CN201483113U - Ball grid array chip welding device and movable tool - Google Patents
Ball grid array chip welding device and movable tool Download PDFInfo
- Publication number
- CN201483113U CN201483113U CN 200920070327 CN200920070327U CN201483113U CN 201483113 U CN201483113 U CN 201483113U CN 200920070327 CN200920070327 CN 200920070327 CN 200920070327 U CN200920070327 U CN 200920070327U CN 201483113 U CN201483113 U CN 201483113U
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- bga chip
- ball bar
- array chips
- bar array
- welding equipment
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Abstract
The utility model discloses a ball grid array chip welding device, which is used for welding operation for a BGA chip circuit board. The device comprises a working platform, a movable BGA chip welding tool and a positioning cantilever. Before the welding operation, the BGA chip circuit board is fixed onto the movable BGA chip welding tool. When in the welding operation, the movable BGA chip welding tool is utilized to move the BGA chip circuit board to the position of a corresponding positioning cantilever according to at least one welding condition of a BGA chip, thereby enabling a heat source supply device to provide proper heat energy for the BGA chip circuit board according to welding condition, and realizing the welding operation.
Description
Technical field
The utility model is meant a kind of to sphere grid several-group type (Ball GridArray relevant for a kind of welding equipment especially; Employed bga chip welding equipment when BGA) chip carries out weld job.
Background technology
The evolution that the Electronic Packaging technology is gone through for many years encapsulates (Dual In-Line Package from traditional pin position; DIP) be developed to sphere grid several-group type (the Ball Grid Array of present main flow gradually; BGA) encapsulation, wherein the ratio of chip area and package area is more and more approaching, and suitable frequency is also more and more higher.The whys and wherefores mainly have high signal input and output (input/output) (Input/Output counts nothing more than bga chip; I/O) density, but its thermal diffusivity is good, signal delay efficient is little, and under identical power output assembly area condition such as decline to a great extent.In view of this, industrial circle begins in a large number the BGA encapsulation technology to be used instead in the field of making consumption electronic products already at present.
Moreover, in order to adapt to the consumption electronic products trend of slimming gradually, the assembly microminiaturization result that is inevitable.With regard to mobile phone, Xin Yidai mobile phone is frivolous and powerful with external form mostly on the market is main demand, to achieve the above object, the dealer uses bga chip to wish to use assembly volume in the reduction mobile phone in a large number, and promotes the service behaviour of mobile phone.
Based on the consideration of environmental factor, when industrial circle is used in the BGA encapsulation technology in a large number with lead-free solder (Lead-Free Solder), also caused the reliability (Reliabilty) of electronic building brick to face very acid test once again.Therefore, how to overcome the higher reflow of lead-free solder (Reflow) temperature and reduce solder joint (Solder Bump) reduction that causes because of heat fatigue (Thermal Fatigue), be urgent problem.
The mobile phone maintenance activity of online normal employing at present, the bga chip circuit board that desire is keeped in repair by the user is fixed in soldering appliance, and heats bga chip to carry out weld job again by mobile air pressure gun.Though said method can reach the purpose of welding again, has following two problems, one is that heat energy transmission mouth is fixing apart from bga chip and heat time heating time, causes bga chip because of heating the inequality cause thermal damage; It two is a superheated, causes the electronic building brick reliability to descend and causes the electronic product life-span to shorten.
Combine and put in order the above, enumerate a known fixed formula bga chip welding equipment below with reference to accompanying drawing and specified.See also Fig. 1 and Fig. 2, Fig. 2 has shown a known bga chip welding equipment schematic diagram; Fig. 2 has shown on the known bga chip according to array laying solder ball.
As shown in the figure, the user is positioned over a fixed bga chip soldering appliance PA1 with a bga chip circuit board 2.Fixed bga chip soldering appliance PA1 comprises a jig PA11 and a fixed support PA12.Fixed support PA12 comprises a rack body PA121, an anchor clamps group PA122, a slidingtype fixation kit PA123, a fixed screw PA124 and elastic parts PA125.Wherein, anchor clamps group PA122 comprises the first anchor clamps PA1221 and the second anchor clamps PA1222.
