CN105472959A - BGA repairing encapsulation method - Google Patents
BGA repairing encapsulation method Download PDFInfo
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- CN105472959A CN105472959A CN201410448579.8A CN201410448579A CN105472959A CN 105472959 A CN105472959 A CN 105472959A CN 201410448579 A CN201410448579 A CN 201410448579A CN 105472959 A CN105472959 A CN 105472959A
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Abstract
The invention relates to a BGA repairing encapsulation method, which comprises the steps of: 1) removing a BGA chip to be repaired on a printed circuit board; 2) cleaning welding pads on the printed circuit board; 3) coating a soldering paste and a soldering flux on the printed circuit board; 4) surface-mounting a new BGA chip, and aligning each solder ball on the new BGA chip with the corresponding welding pad on the printed circuit board; 5) and adopting a set repairing reflow soldering curve to perform hot air reflow soldering processing on the surface-mounted circuit board and the new BGA chip. Compared with the prior art, the BGA repairing encapsulation method has the advantages of increasing qualified rate and performance of the BGA and the like.
Description
Technical field
The present invention relates to a kind of PCB technology, especially relate to a kind of BGA package method.
Background technology
The nineties is along with the use of the progress of integrated technology, the improvement of equipment and deep sub-micron technique, LSI, VLSI, ULSI occur in succession, and silicon Single-Chip Integration degree improves constantly, and require stricter to integrated antenna package, I/O number of pins sharply increases, and power consumption also increases thereupon.For the needs of satisfied development, on original encapsulation kind basis, add again new kind---BGA Package, is called for short BGA (BallGridArrayPackage).
Once there is becoming the optimal selection of the high density of the VLSI chip such as CPU, north and south bridge, high-performance, multi-functional and high I/O pin package in BGA.Its advantage has:
Although 1, I/O number of pins increases, pin-pitch much larger than QFP, thus improves assembly yield;
Although 2 its power consumptions increase, BGA with the welding of control collapsed chip method, can be called for short C4 and welds, thus can improve its electric heating property;
3, Thickness Ratio QFP reduces more than 1/2, weight saving more than 3/4;
4, parasitic parameter reduces, and signal transmission delay is little, and frequency of utilization improves greatly;
5, assemble available coplanar welding, reliability is high.
Existing BGA package is unsatisfactory in situation of many times welding, and have impact on qualification rate and the serviceability of product.
Summary of the invention
Object of the present invention be exactly in order to overcome above-mentioned prior art exist defect and provide the BGA of a kind of BGA of raising qualification rate and performance to reprocess method for packing.
Object of the present invention can be achieved through the following technical solutions:
A kind of BGA reprocesses method for packing, comprises the following steps:
1) bga chip to be repaired on printed circuit board (PCB) is removed;
2) pad on clean printed circuit board (PCB);
3) solder paste application, scaling powder on a printed circuit;
4) new bga chip is mounted, each solder ball on new bga chip and the pad alignment on printed circuit board (PCB);
5) the Reflow Soldering curve of reprocessing of setting is adopted to carry out hot air reflux weldering process to attachment printed circuit board (PCB) and new bga chip.
Described soldering paste comprises RMA soldering paste, exempts from soldering paste and water-soluble soldering paste clearly.
Step 5) in, described Reflow Soldering curve of reprocessing comprises preheating zone, the thermal treatment zone, recirculating zone and cooling zone, and programming rate and the cooling rate of reprocessing Reflow Soldering curve meet the following conditions:
Temperature is below 100 DEG C, and maximum programming rate is less than or equal to 6 DEG C/s; Temperature is more than 100 DEG C, and maximum programming rate is less than or equal to 3 DEG C/s; In cooling zone, maximum cooling rate is less than or equal to 6 DEG C/s.
Step 5) in, in described hot air reflux weldering, also comprise:
The bottom-heated of printed circuit board (PCB).
The mode of described printed circuit board (PCB) bottom-heated comprises Hot-blast Heating and infrared heating.
The Reflow Soldering curve negotiating of reprocessing of described setting obtains with under type:
The printed wiring board scrapped need 4 angles of the bga chip changed and middle part 5 through holes are set, temperature sensor is embedded in the centre of printed wiring board and bga chip by described through hole, carry out preheating successively, heat up, constant temperature, melt weldering, reflow process, and specimens preserving process temperature curve, temperature sensor gathers each phase temperature, judge whether each phase temperature meets the requirements, if, then using processing procedure temperature curve as reprocessing Reflow Soldering curve, if not, then according to each phase temperature adjustment processing procedure temperature curve, using the processing procedure temperature curve after adjustment as reprocessing Reflow Soldering curve.
In execution step 1) before, also comprise:
The preheating of printed circuit board (PCB), bga chip to be repaired.
