CN204498487U - A kind of surface patch SMT production system - Google Patents
A kind of surface patch SMT production system Download PDFInfo
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- CN204498487U CN204498487U CN201520239184.7U CN201520239184U CN204498487U CN 204498487 U CN204498487 U CN 204498487U CN 201520239184 U CN201520239184 U CN 201520239184U CN 204498487 U CN204498487 U CN 204498487U
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Abstract
The utility model discloses a kind of surface patch SMT production system, it comprises upper trigger, printing machine, tin cream detector, multiple chip mounter, reflow soldering furnace, X-ray crack detector and aftertreatment device, the port of export of described upper trigger is connected with the entrance point of printing machine, the port of export of printing machine is connected with the entrance point of tin cream detector, the port of export of tin cream detector is connected with the entrance point of reflow soldering furnace by multiple chip mounter successively, the port of export of reflow soldering furnace is connected with the entrance point of X-ray crack detector, the port of export of X-ray crack detector is connected with the entrance point of aftertreatment device.The utility model sets up tin cream detector and X-ray crack detector in SMT production system, and the manual detection window of other checkout gear and necessity, and while enhancing productivity, the quality of effective guarantee product, improves rate of finished products.
Description
Technical field
The utility model relates to a kind of surface patch SMT production system.
Background technology
At present along with the raising of employment cost, the automatic improving of enterprise is in quickening, and at electronic product production field, SMT project is brought into schedule by enterprise.SMT is surface installation technique (surface mounting technology) (abbreviation of Surface Mount Technology), is most popular a kind of technology and technique in current Electronic Assemblies industry.In existing SMT line configuration, capital equipment has: printing machine, chip mounter, Reflow Soldering.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of surface patch SMT production system, sets up tin cream detector and X-ray crack detector in SMT production system, and other checkout gear, while enhancing productivity, the quality of effective guarantee product, improves rate of finished products.
The purpose of this utility model is achieved through the following technical solutions: a kind of surface patch SMT production system, it comprises upper trigger, printing machine, tin cream detector, multiple chip mounter, reflow soldering furnace, X-ray crack detector and aftertreatment device, the port of export of described upper trigger is connected with the entrance point of printing machine, the port of export of printing machine is connected with the entrance point of tin cream detector, the port of export of tin cream detector is connected with the entrance point of reflow soldering furnace by multiple chip mounter successively, the port of export of reflow soldering furnace is connected with the entrance point of X-ray crack detector, the port of export of X-ray crack detector is connected with the entrance point of aftertreatment device.
Described printing machine is full-automatic printer, and the mode of its fixing pcb board is bottom vacuum plate sucking, Y-direction arranges bearing and Z-direction arranges clamping plate.
Described tin cream detector is provided with at least two 3D detection light source, is the SPI tin cream test pattern instrument of shadow-free effect.
Described chip mounter is high-speed module chip mounter.
Described X-ray crack detector is X-ray high-res harmless flaw detector.
Described reflow soldering furnace is pb-free solder hot-air through nonwoven, is provided with independently heating module, independently temperature control modules and independently blast velocity control module.
One or more manual detection window is provided with between described multiple chip mounters.
The entrance point of described reflow soldering furnace and the port of export are also respectively arranged with manual detection window.
Described aftertreatment device comprises board separator, solder paste thickness gauge and comprehensive test instrument, described board separator is many connecting plates contact board separator, described solder paste thickness gauge is full-automatic 3D solder paste thickness gauge, and described comprehensive test instrument is the integrative test instrument of wireless device air interface test.
The beneficial effects of the utility model are: the utility model sets up tin cream detector and X-ray crack detector in SMT production system, and the manual detection window of other checkout gear and necessity, while enhancing productivity, the quality of effective guarantee product, improves rate of finished products.
Accompanying drawing explanation
Fig. 1 is system architecture diagram of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail, but protection range of the present utility model is not limited to the following stated.
As shown in Figure 1, a kind of surface patch SMT production system, it comprises upper trigger, printing machine, tin cream detector, multiple chip mounter, reflow soldering furnace, X-ray crack detector and aftertreatment device, the port of export of described upper trigger is connected with the entrance point of printing machine, the port of export of printing machine is connected with the entrance point of tin cream detector, the port of export of tin cream detector is connected with the entrance point of reflow soldering furnace by multiple chip mounter successively, the port of export of reflow soldering furnace is connected with the entrance point of X-ray crack detector, the port of export of X-ray crack detector is connected with the entrance point of aftertreatment device.
(1) printing machine described in is full-automatic printer, and the mode of its fixing pcb board is bottom vacuum plate sucking, Y-direction arranges bearing and Z-direction arranges clamping plate.
Such as, model can be adopted to be the full-automatic printer of MPM125+, and this printing machine has following performance:
1. print speed printing speed: (6.35 ~ 305) mm/sec;
2. the print cycle: < 11sec (not comprising print stroke);
3. image contraposition accuracy: ± 0.025mm;
4. print range: 50*50mm ~ 457*406mm (x, y);
5. PCB mode is fixed: bottom vacuum plate sucking, Y-direction bearing and Z-direction clamping plate;
6. overall dimension: W1,606*D1,168*H1,636mm;
7. weight: about 800kg;
8. other configuration: automatic washing steel mesh, has printed 2D and has checked.
(2) the tin cream detector described in is provided with at least two 3D detection light source, is the SPI tin cream test pattern instrument of shadow-free effect.Tin cream detector need have following performance:
① Camera：4M Pixels Power LED；
2. detection light source quantity: two 3D detection light source, shadow-free effect;
3. detect several times: 90 cm2/sec;
4. drive system: linear motor (1um);
5. can drafting board size: 50mm*50mm ~ 510mm*460mm;
6. can slowdown monitoring circuit plate thickness: 0.5mm ~ 5mm;
7. contour size of the unit(s): (W) 1000*(D) 1410*(H) 1600mm.
(3) chip mounter described in is high-speed module chip mounter.
Such as, model can be adopted to be the ultrahigh speed modularization chip mounter of the CM602 of Panasonic, and this chip mounter has following performance:
1. head construction: the high speed head of 12 suction nozzles and direct assimilating type pallet, 3 suction nozzle multi-function heads of band pressure control function, make its various disparate modules compound mode reach 10 kinds, truly achieve modularization, allow client can existing random combination collocation;
2. XY axle all have employed state-of-the art linear motor, for CM602 provides the most powerful power;
3. linear motor have employed new Cooling Design scheme, the equipment of linear motor can be used to cool more fast and effectively than other, guarantee the operational paradigm of motor, improve its life-span when high-speed motion;
4. high speed head attachment minimum can paste 0201 element, general head arrive greatly subsides 100mm*90mm, the maximum 21mm of component thickness, weight 30g;
5. precision: ± 40 μm/chip (Cpk≤1), multi-functional attachment 3: precision: ± 35 μm/QFP (Cpk≤1);
6. substrate size: L 50mm × W 50mm: L 510mm × W 460mm.
Such as, model can be adopted to be the multi-functional module group type chip mounter of the CM101 of Panasonic, and this chip mounter has following performance:
1. mounting head: suction nozzle/8,12 suction nozzle/3 suction nozzle;
2. placement speed: 0.144s/ chip (A-2 type);
3. placement accuracy: ± 40 μm/chip (Cpk >=1);
4. component size (mm): 0402 chip * 1 ~ L12 × W12 × T6.5;
5. substrate size (mm): L50 × W50 ~ L460 × W360;
(4) reflow soldering furnace described in is pb-free solder hot-air through nonwoven, is provided with independently heating module, independently temperature control modules and independently blast velocity control module.Reflow soldering furnace in the utility model need have following performance:
1. patent type independent heating module, the heat efficiency improves greatly, and temperature homogeneity is better;
2. complete corresponding high-performance Pb-free reflow soldering processing procedure, is applicable to BGA, CSP, all SMT element welding such as 0201;
3. adopt independent temperature and the adjustable design of wind speed, meet various high accuracy pb-free solder technological requirement;
4. transport guide rails adjusts wide region 50 ~ 400mm;
5. PCB means of transportation Chain conveyer+net transmission (Chain conveyer+central supporting OPTION);
6. 25mm, lower 25mm on component height pcb board on pcb board;
7. conveyer belt speed: 0 ~ 2000mm/Min.
(5) the X-ray crack detector described in is X-ray high-res harmless flaw detector.X-ray crack detector in the utility model need have following performance:
1. the detection of the SMT element that applicable BGA, CSP, Flip Chip etc. are all;
2. pcb board welding situation is detected;
3. short circuit is supported, open circuit, cavity, the detection of cold welding;
4. IC package detection is supported;
5. the detection of the components and parts such as electric capacity, resistance is supported;
6. X/Y/Z tri-axle is movable;
7. guide rail noiselessness, motion is flexibly;
8. integral protection measure meets world security radiation standard.
Described aftertreatment device comprises board separator, solder paste thickness gauge and comprehensive test instrument.
(6) board separator described in is many connecting plates contact board separator, and the board separator in the utility model need have following performance:
1. single rack fuselage adopts Welding Structure;
2. perfect Xelminator structure, all around converges, and avoids side-blown;
3. 2 TBL can with the PCBA of time-division different model or same model PCBA alternately point plate.
(7) solder paste thickness gauge described in is full-automatic 3D solder paste thickness gauge, and the solder paste thickness gauge in the utility model need have following performance:
1. the 3D data that tin cream obtains each point are scanned;
2. be used for measuring the average thickness of whole pad tin cream;
3. 3D Open-GL display mode can carry out the reproduction of tin cream real topography, provides the another good approach judging paste solder printing quality.
(8) comprehensive test instrument described in is the integrative test instrument of wireless device air interface test.Such as, model can be adopted to be the mobile phone comprehensive test instrument of CMW500, and the comprehensive test instrument in the utility model need have following performance:
1. can be used on all stages of product development and production, support all common honeycombs and non-cellular wireless technology;
2. adopting configurable, to support MIMO radio-frequency front-end, just can connect wireless device flexibly without the need to using external radio frequency transducer;
3. can carry out full-automatic course corrections according to frequency, time, temperature, certainty of measurement is high, and interval of calibration is 2 years;
4. be Almightiness type wireless device test platform.
(9) the utility model also can arrange multiple manual detection window, further by staff, manual detection is carried out to pcb board, be provided with one or more manual detection window between described multiple chip mounters, the entrance point of described reflow soldering furnace and the port of export are also respectively arranged with manual detection window.As shown in Figure 1, when being provided with three chip mounters in generation system, can a manual detection mouth be set between chip mounter 2 and chip mounter 3.
Claims (9)
1. a surface patch SMT production system, it is characterized in that: it comprises upper trigger, printing machine, tin cream detector, multiple chip mounter, reflow soldering furnace, X-ray crack detector and aftertreatment device, the port of export of described upper trigger is connected with the entrance point of printing machine, the port of export of printing machine is connected with the entrance point of tin cream detector, the port of export of tin cream detector is connected with the entrance point of reflow soldering furnace by multiple chip mounter successively, the port of export of reflow soldering furnace is connected with the entrance point of X-ray crack detector, the port of export of X-ray crack detector is connected with the entrance point of aftertreatment device.
2. a kind of surface patch SMT production system according to claim 1, is characterized in that: described printing machine is full-automatic printer, and the mode of its fixing pcb board is bottom vacuum plate sucking, Y-direction arranges bearing and Z-direction arranges clamping plate.
3. a kind of surface patch SMT production system according to claim 1, is characterized in that: described tin cream detector is provided with at least two 3D detection light source, is the SPI tin cream test pattern instrument of shadow-free effect.
4. a kind of surface patch SMT production system according to claim 1, is characterized in that: described chip mounter is high-speed module chip mounter.
5. a kind of surface patch SMT production system according to claim 1, is characterized in that: described X-ray crack detector is X-ray high-res harmless flaw detector.
6. a kind of surface patch SMT production system according to claim 1, is characterized in that: described reflow soldering furnace is pb-free solder hot-air through nonwoven, is provided with independently heating module, independently temperature control modules and independently blast velocity control module.
7. a kind of surface patch SMT production system according to claim 1, is characterized in that: be provided with one or more manual detection window between described multiple chip mounters.
8. a kind of surface patch SMT production system according to claim 1, is characterized in that: the entrance point of described reflow soldering furnace and the port of export are also respectively arranged with manual detection window.
9. a kind of surface patch SMT production system according to claim 1, it is characterized in that: described aftertreatment device comprises board separator, solder paste thickness gauge and comprehensive test instrument, described board separator is many connecting plates contact board separator, described solder paste thickness gauge is full-automatic 3D solder paste thickness gauge, and described comprehensive test instrument is the integrative test instrument of wireless device air interface test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520239184.7U CN204498487U (en) | 2015-04-20 | 2015-04-20 | A kind of surface patch SMT production system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520239184.7U CN204498487U (en) | 2015-04-20 | 2015-04-20 | A kind of surface patch SMT production system |
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| Publication Number | Publication Date |
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| CN204498487U true CN204498487U (en) | 2015-07-22 |
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| CN201520239184.7U Expired - Fee Related CN204498487U (en) | 2015-04-20 | 2015-04-20 | A kind of surface patch SMT production system |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107231762A (en) * | 2017-06-02 | 2017-10-03 | 江苏久正光电有限公司 | A kind of SMT system of processing and its technique |
| CN108617163A (en) * | 2018-07-13 | 2018-10-02 | 苏州市吴通智能电子有限公司 | A kind of shifting apparatus and its control method applied to SMT attachment lines |
| CN109699169A (en) * | 2019-01-31 | 2019-04-30 | 深圳市益光实业有限公司 | Microwave multichannel T/R assembly surface mounting technology |
| CN110488739A (en) * | 2019-07-25 | 2019-11-22 | 爱创智联(深圳)科技有限公司 | A kind of SMT production data acquisition monitoring retroactive method based on Internet of Things |
| CN115426784A (en) * | 2022-07-28 | 2022-12-02 | 南京大陆豪薄膜开关技术有限公司 | FPC flexible touch panel manufacturing equipment and manufacturing method thereof |
-
2015
- 2015-04-20 CN CN201520239184.7U patent/CN204498487U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107231762A (en) * | 2017-06-02 | 2017-10-03 | 江苏久正光电有限公司 | A kind of SMT system of processing and its technique |
| CN108617163A (en) * | 2018-07-13 | 2018-10-02 | 苏州市吴通智能电子有限公司 | A kind of shifting apparatus and its control method applied to SMT attachment lines |
| CN109699169A (en) * | 2019-01-31 | 2019-04-30 | 深圳市益光实业有限公司 | Microwave multichannel T/R assembly surface mounting technology |
| CN110488739A (en) * | 2019-07-25 | 2019-11-22 | 爱创智联(深圳)科技有限公司 | A kind of SMT production data acquisition monitoring retroactive method based on Internet of Things |
| CN115426784A (en) * | 2022-07-28 | 2022-12-02 | 南京大陆豪薄膜开关技术有限公司 | FPC flexible touch panel manufacturing equipment and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20160420 |