Before carrying out the repair welds operation, utilize the first anchor clamps PA1221 and the second anchor clamps PA1222 that this bga chip circuit board 2 is fixed in jig PA11, utilize elastic parts PA125 that slidingtype fixation kit PA123 is adjusted to the appropriate location, and bga chip circuit board 2 is fixed in jig PA11 by fixed screw PA124.
Then, take off failure welding or the bad bga chip 21 of part itself in the bga chip circuit board 2; And utilize a vacuum absorber 33 to draw another bga chip 22 and it is positioned over the position at former bga chip 21 places.Bga chip 22 is laid at least one solder ball 221 according to predetermined array, and after bga chip 22 was positioned over the position at former bga chip 21 places, the mode that can see through heating was engaged in bga chip circuit board 2 with bga chip 22.
One vacuum pumps 31 sees through a vacuum line 32 and connects vacuum absorber 33, and utilizes the folding and unfolding of a barometric damper 331 control vacuum absorbers 33, bga chip 22 is positioned over bga chip circuit board 2 to be repaiied.At last, utilize a heater 4 to provide again to add hot fluid PAH and heat this bga chip 22, and continue in bga chip 22 scopes, to move and add hot fluid PAHGA, use this welding material of fusing (Solder) 221.At last, again thermal source is removed bga chip 22, finished weld job again.
Learn by known technology, past is reprocessed the normal bga chip welding equipment that adopts in the operation at mobile phone, because heater is unfixing to the height of bga chip, the bga chip environment temperature is seriously inhomogeneous when causing weld job, thereby causes the cause thermal damage of bga chip.Moreover, can't determine heat time heating time, also can cause welding back bga chip reliability and descend.
When reprocessing operation, cause the cause thermal damage of bga chip or the situation that reliability descends for effectively reducing mobile phone because of heating inequality, the utility model provides a kind of portable BGA welding equipment, used in when welding and set operating distance, reflow temperature and the heat time heating time of heater, and when heating, move soldering appliance and make thermal source can be uniformly distributed in bga chip to bga chip.By said method, keep reliability and the reduction heating uneven damage that caused of bga chip after welding.
The utility model content
Technical problem and purpose that the utility model institute desire solves:
Because fixed ball bar array (Ball Grid Array in the known technology; BGA) chips welding equipment has the uneven problem that causes bga chip damage and reliability to descend of heating, the utility model provides a kind of portable BGA welding equipment, use the welding conditions such as operating distance, reflow (Reflow) temperature and heat time heating time of accurate setting and control heater and bga chip, and when carrying out weld job, move soldering appliance according to before opening described welding condition, avoid being subjected to improper variance factors such as the control of welding condition is not good and influenced and cause its damage to guarantee to weld bga chip.
The technological means that the utility model is dealt with problems:
The utility model provides a kind of bga chip welding equipment for the technological means that problem adopted that solves known technology, in order to a bga chip circuit board is carried out weld job.This equipment comprises workbench, a portable bga chip soldering appliance and a location cantilever.Before carrying out weld job, the bga chip circuit board is fixed in portable BGA soldering appliance.When carrying out weld job, at least one welding condition according to bga chip, utilize portable BGA soldering appliance the bga chip circuit board to be moved to the position of corresponding location cantilever, provide suitable heat energy to the bga chip circuit board for a thermal source supply according to welding condition, use and carry out weld job.The preferably can install at least one universal pulley assembly in portable BGA soldering appliance, use when carrying out weld job, supplies portable bga chip soldering appliance at least one welding job path movement in a working face upper edge.
