CN202180273U - Automatic dismantling tool for electronic elements - Google Patents
Automatic dismantling tool for electronic elements Download PDFInfo
- Publication number
- CN202180273U CN202180273U CN2011202495091U CN201120249509U CN202180273U CN 202180273 U CN202180273 U CN 202180273U CN 2011202495091 U CN2011202495091 U CN 2011202495091U CN 201120249509 U CN201120249509 U CN 201120249509U CN 202180273 U CN202180273 U CN 202180273U
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- electronic devices
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- guide rod
- heater
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Abstract
The utility model discloses an automatic dismantling tool for electronic elements, which comprises a host, an absorption mechanism, a recycling mechanism, a heater and a support frame. The heater is positioned in the support framework, the absorption mechanism can absorb on an electronic element placed in the heater, and the recycling mechanism can exactly support the electronic element absorbed by the absorption mechanism. Welding legs of the electronic element needing to be dismantled are melted by the aid of the high-precision heater, a suction nozzle approaches the electronic element by a vacuum suction method, the electronic element is successfully dismantled under the condition without being contacted, the problem that other electronic devices which do not need to be dismantled are damaged due to uneven force in the prior art is effectively avoided, the problem of insufficient soldering is also avoided, and repair and recycling of the electronic element are realized advantageously.
Description
Technical field
The utility model relates to a kind of instrument of dismantling circuit board electronic devices and components, and a kind of automatic dismounting electronic devices and components instrument specifically is provided.
Background technology
The main tool of the dismounting electronic devices and components of well known is heat gun, electric iron and heating platform at present.
1. to remove the method for electronic devices and components be to aim at the scolding tin heating on the electronic devices and components that will remove with the heat gun head to heat gun, and the tin fusing back that always is heated to welding electronic part removes electronic devices and components with taking the photograph.Shortcoming is that the heat gun head is to heat with hot blast when removing electronic devices and components; The electronic devices and components that need not remove around also can having influence on simultaneously; And when taking the photograph son and take electronic devices and components away hand with take the photograph son shake easily, near need not remove will running into electronic devices and components cause damage; And the leg of the electronic devices and components of pulling down and pad cause line pad and the few tin of electronic devices and components pad short circuit because of taking the photograph the son inhomogeneous meeting of exerting oneself, and the efficient of this method is low.
2. electric iron is removed the method for electronic devices and components; Be the solder horn new tin silk molten on the scolding tin of the electronic devices and components that will remove that utilizes after the electric iron heating, melt the back to new tin silk with the scolding tin of the electronic devices and components that will remove and sub electronic devices and components are removed with taking the photograph.The shortcoming of this method is the scolding tin that the solder horn of electric iron can only melt fraction together; Such as IC (being the semiconductor element product) leg is arranged all around; Therefore can't melt the scolding tin around the IC together simultaneously; What leg was arranged bottom the BGA (being the PCB of ball grid array structure) just more can't melt the tin silk on the leg, and then can't remove its electronic devices and components.
3. heating platform is removed the method for electronic devices and components, is to be close to the electronic devices and components back side that needs are removed on the heating platform, is heated to remove electronic devices and components with taking the photograph son after the melts soldering tin of dismounting electronic devices and components always.The shortcoming of this method be after the melts soldering tin on the electronic devices and components (IC or BGA part) when taking the photograph son and get IC hand take and take the photograph son shake easily; The scolding tin of the IC part leg of taking off is inhomogeneous, has few tin, many tin and short circuit phenomenon, and the tin that is removed on the line pad of back also non-uniform phenomenon can occur; If the IC part will be recycled; Then need after repairing on the IC leg, just can utilize, perhaps will change new IC part on the pad, will be on the pad with just welding new IC part after the electric iron reparation; And damage other electronic devices and components easily when repairing with electric iron, efficient is low.
Electronics industry in order to reduce cost, improves yield now, and removing reparation electronic devices and components and some valuable electronic devices and components of recycling has been the problem that each company all can run into.Especially current electronic product is more and more flourishing; Circuit and electronic devices and components are more and more accurate; More than three kinds of electronic devices and components removal tool all have a common shortcoming, hand can be shaken when promptly removing electronic devices and components and taking electronic devices and components away, firmly inhomogeneous slightly will the damage other electronic devices and components; And leg and the pad of IC have few tin phenomenon appearance at the same time, are unfavorable for reprocessing and recycling of electronic devices and components.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of automatic dismounting electronic devices and components instrument, and this instrument uses simple, and cost is low, high efficiency, and the electronic devices and components recycling rate after especially pulling down is high.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of automatic dismounting electronic devices and components instrument comprises main frame, adsorbing mechanism, recovering mechanism, heater and support frame; Said heater location places said support frame; The electronic devices and components leg that utilizes said heater to make need to be removed melts; Said adsorbing mechanism can adsorb the electronic devices and components that are placed on the heater; With this electronic devices and components breaking circuit substrate that need are removed, and said recovering mechanism be able to enough be accepted the electronic devices and components of said adsorbing mechanism absorption.
