CN208743880U - A kind of device detecting tin wave morphology - Google Patents
A kind of device detecting tin wave morphology Download PDFInfo
- Publication number
- CN208743880U CN208743880U CN201820747836.1U CN201820747836U CN208743880U CN 208743880 U CN208743880 U CN 208743880U CN 201820747836 U CN201820747836 U CN 201820747836U CN 208743880 U CN208743880 U CN 208743880U
- Authority
- CN
- China
- Prior art keywords
- photoelectric sensor
- solder furnace
- tin
- optical signal
- photosignal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910000679 solder Inorganic materials 0.000 claims abstract description 34
- 230000003287 optical effect Effects 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011326 mechanical measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a kind of device for detecting tin wave morphology, including solder furnace, solder furnace is equipped with an at least tin outputting mouth；XY delivery platform is drivingly connected with solder furnace；Z axis lifting device is arranged in the lower section of solder furnace, and is drivingly connected with solder furnace；First photoelectric sensor is located above tin outputting mouth, can issue and receive photosignal；Second photoelectric sensor is arranged in same level with the first photoelectric sensor, can issue and receive photosignal；The photosignal that first photoelectric sensor issues is mutually perpendicular to the second photoelectric sensor, and has an intersection point, for detecting height, width, surface smoothness and the entire surface form of tin wave；The utility model is detected tin wave morphology before scolding tin operation, is reached raising welding quality, improve the purpose of production capacity by two pairs of photoelectric sensors and Z axis lifting device.
Description
Technical field
The present invention relates to SMT technical field of welding equipment, more particularly, to a kind of device for detecting tin wave morphology and detection
Method.
Background technique
SMT is surface installation technique, referred to as surface mount or surface mounting technique.It is most to be flowed in current electronic assembly industry
A kind of capable technology and technique.
It is it is a kind of by no pin or short leg surface-assembled component be mounted on printed circuit board surface or other bases
On the surface of plate, the circuit load technology of welding assembly is subject to by the methods of Reflow Soldering or immersed solder.
For the welding method used in SMT for selective wave-soldering, tin wave height is with the size of devices according to Selective Soldering
And the height of type program setting wave crest；So the calibration initial value of crest height is particularly important, currently available technology is by one
Group causes calibration to occur the unidirectional calibrated altitude of radio eye or mechanical measurement tin wave height due to the unstability of wave crest form
Deviation easily occurs even tin and few tin or more tin when welding, needs to be modified by secondary welding, the quality and production capacity of product have
Wait improve.
Therefore it needs to improve.
Summary of the invention
In view of the deficienciess of the prior art, the object of the present invention is to provide a kind of devices for detecting tin wave morphology.
To achieve the goals above, the technical scheme adopted by the invention is that:
A kind of device detecting tin wave morphology, including solder furnace, solder furnace are equipped with an at least tin outputting mouth, and XY conveying is flat
Platform, with solder furnace be drivingly connected, for drive solder furnace movement be moved to oxide layer remove brush at, and with oxide layer removing brush into
Row relative motion, to realize removing oxide layer；Z axis lifting device is arranged in the lower section of solder furnace, and drives and connect with solder furnace
It connects, for driving solder furnace to move along Z-direction；First photoelectric sensor is located above tin outputting mouth, can issue and receive light
Electric signal；Second photoelectric sensor is arranged in same level with the first photoelectric sensor, can issue and receive optical telecommunications
Number；The photosignal that first photoelectric sensor issues is mutually perpendicular to the second photoelectric sensor, and has an intersection point, and point of intersection is used for
Detect height, width, surface smoothness and the entire surface form of tin wave.
In further technical solution, first photoelectric sensor includes the X being separately positioned at left and right sides of solder furnace
Direction optical signal transmitter and X-direction signal receiver, the second photoelectric sensor include being separately positioned on solder furnace front and rear sides
Y-direction optical signal transmitter and Y-direction signal receiver；The optical signal and Y-direction light that X-direction optical signal transmitter issues are believed
The optical signal that number reflector issues is mutually perpendicular to, and has intersection point.
After adopting the above structure, the invention has the advantages that compared with the prior art: the present invention is vertical by two groups
To photoelectric sensor and Z axis the lifting device composition penetrated, the configuration of surface of tin wave is detected by photoelectric sensor, and anti-
It is fed in system and is compared, and will test result and be sent to and be used for；Tin wave morphology is detected before operation, reaches raising welding
Quality reduces secondary welding, improves the purpose of production capacity.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the Parameter Map of standard tin wave of the invention；
Fig. 3 is the tin wave parameter figure of Real-time Feedback of the invention；
Fig. 4 is the form comparison schematic diagram of tin wave of the invention.
Specific embodiment
It is only below presently preferred embodiments of the present invention, is not intended to limit the scope of the present invention.
