CN111328255A - Method for packaging mobile phone control chip - Google Patents
Method for packaging mobile phone control chip Download PDFInfo
- Publication number
- CN111328255A CN111328255A CN202010164657.7A CN202010164657A CN111328255A CN 111328255 A CN111328255 A CN 111328255A CN 202010164657 A CN202010164657 A CN 202010164657A CN 111328255 A CN111328255 A CN 111328255A
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- Prior art keywords
- circuit board
- mobile phone
- chip
- workbench
- fixedly connected
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000741 silica gel Substances 0.000 claims abstract description 35
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 35
- 238000003466 welding Methods 0.000 claims abstract description 18
- 238000005096 rolling process Methods 0.000 claims abstract description 17
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims description 21
- 238000010073 coating (rubber) Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 210000003437 trachea Anatomy 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 239000002699 waste material Substances 0.000 abstract description 6
- 238000004891 communication Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 12
- 238000003860 storage Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packages (AREA)
Abstract
The invention discloses a method for packaging a mobile phone control chip, which belongs to the field of communication equipment production, and comprises a circuit board, a conveyor belt, a clamp, a negative pressure sucker, a gluing device and an automatic welding arm, and comprises the following steps: s1, placing the chip on a conveyor belt, and conveying the chip to a packaging station by the conveyor belt; s2, placing the circuit board between two clamps, and clamping the circuit board by the two clamps; the novel packaging method can realize quick packaging of a mobile phone control chip, the chip is accurately conveyed to the upper side of a mobile phone circuit board through the negative pressure sucker, silica gel is uniformly coated on the circuit board through the rolling rod, the waste of the silica gel can be avoided, resources and cost are saved, the chip is pressed on the position coated with the silica gel through the negative pressure sucker, and finally, an automatic welding arm is used for welding.
Description
Technical Field
The invention relates to the field of communication equipment production, in particular to a method for packaging a mobile phone control chip.
Background
The smart phone is like a personal computer, has an independent operating system, is a large-screen machine mostly, is a touch capacitive screen, is a resistance screen partially, and is powerful in function and high in practicability. The user can install programs provided by third-party service providers such as games, the functions of the mobile phone can be continuously expanded through the programs, and the general name of the mobile phone with wireless network access can be realized through a mobile communication network.
The mobile phone chip is the brain of the smart phone, and the control chip needs to be packaged on the mobile phone circuit board in the process of producing the mobile phone.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a mobile phone control chip packaging method which can realize the quick packaging of a mobile phone control chip, accurately convey the chip to the upper part of a mobile phone circuit board through a negative pressure sucker, uniformly coat silica gel on the circuit board by using a rolling rod, avoid the waste of the silica gel, save resources and cost, press the chip on the position coated with the silica gel through the negative pressure sucker, and finally weld by using an automatic welding arm.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A packaging method of a mobile phone control chip comprises a circuit board, a conveyor belt, a clamp, a negative pressure sucker, a gluing device and an automatic welding arm, and comprises the following steps:
s1, placing the chip on a conveyor belt, and conveying the chip to a packaging station by the conveyor belt;
s2, placing the circuit board between two clamps, and clamping the circuit board by the two clamps;
s3, uniformly coating the silica gel on the circuit board by the gluing device;
s4, accurately placing the chip on the circuit board coated with the silica gel by the negative pressure sucker;
and S5, welding the chip on the circuit board by the automatic welding arm.
