CN107995797A - High-accuracy PCB paster technique - Google Patents
High-accuracy PCB paster technique Download PDFInfo
- Publication number
- CN107995797A CN107995797A CN201711043846.3A CN201711043846A CN107995797A CN 107995797 A CN107995797 A CN 107995797A CN 201711043846 A CN201711043846 A CN 201711043846A CN 107995797 A CN107995797 A CN 107995797A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- screen
- silk
- curing
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The object of the present invention is to provide a kind of high-accuracy PCB paster technique, supplied materials detection, labelling, silk-screen tin cream, silk-screen Heraeus, chip mounter feeding, baking and curing, reflow soldering, cleaning, detection are carried out successively, offset and the material casting problem of element are wherein avoided after Heraeus retaining element, PCB patches precision is high, welding is reliable, and product qualification rate is high.
Description
Technical field
The present invention relates to circuit board technology field, more particularly to a kind of high-accuracy PCB paster technique.
Background technology
With electronic product development in pluralism, the requirement to patch precision is also higher and higher., will at present when SMT is produced
Pcb board is fixed on gauge, and gauge once each station Jing Guo SMT wire bodies is driven by guide rail.Element positioning on pcb board
The problems such as tin cream deviates during inaccurate and Overwelding and rewelding furnace, can all influence patch precision so as to it cannot be guaranteed that patch quality, influences to produce
Product quality and production efficiency, improve production cost.In order to realize high-precision patch demand on the basis of existing paster technique,
The present invention provides a kind of high-precision paster technique scheme.
The content of the invention
To solve the above problems, the present invention provides a kind of high-accuracy PCB paster technique, supplied materials detection, patch are carried out successively
Label, silk-screen tin cream, silk-screen Heraeus, chip mounter feeding, baking and curing, reflow soldering, cleaning, detection, wherein Heraeus are consolidated
Determine to avoid after element offset and the material casting problem of element, PCB patches precision is high, and welding is reliable, and product qualification rate is high；Solve
Produced problem in background technology.
The object of the present invention is to provide a kind of high-accuracy PCB paster technique, include following steps：
Step 1：Supplied materials detects：Patch supplied materials is detected；
Step 2：Labelling：Indicate the information such as product item number, batch；
Step 3：Silk-screen tin cream：Tin cream is passed through on the predeterminated position on steel mesh silk-screen to pcb board；
Step 4：Silk-screen Heraeus：By Heraeus by the predeterminated position on steel mesh silk-screen to pcb board,；
Step 5：Chip mounter feeding：Various material elements are placed in the corresponding component pads of pcb board with chip mounter；
Step 6：Baking and curing：After being placed with material element, pcb board is entered in curing oven and is heating and curing；
Step 7：Reflow soldering：Reflow soldering is carried out with reflow soldering；
Step 8：Cleaning：The pcb board assembled is cleaned with cleaning machine；
Step 9：Detection：Welding quality is carried out to the pcb board assembled and assembles the detection of quality.
Further improvement lies in that：Step 6 requirement rapid curing at a temperature of 140 DEG C, and require non-volatility gas
Body release, bubble-free occur and it is fire-retardant, do not answer cross flow particularly, otherwise can pollute pad, influence to weld.
Further improvement lies in that：The step 4 determines steel mesh printing according to the pin shapes and status requirement of surface mount elements
The size and location of perforate.
Beneficial effects of the present invention：The present invention carries out supplied materials detection, labelling, silk-screen tin cream, silk-screen Heraeus, patch successively
The offset and throwing of element are avoided after piece machine feeding, baking and curing, reflow soldering, cleaning, detection, wherein Heraeus retaining element
Material problem, PCB patches precision is high, and welding is reliable, and product qualification rate is high.
Embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be further described, the embodiment
It is only used for explaining the present invention, is not intended to limit the scope of the present invention..
The present embodiment provides a kind of high-accuracy PCB paster technique, include following steps：
Step 1：Supplied materials detects：Patch supplied materials is detected；
Step 2：Labelling：Indicate the information such as product item number, batch；
Step 3：Silk-screen tin cream：Tin cream is passed through on the predeterminated position on steel mesh silk-screen to pcb board；
Step 4：Silk-screen Heraeus：By Heraeus by the predeterminated position on steel mesh silk-screen to pcb board,；
Step 5：Chip mounter feeding：Various material elements are placed in the corresponding component pads of pcb board with chip mounter；
Step 6：Baking and curing：After being placed with material element, pcb board is entered in curing oven and is heating and curing；
Step 7：Reflow soldering：Reflow soldering is carried out with reflow soldering；
Step 8：Cleaning：The pcb board assembled is cleaned with cleaning machine；
Step 9：Detection：Welding quality is carried out to the pcb board assembled and assembles the detection of quality.
Step 6 requirement rapid curing at a temperature of 140 DEG C, and require non-volatility gas to release, bubble-free goes out
Now with it is fire-retardant, do not answer cross flow particularly, otherwise can pollute pad, influence to weld.The step 4 is according to the pins of surface mount elements
Shape and status requirement determine the size and location of steel mesh printing perforate.
