CN101426334B - Soldering pad construction for printed circuit board - Google Patents
Soldering pad construction for printed circuit board Download PDFInfo
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- CN101426334B CN101426334B CN200710167588XA CN200710167588A CN101426334B CN 101426334 B CN101426334 B CN 101426334B CN 200710167588X A CN200710167588X A CN 200710167588XA CN 200710167588 A CN200710167588 A CN 200710167588A CN 101426334 B CN101426334 B CN 101426334B
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- circuit board
- printed circuit
- pcb
- pin
- connector
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The present invention discloses a welding pad structure of printed circuit board, and provides a welding pad structure with a special connector structure for causing that the traction forces bear by a first pin and a second pin in reflow welding are same after a surface mount component provided with the first pin and the second pin is welded on the welding pad structure, thereby preventing the phenomenon that one pin tiles and even pricks up vertically and forms a shape alike tombstone caused by the different holding force corresponding with the welding pad in reflow welding in the prior art.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), more detailed it, relate to a kind of when preventing the printed circuit board (PCB) reflow soldered elements welding pad structure of pin perk phenomenon appears.
Background technology
Along with printed circuit board (PCB) gradually towards high-density wiring (layout), composite multi-layer, the structure essence is little, powerful and direction such as thin plateization develops, how in the PCB design process, to fully take into account the formedness of electric connection, to guarantee signal integrity, and take effective control measure, become the heat subject in the current PCB design industry.And, more seem especially important as the connection medium " welding pad structure " of printed circuit board (PCB) in order to soldering of electronic components.
At present during the wires design of printed circuit board (PCB); usually have a lot of surface adhesion components; and these surface adhesion components normally are welded on the printed circuit board (PCB) by welding pad structure, with printed circuit board (PCB) on electric connections such as other circuit or element, thereby realize the circuit function of design.
See also Fig. 1, be existing printed circuit board weld pad structural representation, as shown in the figure, existing printed circuit board weld pad structure is normally according to the size of surface adhesion components to be welded, one weld pad housing 10 is set on printed circuit board (PCB) 1, in this weld pad housing 10, be provided with a plurality of weld pad entities 12 of respective amount according to this number of pins that surface adhesion components had to be welded, and by being overlapped in the connector 14 between other circuit of this weld pad entity 12 and this welding pad structure periphery, realize that this weld pad entity 12 is connected with other circuit, this connector 14 is formed by metal material, copper for example, and the pin of surface adhesion components just is welded on this weld pad entity 12, promptly with this this surface adhesion components is electrically connected into printed circuit board (PCB) 1.Usually, be in diverse location in this printed circuit board (PCB) 1 according to this welding pad structure, or be connected to different circuit elements according to these surface adhesion components pin needs to be welded, connector 14 forms that respectively other circuit electrically connects in this weld pad entity 12 and the printed circuit board (PCB) 1 in this weld pad are different, and because the form difference of this connector 14 can cause some drawbacks.Often the situation that occurs is a surface adhesion components, for example a pin of ting model such as resistance or electric capacity element (package dimension be 0805 and less than 0805) need electrically connect with other element (not shown) in the printed circuit board (PCB) 1, and the another one pin then needs and earth terminal or power end electrically connect.So; common connector 14 electric connections that need be less with area of this situation with the weld pad entity 12 that other element in the printed circuit board (PCB) 1 electrically connects; as shown in the figure; be generally strip copper sheet structure; and will be in need large-area connector 14a being set with that weld pad entity 12 that earth terminal or power end electrically connect, and usually can be with this weld pad entity 12 and earth terminal or power end to lay the full wafer Copper Foil as this connector 14a.
Yet, two pins of the surface adhesion components of above-mentioned ting model need connect other element and earth terminal or power end in the printed circuit board (PCB) 1 respectively, because the connector 14 of each pin correspondence, 14a area difference, so, large-area connector 14a dispels the heat in follow-up reflow process comparatively fast, and connector 14 heat radiations of small size are slower, make the pull-out capacity difference at two ends, promptly be welded in the pulling force difference that the two pins on the welding pad structure is subjected to, be subjected to the less end meeting perk of pulling force, even can erect, produce so-called " tomb stone effect ", thereby badly influence the electric connection between this surface adhesion components and this printed circuit board (PCB), make entire circuit can't realize the effect of expecting.
Therefore, how to overcome the defective of above-mentioned prior art, a kind of welding pad structure of printed circuit board (PCB) is provided, to avoid producing soldered elements pin perk phenomenon when the reflow, real is present institute problem demanding prompt solution.
Summary of the invention
In view of the defective of above-mentioned prior art, the object of the present invention is to provide a kind of welding pad structure of avoiding the printed circuit board (PCB) of generation soldered elements pin perk phenomenon when reflow.