Further, the automatic walking device comprises a workbench, a plurality of supporting legs are fixedly connected below the workbench, two first electric telescopic rods are arranged at the middle position of the workbench and symmetrically arranged, the conveying belt is arranged at one side of the first electric telescopic rods, two fixtures are respectively and fixedly connected with the two first electric telescopic rods, the workbench is of a hollow structure, an opening chute is formed in the workbench and is arranged at the middle of the workbench, vertical rods are fixedly connected to the lower ends of the two fixtures, pulleys which are in sliding connection with the bottoms of the opening chutes are rotatably connected to the lower ends of the vertical rods, two vertically arranged stand columns are fixedly connected to the upper surface of the workbench, a transverse sliding rail is fixedly connected between the two stand columns, and two self-walking devices are slidably connected to the sliding rail, the lower ends of the two self-walking devices are fixedly connected with vertically arranged second electric telescopic rods, the negative pressure sucker and the gluing device are respectively and fixedly connected with the output ends of the two second electric telescopic rods, an air pipe connector is arranged on one side of the negative pressure sucker, an automatic welding arm is also arranged on the workbench and is far away from the conveyor belt, the chip is accurately conveyed to the upper part of the mobile phone circuit board through the negative pressure sucker, the silica gel is uniformly coated on the circuit board by the rolling rod, can avoid the waste of silica gel, save resources and cost, press the chip on the position coated with the silica gel by the negative pressure sucker, and finally weld by an automatic welding arm, the packaging method can avoid the generation of errors in the packaging process, and the required equipment is simple in composition, the working procedure is simplified, the production cost is reduced, and the production efficiency is improved.
Further, anchor clamps are including the installation piece, driving motor is installed to one side lateral wall of installation piece, the installation piece is hollow structure, it is connected with the lead screw to rotate in the installation piece, and the lead screw is connected with driving motor's output, threaded connection has the nut on the lead screw, the installation piece is kept away from first electric telescopic handle's lateral wall and has been seted up the bar opening, the lateral wall that first electric telescopic handle was kept away from to the installation piece is provided with two splint, one of them splint and the lateral wall fixed connection of installation piece, and another splint and nut fixed connection, and driving motor drives the nut motion on the lead screw to change the distance between two splint, can realize the centre gripping to different specification circuit boards.
Further, the rubber coating device includes the box body that the opening upwards set up, the arc recess has been seted up to the bottom of box body, and roll connection has the roll stick rather than matching in the arc recess, and the roll stick is scribbled silica gel on the circuit board at rolling in-process, can realize even rubber coating like this, can avoid extravagant silica gel again.
Furthermore, the middle upper surface of the workbench is bonded with a base plate, the base plate is made of rubber, and when the negative pressure sucker presses downwards, the base plate can support the middle position of the circuit board so as to prevent the circuit board from being damaged by pressure.
Further, the lower fixed surface of slide rail is connected with stores up gluey box, and stores up the bottom intercommunication of gluing the box and have a rubber delivery pipe, the rubber delivery pipe is kept away from the one end that stores up gluey box and is located the top setting of rubber coating device, stores up gluey box and can provide silica gel constantly to avoid influencing the production process.
Furthermore, the workbench is covered with an isolation cover which is a transparent resin plate, the isolation cover protects the whole device, and an ultra-clean environment is improved for packaging work.
Furthermore, it is a plurality of the equal fixedly connected with lower extreme of landing leg is rag, and the shape of rag is the round platform, and the contact area on landing leg and ground can be multiplicable to the rag of round platform shape, improves stability.
Furthermore, two adjacent fixedly connected with transversely sets up the stiffener between the landing leg to the landing leg slope improves stability.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme can realize the quick encapsulation of cell-phone control chip, through the top of negative pressure suction cup with the accurate mobile phone circuit board of transporting of chip, utilize the roll stick with silica gel even scribble the circuit board on, can avoid silica gel to be extravagant, resources are saved and cost, rethread negative pressure suction cup presses the chip on the position of scribbling silica gel, weld with the automatic weld arm at last, the production of error in the packaging process can be avoided to this kind of packaging method, and required equipment constitutes simply, the process is simplified, and the production cost is reduced, and the production efficiency is improved.
(2) Anchor clamps are including the installation piece, driving motor is installed to one side lateral wall of installation piece, the installation piece is hollow structure, it is connected with the lead screw to rotate in the installation piece, and the lead screw is connected with driving motor's output, threaded connection has the nut on the lead screw, the installation piece is kept away from first electric telescopic handle's lateral wall and has been seted up the bar opening, the lateral wall that first electric telescopic handle was kept away from to the installation piece is provided with two splint, one of them splint and the lateral wall fixed connection of installation piece, and another splint and nut fixed connection, driving motor drives the nut motion on the lead screw, thereby change the distance between two splint, can realize the centre gripping to different specification circuit boards.
(3) The gluing device comprises a box body with an upward opening, an arc-shaped groove is formed in the bottom of the box body, a rolling rod matched with the arc-shaped groove is connected in the arc-shaped groove in a rolling mode, and silica gel is coated on the circuit board in the rolling process of the rolling rod, so that uniform gluing can be achieved, and waste of the silica gel can be avoided.
(4) The middle upper surface of the workbench is bonded with a base plate, the base plate is made of rubber, and when the negative pressure sucker presses downwards, the base plate can support the middle position of the circuit board so as to prevent the circuit board from being damaged by pressure.
(5) The lower fixed surface of slide rail is connected with stores up gluey box, and stores up the bottom intercommunication of gluing the box and have a rubber delivery pipe, and the rubber delivery pipe is kept away from the one end that stores up gluey box and is located the top setting of rubber coating device, stores up gluey box and can provide silica gel constantly to avoid influencing the production process.
(6) The workstation upper shield is equipped with the cage, and the cage is transparent resin board, and the cage gets up whole equipment protection, improves an ultra-clean environment for the encapsulation work.
(7) The equal fixedly connected with lower margin of the lower extreme of a plurality of landing legs, and the shape of lower margin is the round platform, and the contact area on the multiplicable landing leg of round platform shape and ground improves stability.
(8) Fixedly connected with transversely sets up the stiffener between two adjacent landing legs to the landing leg slope improves stability.
Drawings
FIG. 1 is a diagram of the packaging steps of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic cross-sectional view of the clamp of the present invention;
fig. 5 is a schematic sectional view of the cartridge according to the present invention.
The reference numbers in the figures illustrate:
1 workbench, 2 supporting legs, 3 first electric telescopic rods, 4 conveyor belts, 5 clamps, 501 mounting blocks, 502 driving motors, 503 screw rods, 504 nuts, 505 clamping plates, 506 strip-shaped openings, 6 opening sliding grooves, 7 vertical rods, 8 pulleys, 9 upright columns, 10 sliding rails, 11 self-walking devices, 12 second electric telescopic rods, 13 negative pressure suction cups, 14 air pipe connectors, 15 gluing devices, 1501 box bodies, 1502 arc-shaped grooves, 1503 rolling rods, 16 automatic welding arms, 17 backing plates, 18 ground feet, 19 reinforcing rods, 20 glue storage boxes and 21 isolation covers.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-5, a method for packaging a mobile phone control chip includes a circuit board, a conveyor belt 4, a fixture 5, a vacuum chuck 13, a glue applicator 15, and an automatic soldering arm 16, and includes the following steps:
s1, placing the chip on the conveyor belt 4, and conveying the chip to a packaging station by the conveyor belt 4;
s2, placing the circuit board between the two jigs 5, and clamping it by the two jigs 5;
s3, the glue spreading device 15 uniformly spreads the silica gel on the circuit board;
s4, the negative pressure suction cup 13 accurately places the chip on the circuit board coated with the silica gel;
s5, the automatic soldering robot 16 solders the chip to the circuit board.