Further improvement as the utility model; Said main frame is positioned over the support frame top; Its outer surface is installed with a sealing casing, and this casing header board is a control panel, on said control panel, is installed with power switch, heater switch, overtemperature alarm and temperature successively device is set.
Further improvement as the utility model; Said adsorbing mechanism can adsorb the structure that is placed on the electronic devices and components on the heater: said adsorbing mechanism comprise first guide rod, suction nozzle and can drive this first guide rod towards and dorsad electronic devices and components do first cylinder of displacement change; Said first cylinder, one end and host housing lower end are connected; The said first cylinder other end is fixed on first guide rod; Said suction nozzle is fixed on the end of first guide rod towards electronic devices and components, and on said suction nozzle, is installed with inlet valve.
Further improvement as the utility model; The structure that said recovering mechanism be able to enough be accepted the electronic devices and components of said adsorbing mechanism absorption is: this recovering mechanism comprises second guide rod, receiver and can drive second cylinder (promptly second cylinder can drive this second guide rod towards the electronic devices and components that reach dorsad adsorbing mechanism absorption do displacement change) of this second guide rod along its axially-movable; Said second cylinder, one end is fixed on the said support frame one side inwall; The said second cylinder other end is fixed on second guide rod, and said receiver is fixed on second guide rod end of second cylinder dorsad.
Further improvement as the utility model is provided with a floor push, and this floor push can be controlled the keying of first cylinder and open inlet valve.
Further improvement as the utility model also is provided with first and second inductive switch, and said first inductive switch is in order to induction adsorbing mechanism displacement signal and control the recovering mechanism running, promptly through starting second cylinder pulp-collecting box is delivered to the suction nozzle below; Said second inductive switch is in order to induction recovering mechanism displacement signal and control the adsorbing mechanism running, promptly closes the inlet valve on the suction nozzle, and its adsorbed electronic devices and components are fallen in the pulp-collecting box through deadweight.
The beneficial effect of the utility model is: through utilizing the high accuracy heater; The electronic devices and components leg that need be removed is melted; Make suction nozzle near electronic devices and components with the vacuum slot method, under the situation that does not touch electronic devices and components, electronic devices and components are successfully removed, effectively avoided original because of the inhomogeneous phenomenon that occurs other electronic devices and components that need not remove damage of exerting oneself; Do not occur but also do not have few tin phenomenon, help reprocessing and recycling of electronic devices and components.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is Fig. 1 side view.
The specific embodiment
Embodiment to a kind of automatic dismounting electronic devices and components instrument of the utility model is elaborated with reference to the accompanying drawings.
A kind of automatic dismounting electronic devices and components instrument of the utility model comprises main frame 1, adsorbing mechanism 2, recovering mechanism 3, heater 4 and support frame 5; Said heater location places said support frame; The electronic devices and components leg that utilizes said heater to make need to be removed melts; Said adsorbing mechanism can adsorb the electronic devices and components that are placed on the heater; With this electronic devices and components breaking circuit substrate that need are removed, and said recovering mechanism be able to enough be accepted the electronic devices and components of said adsorbing mechanism absorption.
In the present embodiment, said main frame is positioned over the support frame top, and its outer surface is installed with a sealing casing, and this casing header board is a control panel 10, on said control panel, is installed with power switch, heater switch, overtemperature alarm and temperature successively device is set.
Said adsorbing mechanism can adsorb the structure that is placed on the electronic devices and components on the heater: said adsorbing mechanism comprise first guide rod 20, suction nozzle 21 and can drive this first guide rod towards and dorsad electronic devices and components do first cylinder 22 of displacement change; Said first cylinder, one end and host housing lower end are connected; The said first cylinder other end is fixed on first guide rod; Said suction nozzle is fixed on the end of first guide rod towards electronic devices and components, and on said suction nozzle, is installed with inlet valve 23.
The structure that said recovering mechanism be able to enough be accepted the electronic devices and components of said adsorbing mechanism absorption is: this recovering mechanism comprise second guide rod 30, receiver 31 and can drive this second guide rod along second cylinder 32 of its axially-movable (promptly second cylinder can drive this second guide rod towards and the electronic devices and components of adsorbing mechanism absorption dorsad do displacement and change); Said second cylinder, one end is fixed on the said support frame one side inwall; The said second cylinder other end is fixed on second guide rod, and said receiver is fixed on second guide rod end of second cylinder dorsad.
