CN112055480A

CN112055480A - Firmware modification system and implementation method thereof

Info

Publication number: CN112055480A
Application number: CN202010937340.2A
Authority: CN
Inventors: 綦颖; 高剑锋; 杨坚; 李炳生; 谭健铸
Original assignee: Guangzhou Digital Network Technology Co ltd
Current assignee: Guangzhou Digital Network Technology Co ltd
Priority date: 2020-09-08
Filing date: 2020-09-08
Publication date: 2020-12-08

Abstract

The invention discloses a firmware modification system and a realization method thereof, which comprises the steps of taking down a memory chip to be subjected to firmware modification from a chip bonding pad, and separating the memory chip from the chip bonding pad; selecting a burning seat corresponding to the chip bonding pad and the corresponding chip model; the pins on the burning seat and the chip pins on the chip bonding pad are arranged in a one-to-one correspondence mode and are electrically connected through flying wires. The implementation method of the firmware modification system comprises the following steps: the storage chip is taken down from the chip bonding pad, the burning seat corresponds to the type of the chip to be subjected to firmware modification, pins on the burning seat correspond to pins of the storage chip on the chip bonding pad one by one, flying wires are selected and are respectively welded on the pins in the one-to-one correspondence to be connected and conducted, and welding spots of the chip bonding pad are connected to the burning seat of the chip with the corresponding type in a flying wire mode.

Description

Firmware modification system and implementation method thereof

Technical Field

The invention relates to the technical field of electronic equipment, in particular to a firmware modification system and an implementation method thereof.

Background

In the electronic and computer arts, firmware refers to a particular class of software that provides the underlying control for particular hardware. Typical hardware devices that contain firmware include embedded devices, home appliances, computers, computer peripherals, and the like. The firmware is typically stored in the NVM of the hardware device, typically the NVM internal to the chip, or the NVM packaged with the chip.

In some cases, it may be necessary to modify the firmware in the device, and most devices perform corresponding security checks on the firmware, in which case, the modification of the firmware may be performed in two ways: 1. the firmware is modified after safety verification, because the modification of the firmware usually needs to be carried out for a plurality of times of modification test operation, each time of operation needs to be carried out safety verification one by one, and especially, the modification of the firmware often cannot be successful if the firmware is forgotten or has safety verification errors sometimes; 2. another method is to extract firmware by unsoldering a memory chip to modify the firmware, generally, when the firmware needs to be modified, the memory chip needs to be detached from a pad, the firmware is modified and then soldered to perform a test, if the test fails, the memory chip needs to be detached from the pad again to continue the firmware modification and then soldered to perform the test, and the process is repeated for many times.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the firmware modification system and the implementation method thereof are provided, the memory chip can be repeatedly taken down for firmware burning, convenience and rapidness are realized, and the pcb and the memory chip are effectively protected from being damaged.

In order to solve the technical problem, the invention provides a firmware modification system, which comprises a chip bonding pad, a chip and a firmware modification module, wherein the chip is used for taking down a memory chip to be subjected to firmware modification from the chip bonding pad and separating the memory chip from the chip bonding pad; and selecting pins on the burning seat and chip pins on the chip bonding pad to be arranged in a one-to-one correspondence manner and electrically connected through flying wires.

Preferably, the flying wire is a low-resistance pure copper enameled wire or an insulated silver wire.

Preferably, the flying length is controlled within 10 cm.

The invention also discloses a real method of the firmware modification system, which comprises the following steps:

s1: determining a memory chip to be subjected to firmware modification, taking the memory chip down from a chip bonding pad, and separating the memory chip from the chip bonding pad in a unsoldering way;

s2: processing the separated memory chip and the chip bonding pad to obtain a clean chip and a clean chip bonding pad;

s3: selecting a burning seat corresponding to the type of the chip, wherein the number of pins on the burning seat is equal to that of the chip pins on the bonding pad, and the pins are arranged in a one-to-one correspondence manner;

s4: and the pins of the chip bonding pad and the pins of the burning seat are in one-to-one corresponding conduction connection through flying wires.

Preferably, in step S1, the specific steps of the unsoldering separation are: the components and parts around the memory chip are protected by the insulating heat-insulating adhesive tape, the hot air gun is held by hand, the air outlet of the hot air gun is aligned to the pins of the memory chip for uniform heating, and the memory chip falls off from the chip bonding pad after being heated.

Preferably, the heating temperature of the heat gun is controlled to be 350-380 ℃, and the distance separating the alignment pins is 0.5-1.5 cm.

Preferably, the flying wire is a low-resistance pure copper enameled wire or an insulated silver wire, and the length of the wire is controlled within 10 cm.

Preferably, the insulating layers at two ends of the wire are removed, the number of the wire is consistent with that of the pins of the memory chip, and the processed wire is respectively and correspondingly welded on the pins of the chip bonding pad and the pins of the burning seat in a spot welding mode.

Preferably, the heating temperature of the heat gun is controlled to be 370 degrees, and the distance between pins aligned at intervals is 0.5-1.5 cm.

Preferably, step S5 is further provided after step S4, in which the corresponding pin of the storage chip with the modified firmware is placed on the corresponding pin of the burning socket, and a power-on test is performed.

The invention has the technical effects that: according to the firmware modification system and the implementation method thereof, the welding points of the chip welding pads are connected to the chip burning seats of the corresponding models in a flying wire mode, so that the pcb and the storage chip can be effectively protected from being damaged, meanwhile, the chip can be repeatedly taken down from the burning seats for burning the firmware, the firmware modification system is simple, convenient and quick, the working efficiency is greatly improved, the hardware of the chip is protected from being damaged, and the cost is reduced.

Drawings

FIG. 1 is a system architecture diagram of a firmware modification system of the present invention;

FIG. 2 is a flowchart illustrating steps of a method for implementing a firmware modification system according to the present invention.

Detailed Description

Other advantages and capabilities of the present invention will be readily apparent to those skilled in the art from the present disclosure by describing the embodiments of the present invention with specific embodiments thereof in conjunction with the accompanying drawings. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention.

As shown in fig. 1, a firmware modification system of the present invention includes: a chip bonding pad 1 and a burning seat 2 corresponding to the model of the chip.

Firstly, taking down the memory chip from the chip bonding pad 1; the burning seat 2 is a burning seat corresponding to the type of the chip to be modified, pins on the burning seat 2 correspond to pins of the storage chip on the chip bonding pad 1 one by one, flying leads are selected and are respectively welded on the corresponding pins of the chip bonding pad 1 and the burning seat 2 of the pcb in a corresponding connection mode, and the firmware modification system is formed.

In the specific embodiment of the invention, the flying wire is selected from a low-resistance pure copper enameled wire or an insulated silver wire, the length of the wire is controlled within 10cm, insulating layers at two ends of the wire are removed, the number of the wire is consistent with that of pins of a memory chip, the processed wire is respectively welded on the chip bonding pad 1 of the pcb and the pins of the burning seat 2 correspondingly, and the wire and the welding point can be respectively welded by adopting a spot welding mode, and a hot melt adhesive or other insulating adhesives can be used for fixing the wire and the welding point. After the firmware modification system is completed, the corresponding pin of the memory chip after the firmware modification can be placed on the corresponding pin of the burning seat 2, and the power-on test is carried out. Therefore, by the firmware modification system, when the firmware is modified, the memory chip does not need to be repeatedly welded on and taken off the chip bonding pad, so that not only is the hardware product protected, but also the firmware modification time is saved.

FIG. 2 is a flowchart illustrating steps of a method for implementing a firmware modification system according to the present invention. As shown in fig. 2, the method for implementing a firmware modification system of the present invention includes the following steps:

and step S1, taking the memory chip to be modified from the chip bonding pad, and separating the memory chip from the chip bonding pad.

In the embodiment of the invention, the chip packaging standards which can be generally used for flying wire connection are TSSOP-8, TSSOP-16, TSOP-8, TSOP-16 and the like by using a hot air gun and a welding gun and removing a storage chip, the package of the type has longer pins, less quantity, wide application range, lower operation difficulty and less time for detaching and welding, the device around the chip can be protected by an insulating heat-insulating adhesive tape to prevent the device from being blown away by a hot air gun, the temperature of the hot air gun is adjusted to be about 350-380 degrees, preferably about 370 degrees, the air outlet is 0.5-1.5cm away from the upper part of the chip, preferably about 1cm, the hot air gun is held by a hand to rotate along the pins of the memory chip in the same direction at a constant speed to uniformly heat the pins of the memory chip, and the other hand is held by an anti-static pointed-end tweezers to clamp the chip body and slightly lift up the chip to take the memory chip from the chip bonding pad 1 of the pcb.

