CN110849250A

CN110849250A - Surface mounted device pin flatness detection device

Info

Publication number: CN110849250A
Application number: CN201911312504.6A
Authority: CN
Inventors: 何海波
Original assignee: Shenzhen Han Ke Ke Electronics Co Ltd
Current assignee: Shenzhen Han Ke Ke Electronics Co Ltd
Priority date: 2019-12-18
Filing date: 2019-12-18
Publication date: 2020-02-28

Abstract

The invention relates to a device for detecting the pin flatness of a patch element, which comprises a detection plane; the detection plane is distributed with conducting strips which respectively correspond to all pins of the tested patch element, and each conducting strip comprises a first conducting strip and a second conducting strip which are separated by a gap and are insulated with each other; the detection device is used for detecting whether the first conducting plate and the second conducting plate are conducted or not when the bent part at the tail end of the pin of the patch element is pressed on the conducting plate. The flatness of the pins of the patch element is forwarded to detect whether the two conducting strips are conducted, and the flatness of the patch element can be detected by using the detection device for detecting whether the two conducting strips are conducted, so that misjudgment is avoided.

Description

Surface mounted device pin flatness detection device

Technical Field

The invention relates to the field of chip pin flatness detection, in particular to a device for detecting the pin flatness of a chip component.

Background

SMT is a Surface mounting Technology (Surface Mount Technology), which is called Surface Mount Technology entirely and is the most popular Technology and process in the electronic assembly industry.

The surface mount technology is a Circuit mounting technology in which a surface mount device (SMC/SMD, a chip device in chinese) having no leads or short leads is mounted on a surface of a Printed Circuit Board (PCB) or a surface of another substrate, and is soldered and mounted by a method such as reflow soldering or dip soldering.

The SMT is required to have no pin or a short pin for a chip component, and because the chip is a chip, a relatively flat plane is required at the bottom of the short pin, as shown in fig. 1, the chip component 100 is a side view of the chip component, the chip component 100 has pins 101, the pins 101 are led out from two sides of the chip component 100, a bending portion 102 is further arranged at the end of each pin 101, the lower side of the bending portion 102 is a chip portion, if the bending portion 102 of each certain pin 101 is not in the same plane as the other pins, that is, the flatness of the bending portion is relatively poor, the quality of the chip will be affected during chip mounting, even the pins of some chip components are subjected to insufficient soldering, and if the flatness of the bending portion of a certain pin is poor, defective devices such as insufficient soldering and the like can also occur during chip mounting. Therefore, the flatness of the pins of the chip component is an important index, and flatness detection is required when the chip component is mounted or shipped. Currently, laser detection is generally adopted in the industry, namely, a patch element is flatly placed on a flat plate and then irradiated by light (generally adopting laser), and if a photo does not leak from the opposite surface, the flatness is good, and the method can cause misjudgment because the photo is generally observed by naked eyes on the irradiated light. Therefore, some enterprises adopt an automatic detection method, for example, chinese patent publication No. CN 202975534U discloses a stitch flatness detection apparatus, which includes: the device comprises a detection plate and a signal processing circuit, wherein a plurality of strain gauges corresponding to a plurality of pins to be detected are distributed on one plane of the detection plate; the strain gauge converts the pressure applied on the strain gauge into corresponding electric signals and then transmits the electric signals to the signal processing circuit for processing. The voltage signal generated by the strain gauge corresponding to the pin position on the detection device is used for determining which pin is protruded, so that the height of the protruded pin is adjusted, and the flatness of the pin is ensured.

However, this detection method cannot detect whether the end bent portion 102 of the lead 101 is flat or not.

Disclosure of Invention

The invention provides a device for detecting the flatness of pins of a patch element, aiming at the dilemma of detecting the flatness of the pins of the patch element at present.

The technical scheme adopted by the invention for realizing the technical purpose is as follows: a device for detecting the pin flatness of a patch element comprises a detection plane; the detection plane is distributed with conducting strips which respectively correspond to all pins of the tested patch element, and each conducting strip comprises a first conducting strip and a second conducting strip which are separated by a gap and are insulated with each other;

the detection device is used for detecting whether the first conducting plate and the second conducting plate are conducted or not when the bent part at the tail end of the pin of the patch element is pressed on the conducting plate.