In the present embodiment, be provided with a floor push 6, this floor push can be controlled the keying of first cylinder and open inlet valve.Also be provided with first inductive switch 7 and second inductive switch 8, said first inductive switch is in order to induction adsorbing mechanism displacement signal and control the recovering mechanism running, promptly through starting second cylinder pulp-collecting box is delivered to the suction nozzle below; Said second inductive switch is in order to induction recovering mechanism displacement signal and control the adsorbing mechanism running, promptly closes the inlet valve on the suction nozzle, and its adsorbed electronic devices and components be able to enough be fallen in the pulp-collecting box through deadweight.
The mode of operation of present embodiment is: at first open power switch, heater switch and overtemperature alarm on the main frame, and configure temperature, melt through utilizing the heating of high accuracy heater, make the electronic devices and components leg that need be removed; Open floor push then; Start first cylinder and said first cylinder and carry out displacement movement (in the present embodiment for moving downward) towards electronic devices and components, along with the unlatching of floor push, the inlet valve that is arranged on the suction nozzle also is opened simultaneously;, unclamps suction nozzle floor push when dropping to desired location; This moment, first cylinder stopped to move downward, but inlet valve keeps duty, and then suction nozzle adsorbs the electronic devices and components that need be removed; Electronic devices and components break away from the wiring board substrate and rise when arriving certain position with the return motion of first cylinder; First inductive switch receives the displacement signal of this adsorbing mechanism and controls the recovering mechanism running; Start second cylinder pulp-collecting box is delivered to the suction nozzle below; Then second inductive switch receives the displacement signal of recovering mechanism this moment and controls adsorbing mechanism and react; Close the inlet valve on the suction nozzle, its adsorbed electronic devices and components are fallen in the pulp-collecting box through deadweight, pulp-collecting box is back to its original position under the return motion of second cylinder drives; So far the whole electronic devices and components process that retracts finishes.
Claims (6)
1. remove the electronic devices and components instrument automatically for one kind, it is characterized in that: comprise main frame (1), adsorbing mechanism (2), recovering mechanism (3), heater (4) and support frame (5); Said heater location places said support frame, and said adsorbing mechanism can adsorb the electronic devices and components that are placed on the heater, and said recovering mechanism be able to enough be accepted the electronic devices and components of said adsorbing mechanism absorption.
2. automatic dismounting electronic devices and components instrument according to claim 1; It is characterized in that: said main frame is positioned over the support frame top; Its outer surface is installed with a sealing casing; This casing header board is control panel (10), on said control panel, is installed with power switch, heater switch, overtemperature alarm and temperature successively device is set.
3. automatic dismounting electronic devices and components instrument according to claim 1; It is characterized in that: said adsorbing mechanism can adsorb the structure that is placed on the electronic devices and components on the heater and be: said adsorbing mechanism comprise first guide rod (20), suction nozzle (21) and can drive this first guide rod towards and dorsad electronic devices and components do first cylinder (22) of displacement change; Said first cylinder, one end and host housing lower end are connected; The said first cylinder other end is fixed on first guide rod; Said suction nozzle is fixed on the end of first guide rod towards electronic devices and components, and on said suction nozzle, is installed with inlet valve (23).
4. automatic dismounting electronic devices and components instrument according to claim 1; It is characterized in that: the structure that said recovering mechanism be able to enough be accepted the electronic devices and components of said adsorbing mechanism absorption is: this recovering mechanism comprises second guide rod (30), receiver (31) and can drive second cylinder (32) of this second guide rod along its axially-movable; Said second cylinder, one end is fixed on the said support frame one side inwall; The said second cylinder other end is fixed on second guide rod, and said receiver is fixed on second guide rod end of second cylinder dorsad.
5. automatic dismounting electronic devices and components instrument according to claim 1 is characterized in that: be provided with a floor push (6), this floor push can be controlled the keying of first cylinder and open inlet valve.
6. automatic dismounting electronic devices and components instrument according to claim 1 is characterized in that: also be provided with first and second inductive switch (7,8), said first inductive switch is in order to induction adsorbing mechanism displacement signal and control the recovering mechanism running; Said second inductive switch is in order to induction recovering mechanism displacement signal and control the adsorbing mechanism running.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202495091U CN202180273U (en) | 2011-07-15 | 2011-07-15 | Automatic dismantling tool for electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202495091U CN202180273U (en) | 2011-07-15 | 2011-07-15 | Automatic dismantling tool for electronic elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202180273U true CN202180273U (en) | 2012-04-04 |
Family
ID=46173322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202495091U Expired - Fee Related CN202180273U (en) | 2011-07-15 | 2011-07-15 | Automatic dismantling tool for electronic elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202180273U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873423A (en) * | 2011-07-15 | 2013-01-16 | 昆山意力电路世界有限公司 | Tool capable of automatically dismantling electronic components |
-
2011
- 2011-07-15 CN CN2011202495091U patent/CN202180273U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873423A (en) * | 2011-07-15 | 2013-01-16 | 昆山意力电路世界有限公司 | Tool capable of automatically dismantling electronic components |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120404 Termination date: 20170715 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |