CN211102012U - Automatic solder paste dispensing machine for two ends of heat conduction pipe - Google Patents
Automatic solder paste dispensing machine for two ends of heat conduction pipe Download PDFInfo
- Publication number
- CN211102012U CN211102012U CN201921755613.0U CN201921755613U CN211102012U CN 211102012 U CN211102012 U CN 211102012U CN 201921755613 U CN201921755613 U CN 201921755613U CN 211102012 U CN211102012 U CN 211102012U
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- China
- Prior art keywords
- solder paste
- heat conduction
- conduction pipe
- conveying line
- module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 86
- 230000007246 mechanism Effects 0.000 claims abstract description 48
- 238000001514 detection method Methods 0.000 claims abstract description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000006071 cream Substances 0.000 claims abstract description 13
- 238000011084 recovery Methods 0.000 claims description 13
- 239000000969 carrier Substances 0.000 claims description 6
- 230000000007 visual effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to an automatic solder paste machine for two ends of a heat conduction pipe, which comprises a frame, a solder paste applying mechanism, a solder paste detecting mechanism and a conveying line, wherein the solder paste applying mechanism, the solder paste detecting mechanism and the conveying line are respectively arranged at the upper end of the frame; the solder paste dispensing mechanism and the solder paste detection mechanism are both positioned above the conveying line and are sequentially placed along the conveying direction of the conveying line; the solder paste dispensing mechanism comprises an XYZ-axis servo module, solder paste dispensing components respectively arranged at the drive ends of the XYZ-axis servo module, and a vision sensor used for judging the positions of solder paste at two ends of the heat conduction pipe; the solder paste detection mechanism comprises an XY axis linear module and a 3D camera arranged at the drive end of the XY axis linear module and used for detecting the amount of solder paste at two ends of the heat conduction pipe; the utility model discloses can not only improve work efficiency automatically at the both ends point tin cream of heat pipe, and can judge the position of heat pipe both ends point tin cream, make some tin cream position more accurate to can also detect the tin cream volume, guarantee the radiating effect.
Description
Technical Field
The utility model relates to an automatic field refers in particular to a heat pipe both ends are from moving point tin cream machine.
Background
The heat dissipation module is widely applied to a notebook computer for dissipating heat of a CPU and a GPU, and as shown in fig. 1, the heat dissipation module 6 includes a heat pipe 61, a CPU heat conduction block 62 and a GPU heat conduction block 63 fixed on the heat pipe 61 respectively through solder paste, heat dissipation fins 64 fixed at two ends of the heat pipe 61 respectively through solder paste, and end caps 65 fixed at outermost sides of two ends of the heat pipe 61 respectively through solder paste for connecting a motherboard; however, the positions where the two ends of the current heat conduction pipe are connected with the end cover are manually coated with solder paste, so that the following problems exist: 1. because the solder paste is manually applied, the production efficiency is low and the labor intensity is high; 2. the position precision of the solder paste can not be ensured, so that the reject ratio is high, and the production cost is greatly increased; 3. the amount of solder paste is not easy to control, and too much solder paste affects the heat dissipation efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art and providing a heat pipe both ends are from moving point tin cream machine.
In order to achieve the above purpose, the utility model adopts the technical scheme that: an automatic solder paste dispensing machine for two ends of a heat conduction pipe comprises a rack, a solder paste dispensing mechanism, a solder paste detection mechanism, a conveying line and a carrier, wherein the solder paste dispensing mechanism, the solder paste detection mechanism and the conveying line are respectively arranged at the upper end of the rack; the solder paste dispensing mechanism and the solder paste detection mechanism are both positioned above the conveying line and are sequentially placed along the conveying direction of the conveying line; the solder paste dispensing mechanism comprises an XYZ-axis servo module, solder paste dispensing components respectively arranged at the drive ends of the XYZ-axis servo module, and a vision sensor used for judging the positions of solder paste at two ends of the heat conduction pipe; the solder paste detection mechanism comprises an XY axis linear module and a 3D camera arranged at the driving end of the XY axis linear module and used for detecting the amount of solder paste at two ends of the heat conduction pipe.
Preferably, the solder paste detection mechanism further comprises a lifting cylinder vertically arranged at the driving end of the XY axis linear module, a suction disc frame horizontally arranged at the driving end of the lifting cylinder, a plurality of vacuum suction discs arranged on the suction disc frame and used for sucking unqualified carriers, and a recovery frame arranged on the rack and used for placing unqualified carriers; the suction disc frame is provided with a through hole; the 3D camera is arranged on the suction disc frame and is positioned above the through hole.
Preferably, the rack is further provided with a translation mechanism for driving the recovery frame to move outwards; the translation mechanism comprises two sliding rails which are arranged in parallel and used for installing the recovery frame and a translation cylinder which is used for driving the recovery frame to move outwards.
Preferably, the solder paste dispensing mechanisms are two and are respectively used for automatically dispensing solder paste at two ends of the heat conduction pipe.