The effect of the utility model contrast prior art:
Compared to known bga chip welding equipment, the utility model is used portable bga chip soldering appliance fixing bga chip circuit board temporarily, and utilizes location cantilever and thermal source supply to set and the welding condition of control the best.At last, in welding process, continue to move this movable type bga chip soldering appliance, to reach the purpose of thermal source uniformly dispersing.By said method, the reliability that can keep bga chip also reduces because of heating the uneven damage that is caused.Apparently, the reliability when the utility model is kept bga chip really and welded again and reduce the manufacturing and maintenance yield that significantly promotes electronic product because of heating the uneven pyrolytic damage that is caused, using, and increase the use life time of electronic product.
The specific embodiment that the utility model adopted will be described further by following embodiment and accompanying drawing.
Description of drawings
Fig. 1 has shown known ball bar array (Ball Grid Array; BGA) chips welding equipment schematic diagram;
Fig. 2 has shown on the known bga chip to be to lay solder ball according to array;
Fig. 3 has shown the bga chip welding equipment schematic diagram of the utility model first preferred embodiment;
Fig. 4 has shown the portable bga chip soldering appliance bottom schematic view of the utility model first preferred embodiment, wherein comprises four universal pulley assemblies, is used to weld period and rotates this instrument arbitrarily thermal source is dispersed evenly in the bga chip scope
Fig. 5 has shown the mobile schematic diagram of the portable bga chip soldering appliance of the utility model first preferred embodiment;
Fig. 6 has shown the location cantilever schematic diagram of the utility model first preferred embodiment;
Fig. 7 has shown the bga chip welding equipment schematic diagram of the utility model second preferred embodiment; And
Fig. 8 has shown the profile of the location cantilever of the utility model second preferred embodiment along the A-A visual angle.
The primary clustering symbol description
The fixed bga chip soldering appliance of PA1 PA11 jig
PA12 fixed support PA121 rack body
PA122 anchor clamps group PA1221 first anchor clamps
The PA1222 second anchor clamps PA123 slidingtype fixation kit
PA124 fixed screw PA125 elastic parts
100 ball bar array (BGA) chips welding equipment, 200 workbenches
300 ball bar array (BGA) chips welding equipment, 1 portable bga chip soldering appliance
11 jigs, 12 fixed supports
121 rack bodies, 122 anchor clamps groups
1,221 first anchor clamps, 1,222 second anchor clamps
123 slidingtype fixation kits, 124 fixed screws
The universal pulley assembly of 125 elastic parts 131-134
2BGA chip circuit plate 21BGA chip
221 solder ball 22BGA chips
31 vacuum pumps, 32 vacuum lines
33 vacuum absorbers, 331 barometric dampers
4 heaters, 5 thermal source supplies
52 temperature control valve (TCV)s, 53 time set valves
54 hot-blast outlets, 55 start buttons
6 location cantilever 61 heat energy transmit mouth
62-65 direction adjusting part 66 sliding position adjustments assemblies
67 cavitys, 68 hot-fluid control valves
69 heating components, 71 connecting pipelines
72 connecting pipelines, 8 fluid compressing devices
CH1 chamber GA fluid
PAHGA adds hot fluid HGA1 and adds hot fluid
HGA2 adds hot fluid h best effort distance
P1 weld start position P2 welds end position
R1 welding job path
The specific embodiment
Because ball bar array provided by the utility model (Ball Grid Array; BGA) chips welding equipment utilizes fixedly bga chip circuit board of portable bga chip soldering appliance, and adjusts the position of portable bga chip with respect to the location cantilever according to the welding condition that sets and control, and uses and carries out weld job.Apparently, too numerous to enumerate really in the combination embodiment that the utility model is relevant, so give unnecessary details no longer one by one at this, only enumerating wherein, two preferred embodiments are specified.
Hereinafter with reference to each relevant drawings, first preferred embodiment of the present utility model is described.See also Fig. 3 to Fig. 6, Fig. 3 has shown the bga chip welding equipment schematic diagram of the utility model first preferred embodiment; Fig. 4 has shown the portable bga chip soldering appliance bottom schematic view of the utility model first preferred embodiment, wherein comprises four universal pulley assemblies, is used to weld period and rotates this instrument arbitrarily thermal source is dispersed evenly in the bga chip scope; Fig. 5 has shown the mobile schematic diagram of the portable bga chip soldering appliance of the utility model first preferred embodiment; Fig. 6 has shown the location cantilever schematic diagram of the utility model first preferred embodiment.
As shown in the figure, a bga chip welding equipment 100 comprises a workbench 200, one portable bga chip soldering appliance 1, a thermal source supply 5 and a location cantilever 6.Bga chip welding equipment 100 is repaired bga chip circuit board 2 defective in order to the user to be provided.Generally speaking, aforesaid flaw is made a general reference the initial property flaw that is produced or is in use produced the fatigability flaw in manufacture process.
Portable BGA soldering appliance 1 comprises a jig 11, a fixed support 12, four groups of universal pulley assemblies 131,132,133 and 134, and fixed support 12 and universal pulley assembly 131-134 are engaged in jig 11 respectively.Fixed support 12 also comprises a rack body 121, an anchor clamps group 122, a slidingtype fixation kit 123, a fixed screw 124 and an elastic parts 125.Wherein, anchor clamps group 122 comprises one first anchor clamps 1221 and one second anchor clamps 1222, and second anchor clamps 1222 and slidingtype fixation kit 123 are linked to rack body 121 respectively.
Thermal source supply 5 comprises a temperature control valve (TCV) 52, a time setting valve 53, a hot-blast outlet 54 and a start button 55.Location cantilever 6 comprises a heat energy and transmits mouth 61, at least one direction adjusting part 62,63,64,65, one sliding position adjustments assembly 66, a cavity 67 and a hot-fluid control valve 68.Wherein, thermal source supply 5 links location cantilever 6 by a connecting pipe road 71, in order to the heat energy that thermal source supply 5 is produced, is sent to this location cantilever 5 to carry out weld job.In the utility model first preferred embodiment, the preferably, above-mentioned connecting pipeline 71 is a heat-resisting air shooter.
When realizing the technology that the utility model first preferred embodiment is disclosed, the user need earlier will be to be repaiied 2 bearings of bga chip circuit board in portable bga chip soldering appliance 1, and bga chip circuit board 2 is fixed in jig 11 by first anchor clamps 1221 and second anchor clamps 1222, adjust elastic parts 125 to one appropriate locations by slidingtype fixation kit 123 again.At last, utilize fixed screw 124 that bga chip circuit board 2 is fixed in jig 11 again.
Then, the user takes off bga chip 21 defective; And utilize a vacuum absorber 33 (known technology) draw another may with bga chip 22 again it is positioned over the position of bga chip 21.See also Fig. 3, as shown in the figure, it has shown known bga chip 22 and at least one welding material (Solder) 221, and the user sees through heating bga chip 22 makes it engage bga chip circuit board 2 to melt welding material 221.
At this moment, the user is grouped into according to the one-tenth of welding material 221, utilizes temperature control valve (TCV) 52 to set and control a best reflow temperature, sets and control a best heat time heating time by time set valve 53 again.See also Fig. 6, as shown in the figure, the user utilizes sliding position adjustments assembly 66 that heat energy is transmitted mouthfuls 61 and moves to bga chip 22 tops, and according to the size adjusting direction adjusting part 62-65 of bga chip 22, uses and fix a best effort distance h.
For fear of heating the damage that causes bga chip 22 rapidly, the user is before carrying out weld job, earlier by adjusting hot-fluid control valve 68 to set an air flow rate (figure indicates).Then, see through start button 55 again and start thermal source supply 5; At this moment, one adds hot fluid HGA1 and is delivered to chambers (figure indicates) in the cavity 67 from hot blast outlet 54 via connecting pipeline 71 and transmits mouthfuls 61 by heat energy again and be emitted to bga chip 22.
See also Fig. 5, as shown in the figure, portable bga chip soldering appliance 1 according to different welding conditions when carrying out weld job, move to a welding end position P2 by the weld start position P1 of universal pulley assembly 131-134 on a working face, form at least one welding job path R1.Above-mentioned welding condition system can be at least one in welding material, reflow temperature, heat time heating time and the operating distance.
The user continues by aforesaid way, in the best scope heat time heating time, move this movable type bga chip soldering appliance 1 according to welding job path R1, use that the heat energy transmission mouthful 61 hot fluid HGA1 that add that send are dispersed evenly to bga chip 22 scopes, reduce because of heating the uneven damage that is caused.When thermal source supply 5 finished best heat time heating time, can end to provide automatically to add hot fluid HGA1, to finish weld job.
Different with first preferred embodiment of the present utility model is that in second preferred embodiment of the present utility model, heating component 69 can be present in the cantilever 5 of location.See also Fig. 7 and Fig. 8, Fig. 7 has shown the bga chip welding equipment schematic diagram of the utility model second preferred embodiment; Fig. 8 has shown the profile of the location cantilever of the utility model second preferred embodiment along the A-A visual angle.As shown in the figure, a bga chip welding equipment 300 comprises a workbench 200, one portable bga chip soldering appliance 1, a fluid compression set 8 and a location cantilever 6, and in order to provide the user to weld maintenance bga chip circuit board 2 defective.
Fluid compressing device 8 is communicated to cavity C H1 by a connecting pipe road 72, in order to a fluid GA is sent to this thermal source assembly 69, and utilizes heating component 69 that fluid G A is heated as one to add hot fluid HGA2, use and carry out this weld job.
Before carrying out weld job, bga chip circuit board 2 can be fixed in portable bga chip soldering appliance 1, set best reflow temperature by temperature-adjusting device again, and open fluid compressing device 8.By fluid compressing device 8 fluid G A is delivered to cavity C H1 via connecting pipeline 72, and utilizes hot-fluid control valve 68 to adjust the fluid flow of this fluid G A (figure does not indicate).Then, can start heating component 69, and add hot fluid HGA2 by heating component 69 heating fluid G A formation; Wherein, when adding hot fluid HGA2 and arrive default best reflow temperature, can begin to carry out weld job.
In the utility model second preferred embodiment, the preferably, above-mentioned heating component 69 can be a hot blast generator or an air heater.In addition, above-mentioned fluid G A also can be a liquid, because liquid has higher specific heat, but the best reflow temperature during the stable maintenance weld job.Because all the other technology of second preferred embodiment of the present utility model are all similar or identical with first preferred embodiment of the present utility model, no longer given unnecessary details below therefore.
Such as in affiliated technical field, have and know that usually the knowledgeable all can understand easily, compared to known bga chip welding equipment, because bga chip welding equipment provided by the utility model has portable bga chip soldering appliance 1, thermal source supply 5 and location cantilever 6, the user can utilize location cantilever 6 to be set the best effort distance h of welding, more see through thermal source supply 5 and adjust the hot-fluid fluid to best reflow temperature and best heat time heating time, and in weld job, continue to move this movable type bga chip soldering appliance 1, to reach the purpose of even heating.Apparently, the reliability when the utility model can be kept the welding bga chip really, and reduce because of adding the damage that the heat energy inequality is caused, use the use life time that significantly promotes electronic product.
By above-mentioned the utility model embodiment as can be known, the value on the true tool industry of the utility model.Above embodiment explanation only is preferred embodiment explanation of the present utility model, has in the affiliated such as technical field to know that usually the knowledgeable is when doing other all improvement and variation according to the foregoing description explanation of the present utility model.Yet all improvement and variation that these are done according to the utility model embodiment are in the claim that still belongs to utility model spirit of the present utility model and define.