Compared with prior art, the present invention has the following advantages:
1, the present invention obtain setting reprocess Reflow Soldering curve time, by temperature sensor adjustment curve accuracy, ensure that heating-up temperature and the uniformity of BGA package, improve the performance of BGA package;
2, the BGA that the present invention adopts reprocesses the welding effect that method for packing effectively can improve BGA, thus improves the quality of BGA package.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.The present embodiment is implemented premised on technical solution of the present invention, give detailed execution mode and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
The embodiment of the present invention provides a kind of BGA to reprocess method for packing, comprises the following steps:
1) preheating of printed circuit board (PCB) (PCB), bga chip to be repaired, the main purpose of preheating is removed by moisture, if the moisture very little (as chip is just sealed off) in circuit board and BGA, this step can be exempted.
2) bga chip to be repaired on printed circuit board (PCB) is removed.If the BGA removed does not intend to reuse, and PCB can bear high temperature, remove BGA and can adopt higher temperature, to shorten heating cycle.
3) pad on clean printed circuit board (PCB), cleans out scaling powder, the soldering paste of staying PCB surface after dismounting BGA, must use satisfactory cleaning agent.In order to ensure the soldering reliability of BGA, generally can not use the residual soldering paste on pad, old soldering paste must be disposed, unless BGA formed BGA solder ball again.Because BGA volume is little, particularly CSP (or μ BGA), volume is less, and clean pad is more difficult, so when reprocessing CSP, if the surrounding space of CSP is very little, just need use rinse-free flux.
4) solder paste application, scaling powder on a printed circuit.PCB being coated with soldering paste and having material impact for the result of reprocessing of BGA, by choosing the template conformed to BGA, can easily soldering paste be coated with on circuit boards.For CSP, there are 3 kinds of soldering paste to select: RMA soldering paste, exempt from soldering paste and water-soluble soldering paste clearly.Use RMA soldering paste, return time can slightly be grown, and use no-clean solder paste, it is lower that reflux temperature should select.
5) new bga chip is mounted, each solder ball on new bga chip and the pad alignment on printed circuit board (PCB).
6) the Reflow Soldering curve of reprocessing of setting is adopted to carry out hot air reflux weldering process to attachment printed circuit board (PCB) and new bga chip.Hot air reflux weldering is the key of whole Rework Technics.Described Reflow Soldering curve of reprocessing comprises preheating zone, the thermal treatment zone, recirculating zone and cooling zone, and four interval temperature, time parameters can set respectively, and programming rate and the cooling rate of reprocessing Reflow Soldering curve meet the following conditions:
Temperature is below 100 DEG C, and maximum programming rate is less than or equal to 6 DEG C/s; Temperature is more than 100 DEG C, and maximum programming rate is less than or equal to 3 DEG C/s; In cooling zone, maximum cooling rate is less than or equal to 6 DEG C/s.
Because too high programming rate and cooling rate all may damage PCB and BGA, this damage is that naked eyes can not be observed sometimes.Different BGA, different soldering paste, should select different acid extractions.Reflux temperature as CBGA should higher than the reflux temperature of PBGA, and 90Pb/10Sn should select higher reflux temperature compared with 63Sn/37Pb soldering paste.To disposable soldering paste, its activity is lower than non-disposable soldering paste.Therefore, welding temperature is unsuitable too high, and weld time is unsuitable long, to prevent the oxidation of solder grain.
The Reflow Soldering curve negotiating of reprocessing of described setting obtains with under type:
The printed wiring board scrapped need 4 angles of the bga chip changed and middle part 5 through holes are set, temperature sensor is embedded in the centre of printed wiring board and bga chip by described through hole, carry out preheating successively, heat up, constant temperature, melt weldering, reflow process, and specimens preserving process temperature curve, temperature sensor gathers each phase temperature, judge whether each phase temperature meets the requirements, if, then using processing procedure temperature curve as reprocessing Reflow Soldering curve, if not, then according to each phase temperature adjustment processing procedure temperature curve, using the processing procedure temperature curve after adjustment as reprocessing Reflow Soldering curve.
Reprocess Reflow Soldering curve to adjust especially by following steps:
1, early stage preheating and an intensification Duan Weiyi part, the effect of this part is the temperature difference reducing pcb, remove moisture to prevent from bubbling, prevent the effect of cause thermal damage, general temperature requirement is: when the temperature of second segment constant temperature time end of run test tin will meet: unleaded 160 ~ 175 DEG C, have plumbous 145 ~ 160 DEG C.If higher, the intensification section temperature drift of just explanation setting, can reduce a little by the temperature of intensification section or time shorten is a little.If on the low side, the temperature of preheating section and intensification section can be increased a little or time lengthening.If the time of first paragraph preheating can be added the longer plank that toasts by the resting period longer pcb plate do not toasted remove moisture.