For reaching above-mentioned and other purpose, the present invention promptly provides a kind of welding pad structure of printed circuit board (PCB), be in order to surface adhesion components is welded on the printed circuit board (PCB), wherein, this printed circuit board (PCB) has first and second electricity connection end at least, second pin that this surface adhesion components has first pin that need electrically connect with this first electricity connection end at least and need electrically connect with this second electricity connection end, this welding pad structure comprises a plurality of weld pad entities, and to being provided with first connector that electrically connects with this first electricity connection end in this weld pad entity by first pin, and to being provided with second connector that electrically connects with this second electricity connection end in this weld pad entity by second pin, this second connector has the alar part that connects main body and formed to both sides by this connection main body, and this connects main body and this alar part all electrically connects with this second electricity connection end.
In the welding pad structure of aforesaid printed circuit board (PCB), this first connector is the strip structure that is overlapped between this weld pad entity and this first electricity connection end; And this second connector is " T " font structure, " Y " font structure, and one of them person of " individual " font structure.
In addition, this first link is the circuit link, and this second electricity connection end is earth terminal, one of them person of power end.
Than prior art, the welding pad structure of printed circuit board (PCB) of the present invention, provide a kind of welding pad structure with special construction, wherein, first pin of corresponding surface adhesion components is provided with first connector in this weld pad entity, and corresponding second pin is provided with second connector in this weld pad entity, and this second connector has the alar part that connects main body and formed to both sides by this connection main body, make and have the surface adhesion components of first and second pin after being welded on this welding pad structure, this first pin reaches identical with the pulling force that second pin is subjected to when reflow, thereby prevent from the prior art to produce one of them pin perk owing to two pins pull-out capacity of corresponding weld pad when the reflow is different, even uprightly hold up, to form phenomenon as " gravestone " shape.
Description of drawings
Fig. 1 is existing printed circuit board weld pad structural representation;
Fig. 2 is the welding pad structure vertical view that shows printed circuit board (PCB) of the present invention;
Fig. 3 is another embodiment vertical view of welding pad structure that shows printed circuit board (PCB) of the present invention; And
Fig. 4 is the another embodiment vertical view of welding pad structure that shows printed circuit board (PCB) of the present invention.
The main element symbol description:
1,2 printed circuit board (PCB)
10,20 weld pad housings
12,22 weld pad entities
14, the 14a connector
21 first electricity connection ends
23 second electricity connection ends
24 first connectors
26 second connectors
260 connect main body
262 alar parts
Embodiment
Below by particular specific embodiment explanation embodiments of the present invention, those skilled in the art can understand other advantage of the present invention and effect easily by the content that this specification disclosed.The present invention also can be implemented or be used by other different specific embodiment, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications and change under the spirit of the present invention not deviating from.
Seeing also Fig. 2, is the welding pad structure vertical view that shows printed circuit board (PCB) of the present invention.As shown in the figure, the welding pad structure of this printed circuit board (PCB) is in order to the surface adhesion components (not shown) is welded in printed circuit board (PCB) 2 (Printed Circuit Board, PCB) on, wherein, this printed circuit board (PCB) 2 has first electricity connection end 21 and second electricity connection end 23 at least, this first electricity connection end 21 is the circuit link, i.e. for example the pin of other circuit element or cabling; And this second electricity connection end 23 is earth terminal, one of them person of power end.In present embodiment, be to be that 0805 surface adhesion components is identical or less with model, for example undersized resistance or electric capacity etc., and this surface adhesion components second pin of having first pin that need electrically connect with this first electricity connection end 21 at least and need electrically connecting with this second electricity connection end 23.This printed circuit board (PCB) 2 has at least one welding pad structure, comprises the weld pad housing 20 that is provided with according to the size of this surface adhesion components to be welded, and is arranged at a plurality of weld pad entities 22 in this weld pad housing 20.
It should be noted, it is to being provided with first connector 24 that electrically connects with this first electricity connection end 21 in this weld pad entity 22 by first pin that the welding pad structure of printed circuit board (PCB) of the present invention improves the welding pad structure that is characterised in that this printed circuit board (PCB), in present embodiment, this first connector 24 is for being overlapped in the strip structure between this weld pad entity 22 and this first electricity connection end 21, and be the metallic conduction material, as copper bar shape structure, and to being provided with second connector 26 that electrically connects with this second electricity connection end 23 in this weld pad entity 22 by second pin, wherein this second connector 26 has the both wing portions 262 that connects main body 260 and formed symmetry by this connection main body 260 to both sides, and should connect main body 260 electrically connects with this alar part 262 and this second electricity connection end 23, in present embodiment, this second connector 26 is the metallic conduction material, Copper Foil for example, and this second connector 26 all is overlapped between this weld pad entity 22 and this second electricity connection end 23 for three ends of this connection main body 260 and both wing portions 262, and is rendered as " T " font structure.
