CN111353183A - Decryption method of encryption equipment - Google Patents
Decryption method of encryption equipment Download PDFInfo
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- CN111353183A CN111353183A CN202010124127.XA CN202010124127A CN111353183A CN 111353183 A CN111353183 A CN 111353183A CN 202010124127 A CN202010124127 A CN 202010124127A CN 111353183 A CN111353183 A CN 111353183A
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- chip
- memory chip
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- cracked
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000005336 cracking Methods 0.000 claims abstract description 28
- 238000003860 storage Methods 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 58
- 238000005476 soldering Methods 0.000 claims description 37
- 229910052742 iron Inorganic materials 0.000 claims description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 8
- 230000006870 function Effects 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/78—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure storage of data
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/71—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information
- G06F21/72—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information in cryptographic circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Physics & Mathematics (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a cracking method of encryption equipment, which comprises the following steps: step S1, acquiring a main control chip and a storage chip of the encryption equipment to be cracked, and information and a model of an equipment manufacturer; step S2, selecting products of the same type similar to the memory chip of the main control chip of the encryption equipment to be decrypted according to the information obtained in the step S1; step S3, the storage chip of the encryption equipment to be cracked is disassembled and cleaned; step S4, detaching the storage chips in the products of the same type selected in the step S2, and cleaning the bonding pads; step S5, welding the disassembled memory chip of the encryption equipment to be cracked to the bonding pad of the product of the same type processed in the step S4; and step S6, electrifying the same type of products welded with the memory chips of the encryption equipment to be cracked and connecting the products to the electronic equipment to obtain the file contents successfully cracked.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a cracking method of encryption equipment.
Background
Although the smart phone is a necessary product at present, the market of the recording pen is still wide, the core lies in that the recording function of the mobile phone is difficult to meet various requirements under complex recording environments, and the requirements on tone quality, recording distance, confidentiality and the like are met, so that the requirements of the recording pen are not reduced.
At present, recording pens on the market have similar basic functions, most of the recording pens have encryption functions, and after passwords are set, recording files cannot be divulged. Some devices adopt a hardware encryption scheme, but for general medium and low-end digital products (such as a recording pen and an encrypted U disk), the hardware encryption scheme is rarely adopted, and a software encryption scheme is often adopted.
In some cases, for example, if a user does not use a recording file for a long time, the user may forget the password, and the recording pen using the encryption function needs to be cracked.
For a product encrypted by software, cracking software is generally adopted for cracking at present, however, when the traditional cracking software is used for cracking an encrypted product, the content of a flash memory chip needs to be extracted, a reverse main control algorithm is adopted, sector data needs to be recovered, the cost is very high, the time consumption is long, no copying performance exists, different products need to be cracked in a one-to-one mode, and meanwhile, the possibility of data loss or incompleteness exists.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a cracking method of an encryption device, so as to achieve the purpose of cracking with low cost and high efficiency by replacing an unencrypted master control.
In order to achieve the above object, the present invention provides a cracking method of an encryption device, comprising the following steps:
step S1, acquiring a main control chip and a storage chip of the encryption equipment to be cracked, and information and a model of an equipment manufacturer;
step S2, selecting products of the same type similar to the memory chip of the main control chip of the encryption equipment to be decrypted according to the information obtained in the step S1;
step S3, the storage chip of the encryption equipment to be cracked is disassembled and cleaned;
step S4, detaching the storage chips in the products of the same type selected in the step S2, and cleaning the bonding pads;
step S5, welding the disassembled memory chip of the encryption equipment to be cracked to the bonding pad of the product of the same type processed in the step S4;
and step S6, electrifying the same type of products welded with the memory chips of the encryption equipment to be cracked and connecting the products to the electronic equipment to obtain the file contents successfully cracked.
Preferably, in step S2, a product with the same type of function as that of the same manufacturer as the main control chip and the memory chip of the to-be-decrypted encryption device is selected as the product of the same type.
Preferably, in step S3, the memory chip of the device to be cracked is detached by a hot air gun and cleaned by a welding gun.
Preferably, in step S3, when the mass storage chip is detached, the components around the storage chip are protected by the insulating and heat-insulating tape; then, adjusting the temperature of a hot air gun to be about 370 ℃, enabling an air outlet to be about one centimeter away from the upper part of the memory chip, holding the hot air gun by hand to rotate along the pins of the memory chip at a constant speed in the same direction to uniformly heat the pins of the chip, clamping the main body of the memory chip by using an anti-static pointed-end tweezers, slightly lifting up to take the memory chip off a bonding pad, or inserting an operation blade into the bottom of the memory chip, slightly rotating, and taking down the memory chip; taking down the memory chip, cooling to room temperature, and removing redundant soldering tin on the pins and the bonding pads; and after cooling, cleaning the memory chip and the bonding pad.
Preferably, the temperature of the lead-free soldering iron is adjusted to be about 340 ℃, the temperature of the lead soldering iron is adjusted to be about 360 ℃, and the residual soldering tin is sucked away by the tin sucking belt matched with the soldering iron.
