CN205356821U - PCB reprocesses heating device - Google Patents
PCB reprocesses heating device Download PDFInfo
- Publication number
- CN205356821U CN205356821U CN201620031918.7U CN201620031918U CN205356821U CN 205356821 U CN205356821 U CN 205356821U CN 201620031918 U CN201620031918 U CN 201620031918U CN 205356821 U CN205356821 U CN 205356821U
- Authority
- CN
- China
- Prior art keywords
- hot blast
- blast nozzle
- pcb
- axis
- tuyere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a PCB reprocesses heating device, include: the PCB support frame heats the tuyere on, heats tuyere, hot -blast main, heating tuyere mount and mobility control mechanism down, mobility control mechanism is connected with heating tuyere mount, heating tuyere mount be " C " shape structure, and wherein the both ends of " C " shape structure are heated the tuyere on fixed respectively and are heated the tuyere under with heats the tuyere on, and heats the tuyere under and be connected with the hot -blast main, the hot -blast main is fixed to be set up on hot -blast mouth mount, and the air intake of hot -blast main is connected with the hot -blast controlling means who sets up on the PCB support frame, mobility control mechanism and hot -blast controlling means and heating control headtotail. The utility model discloses a hot gas flow makes the solder joint melt or the soldering paste backward flow convenient to detach on assembling the pin and pad of assembling the device in the surface.
Description
Technical field
This utility model relates to a kind of heater, is specifically related to a kind of PCB and reprocesses heater.
Background technology
Along with electronic product develops rapidly to portable/miniaturization, networking and multimedia direction, surface mounting technology is increasingly widely applied in the electronics industry.And partly or entirely instead of traditional circuit assembly technology in a lot of fields.In large scale integrated chip (LSI chip), the IC chip with BGA package is widely used, and repair workstation work is an important component part in whole production link all the time in paster welds.In repair workstation work process, it is necessary to components and parts are dismantled and installs, this is accomplished by being heated processing to it.
Repair workstation in the market adopts infrared heating technique to realize the rework process to pcb board mostly.Owing to repair workstation is that the element on pcb board is dismounted, the impact of the element for closing on is the smaller the better, if adopting infrared heating technique, it is possible to cause that the element closed on made in heating process arrives the temperature of fusing, so that component wear, pcb board can not normally use.
Utility model content
This utility model is for the technical problem of above-mentioned existence, it is proposed that a kind of PCB reprocesses heater, it is provided that one utilizes Hot-blast Heating technology that pcb board is heated, and makes the scope of heating just in the element needing dismounting, does not affect for other elements.
The technical solution of the utility model is: a kind of PCB reprocesses heater, including: PCB bracing frame, on add hot blast nozzle, under add hot blast nozzle, warm-air pipe, add hot blast nozzle fixed mount and moving control mechanism, described moving control mechanism is connected with adding hot blast nozzle fixed mount, the described hot blast nozzle fixed mount that adds is for " C " shape structure, wherein the two ends of " C " shape structure fixing respectively on add hot blast nozzle and under add hot blast nozzle, on add hot blast nozzle and under add hot blast nozzle and be connected with warm-air pipe, described warm-air pipe is fixedly installed on hot blast nozzle fixed mount, the air inlet of warm-air pipe controls device with the hot blast being arranged on PCB bracing frame and is connected, described moving control mechanism and hot blast control device and are connected with heating control system.
Further, described warm-air pipe and hot wind generating device are by hose connection.
Further, the X-axis that includes described moving control mechanism moves bar and Y-axis moves bar, and described X-axis moves bar and is arranged on Y-axis and moves on bar, and described Y-axis moves and arranges X-axis on bar and move chute, described X-axis moves bar and is connected with X-axis control motor, and Y-axis moves bar and is connected with Y-axis control motor.
Further, described in add hot blast nozzle fixed mount also set up temperature sensor, described temperature sensor is arranged on the side adding hot blast nozzle.
The beneficial effects of the utility model:
In this utility model embodiment, adopt thermal current to gather on pin and the pad of surface mounting devices, make solder joint fusing or solder paste reflow, be damaged from substrate or components and parts around, it is possible to dismounting with comparalive ease or welding.
Accompanying drawing explanation
Fig. 1 is that a kind of PCB that the utility model proposes reprocesses heater structure chart.
Shown in figure: 1, PCB bracing frame；2, pcb board；3, hot blast nozzle is added on；4, hot blast nozzle is added under；5, Y-axis moves bar；6, X-axis moves bar；7, warm-air pipe；8, hot blast nozzle fixed mount is added；9, hot wind generating device；10, moving control mechanism.
Detailed description of the invention
Referring to Fig. 1, it is that a kind of PCB that the utility model proposes reprocesses heater structure chart.
As shown in Figure 1, a kind of PCB reprocesses heater, including: PCB bracing frame 1, on add hot blast nozzle 3, under add hot blast nozzle 4, warm-air pipe 7, add hot blast nozzle fixed mount 8 and moving control mechanism 10, described moving control mechanism 10 is connected with adding hot blast nozzle fixed mount 8, the described hot blast nozzle fixed mount 8 that adds is for " C " shape structure, wherein the two ends of " C " shape structure fixing respectively on add hot blast nozzle 3 and under add hot blast nozzle 4, on add hot blast nozzle 3 and under add hot blast nozzle 4 and be connected with warm-air pipe 7, described warm-air pipe 7 is fixedly installed on hot blast nozzle fixed mount 8, the air inlet of warm-air pipe 7 controls device 9 with the hot blast being arranged on PCB bracing frame 1 and is connected, described moving control mechanism 10 and hot blast control device 9 and are connected with heating control system.
