CN105764267A - Smt - Google Patents
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- Publication number
- CN105764267A CN105764267A CN201610287711.0A CN201610287711A CN105764267A CN 105764267 A CN105764267 A CN 105764267A CN 201610287711 A CN201610287711 A CN 201610287711A CN 105764267 A CN105764267 A CN 105764267A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- curing
- baking
- smt
- reflow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Materials For Medical Uses (AREA)
Abstract
The invention provides an SMT.The SMT comprises the following steps of supplied material detection; adhesive dispensing, wherein a surface mount device adhesive is dropped to the preset position on a PCB through a dispenser; surface mount, wherein all the material elements are pasted on the PCB trough a surface mount device; dry curing, wherein a curing oven is used for dry curing, the drying temperature ranges from 130 DEG C to 160 DEG C, and the drying time ranges from 3 min to 7 min; reflow soldering, wherein a reflow soldering furnace is used for reflow soldering; cleaning, wherein a cleaning machine is used for cleaning the assembled PCB; detection, wherein the welding quality and assembly quality of the assembled PCB are detected.
Description
Technical field
The present invention relates to PCBA field, be specifically related to a kind of SMT paster technique.
Background technology
In PCBA processing procedure, SMT paster is to stick electronic devices and components, those electricity various by electric circuit diagram design on PCB
Sub-product is required for being processed by various different SMT paster processing technique.SMT paster technique of the prior art exists
Complex process, the defects, especially flat board electricity such as conforming product rate is low, and efficiency is low, and the adhesion strength of Heraeus is low, and curing rate is slow
When brain manufactures, the pcb board used due to panel computer is relatively big, and element is numerous, and integrated level is high, as it cannot be guaranteed that paster quality, then
Influencing whether production efficiency and conforming product rate, letter connects raising production cost.
Summary of the invention
For solving the problems referred to above, the present invention provides a kind of SMT paster technique, comprises the following steps that:
Supplied materials detects；
Point glue；Heraeus point gum machine is dripped on the predeterminated position on pcb board；
Paster: by various material element chip mounter pasters on pcb board；
Baking and curing: carry out baking and curing with curing oven, dries temperature and is 130-160 DEG C, and drying time is 3-7 minute；
Reflow soldering: carry out reflow soldering with reflow soldering；
Clean: with cleaning machine, the pcb board assembled is carried out；
Detection: the pcb board assembled is carried out welding quality and the detection of assembling quality.
Preferably, in described baking and curing step, drying temperature and be 140-150 DEG C, drying time is 4-6 minute.
Preferably, after paster, detection of also weighing before baking and curing；Described detection of weighing is to preset pcb board mark
Quasi-weight, weighs the pcb board after paster, by claiming to obtain weight and pcb board standard weights comparison, if weight differential is 4%
Within, then it is judged to, without leakage patch element, baking and curing to be carried out, otherwise can not enter baking and curing step.
Preferably, the component of the percentage by weight of described Heraeus be epoxy resin 40%～55%, firming agent 20%～
25%, thixotropic agent 2%～3%, coupling agent 1%～3%；Diluent 1%～3%, filler 15%～25%, toner 0.5%
～0.8%.
Further, the fineness of described firming agent is 2 μ～4 μ.
Further, described thixotropic agent is aerosil.
Further, described filler is calcium carbonate.
The low cost of the SMT paster technique of the present invention, conforming product rate is high, and welding is reliable, technique is simple, efficiency is high.This
It is excellent that the SMT Heraeus of invention has that glue point profile is good, is difficult to hangover, stores time length, adhesion strength is high and curing rate is fast
Point.It addition, through putting into practice surface, the SMT Heraeus of the present invention uses in SMT surface-assembled technique, the SMT surface of bonding
Assembly element has the feature that part rate is low.
Detailed description of the invention
For being more fully understood that the present invention, below by following example the present invention made the most concrete elaboration, but not
Can be regarded as limitation of the invention, some made according to foregoing invention content for those skilled in the art are nonessential
Improve and adjust, be also considered as being within the scope of the present invention.
Embodiment 1 comprises the following steps that:
Supplied materials detects；
Point glue；Heraeus point gum machine is dripped on the predeterminated position on pcb board；
Paster: by various material element chip mounter pasters on pcb board；
Weigh detection；Preset pcb board standard weights, the pcb board after paster is weighed, weight and pcb board will be claimed to obtain
Standard weights comparison, if weight differential is within 4%, then is judged to, without leakage patch element, to carry out baking and curing, otherwise can not
Enter baking and curing step；
Baking and curing: carry out baking and curing with curing oven, drying temperature is 150 DEG C, and drying time is 4 minutes；
Reflow soldering: carry out reflow soldering with reflow soldering；
Clean: with cleaning machine, the pcb board assembled is carried out；
Detection: the pcb board assembled is carried out welding quality and the detection of assembling quality.
The component of the percentage by weight of the Heraeus used is epoxy resin 53%, firming agent 20%, thixotropic agent
2.5%, coupling agent 2%；Diluent 2%, filler 20, toner 0.5%, wherein the fineness of firming agent is 2 μ, thixotropic agent gas phase two
Silicon oxide, filler is calcium carbonate.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (7)
1. a SMT paster technique, it is characterised in that comprise the following steps that:
Supplied materials detects；
Point glue；Heraeus point gum machine is dripped on the predeterminated position on pcb board；
Paster: by various material element chip mounter pasters on pcb board；
Baking and curing: carry out baking and curing with curing oven, dries temperature and is 130-160 DEG C, and drying time is 3-7 minute；
Reflow soldering: carry out reflow soldering with reflow soldering；
Clean: with cleaning machine, the pcb board assembled is carried out；
Detection: the pcb board assembled is carried out welding quality and the detection of assembling quality.
