CN107864567A - A kind of BGA repair methods, device, system - Google Patents

A kind of BGA repair methods, device, system Download PDF

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Publication number
CN107864567A
CN107864567A CN201711084535.1A CN201711084535A CN107864567A CN 107864567 A CN107864567 A CN 107864567A CN 201711084535 A CN201711084535 A CN 201711084535A CN 107864567 A CN107864567 A CN 107864567A
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CN
China
Prior art keywords
bga
printing
detin
pending
pcb pads
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Pending
Application number
CN201711084535.1A
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Chinese (zh)
Inventor
黄海兵
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Vtron Technologies Ltd
Vtron Group Co Ltd
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Vtron Group Co Ltd
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Filing date
Publication date
Application filed by Vtron Group Co Ltd filed Critical Vtron Group Co Ltd
Priority to CN201711084535.1A priority Critical patent/CN107864567A/en
Publication of CN107864567A publication Critical patent/CN107864567A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

This application discloses a kind of BGA repair methods, device, system, this method includes：BGA on failure board is heated, the BGA is pulled down from the failure board, obtains pending BGA；Printing treatment, BGA after being printed are carried out to the pending BGA using tin cream；By BGA after the printing be placed on it is pre- first pass through detin processing and on corresponding with BGA after printing PCB pads, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess operation.BGA repair methods disclosed by the invention can reduce the number that high-temperature process is carried out to bga chip, so as to reduce influence of the high temperature to bga chip, significantly improve life-span and the reliability of bga chip.