Further, described warm-air pipe 7 and hot wind generating device 9 are by hose connection.
Further, the X-axis that includes described moving control mechanism 10 moves bar 5 and Y-axis moves bar 6, and described X-axis moves bar 5 and is arranged on Y-axis and moves on bar 6, and described Y-axis moves and arranges X-axis on bar 6 and move chute, wherein X-axis moves bar 5 and X-axis and controls motor and is connected, and Y-axis moves bar 6 and is connected with Y-axis control motor.
Further, described in add hot blast nozzle fixed mount 8 also set up temperature sensor 11, described temperature sensor 11 is arranged on the side adding hot blast nozzle 3.
In this utility model embodiment, thermal current is adopted to gather on pin and the pad of surface mounting devices, make solder joint fusing or solder paste reflow, to complete dismounting and welding function, dismounting uses a vacuum machine device equipped with spring and rubber suction nozzle simultaneously, is sucked up gently by element in time when whole solder joints melt.
The pin of chip to be removed is heated by the hot air flow of heating from the both sides up and down of pcb board 2, and in the region that the thermal current of upper heated nozzle and the generation of lower heated nozzle is only in chip to be removed, other chips will not be impacted, thus without damaged substrate or components and parts around, it is possible to dismounting with comparalive ease or welding.
Above this utility model is described in detail, but this utility model is not limited to above-mentioned embodiment, in the ken that those of ordinary skill in the art possess, it is also possible to make a variety of changes under the premise without departing from this utility model objective.Many other can be made without departing from design of the present utility model and scope to change and remodeling.Should be appreciated that this utility model is not limited to specific embodiment, scope of the present utility model is defined by the following claims.
Claims (4)
1. a PCB reprocesses heater, it is characterized in that, including: PCB bracing frame, on add hot blast nozzle, under add hot blast nozzle, warm-air pipe, add hot blast nozzle fixed mount and moving control mechanism, described moving control mechanism is connected with adding hot blast nozzle fixed mount, the described hot blast nozzle fixed mount that adds is for " C " shape structure, wherein the two ends of " C " shape structure fixing respectively on add hot blast nozzle and under add hot blast nozzle, on add hot blast nozzle and under add hot blast nozzle and be connected with warm-air pipe, described warm-air pipe is fixedly installed on hot blast nozzle fixed mount, the air inlet of warm-air pipe controls device with the hot blast being arranged on PCB bracing frame and is connected, described moving control mechanism and hot blast control device and are connected with heating control system.
2. a kind of PCB according to claim 1 reprocesses heater, it is characterised in that described warm-air pipe and hot wind generating device are by hose connection.
3. a kind of PCB according to claim 1 reprocesses heater, it is characterized in that, the X-axis that includes described moving control mechanism moves bar and Y-axis moves bar, described X-axis moves bar and is arranged on Y-axis and moves on bar, described Y-axis moves and arranges X-axis on bar and move chute, described X-axis moves bar and is connected with X-axis control motor, and Y-axis moves bar and is connected with Y-axis control motor.
4. a kind of PCB according to claim 1 reprocesses heater, it is characterised in that described in add hot blast nozzle fixed mount also set up temperature sensor, described temperature sensor is arranged on the side adding hot blast nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620031918.7U CN205356821U (en) | 2016-01-13 | 2016-01-13 | PCB reprocesses heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620031918.7U CN205356821U (en) | 2016-01-13 | 2016-01-13 | PCB reprocesses heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205356821U true CN205356821U (en) | 2016-06-29 |
Family
ID=56174440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620031918.7U Expired - Fee Related CN205356821U (en) | 2016-01-13 | 2016-01-13 | PCB reprocesses heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205356821U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107624000A (en) * | 2017-09-06 | 2018-01-23 | 国营芜湖机械厂 | A kind of more pin placing components method for dismounting for the maintenance of aircraft electrical plate |
| CN107911955A (en) * | 2017-12-13 | 2018-04-13 | 晶晨半导体(上海)股份有限公司 | A kind of chip replacing options |
| CN112888190A (en) * | 2021-01-22 | 2021-06-01 | 国营芜湖机械厂 | Method for reliably dismounting large-area grounding plug-in module of high-frequency circuit board |
-
2016
- 2016-01-13 CN CN201620031918.7U patent/CN205356821U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107624000A (en) * | 2017-09-06 | 2018-01-23 | 国营芜湖机械厂 | A kind of more pin placing components method for dismounting for the maintenance of aircraft electrical plate |
| CN107911955A (en) * | 2017-12-13 | 2018-04-13 | 晶晨半导体(上海)股份有限公司 | A kind of chip replacing options |
| CN107911955B (en) * | 2017-12-13 | 2020-08-04 | 晶晨半导体(上海)股份有限公司 | Chip replacement method |
| CN112888190A (en) * | 2021-01-22 | 2021-06-01 | 国营芜湖机械厂 | Method for reliably dismounting large-area grounding plug-in module of high-frequency circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160629 Termination date: 20190113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |