CN110849250A - Surface mounted device pin flatness detection device - Google Patents

Abstract

The invention relates to a device for detecting the flatness of the pins of a patch component, comprising a detection plane; the detection plane is distributed with conductive sheets corresponding to all the pins of the tested patch element, and the conductive sheet includes a Two mutually insulated first conductive sheets and second conductive sheets separated by a gap; also including detecting the first conductive sheet and the second conductive sheet when the bent part of the pin end of the patch element is pressed on the conductive sheet A detection device for whether the chip is turned on. The invention forwards the flatness of the pins of the patch element to the problem of detecting whether the two conductive sheets are connected, and the flatness of the patch element can be detected by using a detection device for detecting whether the two conductive sheets are connected, so as to avoid misjudgment .

Description

A chip component lead flatness detection device

technical field

The invention relates to the field of chip pin flatness detection, in particular to a chip component pin flatness detection device.

Background technique

SMT is Surface Mount Technology (Surface Mount Technology), which is called Surface Mount Technology in English. It is the most popular technology and process in the electronic assembly industry.

It is a kind of surface mount components without leads or short leads (SMC/SMD for short, Chinese called chip components, also known as SMD components) installed on the surface of the printed circuit board (Printed Circuit Board, PCB) or On the surface of other substrates, the circuit assembly technology is soldered and assembled by methods such as reflow soldering or dip soldering.

The requirement of SMT for SMD components is no pins or short pins. Since it is a SMD, the bottom of the short pins needs to have a relatively flat plane. As shown in Figure 1, it is the side of a SMD component. In the view, the SMD component 100 has pins 101, the pins 101 are drawn out from both sides of the SMD component 100, and there is a bending part 102 at the end of the pin 101, and the lower side of this bending part 102 is the SMD part, If the bent portion 102 of each pin 101 is not on the same plane as the others, that is to say, its flatness is relatively poor, the patch quality will be affected during patching, and even the leads of some patch components will be affected. If there is virtual welding, if the flatness of the bending part of a pin is not good, there will be defects such as virtual welding during patching. Therefore, the flatness of the pins of the SMD component is an important indicator, and the flatness test needs to be carried out during the SMD or when leaving the factory. At present, laser detection is generally used in the industry, which is to place the patch component flat on a flat plate, and then use light (usually laser) to irradiate it. If the light photo does not leak from the opposite side, it means that the flatness is good. Light is generally observed with the naked eye, and misjudgment will occur. Therefore, some enterprises adopt automatic detection methods. For example, Chinese Patent Publication No. CN 202975534U discloses a stitch flatness detection device. The stitch flatness detection device includes: a detection board and a signal processing circuit, the detection board, a A plurality of strain gauges corresponding to the plurality of pins to be measured are distributed on the plane; the strain gauges convert the pressure exerted on the strain gauges into corresponding electrical signals and then transmit them to the signal processing circuit for processing. The height of the protruding pin is determined by the voltage signal generated by the strain gauge corresponding to the pin position on the detection device, so as to adjust the height of the protruding pin to ensure the flatness of the pin.

However, this detection method cannot detect whether the bent portion 102 at the end of the pin 101 is straight.

SUMMARY OF THE INVENTION

Aiming at the difficulties encountered in the current flatness detection of the pins of the chip components, the present invention provides a device for detecting the flatness of the pins of the chip components.

The technical scheme adopted by the present invention to achieve its technical purpose is: a device for detecting the flatness of pins of a patch component, comprising a detection plane; A conductive sheet, the conductive sheet includes two mutually insulated first conductive sheets and second conductive sheets separated by a gap;

It also includes a detection device for detecting whether the first conductive sheet and the second conductive sheet are connected when the bent portion of the pin end of the patch element is pressed on the conductive sheet.

The invention forwards the flatness of the pins of the patch element to the problem of detecting whether the two conductive sheets are connected, and the flatness of the patch element can be detected by using a detection device for detecting whether the two conductive sheets are connected, so as to avoid misjudgment .

Further, in the above-mentioned patch component pin flatness detection device: the detection device includes a light-emitting diode D and a power supply, and the conductive sheet is connected in series to the power supply loop of the power supply to the light-emitting diode D; wherein the first conductive sheet is connected. Light-emitting diode D, the second conductive sheet is connected to the power supply.

