CN1236279C - Flatness detecting method and detecting instrument thereby - Google Patents
Flatness detecting method and detecting instrument thereby Download PDFInfo
- Publication number
- CN1236279C CN1236279C CN 03140005 CN03140005A CN1236279C CN 1236279 C CN1236279 C CN 1236279C CN 03140005 CN03140005 CN 03140005 CN 03140005 A CN03140005 A CN 03140005A CN 1236279 C CN1236279 C CN 1236279C
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- transparent base
- electronic package
- weld part
- welding
- detection method
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Abstract
The present invention discloses a flatness detecting method and a detecting device thereof, particularly a detecting method and a corresponding detecting device for detecting the flatness of a welding part of an electronic unit and a circuit board. The detecting method mainly comprises the steps as follows: 1) a transparent base plate is provided, and the electronic unit is positioned on the transparent base plate, wherein the electronic unit corresponds to the transparent base at one side which is provided with the welding part; 2) a measuring device is used for detecting the distance between the bottom surface of the welding part of the electronic unit and the corresponding surface of the transparent base plate; 3) the maximum distance between the bottom surface of the welding part of the electronic unit and the corresponding surface of the transparent base plate is compared with a value which is ensured by theoretical calculation for welding the welding part of the electronic unit with the circuit board so as to judge whether the product is qualified or not.
Description
[technical field]
The present invention relates to a kind of flatness detection method and make in this way pick-up unit, relate in particular to a kind of be used for detector electronics and circuit board mutually the welding position flatness detection method and make in this way pick-up unit.
[background technology]
Between the electronic package, the most common welding manner as electric connector and circuit board has experienced DIP (direct insertion), SMT (surface adhering) and BGA three phases such as (spherical grid arrays).As adopt the DIP mode, circuit board need be provided with corresponding through hole, so cause in the circuit board circuit of multilayer all need avoid the aperture and make the circuit can't densification, thereby can't dwindle the volume of circuit board and electric connector, as for adopting SMT and BGA mode, it needs electric connector leg or the quite high same flatness of the essential maintenance of tin ball lower surface, otherwise can cause between part leg or tin ball and the circuit board producing rosin joint and cause telecommunication connection line between electric connector and the circuit board to interrupt and can't realize intended function, therefore most important to the detection of above-mentioned leg or tin ball flatness in process of production, the used detection method of industry mainly passes through to detect the height of relative electric connector 10 lower surfaces 15 of electric connector 10 welding foots at present, then all measured values are compared and get the difference of its mxm. and minimum, then this difference and all welding foots of assurance that calculate through theory and all welding theoretical difference comparison of circuit board are judged whether welding foot meets the same flatness requirement, but the problem that this kind method may occur has: 1) as shown in Figure 1, when electric connector 10 lower surfaces 15 parts that are connected with the highest pad are bent upwards distortion, the height of the measured welding foot that is arranged at this place is A+B+C (bottom surface that lower surface 15 is bent upwards is to the height on welding foot top), and the height of welding foot is B, thereby the difference in height of peak and minimum point is A+C, this may exceed all welding foots of assurance of calculating through theory and all welding theoretical difference of circuit board 20 and cause judging that product is defective, but with the electric connector lower surface that is connected with minimum pad is benchmark, the difference in height of the two is C, and this may be according in the theoretical value scope and can guarantee that all solder joints all can contact with circuit board.Another situation as shown in Figure 2, when electric connector 10 lower surfaces 15 parts with minimum pad are bent upwards distortion, the height of minimum pad is A '+B ', the height of high pad is B '+C ', suppose A " identical with A ' length; the difference of the measured value of the two is C " may judge that product is qualified less than theoretical difference, but with the electric connector lower surface that is connected with the highest pad is benchmark, the difference in height of the two is A "+C ", this may make this minimum welding foot contact with circuit board greater than theoretical difference.2) as shown in Figure 3, suppose the 15 no flexural deformations of electric connector 10 lower surfaces, when the height difference measuring between the highest welding foot of employing and the minimum welding foot, difference in height between the highest welding foot and the minimum welding foot is E, may be not surpass all welding foots of assurance that calculate through theory and all welding theoretical value of circuit board and can judge that product is qualified.But when electric connector 10 is mounted on the circuit board 20 (as shown in Figure 4), because the supporting role of high welding foot, electric connector 10 can produce the inclination of certain angle, therefore can cause the difference in height between minimum welding foot and the highest welding foot is F, and this may make this minimum welding foot contact with circuit board greater than theoretical difference.
