CN109688788A - A kind of method of the automatic loading board of SMT - Google Patents
A kind of method of the automatic loading board of SMT Download PDFInfo
- Publication number
- CN109688788A CN109688788A CN201811612603.1A CN201811612603A CN109688788A CN 109688788 A CN109688788 A CN 109688788A CN 201811612603 A CN201811612603 A CN 201811612603A CN 109688788 A CN109688788 A CN 109688788A
- Authority
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- China
- Prior art keywords
- control module
- lifting device
- loading board
- automatic loading
- glue
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of method of automatic loading board of SMT, which is characterized in that comprising the following specific steps the S1. purchasing of raw materials；S2. Incoming Quality Control；S3. it puts Heraeus: glue being dripped into PCB corresponding position, effect is the fixed effect played to component on pcb board；S4. patch: the component in product is mounted on corresponding position；S5. solidify drying: the component sticked can be enable firmly to be pasted on pcb board；S6. reflow soldering: laser welding process is used, the component sticked is enable to be welded on the opposite position on pcb board.Loading board method provided by the invention and automatic chip mounting apparatus structure are simple, easy to use and maintenance, are suitble to product batch, production automation can large-scale promotion use.
Description
Technical field
The present invention relates to wiring board technology fields, and in particular to a kind of method of the automatic loading board of SMT.
Background technique
SMT technology is exactly surface component package technique (abbreviation of Surface Mounted Technology), just
For current electronics assembly technology, SMT technology technology is in a kind of most popular technology and technique in industry.This technology
Biggest advantage is the microdevice by the volume compression of traditional component as only original 1/tens volume, from
And it solves conditional electronic and assembles that low faced density, poor reliability, volume be big, some disadvantages such as at high cost.It is this miniature
The component of change is known as: SMY device (or SMC, patch type device).Element is assembled to printing (or other substrates)
On technique be known as SMT technology.The equipment of correlation assembling is then known as SMT equipment.
For the production equipment of SMT technology, structure is complicated, expensive in the prior art, technical requirements in maintenance process
With it is at high cost, be unfavorable for SMT technology large-scale promotion use.
Summary of the invention
In view of this, the present invention provides a kind of method of automatic loading board of SMT, loading board method provided by the invention and automatic patch
Sheet devices structure is simple, easy to use and maintenance, is suitble to product batch, production automation can large-scale promotion use.
A kind of technical solution of the application are as follows: method of the automatic loading board of SMT, which is characterized in that comprising the following specific steps
S1. the purchasing of raw materials；
S2. Incoming Quality Control；
S3. it puts Heraeus: glue is dripped into PCB corresponding position, effect is that play to component on PCB plate one is fixed
Effect；
S4. patch: the component in product is mounted on corresponding position；
S5. solidify drying: the component sticked can be enable firmly to be pasted on PCB plate；
S6. reflow soldering: laser welding process is used, the component sticked is enable to be welded on the corresponding position on PCB plate
It sets.
Further, the invention also includes automatic chip mounting device, the automatic chip mounting devices, which is characterized in that including passing
Band is sent, the conveyer belt top is successively arranged testing agency, glue applying mechanism, plaster mechanism, drying mechanism, welding along feedstock direction
Mechanism；The glue applying mechanism includes the first fixing seat, and first fixing seat is equipped with the first lifting device, the first lifting dress
The front end set is equipped with the first induction control module, and the first induction control module is connect with the first lifting device；Described first
Lifting device opposite side is equipped with point glue equipment, and the point glue equipment includes capacity column, is equipped with above the capacity column into glue portion, described
It is equipped with below capacity column plus glue portion, described plus glue portion end is equipped with ball, described plus glue portion side is equipped with adjustment portion.Pass through tune
The effect in section portion, adjustable each spread add glue by falling after rise after adding the roller in glue portion to contact with wiring board corresponding position
The glue of capacity column is added to corresponding region by portion.By the first induction control module, know that wiring board reaches the letter of machining area
Breath, thus control the first lifting device lifting, so that point glue equipment is by glue spots to the corresponding region of wiring board.