2, constant temperature zone is a part, and the temperature setting of general constant temperature zone is lower than intensification section, and such object is exactly allow the temperature of tin ball inside keep one slowly to heat up reach the effect of constant temperature.The effect of this part is to activate scaling powder, removes the oxide of metal surface to be welded and the volatile matter of skin covering of the surface and solder flux itself, strengthens wetting effect, reduces the effect of the temperature difference.The temperature of the actual test tin of that general constant temperature zone meets: unleaded 170 ~ 185 DEG C, has plumbous 145 ~ 160 DEG C.If higher, thermostat temperature can be reduced, thermostat temperature can be added if on the low side higher.If it is long or too short to go out warm-up time at the temperature analysis recorded, solution can be adjusted by lengthening or shortening the constant temperature zone time.
3, melt weldering and reflow is a part, this part is the fusion making tin ball and pcb pad good, and what that mainly will reach in this section is that welding peak value meets: unleaded 235 ~ 245 DEG C, have 210 ~ 220 DEG C, lead.If record temperature drift, can reduce melt weldering section temperature or shortening melt weldering section time.If it is on the low side to record temperature, can increase melt weldering section temperature or lengthening melt weldering section time.The time that common bga chip melts weldering section was limited with 100 seconds, that is the time is added when temperature is on the low side, more than 100 seconds temperature or on the low side time just select to increase and melt weldering section temperature, if just reached desired peak so can change to 75 seconds the 4th period by 75 seconds.
In described hot air reflux weldering, also comprise: the bottom-heated of printed circuit board (PCB).The object of this heating has two: avoid the one side due to PCB be heated and produce warpage and distortion; Make the time shorten of solder paste melts.Reprocess the BGA of larger size panel, this bottom-heated is even more important.The mode of described printed circuit board (PCB) bottom-heated comprises Hot-blast Heating and infrared heating.The advantage of Hot-blast Heating is homogeneous heating, and the suggestion of general Rework Technics adopts this heating, and it is uneven that the shortcoming of infrared heating is that PCB is heated.
When carrying out hot air reflux weldering process, the hot air reflux nozzle that choose.Hot air reflux nozzle belongs to non-contact thermal, relies on high temperature air stream that the solder of each solder joint on BGA is melted simultaneously during heating.Ensure there is stable temperature environment in whole reflux course, adjacent devices can be protected not damaged by advection heat air backheating simultaneously.
The present invention uses VJELECTRONIXSUMMIT1800SYSTEM to come BGA package according to curve temperature at different levels, its advantage is exactly the distortion that effectively can prevent pcb board, ensure that bga chip is without prejudice in maintenance process, ensure the quality in rework process, have: volume is little, energy is designing power supply and ground pin Fen Walk efficiently; It is firm to encapsulate, and does not need more senior PCB technology; Good heat dissipation properties, has the characteristic of very reasonably heat dissipating method.
Claims (7)
1. BGA reprocesses a method for packing, it is characterized in that, comprises the following steps:
1) bga chip to be repaired on printed circuit board (PCB) is removed;
2) pad on clean printed circuit board (PCB);
3) solder paste application, scaling powder on a printed circuit;
4) new bga chip is mounted, each solder ball on new bga chip and the pad alignment on printed circuit board (PCB);
5) the Reflow Soldering curve of reprocessing of setting is adopted to carry out hot air reflux weldering process to attachment printed circuit board (PCB) and new bga chip.
2. a kind of BGA according to claim 1 reprocesses method for packing, it is characterized in that, described soldering paste comprises RMA soldering paste, exempts from soldering paste and water-soluble soldering paste clearly.
3. a kind of BGA according to claim 1 reprocesses method for packing, it is characterized in that, step 5) in, described Reflow Soldering curve of reprocessing comprises preheating zone, the thermal treatment zone, recirculating zone and cooling zone, and programming rate and the cooling rate of reprocessing Reflow Soldering curve meet the following conditions:
Temperature is below 100 DEG C, and maximum programming rate is less than or equal to 6 DEG C/s; Temperature is more than 100 DEG C, and maximum programming rate is less than or equal to 3 DEG C/s; In cooling zone, maximum cooling rate is less than or equal to 6 DEG C/s.
4. a kind of BGA according to claim 1 reprocesses method for packing, it is characterized in that, step 5) in, in described hot air reflux weldering, also comprise:
The bottom-heated of printed circuit board (PCB).
5. a kind of BGA according to claim 4 reprocesses method for packing, it is characterized in that, the mode of described printed circuit board (PCB) bottom-heated comprises Hot-blast Heating and infrared heating.