Claims (27)
1. a portable ball bar array chips welding instrument for placing at least one bga chip circuit board, is used and is carried out a weld job, it is characterized in that this instrument comprises:
One jig is in order to this bga chip circuit board of bearing;
At least one universal pulley assembly is incorporated into this jig, is set up on the working face, and when carrying out this weld job, supplies this movable type bga chip soldering appliance at least one welding job path movement in this working face upper edge; And
One fixed support comprises:
One rack body is to be incorporated into this jig; And
One anchor clamps group is incorporated into this rack body, and comprises first anchor clamps and second anchor clamps, uses clamping and fixes this bga chip circuit board.
2. portable ball bar array chips welding instrument as claimed in claim 1, it is characterized in that, this fixed support also comprises a slidingtype fixation kit, and this slidingtype fixation kit is incorporated into this rack body, uses its fixed position of size adjusting according to this bga chip circuit board.
3. portable ball bar array chips welding instrument as claimed in claim 2 is characterized in that this slidingtype fixation kit also comprises a fixed screw, uses that this slidingtype fixation kit is positioned at least one fixed position.
4. portable ball bar array chips welding instrument as claimed in claim 2, it is characterized in that, this fixed support also comprises an elastic parts, this elastic parts is arranged at the rack body between these second anchor clamps and this slidingtype fixation kit, in order to this bga chip circuit board fluid-tight engagement in these anchor clamps.
5. portable ball bar array chips welding instrument as claimed in claim 4 is characterized in that this elastic parts is a spring.
6. ball bar array chips welding equipment in order to a bga chip circuit board is carried out weld job, and when carrying out this weld job, is adjusted at least one welding condition of this bga chip circuit board, it is characterized in that this ball bar array chips welding platform comprises:
One workbench;
One location slider assembly is to be suspended to movably on this workbench; And
One portable bga chip soldering appliance is arranged at this workbench movably, uses and fixes this bga chip circuit board to carry out this weld job again;
Wherein, when carrying out this weld job, this movable type bga chip soldering appliance moves this bga chip circuit board according to this welding condition.
7. ball bar array chips welding equipment as claimed in claim 6 is characterized in that also comprise a thermal source supply, this thermal source supply is linked to this location slider assembly, uses to provide and carries out the required heat energy of this weld job.
8. ball bar array chips welding equipment as claimed in claim 7 is characterized in that this thermal source supply also comprises a temperature control valve (TCV), for setting a best reflow temperature.
9. ball bar array chips welding equipment as claimed in claim 7 is characterized in that, this thermal source supply also comprises time setting valve, for setting a best heat time heating time.
10. ball bar array chips welding equipment as claimed in claim 7 is characterized in that, also comprises a connecting pipe road, and this connecting pipeline is communicated with this thermal source supply and this location cantilever, uses a hot fluid that adds that contains this heat energy is delivered to this location cantilever.
11. ball bar array chips welding equipment as claimed in claim 10 is characterized in that this connecting pipeline is a heat-resisting air shooter.
12. ball bar array chips welding equipment as claimed in claim 7 is characterized in that also comprise a chamber in this location cantilever, this chamber is communicated in this connecting pipeline, this adds hot fluid to use reception.
13. ball bar array chips welding equipment as claimed in claim 6 is characterized in that this location cantilever also comprises a heating component, uses to provide and carries out the required heat energy of this weld job.
14. ball bar array chips welding equipment as claimed in claim 13 is characterized in that this heating component is a hot blast generator.
15. ball bar array chips welding equipment as claimed in claim 13 is characterized in that this heating component is an air heater.
16. ball bar array chips welding equipment as claimed in claim 13 is characterized in that this heating component also comprises a temperature-adjusting device, uses definition one best reflow temperature.
17. ball bar array chips welding equipment as claimed in claim 13, it is characterized in that, also comprise a fluid compression set, use that a fluid is sent to this thermal source assembly, and by this heating component this fluid is heated as one and adds hot fluid, use and carry out this weld job.