Therefore, because the area of this first connector 24 that need electrically connect with this first electricity connection end 21 is less, and this second connector 26 that need electrically connect with this second electricity connection end 23, lay the Copper Foil that changes into by this connection main body 260 and both wing portions 262 3 part small sizes by existing full wafer Copper Foil, increased the hollow out zone in this second connector 26, make this second connector 26 follow-up when crossing reflow heat radiation slow down, and pull-out capacity is identical with this first connector 24, thereby has avoided existing because the pull-out capacity difference of two pins corresponding weld pad when reflow produces the phenomenons of one of them pin perk.
Seeing also Fig. 3, is another embodiment vertical view of welding pad structure that shows printed circuit board (PCB) of the present invention.As shown in the figure, in present embodiment, this second connector 26 all is overlapped between this weld pad entity 22 and this second electricity connection end 23 for three ends of this connection main body 260 and both wing portions 262, and presents " individual " font structure.
Seeing also Fig. 4, is the another embodiment vertical view of welding pad structure that shows printed circuit board (PCB) of the present invention.As shown in the figure, in present embodiment, this second connector 26 connects main body 260 for this and both wing portions 262, three ends all are overlapped between this weld pad entity 22 and this second electricity connection end 23, and presents " Y " font structure.
In sum, the welding pad structure of printed circuit board (PCB) of the present invention, provide a kind of welding pad structure with special connector, wherein, first pin of corresponding surface adhesion components is provided with first connector in this weld pad entity, and corresponding second pin is provided with second connector in this weld pad entity, and this second connector has the alar part that connects main body and formed to both sides by this connection main body, welding pad structure with this this printed circuit board (PCB) that forms, make and have the surface adhesion components of first and second pin after being welded on this welding pad structure, can be when reflow, because this second connector is laid the Copper Foil that changes into by three part small sizes of this connection main body and both wing portions by the full wafer Copper Foil of prior art, increased the hollow out zone in this second connector, make that this second connector is identical with the pull-out capacity of this first connector, promptly this first pin is identical with the pulling force that second pin is subjected to, thereby prevent from the prior art to produce one of them pin perk owing to two pins pull-out capacity of corresponding weld pad when the reflow is different, even uprightly hold up, to form phenomenon as " gravestone " shape.
The foregoing description only is illustrative principle of the present invention and effect thereof, but not is used to limit the present invention, that is the present invention in fact still can do other change.Therefore, any those skilled in the art all can make amendment to the foregoing description under spirit of the present invention and category.Therefore the scope of the present invention should be foundation with the scope of claims.
Claims (5)
1. the welding pad structure of a printed circuit board (PCB), be in order to the face of weld adhesion components to printed circuit board (PCB), wherein, this printed circuit board (PCB) has first and second electricity connection end at least, second pin that this surface adhesion components has first pin that need electrically connect with this first electricity connection end at least and need electrically connect with this second electricity connection end, this welding pad structure comprises a plurality of weld pad entities, and to being provided with first connector that electrically connects with this first electricity connection end in this weld pad entity by first pin, and, it is characterized in that being provided with second connector that electrically connects with this second electricity connection end in this weld pad entity by second pin:
This second connector has the alar part that connects main body and formed to both sides by this connection main body, and this connects main body and this alar part all electrically connects with this second electricity connection end.
2. the welding pad structure of printed circuit board (PCB) according to claim 1, it is characterized in that: this first link is the circuit link.
3. the welding pad structure of printed circuit board (PCB) according to claim 1, it is characterized in that: this second electricity connection end is earth terminal, one of them person of power end.
4. the welding pad structure of printed circuit board (PCB) according to claim 1, it is characterized in that: this first connector is the strip structure that is overlapped between this weld pad entity and this first electricity connection end.
5. the welding pad structure of printed circuit board (PCB) according to claim 1 is characterized in that: this second connector is " T " font structure, " Y " font structure, and one of them person of " individual " font structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710167588XA CN101426334B (en) | 2007-10-29 | 2007-10-29 | Soldering pad construction for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710167588XA CN101426334B (en) | 2007-10-29 | 2007-10-29 | Soldering pad construction for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101426334A CN101426334A (en) | 2009-05-06 |
| CN101426334B true CN101426334B (en) | 2010-12-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710167588XA Expired - Fee Related CN101426334B (en) | 2007-10-29 | 2007-10-29 | Soldering pad construction for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101426334B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770198A (en) * | 2018-05-31 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of circuit board being packaged with chip component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2415461Y (en) * | 2000-05-09 | 2001-01-17 | 李安 | Patch diode |
| US20050082686A1 (en) * | 2003-10-17 | 2005-04-21 | Advanced Semiconductor Engineering, Inc. | Circuitized substrate for fixing solder beads on pads |
-
2007
- 2007-10-29 CN CN200710167588XA patent/CN101426334B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2415461Y (en) * | 2000-05-09 | 2001-01-17 | 李安 | Patch diode |
| US20050082686A1 (en) * | 2003-10-17 | 2005-04-21 | Advanced Semiconductor Engineering, Inc. | Circuitized substrate for fixing solder beads on pads |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101426334A (en) | 2009-05-06 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20161029 |
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| CF01 | Termination of patent right due to non-payment of annual fee |