Please refer to the coating 2, which comprises a workbench 1, wherein a backing plate 17 is bonded on the upper surface of the middle part of the workbench 1, the backing plate 17 is made of rubber, when a negative pressure sucker 13 is pressed down, the backing plate 17 can support the middle part of a circuit board so as to prevent the circuit board from being damaged by pressing, a shield 21 is covered on the workbench 1, the shield 21 is made of transparent resin, the whole equipment is protected by the shield 21, an ultra-clean environment is improved for packaging work, a plurality of landing legs 2 are fixedly connected below the workbench 1, the lower ends of the landing legs 2 are fixedly connected with ground feet 18, the ground feet 18 are in a circular truncated cone shape, the contact area between the landing legs 2 and the ground can be increased by the circular truncated cone-shaped ground feet 18, the stability is improved, a reinforcing rod 19 is fixedly connected between two adjacent landing legs 2 so as to prevent the landing legs 2 from inclining, the stability is improved, two first electric telescopic rods 3 are arranged on the middle part of the, the two first electric telescopic rods 3 are symmetrically arranged, the conveyor belt 4 is arranged at one side of the first electric telescopic rods 3, and the two clamps 5 are respectively fixedly connected with the two first electric telescopic rods 3;
referring to fig. 4, the fixture 5 includes a mounting block 501, a driving motor 502 (the internal structure and the working principle are well known in the art, and not described herein), is mounted on a side wall of the mounting block 501, the mounting block 501 is a hollow structure, a screw rod 503 is rotatably connected in the mounting block 501, and the screw rod 503 is connected with the output end of the driving motor 502, the screw rod 503 is connected with the nut 504 by screw thread, the side wall of the mounting block 501 far away from the first electric telescopic rod 3 is provided with a strip-shaped opening 506, the side wall of the mounting block 501 far away from the first electric telescopic rod 3 is provided with two clamping plates 505, one clamping plate 505 is fixedly connected with the side wall of the mounting block 501, the other clamping plate 505 is fixedly connected with the nut 504, the driving motor 502 drives the nut 504 on the screw rod 503 to move, therefore, the distance between the two clamping plates 505 is changed, and the circuit boards with different specifications can be clamped;
the workbench 1 is of a hollow structure, an opening chute 6 is arranged in the workbench 1, the opening chute 6 is arranged in the middle of the workbench 1, the lower ends of two clamps 5 are fixedly connected with a vertical rod 7, the lower end of the vertical rod 7 is rotatably connected with a pulley 8 which is in sliding connection with the bottom of the opening chute 6, the upper surface of the workbench 1 is fixedly connected with two vertically arranged upright posts 9, a transverse slide rail 10 is fixedly connected between the two upright posts 9, the lower surface of the slide rail 10 is fixedly connected with a glue storage box 20, the bottom of the glue storage box 20 is communicated with a glue delivery pipe, one end of the glue delivery pipe, which is far away from the glue storage box 20, is arranged above the gluing device 15, the glue storage box 20 can continuously provide silica gel so as not to influence the production process, the slide rail 10 is slidably connected with two self-walking devices 11 (the internal structure and the working principle are well known by, not described in detail), the lower ends of the two self-walking devices 11 are fixedly connected with vertically arranged second electric telescopic rods 12, negative pressure suckers 13 (the internal structure and the working principle of which are well known to those skilled in the art, and not described in detail) and a glue coating device 15 are respectively fixedly connected with the output ends of the two second electric telescopic rods 12, please refer to fig. 5, the glue coating device 15 comprises a box body 1501 with an upward opening, the bottom of the box body 1501 is provided with an arc-shaped groove 1502, a rolling rod 1503 matched with the arc-shaped groove 1502 is connected in a rolling manner, and the rolling rod 1503 coats silica gel on a circuit board in the rolling process, so that uniform glue coating can be realized, and waste of silica gel can be avoided;
one side of the negative pressure sucker 13 is provided with an air pipe connector 14, an automatic welding arm 16 (the internal structure and the working principle of the automatic welding arm are well known by technical personnel in the field and are not described in detail herein) is further arranged on the workbench 1, the automatic welding arm 16 is far away from the conveyor belt 4, the chip is accurately conveyed to the position above a mobile phone circuit board through the negative pressure sucker 13, the silica gel is uniformly coated on the circuit board through the rolling rod 1503, the waste of the silica gel can be avoided, the resources and the cost are saved, the chip is pressed on the position where the silica gel is coated through the negative pressure sucker 13, and finally the automatic welding arm 16 is used for welding.