Description

A kind of BGA repair methods, device, system
Technical field
The present invention relates to PCB technology technical field, more particularly to a kind of BGA repair methods, device, system.
Background technology
But with the miniaturization of electronic product, these elements commonly encapsulated far can not meet the need of product design Will, so largely occurring BGA (Ball Grid Array, i.e. welded ball array are encapsulated) in the product, it is in encapsulation structure base board Bottom makes I/O end and PCB (Printed Circuit Board, i.e. printed substrate) mutual connection of the array soldered ball as circuit. In SMD (Surface Mounted Devices, i.e. surface mount device) processing procedure, due to many reasons, cause always to have Bad generation, such as missing solder, short circuit, so unavoidable have maintenance generation.For common SMD elements, such as Chip-R, paster electricity Hold etc., maintenance is easier, and need not configure maintenance system in addition substantially.And for BGA, then it is carried out using repair system Maintenance.
It is well known that for bga chip, temperature be the most key core to the life-span of chip and reliability effect because Element, particularly welding high temperature and work high temperature influences.However, in current BGA Rework Technics, using liner ball mode pair BGA is reprocessed and is re-soldered on board, shown in Figure 1, and such a mode needs to carry out high temperature three times to BGA bodies (260 degree) soldering, causes BGA the high-temperature expansion of high temperature bubble and circuit occur, influences bga chip reliability and longevity Life.
Therefore, how a kind of BGA repair methods are provided, to reduce influence of the high temperature to chip, improve the chip life-span and Reliability, while the efficiency of reclamation work is greatly improved, it is those skilled in the art's technical problem urgently to be resolved hurrily.
The content of the invention
In view of this, it is an object of the invention to provide a kind of BGA repair methods, to reduce influence of the high temperature to chip, Improve chip life-span and reliability.Its concrete scheme is as follows：
A kind of BGA repair methods, including：
BGA on failure board is heated, the BGA is pulled down from the failure board, treated Handle BGA；
Printing treatment, BGA after being printed are carried out to the pending BGA using tin cream；
BGA after the printing is placed on pre- first pass through detin processing and PCB corresponding with BGA after printing weldering On disk, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess operation.
Preferably, the BGA on failure board heats, by the BGA from the failure board The step of pulling down, including：
The BGA on failure board is heated using BGA Rework stations, by the BGA from the failure board On pull down.
Preferably, it is described that printing treatment is carried out to the pending BGA using tin cream, after being printed the step of BGA it Before, in addition to：
Detin processing is carried out to the pending BGA using detin device.
Preferably, it is described by BGA after the printing be placed on it is pre- first pass through detin processing and with BGA after the printing On corresponding PCB pads, by before the step of BGA after the printing and PCB pads progress soldering, also to wrap Include：
Detin processing is done to PCB pads corresponding to BGA after the printing using detin device.
Preferably, the detin device includes electric iron.
Accordingly, present invention also offers a kind of BGA device for repairing, including：
BGA heating modules, for heating to the BGA on failure board, by the BGA from the faulty board Pulled down on card, obtain pending BGA；
BGA printing modules, for carrying out printing treatment, BGA after being printed to the pending BGA using tin cream；
Welding module, for by BGA after the printing be placed on it is pre- first pass through detin processing and with after the printing Corresponding to BGA on PCB pads, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess behaviour Make.
Preferably, the device also includes：
BGA detin modules, for carrying out detin processing to the pending BGA, obtain BGA after detin.
Preferably, the device also includes：
PCB pad detin modules, for being done using detin device to PCB pads corresponding to BGA after the printing at detin Reason, obtains PCB pads after detin.
Accordingly, present invention also offers a kind of BGA repair systems, including：
BGA Rework stations, for heating to the BGA on failure board, by the BGA from the failure board On pull down, obtain pending BGA；
Printing equipment, for carrying out printing treatment, BGA after being printed to the pending BGA using tin cream；
Welding bench, for by BGA after the printing be placed on it is pre- first pass through detin processing and with BGA after the printing On corresponding PCB pads, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess operation.
Preferably, the system also includes：
Detin device, for being done to PCB pads corresponding to BGA after the printing and/or the pending BGA at detin Reason.
BGA repair methods disclosed by the invention, first, by heating to the BGA on failure board, by institute State BGA to pull down from the failure board, obtain pending BGA；Then, the pending BGA is printed using tin cream Processing, BGA after being printed；Finally, by BGA after the printing be placed on it is pre- first pass through detin processing and with the printing Afterwards corresponding to BGA on PCB pads, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess Operation.As can be seen here, compared with prior art, it can be reduced using BGA repair methods disclosed by the invention and bga chip is carried out The number of high-temperature process, so as to reduce influence of the high temperature to bga chip, life-span and the reliability of bga chip are significantly improved, In addition, BGA repair methods disclosed by the invention reduce the technological process that bga chip is reprocessed, reclamation work efficiency is improved.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of BGA repair methods flow chart disclosed in prior art；
Fig. 2 is a kind of BGA repair methods flow chart disclosed by the invention；
Fig. 3 is a kind of specific BGA repair method flow charts disclosed by the invention；
Fig. 4 is a kind of BGA device for repairing structural representation disclosed by the invention；
Fig. 5 is a kind of BGA repair systems structural representation disclosed by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made Embodiment, belong to the scope of protection of the invention.
The embodiment of the invention discloses a kind of BGA repair methods, shown in reference picture 2, this method includes：
Step S21：BGA on failure board is heated, the BGA is torn open from the failure board Under, obtain pending BGA.
