CN103118504A - Hot wind heating device of printed circuit board (PCB) repair work station - Google Patents
Hot wind heating device of printed circuit board (PCB) repair work station Download PDFInfo
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- CN103118504A CN103118504A CN 201110364024 CN201110364024A CN103118504A CN 103118504 A CN103118504 A CN 103118504A CN 201110364024 CN201110364024 CN 201110364024 CN 201110364024 A CN201110364024 A CN 201110364024A CN 103118504 A CN103118504 A CN 103118504A
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- heating
- pcb
- work station
- hot wind
- repair work
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Abstract
A hot wind heating device of a printed circuit board (PCB) repair work station comprises a heat dissipation device, an upper portion heating wind nozzle and a bottom heating wind nozzle, wherein the upper portion heating wind nozzle is arranged on the lower portion of the heat dissipating device and provided with a temperature sensor, and the bottom heating wind nozzle is arranged under the upper portion heating wind nozzle. According to the hot wind heating device of the PCB repair work station, hot wind heating technology is utilized to heat the PCB, the range of heating only aims at components with requirements for disassembly, other components are not influenced, and the defect of infrared heating technology is effectively overcome.
Description
Technical field
The present invention relates to PCB reclamation work station technical field, be specifically related to the hot air heating apparatus at a kind of PCB reclamation work station.
Background technology
Along with electronic product develops rapidly to portable/miniaturization, networking and multimedia direction, surface mounting technology obtains using more and more widely in electronics industry.And partly or entirely replaced in a lot of fields traditional circuit assembly technology.IC chip with BGA encapsulation in large scale integrated chip (LSI chip) is widely used, and the work of reclamation work station is an important component part in whole production link all the time in the paster welding.In the course of work of reclamation work station, need to dismantle and install components and parts, this just need to carry out heat treated to it.
Reclamation work station in the market adopts infrared heating technique to realize rework process to pcb board mostly.Because the reclamation work station is that the element on pcb board is carried out dismounting, impact for the element that closes on is the smaller the better, if adopt infrared heating technique, the element that closes on that may cause making in heating process arrives the temperature that melts, thereby make component wear, pcb board can not normally use.
Summary of the invention
The deficiency that exists in order to overcome above-mentioned prior art, the object of the present invention is to provide the hot air heating apparatus at a kind of PCB reclamation work station, this device utilizes the Hot-blast Heating technology that pcb board is heated, make the scope of heating only be directed to the element that needs dismounting, for the not impact of other elements, effectively solved the deficiency of infrared heating technique.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
The hot air heating apparatus at a kind of PCB reclamation work station comprises heat abstractor 1, is arranged on heat abstractor 1 bottom and adds hot blast nozzle 2 with the top of temperature sensor 4, is arranged on top and adds bottom-heated tuyere 3 under hot blast nozzle 2.
Its principle is to adopt thermal current to gather on the pin and pad of surface mounting devices, solder joint fusing or soldering paste are refluxed, to complete dismounting and welding function, use the vacuum machine device that spring and rubber suction nozzle are housed during dismounting, in time element is sucked up gently when whole solder joint fusing.
The hot air flow that described hot-blast spray nozzle produces is realized by changing various different specification size hot-blast spray nozzles, nozzle adopts the mode of hot blast at element surrounding and flows, thermal current from the heating head surrounding out, make the scope of heating only be directed to the element that needs dismounting, therefore can damaged substrate or components and parts on every side, can dismantle with comparalive ease or weld.
Description of drawings
Accompanying drawing is the hot air heating apparatus structural representation at PCB reclamation work of the present invention station
Embodiment
As shown in drawings, the hot air heating apparatus at PCB reclamation work of the present invention station, this device mainly adds hot blast nozzle 2, bottom-heated tuyere 3, top heat abstractor 1, temperature sensor 4 and bottom support frame 6 by top and forms, top adds hot blast nozzle 2 with temperature sensor 4, be arranged on heat abstractor 1 bottom, bottom-heated tuyere 3 is placed on bottom support frame 5 and is arranged on top and adds under hot blast nozzle 2.
The course of work of this device is as follows: the thermal current that hot-blast spray nozzle produces gathers on the pin and pad of surface mounting devices, and solder joint fusing or soldering paste are refluxed, and completes dismounting and welding function.Use the mechanical device that spring and rubber suction nozzle are housed during dismounting, when whole solder joint fusing, the BGA element is sucked up, complete the unloading process of element.The mode of heating of this device is that thermal current that top adds hot blast nozzle is from the surrounding of heating head out, heating for BGA element 6 only need to be with the solder fusing of its pin, do not need heating for element itself, be that top adds hot blast nozzle and only thermal current appearred in the surrounding of element and heat, can not damage BGA element and substrate or components and parts on every side.The thermal current that the bottom-heated tuyere produces is realized heating bottom BGA.Heating-up temperature can be by the temperature sensor measurement of installing, and element dismounting or install will stop producing thermal current, and the heat abstractor that this moment, inner heat can add by being arranged on top hot blast nozzle dispels the heat.
Claims (1)
1. the hot air heating apparatus at a PCB reclamation work station, it is characterized in that: comprise heat abstractor (1), be arranged on heat abstractor (1) bottom and add hot blast nozzle (2) with the top of temperature sensor (4), be arranged on top and add bottom-heated tuyere (3) under hot blast nozzle (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110364024 CN103118504A (en) | 2011-11-17 | 2011-11-17 | Hot wind heating device of printed circuit board (PCB) repair work station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110364024 CN103118504A (en) | 2011-11-17 | 2011-11-17 | Hot wind heating device of printed circuit board (PCB) repair work station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103118504A true CN103118504A (en) | 2013-05-22 |
Family
ID=48416742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110364024 Pending CN103118504A (en) | 2011-11-17 | 2011-11-17 | Hot wind heating device of printed circuit board (PCB) repair work station |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103118504A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752974A (en) * | 2014-02-13 | 2014-04-30 | 深圳市卓茂科技有限公司 | Integrated desoldering system conducting upper hot air heating and lower hot air heating synchronously |
| CN108990300A (en) * | 2018-08-24 | 2018-12-11 | 郑州云海信息技术有限公司 | PCH module method for dismounting |
| CN111687790A (en) * | 2020-07-07 | 2020-09-22 | 深圳市微组半导体科技有限公司 | Detaching and welding suction nozzle, device detaching device and detaching and welding method by using detaching and welding suction nozzle |
-
2011
- 2011-11-17 CN CN 201110364024 patent/CN103118504A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103752974A (en) * | 2014-02-13 | 2014-04-30 | 深圳市卓茂科技有限公司 | Integrated desoldering system conducting upper hot air heating and lower hot air heating synchronously |
| CN103752974B (en) * | 2014-02-13 | 2016-02-17 | 深圳市卓茂科技有限公司 | Upper and lower hot blast Synchronous Heating integration sealing-off system |
| CN108990300A (en) * | 2018-08-24 | 2018-12-11 | 郑州云海信息技术有限公司 | PCH module method for dismounting |
| CN111687790A (en) * | 2020-07-07 | 2020-09-22 | 深圳市微组半导体科技有限公司 | Detaching and welding suction nozzle, device detaching device and detaching and welding method by using detaching and welding suction nozzle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130522 |