CN202684256U - Sealing-off device - Google Patents
Sealing-off device Download PDFInfo
- Publication number
- CN202684256U CN202684256U CN 201220009040 CN201220009040U CN202684256U CN 202684256 U CN202684256 U CN 202684256U CN 201220009040 CN201220009040 CN 201220009040 CN 201220009040 U CN201220009040 U CN 201220009040U CN 202684256 U CN202684256 U CN 202684256U
- Authority
- CN
- China
- Prior art keywords
- sealing
- module
- treatment
- parts
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a sealing-off device which comprises a heat source generating part, a lead foot heating part, a supporting part and a module-pulling part. The lead foot heating part is connected with the heat source generating part, and the supporting part is placed on the lead foot heating part. When the lead foot heating part heats a lead foot of a to-be sealed off module placed on the supporting part, the position of the lead foot heating part is corresponded with the position of the lead foot of the to-be sealed off module. When the module-pulling part pulls the to-be sealed off module, the position of the module-pulling part is corresponded with the position of the to-be sealed off module. The sealing-off device solves the technical problems that the interior of the to-be sealed off module and components around the to-be sealed off module on a printed circuit board (PCB) is prone to be damaged and the sealing-off efficiency is low in the sealing off process of the existing technique, reduces probability of novel faults caused by sealing-off repair and achieves the quick, safe and effective sealing-off and repair.
Description
Technical field
The utility model relates to welding field, in particular to a kind of sealing-off device.
Background technology
Along with the development of the communication technology and power technology, the power module of increasing high power density is used on the various printed circuit boards (Printed Circuit Board is referred to as PCB).Yet power density is large because it exists, the pin of power module is thick, the large problem of area of pad and Copper Foil, therefore with power module from pcb board pull down reprocess quite difficult.At present, only be applied to ball grid array structure (Ball Grid Array, referred to as BGA) PCB mount the sealing-off Rework station (patent No.: 201020676801), or can only be used for the solder horn (patent No.: 200920024553) that small-sized plug-in mounting integrated circuit is carried out sealing-off of device.It is to adopt tin sucking gun that pin is one by one dismantled mostly that power module is carried out sealing-off, or with flattening oven to whole module heating or the mode sealing-off of each pin being melted with the tin stove.Yet, above these sealing-off modes exist sealing-off efficient low, easily damage the problem of inside modules or pcb board upper module peripheral devices.
For above-mentioned problem, effective solution is proposed not yet at present.
The utility model content
The utility model provides a kind of sealing-off device, and is low to solve at least in the prior art sealing-off efficient, in the sealing-off process, easily damage by on sealing-off inside modules or the pcb board by the technical problem of the device of sealing-off module periphery.
According to an aspect of the present utility model, a kind of sealing-off device is provided, comprising: the thermal source production part; The pin heater block links to each other with the thermal source production part; Support component is positioned at pin heater block top, and the position the during pin of the module for the treatment of sealing-off that the pin heater block carries at the heating support component is corresponding with the position of the pin of the module for the treatment of sealing-off; The module parts of choosing, the module position of parts when choosing the module for the treatment of sealing-off of choosing is corresponding with the position of the module for the treatment of sealing-off.
Preferably, support component comprises: support is positioned at the both sides of sealing-off device; Gripper shoe is slidingly connected with support; Pallet is installed on the gripper shoe, carries the pcb board of module that welding remains sealing-off on it.
Preferably, the module parts of choosing comprise: moving-member is slidingly connected with support; The module fixed part is fixedly connected with moving-member by attaching parts, rotates between module fixed part and the attaching parts or is slidingly connected.
Preferably, the sealing-off device also comprises: press down parts, be slidingly connected with support, press down parts and welding remained the pcb board of module of sealing-off when choosing the module 5 for the treatment of sealing-off and be fixed on the support component.
Preferably, the module for the treatment of sealing-off is: the power module on the pcb board.
Preferably, the thermal source production part comprises: the dull and stereotyped heating furnace of aluminum heating wire and/or infrared heating furnace.
Preferably, the pin heater block is made by the material of thermal conductivity greater than predetermined threshold.
Preferably, material is aluminium or copper.
Preferably, the module parts of choosing are one of following: the mechanical device of linkage, vacuum cap type device or adhesive device.
In the utility model, when the module that needs sealing-off is carried out sealing-off, pin heater block and this pin for the treatment of the module of sealing-off are carried out correspondence, the heat that produces by the thermal source production part melts the scolding tin on the pin, treat the sealing-off module by what module chose that parts choose that scolding tin melted again, thereby realize the overall process of sealing-off.The utility model solved in the prior art in the sealing-off process, easily damage by on sealing-off inside modules or the pcb board by the device of sealing-off module periphery, the inefficient technical problem of sealing-off, reduced because of sealing-off and reprocessed the probability of introducing new fault, realized that quick, safe and effective sealing-off reprocesses.