Further, the testing agency includes the first fixed frame, is symmetrically arranged with CCD camera on first fixed frame,
The first control module is additionally provided on first fixed frame, first control module is equipped with the first radio receiving transmitting module.Pass through
CCD camera can send the prior art by the first radio receiving transmitting module of the first control module for PCB surface situation
Display module understands PCB surface situation.
Further, the plaster mechanism includes the second fixing seat, and second fixing seat is equipped with the second lifting device, institute
The front end for stating the second lifting device is equipped with the second induction control module, and the second induction control module and the second lifting device connect
It connects；Second lifting device is connected with adsorbent equipment, and the adsorbent equipment includes symmetrically arranged adsorption head, connects with adsorption head
The absorbent module connect.By the second induction control module, know that wiring board reaches the information of machining area, thus second liter of control
Falling unit lifting, so that the element of adsorbent equipment absorption installs region corresponding to wiring board.
Further, second fixing seat is equipped with sliding slot, and the sliding slot is equipped with sliding block, and the sliding block is connected with driving
Device, the driving device are equipped with the second control module, and second control module is equipped with the second radio receiving transmitting module, the cunning
Block is fixedly connected with the second lifting device.Conveyer belt side corresponding with the second lifting device is equipped with slice feeder.It is described
Driving device is connect by the second radio receiving transmitting module of the second control module with middle control module, the absorption of realization element material and
Installation.
Further, the drying mechanism includes third fixing seat, and the third fixing seat is equipped with third lifting device, institute
The front end for stating third lifting device is equipped with third and incudes control module, and the third induction control module and third lifting device connect
It connects；The third lifting device is provided with drying unit, and the drying unit includes drying gun, the drying group connecting with drying gun
Part.Control module is incuded by third, knows that wiring board reaches the information of machining area, to control third lifting device liter
Drop, so that drying unit quickly realizes solidification drying to the corresponding region of wiring board.
Further, the welding mechanism includes the second fixed frame, the induction of the second fixed frame lower front end the 4th control
Molding block, equipped with laser soldering device is symmetrically arranged on second fixed frame, the described 4th incudes control module and Laser Welding
Connection device connection.The laser soldering device includes laser welding head and energy generating apparatus interconnected.Pass through the 4th sense
Control module is answered, knows that wiring board reaches the information of machining area, so that it is quickly corresponding to wiring board to control laser soldering device
Region realize laser welding fix.
It further, further include middle control module, the middle control module is equipped with wireless receiving and sending module.The middle control mould
Block can be connect by wireless receiving with each functional module of sending module and the application by prior art means, be realized whole
Control.
Particularly, the realization of the technical characteristic of software, circuit program involved in the application, function belongs to the prior art,
The essence of technical scheme is the improvement carried out to the composition and connection relationship of hardware components, is not related to software program
Or the improvement of circuit structure itself.
The technical process of the application includes the purchasing of raw materials → Incoming Quality Control → Heraeus → patch → solidification drying
→ reflow soldering.The glue applying mechanism of the application: glue is dripped into PCB corresponding position, effect is played to component on PCB plate
A fixed effect；Plaster mechanism: the component in product is mounted on corresponding position；Drying mechanism: can make
The component sticked can be firmly pasted on PCB plate；Reflow soldering: using laser welding process, makes to stick
Component can be welded on the opposite position on PCB plate.
The present invention is suitable for the patch installation for the electronic component that volume is smaller, weight is lighter, has high reliablity, antidetonation
The feature that ability is strong, defect solder joint rate is low, while high frequency characteristics is good, reduces electromagnetism and radio frequency interference, is convenient for automated job,
Productivity is high.The patch installation of wiring board is carried out through the invention, and cost is only original 50% or so, saves material resources, financial resources
Deng.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is partial structural diagram of the invention；
Fig. 3 is partial structural diagram of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1
A kind of method of the automatic loading board of SMT, which is characterized in that comprising the following specific steps
S1. the purchasing of raw materials；
S2. Incoming Quality Control；
S3. it puts Heraeus: glue is dripped into PCB corresponding position, effect is that play to component on PCB plate one is fixed
Effect；
S4. patch: the component in product is mounted on corresponding position；
S5. solidify drying: the component sticked can be enable firmly to be pasted on PCB plate；
S6. reflow soldering: laser welding process is used, the component sticked is enable to be welded on the corresponding position on PCB plate
It sets.