18. ball bar array chips welding equipment as claimed in claim 17 is characterized in that, also comprises a connecting pipe road, this connecting pipeline engages this fluid compressing device and this location cantilever, uses that this fluid is transferred to this location cantilever.
19. ball bar array chips welding equipment as claimed in claim 18 is characterized in that also comprise a chamber in this location cantilever, this chamber is communicated in this connecting pipeline, uses to receive this fluid.
20. ball bar array chips welding equipment as claimed in claim 6 is characterized in that this location cantilever also comprises a sliding position adjustments assembly, uses and adjusts this location cantilever to an optimum welding position.
21. ball bar array chips welding equipment as claimed in claim 6 is characterized in that this location cantilever group also comprises at least one direction adjusting part, uses the size adjusting one best effort distance according to this bga chip.
22. ball bar array chips welding equipment as claimed in claim 6 is characterized in that this location cantilever also comprises a flow control valve, uses and sets an adopted fluid flow.
23. ball bar array chips welding equipment as claimed in claim 6 is characterized in that, this location cantilever also comprises a heat energy and transmits mouth, uses that this heat energy is sent to this bga chip.
24. ball bar array chips welding equipment as claimed in claim 6, it is characterized in that, this movable type bga chip soldering appliance also comprises at least one universal pulley assembly, uses when carrying out this weld job, moves this bga chip circuit board according to this welding condition.
25. ball bar array chips welding equipment as claimed in claim 6 is characterized in that this bga chip also comprises at least one welding material, uses to engage this bga chip and this bga chip circuit board.
26. ball bar array chips welding equipment as claimed in claim 6 is characterized in that this welding condition is at least one in welding material, reflow temperature, heat time heating time and the operating distance.
27. ball bar array chips welding equipment as claimed in claim 26 is characterized in that this reflow temperature is adjusted according to the constituent of this welding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920070327 CN201483113U (en) | 2009-04-14 | 2009-04-14 | Ball grid array chip welding device and movable tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920070327 CN201483113U (en) | 2009-04-14 | 2009-04-14 | Ball grid array chip welding device and movable tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201483113U true CN201483113U (en) | 2010-05-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920070327 Expired - Fee Related CN201483113U (en) | 2009-04-14 | 2009-04-14 | Ball grid array chip welding device and movable tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201483113U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528346A (en) * | 2012-01-08 | 2012-07-04 | 余胜东 | Flexible electrode welding fixture for keeping position of workpiece |
| CN103028803A (en) * | 2012-12-04 | 2013-04-10 | 惠州Tcl移动通信有限公司 | Magnetic induction hot welding control device, system and method for controlling hot welding time |
| CN107635714A (en) * | 2016-07-14 | 2018-01-26 | 深圳欣锐科技股份有限公司 | Positioner |
| CN107825011A (en) * | 2017-11-10 | 2018-03-23 | 普尔思（苏州）无线通讯产品有限公司 | A kind of welding system that can control temperature |
-
2009
- 2009-04-14 CN CN 200920070327 patent/CN201483113U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528346A (en) * | 2012-01-08 | 2012-07-04 | 余胜东 | Flexible electrode welding fixture for keeping position of workpiece |
| CN102528346B (en) * | 2012-01-08 | 2015-03-25 | 温州职业技术学院 | Flexible electrode welding fixture for keeping position of workpiece |
| CN103028803A (en) * | 2012-12-04 | 2013-04-10 | 惠州Tcl移动通信有限公司 | Magnetic induction hot welding control device, system and method for controlling hot welding time |
| CN103028803B (en) * | 2012-12-04 | 2015-09-23 | 惠州Tcl移动通信有限公司 | A kind of magnetic for controlling the hot weld time answers hot weld control device, system and method |
| CN107635714A (en) * | 2016-07-14 | 2018-01-26 | 深圳欣锐科技股份有限公司 | Positioner |
| CN107825011A (en) * | 2017-11-10 | 2018-03-23 | 普尔思（苏州）无线通讯产品有限公司 | A kind of welding system that can control temperature |
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