Further, in the above-mentioned device for detecting the flatness of the pins of the patch component: the gaps are zigzag gaps that mesh with each other.

Further, in the above-mentioned device for detecting the flatness of the pins of the chip component: the gap is an irregular gap.

Further, the detection plane described in the above-mentioned SMD component pin flatness detection device is a printed circuit board, the conductive sheet is two mutually insulated copper sheets attached to the surface of the printed circuit board, the power supply and the light-emitting diode D are connected. A loop is a circuit on a printed circuit board.

The present invention will be described in more detail below with reference to the accompanying drawings and embodiments.

Description of drawings

Figure 1 is a left side view of a commonly used chip component.

FIG. 2 is a schematic diagram of detecting the flatness of the pins of the chip component by applying the flatness detection device of the present invention.

FIG. 3 is a cross-sectional view of FIG. 2A_A.

FIG. 4 is an enlarged view of FIG. 2B .

FIG. 5 is a schematic diagram (1) of a PCB used for detection in Embodiment 1 of the present invention.

FIG. 6 is a schematic diagram (2) of a PCB used for detection in Embodiment 1 of the present invention.

FIG. 7 is a schematic diagram (1) of a PCB used for detection in Embodiment 2 of the present invention.

FIG. 8 is a schematic diagram (2) of a PCB used for detection in Embodiment 2 of the present invention.

Detailed ways

Embodiment 1, as shown in Figure 2, Figure 3 and Figure 4: This embodiment is a detection device for detecting the flatness of the pins of SMT components, which is a necessary tool for the SMT process, and the SMT components only have The flatness of the pins is good for the quality of the patch.

In this embodiment, the device for detecting the flatness of the pins of the SMD component includes a detection plane 200; the SMD component to be detected is placed on the top for flatness detection. The detection plane 200 uses a PCB in this embodiment, which It is a flat board, as shown in Figure 2, it is a detection tool for a 12-pin SMD component 100 on 2. On the detection plane 200, in this embodiment, it is on the PCB board. The conductive sheets 201 corresponding to all the pins 101 of the SMD component 100 are measured. In practice, 12 copper sheets are pasted on the PCB in a 2×6 order. The conductive sheet 203 and the second conductive sheet 204, in this embodiment, the copper sheet is split into two mutually insulated copper sheets through an irregular crack in the middle; the gap 202 between the two copper sheets is isolated. 4, in this way, when the bent portion 102 of the end of the pin 101 of the patch component 100 is pressed against the conductive sheet 201, there can be a larger amount of movement, unlike the regular two straight lines that connect the conductive sheet 201 is divided into two pieces, in this way, the bending part 102 of the end of the pin 101 of the chip component 100 must be pressed on both sides of the two straight lines to achieve the detection purpose. If it is a zigzag or other irregular curve, the conductive sheet 201 is divided into If there are two pieces, the SMD component 100 can be pressed down much more freely.

In this way, when the detection is performed, it is only necessary to detect whether the first conductive sheet 203 and the second conductive sheet 204 are conductive to determine whether the bent portion 103 at the end of the pin 102 of the chip component 100 pressed on the top is flat. If the two pieces also include a detection device for detecting whether the first conductive sheet 203 and the second conductive sheet 204 are connected when the bent portion 102 at the end of the lead 101 of the chip component 100 is pressed against the conductive sheet 201 . At present, there are many such detection devices, and those skilled in the art can design such circuits according to practice. As shown in FIG. 5 , the detection device includes a light-emitting diode D and a power supply. The conductive sheet 201 is connected to the power supply in series to supply power to the light-emitting diode D. The first conductive sheet 203 is connected to the light-emitting diode D, and the second conductive sheet 204 is connected to the power supply. During detection, the flatness of the pin is good only when the light-emitting diode D emits light. In fact, in this embodiment, the detection plane 200 is a printed circuit board, the conductive sheet 201 is two mutually insulated copper sheets attached to the surface of the printed circuit board, and the circuit between the power supply and the light-emitting diode D is the circuit on the printed circuit board .

As shown in Figure 5, the circuit schematic diagram on the printed circuit board of the detection plane of the pin flatness detection of a single chip component is shown. In practice, multiple SMD components can be inspected simultaneously on the same tooling, which is on a larger printed circuit board 300 as shown in FIG. 6 . Paste 4×4 groups of conductive sheets 201 to form a testing tool for testing 16 SMD components at the same time.

Embodiment 2 is shown in FIGS. 7 and 8 . The difference between this embodiment and Embodiment 1 is that the detection device for detecting whether the first conductive sheet 203 and the second conductive sheet 204 are connected is different. As shown in FIG. 7 , the detection device is different. The device circuit includes a power supply VCC and a current limiting resistor R; the power supply VCC is connected to the first conductive sheet 203 in the conductive sheet 2011 , the second conductive sheet 204 is grounded through the current limiting resistor R, and a voltage detection device for detecting the voltage of the second conductive sheet 204 . The voltage detection device is a single-chip microcomputer. When the chip component 100 is pressed on it, the single-chip microcomputer scans the voltage of the second conductive sheet 204. If there is a low voltage, it means that the pin flatness of the corresponding chip component 100 does not meet the requirements. As in Embodiment 1, in this embodiment, the detection plane 200 is a printed circuit board, and 4×6 groups of conductive sheets 301 are formed on the printed circuit board. In this way, 24 SMD components can be detected at the same time. As shown in FIG. 8 , the conductive sheet 201 is a first conductive sheet 203 and a second conductive sheet 204 formed by two pieces of isolated solder soldered on the printed circuit board, and all the second conductive sheets 204 pass through the printed circuit board. The wire is connected to the microcontroller. In practice, by scanning the voltage of each second conductive sheet 204, the single-chip microcomputer can determine whether any of the 24 SMD components has unqualified flatness.

Claims (7)

1. A device for detecting pin flatness of a patch component, comprising a detection plane (200); it is characterized in that: the detection plane (200) is distributed with all the pins ( 101) A corresponding conductive sheet (201), the conductive sheet (201) comprising two mutually insulated first conductive sheets (203) and second conductive sheets (204) separated by a slit (202); further comprising When the bent portion (102) at the end of the lead (101) of the patch component (100) is pressed on the conductive sheet (201), the first conductive sheet (203) and the second conductive sheet (204) are detected. A detection device for conduction. 2 . The device for detecting the flatness of the pins of a chip component according to claim 1 , wherein the detecting device comprises a light-emitting diode D and a power supply, and the conductive sheet (201) is connected to the power supply in series to supply power to the light-emitting diode D. 3 . The first conductive sheet (203) is connected to the light-emitting diode D, and the second conductive sheet (204) is connected to the power supply. 3 . The device for detecting the flatness of pins of a patch component according to claim 1 , wherein the gap ( 202 ) is a zigzag gap that meshes with each other. 4 . 4. The device for detecting the flatness of pins of a patch component according to claim 1, wherein the gap (202) is an irregular gap. 5. The device for detecting the flatness of pins of a chip component according to claim 2, wherein the detection plane (200) is a printed circuit board, and the conductive sheet (201) is a surface of the printed circuit board. Two pieces of copper insulated from each other, the circuit between the power supply and the light-emitting diode D is the circuit on the printed circuit board. 6. The device for detecting the flatness of pins of a chip component according to claim 1, wherein the detecting device comprises a power supply VCC and a current limiting resistor R; the power supply VCC is connected to the first conductive sheet in the conductive sheet (201). (203), the second conductive sheet (204) is grounded through the current limiting resistor R, and a voltage detection device for detecting the voltage of the second conductive sheet (204). 7 . The device for detecting the flatness of the pins of a chip component according to claim 6 , further comprising a single-chip microcomputer, and the detection plane ( 200 ) is a printed circuit board, and on the printed circuit board, an N× M groups of conductive sheets (301), each group of conductive sheets (201) forms a flatness detection area for a patch component (100), and the conductive sheets (201) are two pieces of mutually isolated solder soldered on the printed circuit board The first conductive sheet (203) and the second conductive sheet (204) are formed, and all the second conductive sheets (204) are connected to the single-chip microcomputer through wires on the printed circuit board.

Images