Further, the invention also includes automatic chip mounting device, the automatic chip mounting devices, which is characterized in that including passing
Band 1 is sent, the conveyer belt top is successively arranged testing agency 2, glue applying mechanism 3, plaster mechanism 4, drying mechanism along feedstock direction
5, welding mechanism 6；The glue applying mechanism 3 includes the first fixing seat 31, and first fixing seat is equipped with the first lifting device 32, institute
The front end for stating the first lifting device is equipped with the first induction control module 33, the first induction control module and the first lifting device
Connection；First lifting device opposite side is equipped with point glue equipment 34, and the point glue equipment includes capacity column 341, the capacity column
Top is equipped with into glue portion 342, and the capacity column lower section is equipped with plus glue portion 343, and described plus glue portion end is equipped with ball 344, described
The side in glue portion is added to be equipped with adjustment portion 345.By the effect of adjustment portion, adjustable each spread, by the rolling for adding glue portion
Column is fallen after rise after contacting with wiring board corresponding position, adds glue portion that the glue of capacity column is added to corresponding region.Pass through the first induction control
Molding block knows that wiring board reaches the information of machining area, thus control the first lifting device lifting, so that point glue equipment is by glue
Water spot is to the corresponding region of wiring board.
Further, the testing agency 2 includes the first fixed frame 21, is symmetrically arranged with CCD phase on first fixed frame
Machine 22, the first control module 23 is additionally provided on first fixed frame, and first control module is equipped with the first wireless receiving and dispatching mould
Block 24.By CCD camera, can send PCB surface situation to by the first radio receiving transmitting module of the first control module existing
There is the display module of technology, understands PCB surface situation.
Further, the plaster mechanism 4 includes the second fixing seat 41, and second fixing seat is equipped with the second lifting device
42, the front end of second lifting device is equipped with the second induction control module 43, and described second incudes control module and second liter
Falling unit connection；Second lifting device is connected with adsorbent equipment 44, and the adsorbent equipment includes symmetrically arranged adsorption head
441, the absorbent module 442 being connect with adsorption head.By the second induction control module, know that wiring board reaches the letter of machining area
Breath, thus control the second lifting device lifting, so that the element of adsorbent equipment absorption installs region corresponding to wiring board.
Further, second fixing seat 41 is equipped with sliding slot 411, and the sliding slot is equipped with sliding block 412, and the sliding block connects
It is connected to driving device 413, the driving device is equipped with the second control module 414, and it is wireless that second control module is equipped with second
Transceiver module 415, the sliding block are fixedly connected with the second lifting device.Conveyer belt side corresponding with the second lifting device
Equipped with slice feeder 11.The driving device is connect by the second radio receiving transmitting module of the second control module with middle control module,
Realize the absorption and installation of element material.
Further, the drying mechanism 5 includes third fixing seat 51, and the third fixing seat is equipped with third lifting device
52, the front end of the third lifting device is equipped with third and incudes control module 53, the third induction control module and third liter
Falling unit connection；The third lifting device is provided with drying unit 54, and the drying unit includes drying gun 541 and drying
The drying component 542 of rifle connection.Control module is incuded by third, knows that wiring board reaches the information of machining area, to control
Third lifting device lifting processed, so that drying unit quickly realizes solidification drying to the corresponding region of wiring board.
Further, the welding mechanism 6 includes the second fixed frame 61, and the second fixed frame lower front end the 4th incudes
Control module 62, equipped with being symmetrically arranged with laser soldering device 63 on second fixed frame, the 4th induction control module with
Laser soldering device connection.The laser soldering device includes laser welding head 631 and energy generating apparatus interconnected
632.By the 4th induction control module, know that wiring board reaches the information of machining area, so that it is fast to control laser soldering device
Speed realizes that laser welding is fixed to the corresponding region of wiring board.
It further, further include middle control module 7, the middle control module is equipped with wireless receiving and sending module 71.In described
Control module can be connect by wireless receiving with each functional module of sending module and the application by prior art means, be realized
Whole control.
The technical process of the application includes the purchasing of raw materials → Incoming Quality Control → Heraeus → patch → solidification drying
→ reflow soldering.The glue applying mechanism of the application: glue is dripped into PCB corresponding position, effect is played to component on PCB plate
A fixed effect；Plaster mechanism: the component in product is mounted on corresponding position；Drying mechanism: can make
The component sticked can be firmly pasted on PCB plate；Reflow soldering: using laser welding process, makes to stick
Component can be welded on the opposite position on PCB plate.
The present invention is suitable for the patch installation for the electronic component that volume is smaller, weight is lighter, has high reliablity, antidetonation
The feature that ability is strong, defect solder joint rate is low, while high frequency characteristics is good, reduces electromagnetism and radio frequency interference, is convenient for automated job,
Productivity is high.The patch installation of wiring board is carried out through the invention, and cost is only original 50% or so, saves material resources, financial resources
Deng.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, it can be by appointing
One prior art is realized.
Claims (10)
1. a kind of method of the automatic loading board of SMT, which is characterized in that comprising the following specific steps
S1. the purchasing of raw materials；
S2. Incoming Quality Control；
S3. it puts Heraeus: glue is dripped into PCB corresponding position, effect is that play to component on PCB plate one is fixed
Effect；
S4. patch: the component in product is mounted on corresponding position；
S5. solidify drying: the component sticked can be enable firmly to be pasted on PCB plate；
S6. reflow soldering: laser welding process is used, the component sticked is enable to be welded on the corresponding position on PCB plate
It sets.
2. the method for the automatic loading board of SMT according to claim 1, which is characterized in that it further include automatic chip mounting device, it is described
Paster apparatus includes conveyer belt, is successively arranged testing agency, glue applying mechanism, chip mounter along feedstock direction above the conveyer belt
Structure, drying mechanism, welding mechanism；The glue applying mechanism includes the first fixing seat, and first fixing seat is equipped with the first lifting dress
It sets, the front end of first lifting device is equipped with the first induction control module, the first induction control module and the first lifting
Device connection；First lifting device opposite side is equipped with point glue equipment, and the point glue equipment includes capacity column, on the capacity column
Side is equipped with into glue portion, and the capacity column lower section is equipped with plus glue portion, and described plus glue portion end is equipped with ball, the side for adding glue portion
Equipped with adjustment portion.
3. the method for the automatic loading board of SMT according to claim 2, which is characterized in that the testing agency includes first solid
Determine frame, CCD camera is symmetrically arranged on first fixed frame, the first control module is additionally provided on first fixed frame, it is described
First control module is equipped with the first radio receiving transmitting module.
4. the method for the automatic loading board of SMT according to claim 2, which is characterized in that the plaster mechanism includes second solid
Reservation, second fixing seat are equipped with the second lifting device, and the front end of second lifting device is equipped with the second induction and controls mould
Block, the second induction control module are connect with the second lifting device；Second lifting device is connected with adsorbent equipment, described
Adsorbent equipment includes symmetrically arranged adsorption head, the absorbent module connecting with adsorption head.
5. the method for the automatic loading board of SMT according to claim 4, which is characterized in that second fixing seat, which is equipped with, to be slided
Slot, the sliding slot are equipped with sliding block, and the sliding block is connected with driving device, and the driving device is equipped with the second control module, described
Second control module is equipped with the second radio receiving transmitting module, and the sliding block is fixedly connected with the second lifting device.
6. the method for the automatic loading board of SMT according to claim 5, which is characterized in that the conveyer belt and the second lifting fill
Corresponding side is set equipped with slice feeder.
7. the method for the automatic loading board of SMT according to claim 2, which is characterized in that the drying mechanism includes that third is solid
Reservation, the third fixing seat are equipped with third lifting device, and the front end of the third lifting device is equipped with third induction control mould
Block, the third induction control module are connect with third lifting device；The third lifting device is provided with drying unit, described
Drying unit includes drying gun, the drying component connecting with drying gun.
8. the method for the automatic loading board of SMT according to claim 2, which is characterized in that the welding mechanism includes second solid
Determine frame, the second fixed frame lower front end the 4th incudes control module, equipped with being symmetrically arranged with laser on second fixed frame
Welder, the 4th induction control module are connect with laser soldering device.