When the device works, a circuit board is firstly placed between two clamps 5, the first electric telescopic rod 3 is started, the two first electric telescopic rods 3 push two clamping plates 505 to clamp the circuit board so as to realize fixation, when circuit boards with different specifications are clamped, the driving motor 502 drives the screw rod 503 to rotate, because a connecting rod between the nut 504 and the clamping plates 505 is limited by the strip-shaped opening 506, the nut 504 can drive the clamping plates 505 to move, so that the clamping of different circuit boards is realized, the second electric telescopic rod 12 drives the negative pressure suction cup 13 to suck chips on the conveyor belt 4 and move to the upper part of the circuit board, the other second electric telescopic rod 12 drives the box body 1501 to move back and forth on the circuit board, simultaneously the rolling rod 1503 uniformly coats silica gel on the circuit board, then the negative pressure suction cup 13 presses the chips on the positions coated with the silica gel, and finally the automatic welding arm 16 carries, can realize the quick encapsulation of cell-phone control chip, through the top of negative pressure suction cup with the accurate transportation mobile phone circuit board of chip, utilize the roll stick with silica gel even scribble the circuit board on, can avoid silica gel to be wasted, resources are saved and cost, rethread negative pressure suction cup presses the chip on the position of scribbling silica gel, weld with the automatic weld arm at last, the production of error in the encapsulation process can be avoided to this kind of packaging method, and required equipment constitutes simply, the process is simplified, and the production cost is reduced, and the production efficiency is improved.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (9)
1. The packaging method of the mobile phone control chip comprises a circuit board, a conveyor belt (4), a clamp (5), a negative pressure sucker (13), a gluing device (15) and an automatic welding arm (16), and is characterized in that: the method comprises the following steps:
s1, placing the chip on a conveyor belt (4), and conveying the chip to a packaging station by the conveyor belt (4);
s2, placing the circuit board between two clamps (5), and clamping the circuit board by the two clamps (5);
s3, uniformly coating the silica gel on the circuit board by the gluing device (15);
s4, accurately placing the chip on the circuit board coated with the silica gel by the negative pressure sucker (13);
and S5, the automatic welding arm (16) welds the chip on the circuit board.
2. The device of claim 1, wherein the device comprises: comprises a workbench (1), a plurality of supporting legs (2) are fixedly connected below the workbench (1), two first electric telescopic rods (3) are arranged at the middle position of the workbench (1), the two first electric telescopic rods (3) are symmetrically arranged, a conveyor belt (4) is arranged at one side of each first electric telescopic rod (3), two clamps (5) are respectively fixedly connected with the two first electric telescopic rods (3), the workbench (1) is of a hollow structure, an opening chute (6) is arranged inside the workbench (1), the opening chute (6) is arranged at the middle part of the workbench (1), the lower ends of the two clamps (5) are fixedly connected with a vertical rod (7), a pulley (8) which is connected with the bottom of the opening chute (6) in a sliding manner is rotatably connected with the lower end of the vertical rod (7), two upright columns (9) which are vertically arranged are fixedly connected with the upper surface of the workbench (1), and slide rail (10) that fixedly connected with transversely set up between two stand (9), sliding connection has two from running gear (11) on slide rail (10), and two second electric telescopic handle (12) from the vertical setting of the equal fixedly connected with of lower extreme of running gear (11), negative pressure sucking disc (13) and rubber coating device (15) respectively with the output fixed connection of two second electric telescopic handle (12), one side of negative pressure sucking disc (13) is provided with trachea interface (14), still be provided with automatic weld arm (16) on workstation (1), and automatic weld arm (16) keep away from conveyer belt (4) setting.