Preferably, after cooling, the memory chip and the bonding pad are cleaned with absolute alcohol or board washing water.
Preferably, in step S4, the storage chip in the same type of product is detached and the pads are cleaned in the same way as in step S3.
Preferably, in step S5, a solder-dragging method is used for the memory chip with many bonding pins.
Preferably, in step S5, after aligning the chip pin with the pad, fixing a pin with an appropriate amount of solder by using an electric iron; then coating proper amount of soldering flux or soldering paste on the pins at the two sides; using an electric soldering iron, preheating, then, supplying a certain amount of tin on the pin at one side, holding the electric soldering iron by hand, dragging the electric soldering iron towards the pin in one direction by using the bent part of the iron burning nozzle, so that the soldering tin is uniformly attached to the pin and the bonding pad, and the pin at the other side is well soldered in the same way; and finally, removing the excessive soldering tin by using a tin absorbing belt matched with an electric soldering iron.
Preferably, an elbow iron nozzle is adopted, and the temperature of the electric iron is adjusted to be about 380 ℃.
Compared with the prior art, the cracking method of the encryption equipment adopts a simple storage chip replacing method aiming at the encryption equipment which does not adopt a hardware encryption mode, namely, the same type of products are selected, and the encrypted storage chip is replaced by the unencrypted storage chip, so that the high-efficiency, reproducible and low-cost software encryption type product cracking can be realized, the cost and time required by cracking are reduced, and the cracking success rate is improved.
Drawings
Fig. 1 is a flowchart illustrating steps of a cracking method of an encryption device according to the present invention.
Detailed Description
Other advantages and capabilities of the present invention will be readily apparent to those skilled in the art from the present disclosure by describing the embodiments of the present invention with specific embodiments thereof in conjunction with the accompanying drawings. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention.
Fig. 1 is a flowchart illustrating steps of a cracking method of an encryption device according to the present invention. As shown in fig. 1, a cracking method of an encryption device of the present invention includes the following steps:
and step S1, acquiring the main control chip and the memory chip of the encryption equipment to be cracked and the information and the model of the equipment manufacturer. In the specific embodiment of the invention, the encryption equipment to be cracked is disassembled, and the main control chip and the storage chip of the encryption equipment as well as the information and the model of the equipment manufacturer are obtained.
And step S2, selecting the same type of products similar to the main control chip and the storage chip of the encryption equipment to be decrypted. Generally, the same type of functionally similar products of the same manufacturer can be used as containers for devices to be cracked, which are not provided with any encryption.
And step S3, disassembling the storage chip of the encryption equipment to be cracked, and cleaning the storage chip. In the specific embodiment of the invention, the memory chip of the device to be cracked is detached and welded by a hot air gun and cleaned by a welding gun.
For a large-capacity memory chip, the packaging format is generally TSSOP-48, TSSOP-56 and the like, when the chip is detached, the components around the chip can be protected by an insulating and heat-insulating adhesive tape to prevent the components from being blown away by a hot air gun; then, the temperature of the hot air gun is adjusted to be about 370 ℃, the air outlet is about one centimeter away from the upper part of the chip, the hot air gun is held by hands to rotate along the pins of the chip at a constant speed in the same direction, so that the pins of the chip are uniformly heated, the other hand holds an anti-static pointed-end tweezers to clamp the main body of the chip, the chip can be taken down from the pcb by slightly lifting upwards, or an operation blade is inserted into the bottom of the chip and slightly rotated, and the chip is taken down; taking down the chip, cooling to room temperature, removing redundant soldering tin on the pins and the pcb pad by using an electric soldering iron, adjusting the temperature of a lead-free soldering iron to be about 340 ℃, adjusting the temperature of lead soldering tin to be about 360 ℃, and sucking away residual soldering tin by using a tin sucking belt matched with the electric soldering iron; after cooling, the chip and bonding pad are cleaned with absolute alcohol or plate washing water.
And step S4, detaching the storage chips in the products of the same type selected in the step S2, and cleaning the bonding pads.
In the embodiment of the present invention, the method for detaching the memory chips in this step is the same as that in step S3, that is, the memory chips in the products of the same type are detached and welded by using a heat gun, which is not described herein again.
And step S5, welding the disassembled memory chip of the encryption equipment to be cracked to the bonding pad of the same type of product processed in the step S4.
In the embodiment of the invention, for a memory chip with many welding pins, a tin dragging method is generally adopted, specifically, after the chip pins are aligned with bonding pads, a proper amount of soldering tin is dripped by an electric iron to fix one pin; then coating proper amount of soldering flux or soldering paste on the pins at the two sides; the method comprises the following steps of (1) adjusting the temperature of an electric iron to be about 380 ℃ by using an elbow iron nozzle, preheating, and then supplying a certain amount of tin to a pin on one side, wherein the amount of the tin is more than that of the tin in common spot welding; and finally, removing the excessive soldering tin by using a tin absorbing belt matched with an electric soldering iron.