[summary of the invention]
The object of the present invention is to provide a kind of easy operating and intuitively easy detection go out electronic package weld part flatness situation the flatness detection method.
Another purpose of the present invention is to provide a kind of pick-up unit that uses above-mentioned flatness detection method.
Flatness detection method of the present invention, be used for detector electronics and the circuit board flatness of welding position mutually, it is characterized in that this flatness detection method may further comprise the steps: 1) provide a transparent base, and electronic package is positioned on this transparent base, it is relative with described transparent base that wherein electronic package is provided with a side of weld part; 2) by the distance on relative transparent base surface, a measurement mechanism detector electronics weld part bottom surface, wherein measurement mechanism comprises light emitting devices and optical pickup apparatus; 3) ultimate range of the relative transparent base in electronic package weld part bottom surface is judged whether product is qualified with all weld parts of assurance electronic package that calculate through theory and all welding numeric ratio of circuit board.
The pick-up unit of implementing flatness detection method of the present invention comprises a transparent base and measurement mechanism at least, wherein said transparent base is in order to carry measured electronic package, it is relative with transparent base that electronic package is provided with a side of weld part, measurement mechanism comprises light emitting devices and optical pickup apparatus, and emitting beam from light emitting devices can see through transparent base and through the weld part reflection and finally received by optical pickup apparatus.
Compared with prior art, flatness detection method of the present invention adopts the distance between direct measurement electronic package weld part and substrate and judges whether maximal value therebetween exceeds all welding foots of assurance and all welding numerical value of circuit board that calculates through theory, so enforcement is easier intuitively also can guarantee that all welding foots all can weld mutually with circuit board, produce wrongheaded defective and overcome prior art.
[description of drawings]
Fig. 1 is the synoptic diagram of existing flatness detection method.
Fig. 2 is the another synoptic diagram of existing flatness detection method.
Fig. 3 is another synoptic diagram of existing flatness detection method.
Fig. 4 is the application synoptic diagram of flatness detection method shown in Figure 3.
Fig. 5 is for implementing synoptic diagram of the present invention.
Fig. 6 is for implementing another synoptic diagram of the present invention.
[embodiment]
See also shown in Figure 5, implementing flatness detection method of the present invention may further comprise the steps: 1) transparent base is provided, and electronic package is positioned on this transparent base, wherein the electronic package side and the described transparent base that are provided with weld part is oppositely arranged, in the present embodiment, above-mentioned electronic package is an electric connector 40, this electric connector 40 is provided with conducting terminal (not icon), the conducting terminal end is provided with tin ball 41 and makes this electric connector 40 adopt BGA (spherical grid array) mode to be connected with circuit board (not icon), described weld part is tin ball 41, and above-mentioned transparent base is one to have the glass substrate 42 of high-level degree; 2) pass through the distance H that a measurement mechanism detects relative glass substrate 42 surfaces, electric connector 40 tin balls, 41 bottom surfaces, this measurement mechanism comprises optical pickup apparatus 43 (as CCD) and light emitting devices 44 (as light source) in the present embodiment, light from light emitting devices 44 send that the back sees through glass substrate 42 and by tin ball 41 bottom reflections to optical pickup apparatus 43, really also a plurality of reflection units can be set between light emitting devices 44 and optical pickup apparatus 43, light is through the reflection of tin ball 41 bottom surfaces and reflection unit and finally received by optical pickup apparatus 43; 3) by a comparison means all tin balls 41 of ultimate range and the assurance of calculating through theory of the relative glass substrate 42 in tin ball 41 bottom surfaces are judged whether product is qualified with all welding numeric ratio of circuit board.
Figure 6 shows that another embodiment that implements flatness detection method of the present invention, be that with the first embodiment difference its measurement mechanism adopts laser detector 50, it is arranged at electric connector 40 and glass substrate 42 belows, laser detector 50 integrates optical pickup apparatus and light emitting devices, concrete measuring method does not as above repeat them here.
Really, the foregoing description is to be that example is described with the electric connector that adopts BGA (spherical grid array) mode to be connected with circuit board, and this method also can apply to the electric connector that adopts SMT (surface adhering) mode to be connected with circuit board.Really this detection method also can be applicable to detect the electronic package that other flatness is had relatively high expectations.