The flatness of the pins of the patch element is forwarded to detect whether the two conducting strips are conducted, and the flatness of the patch element can be detected by using the detection device for detecting whether the two conducting strips are conducted, so that misjudgment is avoided.

Further, among the aforesaid patch element pin roughness detection device: the detection device comprises a light-emitting diode D and a power supply, wherein the conductive sheet is connected in series to a loop of the power supply for the light-emitting diode D; the first conducting plate is connected with the light emitting diode D, and the second conducting plate is connected with the power supply.

Further, among the aforesaid patch element pin roughness detection device: the gaps are saw-tooth gaps which are meshed with each other.

Further, among the aforesaid patch element pin roughness detection device: the gap is an irregular gap.

Furthermore, in the device for detecting the pin flatness of the patch element, the detection plane is a printed circuit board, the conducting strips are two mutually insulated copper sheets attached to the surface of the printed circuit board, and the power supply and the light emitting diode D are circuits on the printed circuit board.

The invention will be explained in more detail below with reference to the drawings and examples.

Drawings

Fig. 1 is a left side view of a conventional patch element.

Fig. 2 is a schematic diagram of the flatness detection device for detecting the flatness of the pins of the patch element.

Fig. 3 is a sectional view of fig. 2A _ a.

Fig. 4 is an enlarged view of fig. 2B.

Fig. 5 is a schematic diagram (one) of a PCB for inspection in embodiment 1 of the present invention.

Fig. 6 is a schematic diagram (ii) of the PCB for detection in embodiment 1 of the present invention.

Fig. 7 is a schematic diagram (one) of a PCB for detection in embodiment 2 of the present invention.

Fig. 8 is a schematic diagram (ii) of the PCB for detection in embodiment 2 of the present invention.

Detailed Description

Example 1, as shown in fig. 2, 3 and 4: this embodiment is a detection device that detects the roughness of paster component pin, and it is SMT process's necessary frock, and the paster component can make the paster be of high quality only to the roughness of pin is good.

In this embodiment, the device for detecting the pin flatness of the patch element includes a detection plane 200; the method comprises the following steps that a patch element to be detected is placed on a PCB for flatness detection, a PCB is used in a detection plane 200 in the embodiment, the detection plane is a flat board and is a detection tool of the patch element 100 with 12 pins on 2, as shown in FIG. 2, conductive sheets 201 corresponding to all pins 101 of the patch element 100 to be detected are distributed on the PCB in the embodiment, 12 copper sheets are pasted on the PCB in a 2 x 6 sequencing mode in practice, the conductive sheets 201 comprise a first conductive sheet 203 and a second conductive sheet 204 which are separated by a gap 202 and are insulated from each other, and in the embodiment, the copper sheets are split into two copper sheets which are insulated from each other through an irregular gap in the middle; in this embodiment, the gap 202 between two copper sheets is isolated by using a zigzag shape, as shown in fig. 4, so that when the terminal bending portion 102 of the pin 101 of the patch element 100 presses the conductive sheet 201, there is a large amount of movement, unlike two regular straight lines that divide the conductive sheet 201 into two, so that the terminal bending portion 102 of the pin 101 of the patch element 100 must press two sides shared by the two straight lines to achieve the detection purpose, and if the conductive sheet 201 is divided into two by using a zigzag or other irregular curve, the patch element 100 is pressed more freely.

Thus, when detecting, it can be determined whether the bent portion 103 at the end of the pin 102 of the chip element 100 pressed thereon is flat by detecting whether the first conductive sheet 203 and the second conductive sheet 204 are conductive, and if the two sheets further include a detecting device for detecting whether the first conductive sheet 203 and the second conductive sheet 204 are conductive when the bent portion 102 at the end of the pin 101 of the chip element 100 is pressed on the conductive sheet 201. At present, there are many such detecting devices, and those skilled in the art can design such a circuit according to practice, as shown in fig. 5, the detecting device includes a light emitting diode D, a power supply, and a conductive sheet 201 connected in series to a loop of the power supply supplying power to the light emitting diode D; the first conductive plate 203 is connected with the light emitting diode D, and the second conductive plate 204 is connected with the power supply. During detection, the flatness of the pin is good only when the light emitting diode D emits light. In fact, in this embodiment, the detection plane 200 is a printed circuit board, the conductive sheet 201 is two mutually insulated copper sheets attached to the surface of the printed circuit board, and the power supply and the circuit of the light emitting diode D are circuits on the printed circuit board.