3. The packaging method of the mobile phone control chip as claimed in claim 1, wherein: anchor clamps (5) are including installation piece (501), driving motor (502) are installed to one side lateral wall of installation piece (501), installation piece (501) are hollow structure, installation piece (501) internal rotation is connected with lead screw (503), and lead screw (503) are connected with driving motor (502) output, threaded connection has nut (504) on lead screw (503), bar opening (506) have been seted up to the lateral wall of keeping away from first electric telescopic handle (3) in installation piece (501), the lateral wall of keeping away from first electric telescopic handle (3) in installation piece (501) is provided with two splint (505), one of them splint (505) and the lateral wall fixed connection of installation piece (501), and another splint (505) and nut (504) fixed connection.
4. The packaging method of the mobile phone control chip as claimed in claim 1, wherein: the gluing device (15) comprises a box body (1501) with an upward opening, an arc-shaped groove (1502) is formed in the bottom of the box body (1501), and a rolling rod (1503) matched with the arc-shaped groove (1502) is connected in a rolling mode.
5. The packaging method of the mobile phone control chip as claimed in claim 2, wherein: a backing plate (17) is bonded to the upper surface of the middle of the workbench (1), and the backing plate (17) is made of rubber.
6. The packaging method of the mobile phone control chip as claimed in claim 2, wherein: the lower surface fixedly connected with of slide rail (10) stores up gluey box (20), and the bottom intercommunication of storing up gluey box (20) has a rubber delivery pipe, the rubber delivery pipe is kept away from the one end that stores up gluey box (20) and is located the top setting of rubber coating device (15).
7. The packaging method of the mobile phone control chip as claimed in claim 2, wherein: the workbench (1) is covered with an isolation cover (21), and the isolation cover (21) is a transparent resin plate.
8. The packaging method of the mobile phone control chip as claimed in claim 2, wherein: the lower ends of the supporting legs (2) are fixedly connected with feet (18), and the feet (18) are round tables.
9. The packaging method of the mobile phone control chip as claimed in claim 2, wherein: a reinforcing rod (19) is transversely arranged and fixedly connected between every two adjacent supporting legs (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010164657.7A CN111328255A (en) | 2020-03-11 | 2020-03-11 | Method for packaging mobile phone control chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010164657.7A CN111328255A (en) | 2020-03-11 | 2020-03-11 | Method for packaging mobile phone control chip |
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| CN111328255A true CN111328255A (en) | 2020-06-23 |
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| CN202010164657.7A Pending CN111328255A (en) | 2020-03-11 | 2020-03-11 | Method for packaging mobile phone control chip |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112051281A (en) * | 2020-09-14 | 2020-12-08 | 深圳格兰达智能装备股份有限公司 | A detection platform for placing strips |
| CN113246580A (en) * | 2021-05-31 | 2021-08-13 | 深圳市合扬智能卡科技有限公司 | Intelligent card packaging equipment combining electronic ink screen and keys and packaging method thereof |
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| CN116435219A (en) * | 2023-04-03 | 2023-07-14 | 津日科技(无锡)有限公司 | A chip packaging device for preventing electrostatic damage |
| CN119742259A (en) * | 2025-03-05 | 2025-04-01 | 常州科瑞尔科技有限公司 | Integrated DSC chip conveying fixture and working method thereof |
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| CN113394133A (en) * | 2021-05-08 | 2021-09-14 | 桂林芯飞光电子科技有限公司 | Packaging adjusting device and method for transferring detector chip |
| CN113246580A (en) * | 2021-05-31 | 2021-08-13 | 深圳市合扬智能卡科技有限公司 | Intelligent card packaging equipment combining electronic ink screen and keys and packaging method thereof |
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| CN119742259A (en) * | 2025-03-05 | 2025-04-01 | 常州科瑞尔科技有限公司 | Integrated DSC chip conveying fixture and working method thereof |
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