Wherein, above-mentioned failure board refers to problematic pcb board card.It is understood that in this step, to above-mentioned , can be according to actual conditions before the BGA of failure board is heated, can be to corresponding if having moisture in board or bga chip Board or BGA preheated, to remove moisture.In addition, the embodiment of the present application is to utilizing which kind of device or mode to above-mentioned BGA on failure board, which is heated, does not do any restrictions, pulls down the BGA from the failure board as long as can realize .Such as Rework station can be used, heat gun can also be used.
Step S22：Printing treatment, BGA after being printed are carried out to the pending BGA using tin cream.
It should be noted that in the embodiment of the present application, on bga chip the effect of print solder paste be by bga chip and Board is reliably connected, and realizes electrically conducting, likewise, the present invention using which kind of device to above-mentioned bga chip to being printed Any restriction is not done.
Step S23：By BGA after the printing be placed on it is pre- first pass through detin processing and with BGA pairs after the printing On the PCB pads answered, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess operation.
It should be noted that in the embodiment of the present application, can be above-mentioned directly by putting by hand by BGA after above-mentioned printing On PCB pads, it can also be completed with other clamping devices.
Compared with prior art, BGA repair methods disclosed by the invention can be reduced carries out high-temperature process to bga chip Number, so as to reduce influence of the high temperature to bga chip, life-span and the reliability of bga chip are significantly improved, in addition, this hair Bright disclosed BGA repair methods reduce the technological process that bga chip is reprocessed, and improve reclamation work efficiency.
The invention discloses a kind of specific BGA repair methods, relative to a upper embodiment, the present embodiment is to technical scheme Further instruction and optimization are made.It is shown in Figure 3, specifically include following steps：
Step S31：The BGA on failure board is heated using BGA Rework stations, by the BGA from described Pulled down on failure board.
Step S32：Detin processing is carried out to the pending BGA using detin device.
It should be noted that detin processing can be carried out to above-mentioned pending BGA using soldering iron, that is, the present embodiment In detin device be soldering iron, it is clean in order to which the tin that is remained on bga chip is handled, make bga chip more smooth so that Follow-up reclamation work is more accurate.
Step S33：Printing treatment, BGA after being printed are carried out to the pending BGA using tin cream.
Step S34：Detin processing is done to PCB pads corresponding to BGA after the printing using detin device.
Wherein it is possible to detin processing is done to PCB pads corresponding to BGA after the printing using electric iron, that is, this implementation Detin device in example is electric iron.
Step S35：By BGA after the printing be placed on by above-mentioned detin processing and with BGA pairs after the printing On the PCB pads answered, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess operation.
Wherein, the related description of this step can refer to above-described embodiment.
It should be noted that the order of the step S32 and step S34 in this city embodiment can overturn, can also by this two Individual step is combined, as long as follow-up reclamation work is not influenceed.
The beneficial effect of the present embodiment can refer to above-described embodiment, will not be repeated here.
Accordingly, the embodiment of the invention discloses a kind of BGA device for repairing, shown in Figure 4, the device includes：
BGA heating modules 41, for heating to the BGA on failure board, by the BGA from the failure Pulled down on board, obtain pending BGA.
BGA printing modules 42, for carrying out printing treatment, BGA after being printed to the pending BGA using tin cream.
Welding module 43, for by BGA after the printing be placed on it is pre- first pass through detin processing and with the printing Afterwards corresponding to BGA on PCB pads, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess Operation.
It should be noted that in view of in actual conditions, it may be necessary to which pending bga chip or PCB pads are carried out Detin is handled, therefore the device can also specifically include：
Detin module, for using detin device to PCB pads corresponding to BGA after the printing and/or described pending BGA carries out detin processing.
It should be noted that it refer on the specific work process between modules in the present embodiment and beneficial effect BGA repair methods disclosed by the invention, will not be repeated here.
Accordingly, the embodiment of the invention discloses a kind of BGA repair systems, shown in Figure 5, the system includes：
BGA Rework stations 51, for heating to the BGA on failure board, by the BGA from the faulty board Pulled down on card, obtain pending BGA.
Printing equipment 52, for carrying out printing treatment, BGA after being printed to the pending BGA using tin cream.
Welding bench 53, for by BGA after the printing be placed on it is pre- first pass through detin processing and with after the printing Corresponding to BGA on PCB pads, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess behaviour Make.
Same above-described embodiment, the system can also specifically include：
Detin device 54, for being done to PCB pads corresponding to BGA after the printing and/or the pending BGA at detin Reason.
Disclosed it should be noted that refer to the present invention on the specific work process between modules in the present embodiment BGA repair methods, will not be repeated here.
Finally, it is to be noted that, herein, such as first and second or the like relational terms be used merely to by One entity or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or operation Between any this actual relation or order be present.Moreover, term " comprising ", "comprising" or its any other variant meaning Covering including for nonexcludability, so that process, method, article or equipment including a series of elements not only include that A little key elements, but also the other element including being not expressly set out, or also include for this process, method, article or The intrinsic key element of equipment.In the absence of more restrictions, the key element limited by sentence "including a ...", is not arranged Except other identical element in the process including the key element, method, article or equipment being also present.
A kind of BGA repair methods provided by the present invention, device, system are described in detail above, herein should The principle and embodiment of the present invention are set forth with specific case, the explanation of above example is only intended to help and managed Solve the method and its core concept of the present invention；Meanwhile for those of ordinary skill in the art, according to the thought of the present invention, There will be changes in embodiment and application, in summary, this specification content should not be construed as to this hair Bright limitation.