Fig. 5 is a schematic diagram of a circuit on a printed circuit board of a detection plane for detecting the flatness of a single chip component pin. In practice, multiple patch elements can be tested simultaneously on the same tool, as shown in fig. 6 on a larger printed circuit board 300. And 4 × 4 groups of conducting strips 201 are attached to form a detection tool for simultaneously detecting 16 patch elements.

Embodiment 2 as shown in fig. 7 and 8, the present embodiment is different from embodiment 1 in that a detecting device for detecting whether a first conductive sheet 203 and a second conductive sheet 204 are conductive is different, and as shown in fig. 7, the circuit of the detecting device includes a power supply VCC, a current limiting resistor R; the power VCC is connected to the first conductive plate 203 in the conductive plate 2011, and the second conductive plate 204 is grounded through the current limiting resistor R, thereby detecting the voltage of the second conductive plate 204. The voltage detection device is a single chip microcomputer, when the patch element 100 is pressed on the upper surface, the single chip microcomputer scans the voltage of the second conducting strip 204, and if the voltage is low, the pin flatness of the corresponding patch element 100 is not satisfactory. Like embodiment 1, in this embodiment, the detection plane 200 is a printed circuit board, and 4 × 6 sets of conductive sheets 301 are formed on the printed circuit board, and each set of conductive sheets 201 forms a flatness detection area of one patch element 100, so that 24 patch elements can be detected at the same time. As shown in fig. 8, the conductive sheet 201 is a first conductive sheet 203 and a second conductive sheet 204 formed by two mutually isolated solders soldered on a printed circuit board, and all the second conductive sheets 204 are connected to the single chip via wires on the printed circuit board. In practice, the single chip microcomputer can judge whether the 24 patch elements have elements with unqualified flatness or not by scanning the voltage of each second conducting strip 204.

Claims

1. A device for detecting pin flatness of a patch element comprises a detection plane (200); the method is characterized in that: the detection plane (200) is distributed with conducting strips (201) which respectively correspond to all pins (101) of the tested patch element (100), and each conducting strip (201) comprises a first conducting strip (203) and a second conducting strip (204) which are separated by a gap (202) and are insulated from each other; the device also comprises a detection device for detecting whether the first conducting sheet (203) and the second conducting sheet (204) are conducted or not when the bent part (102) at the tail end of the pin (101) of the patch element (100) is pressed on the conducting sheet (201).

2. A patch element pin flatness detection apparatus according to claim 1, wherein: the detection device comprises a light-emitting diode D and a power supply, wherein a conducting sheet (201) is connected in series to a loop of the power supply for the light-emitting diode D; wherein the first conducting plate (203) is connected with the light emitting diode D, and the second conducting plate (204) is connected with the power supply.

3. A patch element pin flatness detection apparatus according to claim 1, wherein: the gaps (202) are saw-tooth gaps which are meshed with each other.

4. A patch element pin flatness detection apparatus according to claim 1, wherein: the gap (202) is an irregular gap.

5. A patch element pin flatness detection apparatus according to claim 2, wherein: the detection plane (200) is a printed circuit board, the conducting strip (201) is two mutually insulated copper sheets attached to the surface of the printed circuit board, and a power supply and a loop of the light emitting diode D are circuits on the printed circuit board.

6. A patch element pin flatness detection apparatus according to claim 1, wherein: the detection device comprises a power supply VCC and a current-limiting resistor R; the power VCC connects the first conducting plate (203) in the conducting plate (201), the second conducting plate (204) is earthed through the current limiting resistance R, detect the voltage detection device of the second conducting plate (204) voltage.

7. A patch element pin flatness detection apparatus according to claim 6, wherein: the detection device is characterized by further comprising a single chip microcomputer, the detection plane (200) is a printed circuit board, conducting strips (301) of an NxM group are formed on the printed circuit board, each group of conducting strips (201) form a flatness detection area of one patch element (100), the conducting strips (201) are first conducting strips (203) and second conducting strips (204) which are formed by two mutually isolated soldering tin welded on the printed circuit board, and all the second conducting strips (204) are connected into the single chip microcomputer through conducting wires on the printed circuit board.