9. the method for the automatic loading board of SMT according to claim 2, which is characterized in that the laser soldering device includes phase
The laser welding head and energy generating apparatus to connect.
10. the method for the automatic loading board of SMT according to claim 2, which is characterized in that further include middle control module, it is described in
It controls module and is equipped with wireless receiving and sending module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811612603.1A CN109688788A (en) | 2018-12-27 | 2018-12-27 | A kind of method of the automatic loading board of SMT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811612603.1A CN109688788A (en) | 2018-12-27 | 2018-12-27 | A kind of method of the automatic loading board of SMT |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109688788A true CN109688788A (en) | 2019-04-26 |
Family
ID=66190545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811612603.1A Withdrawn CN109688788A (en) | 2018-12-27 | 2018-12-27 | A kind of method of the automatic loading board of SMT |
Country Status (1)
| Country | Link |
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| CN (1) | CN109688788A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111328255A (en) * | 2020-03-11 | 2020-06-23 | 深圳市斯奈尔科技有限公司 | Method for packaging mobile phone control chip |
| CN111331216A (en) * | 2020-04-03 | 2020-06-26 | 嘉兴军胜电子科技有限公司 | Jig-free PCBA automatic welding method |
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| CN104853531A (en) * | 2015-04-14 | 2015-08-19 | 中山市智牛电子有限公司 | Automatic circuit board mounting process |
| CN204685401U (en) * | 2015-05-29 | 2015-10-07 | 泰马克精密铸造（苏州）有限公司 | Hard plate parts point glue equipment |
| CN204685399U (en) * | 2015-05-29 | 2015-10-07 | 泰马克精密铸造（苏州）有限公司 | Novel spot gluing device |
| CN105120603A (en) * | 2015-08-21 | 2015-12-02 | 苏州斯卡柏通讯技术有限公司 | Novel chip mounter |
| CN205341180U (en) * | 2015-12-31 | 2016-06-29 | 东莞天苾电子科技有限公司 | Electronic component point gum machine constructs |
| CN105764267A (en) * | 2016-05-04 | 2016-07-13 | 惠州光弘科技股份有限公司 | Smt |
| CN207188125U (en) * | 2017-08-04 | 2018-04-06 | 杭州里德通信有限公司 | A kind of glue applying mechanism |
| CN107995797A (en) * | 2017-10-31 | 2018-05-04 | 马瑞利汽车零部件(芜湖)有限公司 | High-accuracy PCB paster technique |
-
2018
- 2018-12-27 CN CN201811612603.1A patent/CN109688788A/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853531A (en) * | 2015-04-14 | 2015-08-19 | 中山市智牛电子有限公司 | Automatic circuit board mounting process |
| CN204685401U (en) * | 2015-05-29 | 2015-10-07 | 泰马克精密铸造（苏州）有限公司 | Hard plate parts point glue equipment |
| CN204685399U (en) * | 2015-05-29 | 2015-10-07 | 泰马克精密铸造（苏州）有限公司 | Novel spot gluing device |
| CN105120603A (en) * | 2015-08-21 | 2015-12-02 | 苏州斯卡柏通讯技术有限公司 | Novel chip mounter |
| CN205341180U (en) * | 2015-12-31 | 2016-06-29 | 东莞天苾电子科技有限公司 | Electronic component point gum machine constructs |
| CN105764267A (en) * | 2016-05-04 | 2016-07-13 | 惠州光弘科技股份有限公司 | Smt |
| CN207188125U (en) * | 2017-08-04 | 2018-04-06 | 杭州里德通信有限公司 | A kind of glue applying mechanism |
| CN107995797A (en) * | 2017-10-31 | 2018-05-04 | 马瑞利汽车零部件(芜湖)有限公司 | High-accuracy PCB paster technique |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111328255A (en) * | 2020-03-11 | 2020-06-23 | 深圳市斯奈尔科技有限公司 | Method for packaging mobile phone control chip |
| CN111331216A (en) * | 2020-04-03 | 2020-06-26 | 嘉兴军胜电子科技有限公司 | Jig-free PCBA automatic welding method |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190426 |
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| WW01 | Invention patent application withdrawn after publication |