And step S6, electrifying the same type of products welded with the memory chips of the encryption equipment to be cracked and connecting the products to the electronic equipment to obtain the file contents successfully cracked. In the embodiment of the invention, the products of the same type processed in the step S5 are powered on and connected to the usb, a new removable storage device appears when the computer is opened, and the device is directly read without password verification when the device is opened, that is, all files stored in the encryption device to be decrypted are obtained, so that decryption is completed.
In summary, the cracking method of the encryption device of the present invention adopts a simple storage chip replacement method for the encryption device without adopting a hardware encryption manner, that is, the same type of product is selected, and the encrypted storage chip is replaced with the unencrypted storage chip, so that the high-efficiency, reproducible and low-cost software encryption product cracking can be realized, the cost and time required for cracking can be reduced, and the cracking success rate can be improved.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.
Claims (10)
1. A cracking method of an encryption device comprises the following steps:
step S1, acquiring a main control chip and a storage chip of the encryption equipment to be cracked, and information and a model of an equipment manufacturer;
step S2, selecting products of the same type similar to the memory chip of the main control chip of the encryption equipment to be decrypted according to the information obtained in the step S1;
step S3, the storage chip of the encryption equipment to be cracked is disassembled and cleaned;
step S4, detaching the storage chips in the products of the same type selected in the step S2, and cleaning the bonding pads;
step S5, welding the disassembled memory chip of the encryption equipment to be cracked to the bonding pad of the product of the same type processed in the step S4;
and step S6, electrifying the same type of products welded with the memory chips of the encryption equipment to be cracked and connecting the products to the electronic equipment to obtain the file contents successfully cracked.
2. The method for cracking an encryption device according to claim 1, wherein: in step S2, a product with the same type of function as that of the main control chip and the memory chip of the encryption device to be decrypted is selected as the product of the same type.
3. The method for cracking an encryption device according to claim 1, wherein: in step S3, the memory chip of the device to be cracked is detached and welded by a hot air gun and cleaned by a welding gun.
4. A cracking method of an encryption device according to claim 3, characterized in that: in step S3, when the large-capacity memory chip is to be detached, the insulating and heat-insulating tape is used to protect the components around the memory chip; then, adjusting the temperature of a hot air gun to be about 370 ℃, enabling an air outlet to be about one centimeter away from the upper part of the memory chip, holding the hot air gun by hand to rotate along the pins of the memory chip at a constant speed in the same direction to uniformly heat the pins of the chip, clamping the main body of the memory chip by using an anti-static pointed-end tweezers, slightly lifting up to take the memory chip off a bonding pad, or inserting an operation blade into the bottom of the memory chip, slightly rotating, and taking down the memory chip; taking down the memory chip, cooling to room temperature, and removing redundant soldering tin on the pins and the bonding pads; and after cooling, cleaning the memory chip and the bonding pad.
5. The method for cracking an encryption device according to claim 4, wherein: the temperature of the lead-free soldering iron is adjusted to be about 340 ℃, the temperature of the lead soldering iron is adjusted to be about 360 ℃, and the residual soldering tin is sucked away by the tin sucking belt matched with the electric soldering iron.
6. The method for cracking an encryption device according to claim 4, wherein: and after cooling, cleaning the storage chip and the bonding pad by using absolute ethyl alcohol or board washing water.
7. The method for cracking an encryption device according to claim 4, wherein: in step S4, the memory chip in the same type of product is removed and the pads are cleaned in the same manner as in step S3.
8. The method for cracking an encryption device according to claim 4, wherein: in step S5, a solder stripping method is used for the memory chip with many bonding pins.
9. The method for cracking an encryption device according to claim 8, wherein: in step S5, after aligning the chip pin with the pad, fixing a pin with an appropriate amount of solder paste by an electric iron; then coating proper amount of soldering flux or soldering paste on the pins at the two sides; using an electric soldering iron, preheating, then, supplying a certain amount of tin on the pin at one side, holding the electric soldering iron by hand, dragging the electric soldering iron towards the pin in one direction by using the bent part of the iron burning nozzle, so that the soldering tin is uniformly attached to the pin and the bonding pad, and the pin at the other side is well soldered in the same way; and finally, removing the excessive soldering tin by using a tin absorbing belt matched with an electric soldering iron.
10. The method for cracking an encryption device according to claim 9, wherein: the elbow iron nozzle is adopted, and the temperature of the electric iron is adjusted to be about 380 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010124127.XA CN111353183A (en) | 2020-02-27 | 2020-02-27 | Decryption method of encryption equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010124127.XA CN111353183A (en) | 2020-02-27 | 2020-02-27 | Decryption method of encryption equipment |
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| Publication Number | Publication Date |
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| CN111353183A true CN111353183A (en) | 2020-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010124127.XA Pending CN111353183A (en) | 2020-02-27 | 2020-02-27 | Decryption method of encryption equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112446057A (en) * | 2020-12-03 | 2021-03-05 | 广州数智网络科技有限公司 | Method for breaking certain software encryption type encryption product at low cost |
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