand is used for holding an anti-static pointed tweezers to clamp the main body of the chip and slightly lifting the main body of the chip to take the storage chip down.
And step S2, processing the separated chip and chip bonding pad to obtain a clean chip and chip bonding pad. Specifically, after the memory chip is taken down and cooled to room temperature, an electric iron is used for removing redundant soldering tin on the pins and the pcb pad, lead-free soldering tin is formed, the temperature of the electric iron is adjusted to be about 340 ℃, lead soldering tin is adjusted to be about 360 ℃, a tin absorption belt is matched with the electric iron to absorb residual soldering tin, and after cooling, absolute ethyl alcohol or board washing water is used for cleaning the chip and the pad.
And step S3, selecting a burning seat corresponding to the type of the chip, wherein pins on the burning seat correspond to the pins of the chip on the bonding pad one by one.
And step S4, selecting a low-resistance pure copper enameled wire or an insulated silver wire, and respectively and correspondingly welding the low-resistance pure copper enameled wire or the insulated silver wire on the chip bonding pad and the pins of the burning seat. In the specific embodiment of the invention, a low-resistance pure copper enameled wire or an insulated silver wire is selected, the length of the wire is controlled within 10CM, insulating layers at two ends of the wire are removed, the number of the wire is consistent with that of pins of a memory chip, the processed wire is respectively welded on a chip bonding pad and the pins of a burning seat correspondingly, a spot welding mode is adopted, and the temperature is controlled to be about 350 ℃. Preferably, a hot melt adhesive or other insulating adhesive is also used to secure the wires and solder joints to prevent the solder joints from falling off.
And step S5, placing the corresponding pins of the chip with the modified firmware on the corresponding pins of the burning seat, and electrifying the starting test to finish the firmware modification.
Therefore, the welding points of the chip welding pads are connected to the chip burning seats of the corresponding models in a flying wire mode, so that the pcb and the storage chip can be effectively protected from being damaged, meanwhile, the chip can be repeatedly taken down from the burning seats for firmware burning, the method is simple, convenient and quick, the working efficiency is greatly improved, the hardware is protected from being damaged, and the cost is reduced.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.
Claims (10)
1. A firmware modification system, characterized by: the system comprises a chip bonding pad and a burning seat corresponding to the type of a chip, wherein the chip bonding pad is taken down from the chip to be subjected to firmware modification, pins on the burning seat correspond to chip pins on the chip bonding pad one to one, a low-resistance pure copper enameled wire or an insulated silver wire is selected and correspondingly welded on the chip bonding pad and the pins of the burning seat respectively, and the firmware modification system is formed.
2. A firmware modification system as claimed in claim 1, wherein: the length of the low-resistance pure copper enameled wire or the insulated silver wire is controlled within 10 CM.
3. A firmware modification system as claimed in claim 2, wherein: and after removing the insulating layers at the two ends of the low-resistance pure copper enameled wire or the insulating silver wire, respectively and correspondingly welding the processed wires on the chip bonding pad and the pins of the burning seat by adopting a spot welding mode.
4. A firmware modification system as claimed in claim 3, wherein: the welding temperature is controlled to be about 350 ℃.
5. A firmware modification system as claimed in claim 4, wherein: and fixing the low-resistance pure copper enameled wire or the insulated silver wire and the welding point by using a hot melt adhesive or other insulating adhesives.
6. A firmware modification system as claimed in claim 4, wherein: and after the firmware modification system is finished, placing the corresponding pin of the chip with the modified firmware on the corresponding pin of the burning seat, and electrifying for starting up the test.
7. A method for implementing a firmware modification system comprises the following steps:
step S1, taking down the memory chip to be modified from the chip bonding pad, and separating the memory chip from the chip bonding pad;
step S2, processing the separated chip and chip bonding pad to obtain clean chip and chip bonding pad;
step S3, selecting a burning seat corresponding to the type of the chip, wherein pins on the burning seat correspond to the pins of the chip on the bonding pad one by one;
and step S4, selecting a low-resistance pure copper enameled wire or an insulated silver wire, and respectively and correspondingly welding the low-resistance pure copper enameled wire or the insulated silver wire on the chip bonding pad and the pins of the burning seat.
8. A method for implementing a firmware modification system as claimed in claim 7, wherein: in step S1, a hot air gun and a welding gun are used, and when the welding is detached, the components around the memory chip are protected by an insulating heat-insulating tape, the temperature of the hot air gun is adjusted to be about 370 ℃, the air outlet is spaced about one centimeter above the memory chip, the pins of the memory chip are uniformly heated by holding the hot air gun, and the memory chip is taken down from the chip bonding pad.
9. A method for implementing a firmware modification system as claimed in claim 7, wherein: in step S4, a low-resistance pure copper enameled wire or an insulated silver wire is selected, the length of the wire is controlled within 10CM, the insulating layers at two ends of the wire are removed, the number of the wires is consistent with the number of the pins of the memory chip, and the processed wires are respectively and correspondingly welded on the chip bonding pad and the pins of the burning seat by adopting a spot welding mode.
10. The method of claim 9, further comprising, after step S4, the steps of:
and step S5, placing the corresponding pins of the chip with the modified firmware on the corresponding pins of the burning seat, and electrifying for starting up the test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010124113.8A CN111341677A (en) | 2020-02-27 | 2020-02-27 | Firmware modification system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010124113.8A CN111341677A (en) | 2020-02-27 | 2020-02-27 | Firmware modification system and method |
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| CN111341677A true CN111341677A (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010124113.8A Pending CN111341677A (en) | 2020-02-27 | 2020-02-27 | Firmware modification system and method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543175A (en) * | 2010-12-17 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Fixture for burning basic input output system (BIOS) memory chip |
| CN205003657U (en) * | 2015-08-25 | 2016-01-27 | 广东九联科技股份有限公司 | Chip program debugging tool |
| CN109342933A (en) * | 2018-12-18 | 2019-02-15 | 北京兆易创新科技股份有限公司 | A kind of test fixture |
-
2020
- 2020-02-27 CN CN202010124113.8A patent/CN111341677A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543175A (en) * | 2010-12-17 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Fixture for burning basic input output system (BIOS) memory chip |
| CN205003657U (en) * | 2015-08-25 | 2016-01-27 | 广东九联科技股份有限公司 | Chip program debugging tool |
| CN109342933A (en) * | 2018-12-18 | 2019-02-15 | 北京兆易创新科技股份有限公司 | A kind of test fixture |
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Application publication date: 20200626 |