2. according to SMT paster technique described in claim 1, it is characterised in that: in described baking and curing step, drying temperature is
140 DEG C, drying time is 4 minutes.
3. according to SMT paster technique described in claim 1, it is characterised in that: after paster, inspection of also weighing before baking and curing
Survey；Described detection of weighing is to preset pcb board standard weights, is weighed by the pcb board after paster, by claim weight with
Pcb board standard weights comparison, if weight differential is within 4%, then is judged to, without leakage patch element, to carry out baking and curing, otherwise
Baking and curing step can not be entered.
4. according to SMT paster technique described in claim 1, it is characterised in that: the component of the percentage by weight of described Heraeus is
Epoxy resin 40%～55%, firming agent 20%～25%, thixotropic agent 2%～3%, coupling agent 1%～3%；Diluent 1%
～3%, filler 15%～25%, toner 0.5%～0.8%.
5. SMT paster technique as claimed in claim 4, it is characterised in that: the fineness of described firming agent is 2 μ～4 μ.
6. SMT paster technique as claimed in claim 4, it is characterised in that: described thixotropic agent is aerosil.
7. SMT paster technique as claimed in claim 4, it is characterised in that: described filler is calcium carbonate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287711.0A CN105764267A (en) | 2016-05-04 | 2016-05-04 | Smt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287711.0A CN105764267A (en) | 2016-05-04 | 2016-05-04 | Smt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105764267A true CN105764267A (en) | 2016-07-13 |
Family
ID=56323307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610287711.0A Pending CN105764267A (en) | 2016-05-04 | 2016-05-04 | Smt |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105764267A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688788A (en) * | 2018-12-27 | 2019-04-26 | 惠州市骏亚数字技术有限公司 | A kind of method of the automatic loading board of SMT |
| CN110057429A (en) * | 2019-04-25 | 2019-07-26 | 伟创力电子设备(深圳)有限公司 | Circuit board assemblies detection method, device and electronic equipment |
| CN110602897A (en) * | 2019-09-09 | 2019-12-20 | 东莞市合权电子有限公司 | SMT (surface mount technology) chip mounting process |
| CN111083880A (en) * | 2018-10-20 | 2020-04-28 | 中山市浦源电子有限公司 | Energy-saving and consumption-reducing SMT paster processing assembly line and processing method thereof |
| CN111148372A (en) * | 2020-01-10 | 2020-05-12 | 丰县云鸣电子科技有限公司 | SMT (surface mount technology) pasting technology for anti-seismic electric vehicle converter |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120164888A1 (en) * | 2009-05-28 | 2012-06-28 | Hsio Technologies, Llc | Metalized pad to electrical contact interface |
| KR20140058043A (en) * | 2012-11-06 | 2014-05-14 | 주식회사 오라컴 | Methode for flexible printed circuit board process with vaccum zig system |
| CN104694029A (en) * | 2015-03-11 | 2015-06-10 | 河源西普电子有限公司 | SMT pasting technique |
| CN205124128U (en) * | 2015-09-30 | 2016-03-30 | 深圳市德运昌科技有限公司 | Novel SMT paster |
-
2016
- 2016-05-04 CN CN201610287711.0A patent/CN105764267A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120164888A1 (en) * | 2009-05-28 | 2012-06-28 | Hsio Technologies, Llc | Metalized pad to electrical contact interface |
| KR20140058043A (en) * | 2012-11-06 | 2014-05-14 | 주식회사 오라컴 | Methode for flexible printed circuit board process with vaccum zig system |
| CN104694029A (en) * | 2015-03-11 | 2015-06-10 | 河源西普电子有限公司 | SMT pasting technique |
| CN205124128U (en) * | 2015-09-30 | 2016-03-30 | 深圳市德运昌科技有限公司 | Novel SMT paster |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111083880A (en) * | 2018-10-20 | 2020-04-28 | 中山市浦源电子有限公司 | Energy-saving and consumption-reducing SMT paster processing assembly line and processing method thereof |
| CN109688788A (en) * | 2018-12-27 | 2019-04-26 | 惠州市骏亚数字技术有限公司 | A kind of method of the automatic loading board of SMT |
| CN110057429A (en) * | 2019-04-25 | 2019-07-26 | 伟创力电子设备(深圳)有限公司 | Circuit board assemblies detection method, device and electronic equipment |
| CN110602897A (en) * | 2019-09-09 | 2019-12-20 | 东莞市合权电子有限公司 | SMT (surface mount technology) chip mounting process |
| CN110602897B (en) * | 2019-09-09 | 2021-07-27 | 东莞市合权电子有限公司 | SMT (surface mount technology) chip mounting process |
| CN111148372A (en) * | 2020-01-10 | 2020-05-12 | 丰县云鸣电子科技有限公司 | SMT (surface mount technology) pasting technology for anti-seismic electric vehicle converter |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160713 |
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| RJ01 | Rejection of invention patent application after publication |