Claims (10)

  1. A kind of 1. BGA repair methods, it is characterised in that including：
    BGA on failure board is heated, the BGA is pulled down from the failure board, obtained pending BGA；
    Printing treatment, BGA after being printed are carried out to the pending BGA using tin cream；
    BGA after the printing is placed on pre- first passing through detin processing and corresponding with BGA after printing PCB pads On, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess operation.
  2. 2. BGA repair methods according to claim 1, it is characterised in that the BGA on failure board is heated Processing, the step of the BGA is pulled down from the failure board, including：
    The BGA on failure board is heated using BGA Rework stations, the BGA is torn open from the failure board Under.
  3. 3. BGA repair methods according to claim 1, it is characterised in that described to be entered using tin cream to the pending BGA Row printing treatment, after being printed the step of BGA before, in addition to：
    Detin processing is carried out to the pending BGA using detin device.
  4. 4. BGA repair methods according to claim 1, it is characterised in that described to be placed on BGA after the printing in advance By detin processing and on corresponding with BGA after printing PCB pads, so as to by BGA after the printing and PCB Before pad carries out the step of soldering, in addition to：
    Detin processing is done to PCB pads corresponding to BGA after the printing using detin device.
  5. 5. the BGA repair methods according to claim 3 or 4, it is characterised in that the detin device includes electric iron.
  6. A kind of 6. BGA device for repairing, it is characterised in that including：
    BGA heating modules, for heating to the BGA on failure board, by the BGA from the failure board Pull down, obtain pending BGA；
    BGA printing modules, for carrying out printing treatment, BGA after being printed to the pending BGA using tin cream；
    Welding module, for by BGA after the printing be placed on it is pre- first pass through detin processing and with BGA pairs after the printing On the PCB pads answered, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess operation.
  7. 7. BGA device for repairing according to claim 6, it is characterised in that also include：
    BGA detin modules, for carrying out detin processing to the pending BGA, obtain BGA after detin.
  8. 8. the BGA device for repairing stated according to claim 6, it is characterised in that also include：
    PCB pad detin modules, for doing detin processing to PCB pads corresponding to BGA after the printing using detin device, obtain PCB pads after to detin.
  9. A kind of 9. BGA repair systems, it is characterised in that including：
    BGA Rework stations, for heating to the BGA on failure board, the BGA is torn open from the failure board Under, obtain pending BGA；
    Printing equipment, for carrying out printing treatment, BGA after being printed to the pending BGA using tin cream；
    Welding bench, for by BGA after the printing be placed on it is pre- first pass through detin processing and it is corresponding with BGA after the printing PCB pads on, so as to which BGA after the printing and the PCB pads are carried out into soldering, complete BGA and reprocess operation.
  10. 10. BGA repair systems according to claim 9, it is characterised in that also include：
    Detin device, for doing detin processing to PCB pads corresponding to BGA after the printing and/or the pending BGA.
CN201711084535.1A 2017-11-07 2017-11-07 A kind of BGA repair methods, device, system Pending CN107864567A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711084535.1A CN107864567A (en) 2017-11-07 2017-11-07 A kind of BGA repair methods, device, system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711084535.1A CN107864567A (en) 2017-11-07 2017-11-07 A kind of BGA repair methods, device, system

Publications (1)

Publication Number Publication Date
CN107864567A true CN107864567A (en) 2018-03-30

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Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101207049A (en) * 2006-12-18 2008-06-25 比亚迪股份有限公司 Tin paste printing apparatus and CSP, BGA chip repairing method using the same
CN102883552A (en) * 2012-09-18 2013-01-16 奈电软性科技电子(珠海)有限公司 LGA and BGA repair process
CN105472959A (en) * 2014-09-04 2016-04-06 上海唐盛信息科技有限公司 BGA repairing encapsulation method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101207049A (en) * 2006-12-18 2008-06-25 比亚迪股份有限公司 Tin paste printing apparatus and CSP, BGA chip repairing method using the same
CN102883552A (en) * 2012-09-18 2013-01-16 奈电软性科技电子(珠海)有限公司 LGA and BGA repair process
CN105472959A (en) * 2014-09-04 2016-04-06 上海唐盛信息科技有限公司 BGA repairing encapsulation method

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Application publication date: 20180330