Easy to understand, the pick-up unit of implementing flatness detection method of the present invention comprises a transparent base and measurement mechanism at least, and wherein said transparent base is in order to carry measured electronic package, and it is relative with transparent base that described electronic package is provided with a side of weld part; Measurement mechanism is in order to the distance of detector electronics weld part and transparent base upper surface.Whether in all welding foots of assurance that calculate through theory and all welding numerical range of circuit board, also can adopt artificial judgment as for the distance of judging the maximum between electronic package weld part and transparent base, that is adopt a display device that above-mentioned maximal value is demonstrated and judge by the testing staff whether product is qualified, certainly also a comparison means can be set, as counter etc., in order to the distance of judging the maximum between electronic package weld part and transparent base whether in the numerical range of Theoretical Calculation and whether the decision product is qualified.
Claims (6)
1. flatness detection method, be used for detector electronics and the circuit board flatness of welding position mutually, it is characterized in that this flatness detection method may further comprise the steps: 1) provide a transparent base, and electronic package is positioned on this transparent base, it is relative with described transparent base that wherein electronic package is provided with a side of weld part; 2) by the distance on relative transparent base surface, a measurement mechanism detector electronics weld part bottom surface, wherein measurement mechanism comprises light emitting devices and optical pickup apparatus; 3) ultimate range of the relative transparent base in electronic package weld part bottom surface is judged whether product is qualified with all weld parts of assurance electronic package that calculate through theory and all welding numeric ratio of circuit board.
2. flatness detection method as claimed in claim 1 is characterized in that: described electronic package is an electric connector, and this electric connector is provided with conducting terminal, and described weld part is and the terminal tin ball that electrically connects of conducting terminal.
3. flatness detection method as claimed in claim 1 is characterized in that: described electronic package is an electric connector, and this electric connector is provided with conducting terminal, and weld part is a surface adhesion type leg of being located at the conducting terminal end.
4. as claim 1,2 or 3 described flatness detection methods, it is characterized in that: emitting beam from light emitting devices can see through transparent base and through the weld part reflection and finally received by optical pickup apparatus.
5. pick-up unit of implementing the described flatness detection method of claim 1, it is characterized in that: this pick-up unit comprises transparent base and measurement mechanism at least, wherein said transparent base is in order to carry measured electronic package, it is relative with transparent base that electronic package is provided with a side of weld part, measurement mechanism comprises light emitting devices and optical pickup apparatus, and emitting beam from light emitting devices can see through transparent base and through the weld part reflection and finally received by optical pickup apparatus.
6. pick-up unit as claimed in claim 5 is characterized in that: described pick-up unit also comprise one in order to the distance of the maximum of judging the electronic package weld part whether at all welding foots of assurance that calculate through theory and the comparison means in all welding numerical range of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03140005 CN1236279C (en) | 2003-07-31 | 2003-07-31 | Flatness detecting method and detecting instrument thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03140005 CN1236279C (en) | 2003-07-31 | 2003-07-31 | Flatness detecting method and detecting instrument thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1514203A CN1514203A (en) | 2004-07-21 |
| CN1236279C true CN1236279C (en) | 2006-01-11 |
Family
ID=34240227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03140005 Expired - Lifetime CN1236279C (en) | 2003-07-31 | 2003-07-31 | Flatness detecting method and detecting instrument thereby |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1236279C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI476370B (en) * | 2011-01-27 | 2015-03-11 | Hon Hai Prec Ind Co Ltd | Flatness testing device |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102607481A (en) * | 2011-01-24 | 2012-07-25 | 鸿富锦精密工业（深圳）有限公司 | Coplane degree testing device |
| CN102944185B (en) * | 2012-11-14 | 2016-04-27 | 西南大学 | A kind of device detecting miniature deformation under multaxial stress effect |
| CN103868478A (en) * | 2014-04-01 | 2014-06-18 | 四川虹视显示技术有限公司 | Rapid detection method and device for flatness of transparent flat plate |
| CN108613640A (en) * | 2016-12-13 | 2018-10-02 | 海太半导体（无锡）有限公司 | A kind of semiconductor tin ball coplanarity test system and method |
| JP7039806B2 (en) * | 2018-01-17 | 2022-03-23 | 三菱重工業株式会社 | Heat transfer panel distortion correction method, heat transfer panel distortion correction support system, and heat transfer panel distortion correction program |
-
2003
- 2003-07-31 CN CN 03140005 patent/CN1236279C/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI476370B (en) * | 2011-01-27 | 2015-03-11 | Hon Hai Prec Ind Co Ltd | Flatness testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1514203A (en) | 2004-07-21 |
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Granted publication date: 20060111 |