6. a kind of BGA according to claim 1 reprocesses method for packing, it is characterized in that, the Reflow Soldering curve negotiating of reprocessing of described setting obtains with under type:
The printed wiring board scrapped need 4 angles of the bga chip changed and middle part 5 through holes are set, temperature sensor is embedded in the centre of printed wiring board and bga chip by described through hole, carry out preheating successively, heat up, constant temperature, melt weldering, reflow process, and specimens preserving process temperature curve, temperature sensor gathers each phase temperature, judge whether each phase temperature meets the requirements, if, then using processing procedure temperature curve as reprocessing Reflow Soldering curve, if not, then according to each phase temperature adjustment processing procedure temperature curve, using the processing procedure temperature curve after adjustment as reprocessing Reflow Soldering curve.
7. a kind of BGA according to claim 1 reprocesses method for packing, it is characterized in that, in execution step 1) before, also comprise:
The preheating of printed circuit board (PCB), bga chip to be repaired.
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| CN201410448579.8A CN105472959A (en) | 2014-09-04 | 2014-09-04 | BGA repairing encapsulation method |
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| CN201410448579.8A CN105472959A (en) | 2014-09-04 | 2014-09-04 | BGA repairing encapsulation method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105772889A (en) * | 2016-05-04 | 2016-07-20 | 惠州光弘科技股份有限公司 | Reflow soldering improving technology |
| CN106252237A (en) * | 2016-06-15 | 2016-12-21 | 爱普科斯科技（无锡）有限公司 | A kind of thin-film package plant ball technique |
| CN107864567A (en) * | 2017-11-07 | 2018-03-30 | 威创集团股份有限公司 | A kind of BGA repair methods, device, system |
| CN107911955A (en) * | 2017-12-13 | 2018-04-13 | 晶晨半导体(上海)股份有限公司 | A kind of chip replacing options |
| CN108356374A (en) * | 2018-01-30 | 2018-08-03 | 中国电子科技集团公司第三十八研究所 | A kind of soldering of printed boards method containing unleaded BGA device |
| CN109128420A (en) * | 2018-08-29 | 2019-01-04 | 西安中科麦特电子技术设备有限公司 | It is a kind of automatically to reprocess sealing-off method |
| CN109285785A (en) * | 2018-08-17 | 2019-01-29 | 国营芜湖机械厂 | It is a kind of based on infrared with hot wind Hybrid Heating technology BGA ball-establishing method |
| CN111212525A (en) * | 2018-11-21 | 2020-05-29 | 浙江宇视科技有限公司 | Repair positioning device |
| CN111243940A (en) * | 2020-01-15 | 2020-06-05 | 西安微电子技术研究所 | Method for removing oxidation of pins of surface mount array device |
| CN111353183A (en) * | 2020-02-27 | 2020-06-30 | 广东安创信息科技开发有限公司 | Decryption method of encryption equipment |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105772889A (en) * | 2016-05-04 | 2016-07-20 | 惠州光弘科技股份有限公司 | Reflow soldering improving technology |
| CN106252237B (en) * | 2016-06-15 | 2019-03-01 | 全讯射频科技(无锡)有限公司 | A kind of plant ball technique of thin-film package |
| CN106252237A (en) * | 2016-06-15 | 2016-12-21 | 爱普科斯科技（无锡）有限公司 | A kind of thin-film package plant ball technique |
| CN107864567A (en) * | 2017-11-07 | 2018-03-30 | 威创集团股份有限公司 | A kind of BGA repair methods, device, system |
| CN107911955A (en) * | 2017-12-13 | 2018-04-13 | 晶晨半导体(上海)股份有限公司 | A kind of chip replacing options |
| CN107911955B (en) * | 2017-12-13 | 2020-08-04 | 晶晨半导体(上海)股份有限公司 | Chip replacement method |
| CN108356374A (en) * | 2018-01-30 | 2018-08-03 | 中国电子科技集团公司第三十八研究所 | A kind of soldering of printed boards method containing unleaded BGA device |
| CN109285785A (en) * | 2018-08-17 | 2019-01-29 | 国营芜湖机械厂 | It is a kind of based on infrared with hot wind Hybrid Heating technology BGA ball-establishing method |
| CN109128420A (en) * | 2018-08-29 | 2019-01-04 | 西安中科麦特电子技术设备有限公司 | It is a kind of automatically to reprocess sealing-off method |
| CN109128420B (en) * | 2018-08-29 | 2021-03-02 | 西安中科麦特电子技术设备有限公司 | Full-automatic repair and unsolder method |
| CN111212525A (en) * | 2018-11-21 | 2020-05-29 | 浙江宇视科技有限公司 | Repair positioning device |
| CN111243940A (en) * | 2020-01-15 | 2020-06-05 | 西安微电子技术研究所 | Method for removing oxidation of pins of surface mount array device |
| CN111353183A (en) * | 2020-02-27 | 2020-06-30 | 广东安创信息科技开发有限公司 | Decryption method of encryption equipment |
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