Preferably, the XYZ-axis servo module comprises an X-axis servo module and a spot tin guide rail which are respectively arranged on the rack in parallel and located on two sides of the conveying line, a Y-axis servo module with one end arranged on the spot tin guide rail in a sliding mode and the other end connected with the driving end of the X-axis servo module, and a Z-axis servo module vertically arranged at the driving end of the Y-axis servo module; and the solder paste component and the visual sensor are both arranged at the driving end of the Z-axis servo module.
Preferably, the XY-axis linear module comprises an X-axis linear module and a detection guide rail which are respectively arranged on the rack in parallel and positioned at two sides of the conveying line, and a Y-axis linear module, one end of the Y-axis linear module is arranged on the detection guide rail in a sliding mode, and the other end of the Y-axis linear module is connected with the driving end of the X-axis linear module; the lifting cylinder is arranged at the driving end of the Y-axis linear module.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the utility model discloses can not only improve work efficiency at the both ends point tin cream of heat pipe automatically, and can judge the position of heat pipe both ends point tin cream, make some tin cream position more accurate, and can also detect the tin cream volume, guarantee the radiating effect;
2. the utility model can take off the unqualified carrier from the conveying line, thereby improving the qualification rate;
3. the utility model discloses be provided with two some tin cream mechanisms, can improve work efficiency to the automatic some tin cream in both ends of heat pipe respectively.
Drawings
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
FIG. 1 is a diagram of a heat dissipation module;
FIG. 2 is a schematic structural view of an automatic solder paste dispensing machine for two ends of a heat pipe according to the present invention;
FIG. 3 is a schematic structural view of two solder paste applying mechanisms of the present invention;
FIG. 4 is a schematic structural view of a single point solder paste mechanism in the present invention;
fig. 5 is a schematic structural diagram of the middle solder paste detection mechanism of the present invention.
Wherein: 1. a frame; 2. a conveying line; 3. a solder paste dispensing mechanism; 31. an X-axis servo module; 32. a Z-axis servo module; 33. a Y-axis servo module; 34. tin soldering guide rails; 35. a solder paste dispensing component; 36. a vision sensor; 4. a solder paste detection mechanism; 40. a recycling rack; 41. an X-axis linear module; 42. a Y-axis linear module; 43. a lifting cylinder; 44. detecting a guide rail; 45. a vacuum chuck; 46. a 3D camera; 47. a through hole; 48. a suction cup holder; 49. a translation mechanism; 491. a slide rail; 492. a translation cylinder; 5. a carrier is provided.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 2-5 show an automatic solder paste dispensing machine for two ends of a heat pipe according to the present invention, which comprises a frame 1, two solder paste dispensing mechanisms 3 respectively disposed at the upper end of the frame 1, a solder paste detecting mechanism 4, a conveying line 2, and a carrier 5 disposed on the conveying line 2 for placing the heat pipe; the two point solder paste mechanisms 3 and the solder paste detection mechanism 4 are positioned above the conveying line 2 and are sequentially arranged along the conveying direction of the conveying line 2; each solder paste dispensing mechanism 3 comprises an XYZ-axis servo module, a solder paste dispensing component 35 respectively arranged at the drive end of the XYZ-axis servo module, and a vision sensor 36 for judging the positions of solder pastes at two ends of the heat conduction pipe; the solder paste detection mechanism 4 comprises an XY-axis linear module, a lifting cylinder 43 vertically arranged at the driving end of the XY-axis linear module, a sucker frame 48 respectively arranged at the driving end of the lifting cylinder 43, a 3D camera 46 for detecting the amount of solder paste at two ends of a heat conduction pipe, a plurality of vacuum suckers 45 arranged on the sucker frame 48 and used for sucking unqualified carriers 5, and a recovery frame 40 arranged on the frame 1 and used for placing unqualified carriers 5; the suction cup frame 48 is provided with a through hole 47; the 3D camera 46 is located over the via 47; the two ends of the conveying line 2 can be connected with other equipment; when in work: the carrier 5 is conveyed to a solder paste dispensing station by the conveying line 2 under the control of an external controller, then the two XYZ-axis servo modules drive the vision sensor 36 to judge the positions of solder pastes at two ends of the heat conduction pipe respectively, and then drive the solder paste dispensing components 35 to dispense solder pastes at two ends of the heat conduction pipe respectively; after the solder paste is dispensed, the carrier 5 is conveyed to an inspection station by the conveying line 2, the XY-axis linear module drives the 3D camera 46 to inspect whether the solder paste amount at the two ends of the heat conduction pipe is qualified or not, if so, the carrier 5 is conveyed to the next station by the conveying line 2, and if not, the lifting cylinder 43 drives the suction disc frame 48 to descend, the unqualified carrier 5 is sucked by the plurality of vacuum suction discs 45 and is placed on the recovery frame 40 to sequentially and circularly work; where the solder paste dispensing assembly 35 is prior art, reference may be made to the solder paste dispensing mechanism of a solder paste dispenser disclosed in prior art 201720469109.9.
Further, a translation mechanism 49 for driving the recovery frame 40 to move outwards is further arranged on the rack 1; the translation mechanism 49 comprises two slide rails 491 for installing the recovery frame 40 and a translation cylinder 492 for driving the recovery frame 40 to move outwards, which is parallel to each other, and is convenient for the worker to take off the unqualified carrier 5.
Further, the XYZ-axis servo module comprises an X-axis servo module 31 and a spot tin guide 34 which are respectively arranged on the rack 1 in parallel and located at two sides of the conveying line 2, a Y-axis servo module 33 with one end arranged on the spot tin guide 34 in a sliding manner and the other end connected with the driving end of the X-axis servo module 31, and a Z-axis servo module 32 vertically arranged at the driving end of the Y-axis servo module 33; the point solder paste component 35 and the visual sensor 36 are both arranged at the driving end of the Z-axis servo module 32, and the structure enables the point solder paste component 35 and the visual sensor 36 to move randomly within a certain range and move stably.
Further, the XY-axis linear module comprises an X-axis linear module 41 and a detection guide rail 44 which are respectively arranged on the rack 1 in parallel and located on two sides of the conveying line 2, and a Y-axis linear module 42, one end of which is arranged on the detection guide rail 44 in a sliding manner, and the other end of which is connected with the driving end of the X-axis linear module 41; the lifting cylinder 43 is arranged at the driving end of the Y-axis linear module 42, and the structure enables the 3D camera 46 and the vacuum chuck 45 to move randomly within a certain range and to move stably.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (6)
1. The utility model provides a heat pipe both ends are from moving point tin cream machine which characterized in that: the device comprises a rack, a solder paste dispensing mechanism, a solder paste detection mechanism, a conveying line and a carrier, wherein the solder paste dispensing mechanism, the solder paste detection mechanism and the conveying line are respectively arranged at the upper end of the rack; the solder paste dispensing mechanism and the solder paste detection mechanism are both positioned above the conveying line and are sequentially placed along the conveying direction of the conveying line; the solder paste dispensing mechanism comprises an XYZ-axis servo module, solder paste dispensing components respectively arranged at the drive ends of the XYZ-axis servo module, and a vision sensor used for judging the positions of solder paste at two ends of the heat conduction pipe; the solder paste detection mechanism comprises an XY axis linear module and a 3D camera arranged at the driving end of the XY axis linear module and used for detecting the amount of solder paste at two ends of the heat conduction pipe.
2. The automatic solder paste machine for two ends of the heat conduction pipe according to claim 1, characterized in that: the solder paste detection mechanism also comprises a lifting cylinder vertically arranged at the driving end of the XY axis linear module, a suction disc frame horizontally arranged at the driving end of the lifting cylinder, a plurality of vacuum suction discs arranged on the suction disc frame and used for sucking unqualified carriers, and a recovery frame arranged on the frame and used for placing the unqualified carriers; the suction disc frame is provided with a through hole; the 3D camera is arranged on the suction disc frame and is positioned above the through hole.
3. The automatic solder paste machine for two ends of the heat conduction pipe according to claim 2, characterized in that: the rack is also provided with a translation mechanism for driving the recovery frame to move outwards; the translation mechanism comprises two sliding rails which are arranged in parallel and used for installing the recovery frame and a translation cylinder which is used for driving the recovery frame to move outwards.
4. The automatic solder paste dispensing machine for two ends of the heat conduction pipe according to any one of claims 1 to 3, characterized in that: and the two solder paste dispensing mechanisms are respectively used for automatically dispensing solder paste at two ends of the heat conduction pipe.
5. The automatic solder paste dispensing machine for two ends of the heat conduction pipe according to claim 4, characterized in that: the XYZ-axis servo module comprises an X-axis servo module and a spot tin guide rail which are respectively arranged on the rack in parallel and positioned on two sides of the conveying line, a Y-axis servo module with one end arranged on the spot tin guide rail in a sliding mode and the other end connected with the driving end of the X-axis servo module, and a Z-axis servo module vertically arranged at the driving end of the Y-axis servo module; and the solder paste component and the visual sensor are both arranged at the driving end of the Z-axis servo module.
6. The automatic solder paste dispensing machine for two ends of the heat conduction pipe according to claim 2 or 3, characterized in that: the XY-axis linear module comprises an X-axis linear module and a detection guide rail which are respectively arranged on the rack in parallel and positioned at two sides of the conveying line, and a Y-axis linear module, one end of the Y-axis linear module is arranged on the detection guide rail in a sliding mode, and the other end of the Y-axis linear module is connected with the driving end of the X-axis linear module; the lifting cylinder is arranged at the driving end of the Y-axis linear module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921755613.0U CN211102012U (en) | 2019-10-18 | 2019-10-18 | Automatic solder paste dispensing machine for two ends of heat conduction pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921755613.0U CN211102012U (en) | 2019-10-18 | 2019-10-18 | Automatic solder paste dispensing machine for two ends of heat conduction pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211102012U true CN211102012U (en) | 2020-07-28 |
Family
ID=71716368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921755613.0U Expired - Fee Related CN211102012U (en) | 2019-10-18 | 2019-10-18 | Automatic solder paste dispensing machine for two ends of heat conduction pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211102012U (en) |
-
2019
- 2019-10-18 CN CN201921755613.0U patent/CN211102012U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200728 |
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| CF01 | Termination of patent right due to non-payment of annual fee |