Supplied materials detection, labelling, silk-screen tin cream, silk-screen Heraeus, chip mounter feeding, baking and curing, reflux are carried out successively
Welding, cleaning, detection, wherein avoid offset and the material casting problem of element after Heraeus retaining element, PCB patches precision is high,
Welding is reliable, and product qualification rate is high.
Claims (3)
- A kind of 1. high-accuracy PCB paster technique, it is characterised in that：Include following steps：Step 1：Supplied materials detects：Patch supplied materials is detected；Step 2：Labelling：Indicate the information such as product item number, batch；Step 3：Silk-screen tin cream：Tin cream is passed through on the predeterminated position on steel mesh silk-screen to pcb board；Step 4：Silk-screen Heraeus：By Heraeus by the predeterminated position on steel mesh silk-screen to pcb board,；Step 5：Chip mounter feeding：Various material elements are placed in the corresponding component pads of pcb board with chip mounter；Step 6：Baking and curing：After being placed with material element, pcb board is entered in curing oven and is heating and curing；Step 7：Reflow soldering：Reflow soldering is carried out with reflow soldering；Step 8：Cleaning：The pcb board assembled is cleaned with cleaning machine；Step 9：Detection：Welding quality is carried out to the pcb board assembled and assembles the detection of quality.
- 2. high-accuracy PCB paster technique as claimed in claim 1, it is characterised in that：Temperature of the step 6 requirement at 140 DEG C The lower rapid curing of degree, and require non-volatility gas to release, bubble-free occur and fire-retardant, do not answer cross flow particularly, otherwise can be dirty Pad is contaminated, influences to weld.
- 3. high-accuracy PCB paster technique as claimed in claim 1, it is characterised in that：The step 4 is according to surface mount elements Pin shapes and status requirement determine the size and location of steel mesh printing perforate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711043846.3A CN107995797A (en) | 2017-10-31 | 2017-10-31 | High-accuracy PCB paster technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711043846.3A CN107995797A (en) | 2017-10-31 | 2017-10-31 | High-accuracy PCB paster technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995797A true CN107995797A (en) | 2018-05-04 |
Family
ID=62030035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711043846.3A Pending CN107995797A (en) | 2017-10-31 | 2017-10-31 | High-accuracy PCB paster technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107995797A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617108A (en) * | 2018-06-28 | 2018-10-02 | 宁波高新区技领电源有限公司 | A kind of patch welding procedure of horizontal patch capacitor |
| CN109548313A (en) * | 2018-11-30 | 2019-03-29 | 深圳市德仓科技有限公司 | A kind of FPC component paster technique |
| CN109688788A (en) * | 2018-12-27 | 2019-04-26 | 惠州市骏亚数字技术有限公司 | A kind of method of the automatic loading board of SMT |
| CN109911607A (en) * | 2019-01-28 | 2019-06-21 | 中南大学 | The automatic chip mounting of optical transceiver module transports detection machine |
| CN111191762A (en) * | 2019-12-30 | 2020-05-22 | 神思电子技术股份有限公司 | Method for improving performance of dinner plate RFID electronic tag |
| CN111885851A (en) * | 2020-07-27 | 2020-11-03 | 昆山英业特电子科技有限公司 | SMT (surface mount technology) chip mounting process |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104694029A (en) * | 2015-03-11 | 2015-06-10 | 河源西普电子有限公司 | SMT pasting technique |
| CN105338757A (en) * | 2015-12-04 | 2016-02-17 | 深圳威迈斯电源有限公司 | Printed circuit board manufacturing method and printed circuit board |
-
2017
- 2017-10-31 CN CN201711043846.3A patent/CN107995797A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104694029A (en) * | 2015-03-11 | 2015-06-10 | 河源西普电子有限公司 | SMT pasting technique |
| CN105338757A (en) * | 2015-12-04 | 2016-02-17 | 深圳威迈斯电源有限公司 | Printed circuit board manufacturing method and printed circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617108A (en) * | 2018-06-28 | 2018-10-02 | 宁波高新区技领电源有限公司 | A kind of patch welding procedure of horizontal patch capacitor |
| CN109548313A (en) * | 2018-11-30 | 2019-03-29 | 深圳市德仓科技有限公司 | A kind of FPC component paster technique |
| CN109688788A (en) * | 2018-12-27 | 2019-04-26 | 惠州市骏亚数字技术有限公司 | A kind of method of the automatic loading board of SMT |
| CN109911607A (en) * | 2019-01-28 | 2019-06-21 | 中南大学 | The automatic chip mounting of optical transceiver module transports detection machine |
| CN111191762A (en) * | 2019-12-30 | 2020-05-22 | 神思电子技术股份有限公司 | Method for improving performance of dinner plate RFID electronic tag |
| CN111191762B (en) * | 2019-12-30 | 2023-03-10 | 神思电子技术股份有限公司 | Method for improving performance of dinner plate RFID electronic tag |
| CN111885851A (en) * | 2020-07-27 | 2020-11-03 | 昆山英业特电子科技有限公司 | SMT (surface mount technology) chip mounting process |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20180504 |