As shown in Figures 1 to 4, a kind of device detecting tin wave morphology, including solder furnace 1, solder furnace 1 are equipped at least
One tin outputting mouth 11；XY delivery platform is drivingly connected with solder furnace 1, and the lower section of solder furnace 1 is arranged in Z axis lifting device 2, and
It is drivingly connected with solder furnace 1, for driving solder furnace 1 to move along Z axis direction；First photoelectric sensor is located in tin outputting mouth 11
Side, can issue and receive photosignal；Second photoelectric sensor is arranged in same level with the first photoelectric sensor,
It can issue and receive photosignal；The photosignal that first photoelectric sensor issues is mutually perpendicular to the second photoelectric sensor,
And having an intersection point, point of intersection is used to detect height, width, surface smoothness and the entire surface form of tin wave.
In the present solution, first photoelectric sensor includes the direction the X light for being separately positioned on 1 left and right sides of solder furnace
Signal projector 5 and X-direction signal receiver 6, the second photoelectric sensor includes the Y for being separately positioned on 1 front and rear sides of solder furnace
Direction optical signal transmitter 7 and Y-direction signal receiver 8；The optical signal and Y-direction light that X-direction optical signal transmitter 5 issues are believed
The optical signal that number reflector 7 issues is mutually perpendicular to, and has intersection point.
Working principle:
Before carrying out weld job, detection tin wave morphology is first had to, the XY delivery platform drives the solder furnace 1 to move
The underface of the signal point of intersection to first, second photoelectric sensor is moved, the Z axis lifting device 2 drives solder furnace 1
It slowly being moved along Z-direction, tin wave is made gradually to intersect with signal point of intersection, optical signal is irradiated to the surface of tin wave, due to
Tin wave at tin outputting mouth 11 has blocked the signal of the first, second photoelectric sensor, and the discontinuous signal received is converted by system
Width W, height H, surface smoothness and the tin wave surface form of tin wave, and compared with the standard parameter of storage in systems
It is right, judge whether current tin wave is qualified, feeds back OK as a result, feeding back NG if unqualified as a result, and by result to report if qualified
The form of announcement is sent to user；As in Figure 2-4, first coordinate diagram is the Parameter Map of standard tin wave, and second coordinate diagram is
The tin wave parameter figure of Real-time Feedback, third coordinate diagram be both comparison diagram, and Fig. 2-4 be testing result be NG when parameter
Pattern.
The above is only a preferred embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (2)
1. a kind of device for detecting tin wave morphology, including solder furnace, solder furnace are equipped with an at least tin outputting mouth, it is characterised in that:
Including,
XY delivery platform is drivingly connected with solder furnace, is removed at brush for driving solder furnace movement to be moved to oxide layer, and and oxygen
Change layer and remove brush progress relative motion, to realize removing oxide layer；
Z axis lifting device is arranged in the lower section of solder furnace, and is drivingly connected with solder furnace, for driving solder furnace along Z-direction
Movement；
First photoelectric sensor is located above tin outputting mouth, can issue and receive photosignal；
Second photoelectric sensor is arranged in same level with the first photoelectric sensor, can issue and receive photosignal；
The photosignal that first photoelectric sensor issues is mutually perpendicular to the second photoelectric sensor, and has an intersection point, and point of intersection is used
In height, width, surface smoothness and the entire surface form of detection tin wave.
2. a kind of device for detecting tin wave morphology according to claim 1, it is characterised in that: first photoelectric sensor
Including the X-direction optical signal transmitter and X-direction signal receiver being separately positioned at left and right sides of solder furnace, the second photoelectric sensing
Device includes the Y-direction optical signal transmitter and Y-direction signal receiver for being separately positioned on solder furnace front and rear sides；X-direction light letter
The optical signal that the optical signal that number transmitter issues is issued with Y-direction light signal reflectors is mutually perpendicular to, and has intersection point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820747836.1U CN208743880U (en) | 2018-05-19 | 2018-05-19 | A kind of device detecting tin wave morphology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820747836.1U CN208743880U (en) | 2018-05-19 | 2018-05-19 | A kind of device detecting tin wave morphology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208743880U true CN208743880U (en) | 2019-04-16 |
Family
ID=66052458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820747836.1U Withdrawn - After Issue CN208743880U (en) | 2018-05-19 | 2018-05-19 | A kind of device detecting tin wave morphology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208743880U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108465901A (en) * | 2018-05-19 | 2018-08-31 | 东莞市合易自动化科技有限公司 | A kind of device and detection method of detection tin wave morphology |
-
2018
- 2018-05-19 CN CN201820747836.1U patent/CN208743880U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108465901A (en) * | 2018-05-19 | 2018-08-31 | 东莞市合易自动化科技有限公司 | A kind of device and detection method of detection tin wave morphology |
| CN108465901B (en) * | 2018-05-19 | 2024-03-12 | 东莞市合易自动化科技有限公司 | Device and method for detecting tin wave form |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190416 Effective date of abandoning: 20240312 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20190416 Effective date of abandoning: 20240312 |