Step S2, the separated memory chip and die pad 1 are processed to obtain a clean memory chip and die pad 1. Specifically, after the memory chip is taken down and cooled to room temperature, an electric iron is used for removing the pins and the redundant soldering tin on the pcb chip bonding pad 1, the lead-free soldering tin is formed, the temperature of the electric iron is adjusted to be about 340 ℃, the lead soldering tin is adjusted to be about 360 ℃, a tin absorption belt is matched with the electric iron to absorb the residual soldering tin, and after cooling, absolute alcohol or board washing water is used for cleaning the chip and the bonding pad.

And step S3, selecting a burning seat corresponding to the type of the chip, wherein the pins on the burning seat 2 correspond to the pins of the chip on the bonding pad one by one.

And step S4, selecting a low-resistance pure copper enameled wire or an insulated silver wire as the flying wire, and respectively and correspondingly welding the flying wire on the chip bonding pad 1 and the pins of the burning seat 2. In the specific embodiment of the invention, a low-resistance pure copper enameled wire or an insulated silver wire is selected, the length of the wire is controlled within 10cm, insulating layers at two ends of the wire are removed, the number of the wire is consistent with that of pins of a memory chip, the processed wire is respectively welded on the chip bonding pad 1 and the pins of the burning seat 2 correspondingly, and the wire is respectively welded by adopting a spot welding mode, wherein the temperature is controlled to be about 350 ℃. Preferably, a hot melt adhesive or other insulating adhesive is also used to secure the flying leads to the solder joints to prevent the solder joints from falling off.

Step S5, placing the corresponding pin of the memory chip with the modified firmware on the corresponding pin of the burning socket 2, and performing a power-on test to complete the firmware modification.

The invention adopts the mode of 'in vitro culture', can effectively reduce the risk of equipment damage, welds the chip bonding pad 1 on the pcb and the pin of the corresponding chip burning seat 2 through the low-resistance pure copper enameled wire, and fixes the chip bonding pad and the pin by hot melt adhesive, so that the memory chip can be placed in the chip burning seat 2, the normal and stable work of the equipment can be ensured when the flying distance does not exceed a certain range, and the chip can be taken out of the burning seat to repeatedly burn the firmware, thereby reducing the cost and saving a large amount of time for repeatedly removing and welding.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.

Claims

1. A firmware modification system is characterized in that a memory chip to be subjected to firmware modification is taken down from a chip bonding pad, and the memory chip is separated from the chip bonding pad; and selecting pins on the burning seat and chip pins on the chip bonding pad to be arranged in a one-to-one correspondence manner and electrically connected through flying wires.

2. The firmware modification system of claim 1, wherein the flying lead is a low resistance pure copper enameled or insulated silver wire.

3. The firmware modification system of claim 1, wherein the fly-line length is controlled to within 10 cm.

4. A method for implementing a firmware modification system, comprising the steps of:

5. The method of claim 4, wherein in step S1, the step of separating the welding parts comprises: the components and parts around the memory chip are protected by the insulating heat-insulating adhesive tape, the hot air gun is held by hand, the air outlet of the hot air gun is aligned to the pins of the memory chip for uniform heating, and the memory chip falls off from the chip bonding pad after being heated.

6. The method as claimed in claim 5, wherein the heating temperature of the heat gun is controlled to be 380 degrees and the distance from the alignment pin is 0.5-1.5 cm.

7. A realistic method of a firmware modification system as claimed in claim 4, wherein the flying wire is selected from a low-resistance pure copper enameled wire or an insulated silver wire, and the wire length is controlled within 10 cm.

8. The method of claim 7, wherein the insulation layers at two ends of the wire are removed, the number of the wire is the same as the number of the pins of the memory chip, and the processed wire is respectively and correspondingly welded to the pins of the chip pad and the pins of the burn rack by spot welding.

9. The method of claim 4, wherein the step S2 includes the following steps: after the memory chip is taken down and cooled to the room temperature, the pins and the pcb are cleaned by an electric iron, redundant soldering tin on the chip bonding pad is removed, the temperature of the electric iron is adjusted to be about 340 ℃ for lead-free soldering tin, the temperature of the electric iron is adjusted to be about 360 ℃ for lead soldering tin, a tin absorption belt is matched with the electric iron to absorb the residual soldering tin, and after the memory chip and the chip bonding pad are cooled, the memory chip and the chip bonding pad are respectively cleaned by absolute ethyl alcohol or board washing water.

10. The method of claim 5, wherein the step S4 is further followed by a step S5: and placing the corresponding pin of the storage chip with the modified firmware on the corresponding pin of the burning seat, and electrifying for starting up the test.