Description of drawings
Accompanying drawing described herein is used to provide further understanding of the present utility model, consists of the application's a part, and illustrative examples of the present utility model and explanation thereof are used for explaining the utility model, do not consist of improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is a kind of preferred structure schematic diagram according to the sealing-off device of the utility model embodiment;
Fig. 2 is a kind of preferred structure schematic diagram according to the module pin heat block of the utility model embodiment;
Fig. 3 is a kind of preferred structure schematic diagram according to the mechanical type power module pulling attachment of the utility model embodiment.
The specific embodiment
Hereinafter also describe in conjunction with the embodiments the utility model in detail with reference to accompanying drawing.Need to prove, in the situation that do not conflict, embodiment and the feature among the embodiment among the application can make up mutually.
Embodiment 1
As shown in Figure 1, the utility model provides a kind of preferred sealing-off device, and this device comprises: thermal source production part 1; Pin heater block 2 links to each other with thermal source production part 1; Support component is positioned at pin heater block 2 tops, and the position of pin heater block 2 when the pin of the heating support component module for the treatment of sealing-off of carrying is corresponding with the position of the pin of the module for the treatment of sealing-off; The module parts 9 of choosing, the module position of parts 9 when choosing the module for the treatment of sealing-off of choosing is corresponding with the position of the module for the treatment of sealing-off.
In above preferred embodiment, when the module that needs sealing-off is carried out sealing-off, pin heater block and this pin for the treatment of the module of sealing-off are carried out correspondence, the heat that produces by the thermal source production part melts the scolding tin on the pin, treat the sealing-off module by what module chose that parts choose that scolding tin melted again, thereby realize the overall process of sealing-off, solved in the prior art in the sealing-off process, easily damage by on sealing-off inside modules or the PCB by the device of sealing-off module periphery, the inefficient technical problem of sealing-off, reduced because of sealing-off and reprocessed the probability of introducing new fault, realized fast, safety, effectively sealing-off is reprocessed.
The utility model also improves support component, is fixed in order to reach the module for the treatment of sealing-off in sealing-off.To achieve these goals, concrete, on the basis of each preferred embodiment of the utility model, support component comprises: support 6 is positioned at the both sides of sealing-off device; Gripper shoe 7 is slidingly connected with support 6; Pallet 3 is installed on the gripper shoe 7, has carried on it to be welded with the described pcb board for the treatment of the module 5 of sealing-off.Preferably, the module parts 9 of choosing can be fixed on the support 6.In above-mentioned preferred embodiment, pallet is used for the pcb board of module that the carrying welding remains sealing-off, and pallet connects with support by gripper shoe, thereby has increased the stability of pallet.
The utility model also improves the module parts 9 of choosing, so that the applicable different sealing-off module for the treatment of.To achieve these goals, concrete, on the basis of each preferred embodiment of the utility model, the module parts 9 of choosing also comprise: moving-member is slidingly connected with support 6; The module fixed part is fixedly connected with moving-member by attaching parts, rotates between module fixed part and the attaching parts or is slidingly connected.In above-mentioned preferred embodiment, thereby the module fixed part is used for this module being fixed on when treating the sealing-off module module and choosing and will treat that the sealing-off module removes from pcb board on the parts choosing, preferably, the module fixed part by connector be fixedly connected with support 6 that support is slidingly connected, thereby can be according to the size for the treatment of the sealing-off module and position, and the size of pcb board etc. is carried out the adjustment of position and size to the module fixed part, with realization different modules is fixed when choosing, thereby adapts to different pcb boards, or the different sealing-off demand for the treatment of the sealing-off module.
In preferred embodiment of the utility model, the sealing-off device also comprises: press down parts 8, be slidingly connected with support 6, press down parts 8 and welding remained the pcb board of module 5 of sealing-off when choosing the module for the treatment of sealing-off and be fixed on the support component.In above-mentioned preferred embodiment, PCB is installed in this sealing-off device presses down parts, thereby prevent moving of when choosing power module PCB, guaranteed the validity of choosing, also reduced simultaneously the impaired probability of element, further, pressed down parts and also can realize being slidingly connected, thereby can reasonably adjust along with pcb board and with the difference of the shape of sealing-off module or size etc., improve applicability of the present utility model and flexibility.
In preferred embodiment of the utility model, the module for the treatment of sealing-off can be the power module on the pcb board.In above-mentioned preferred embodiment, realized the sealing-off to pcb board power source module.
In preferred embodiment of the utility model, thermal source production part 1 can be but be not limited to the dull and stereotyped heating furnace of aluminum heating wire or infrared heating furnace, and this thermal source production part 1 mainly is for pin heater block 2 being heated and the temperature of heating being controlled.
In preferred embodiment of the utility model, pin heater block 2 is made by the material of thermal conductivity greater than predetermined threshold, preferably, can adopt the extremely strong materials of thermal conductivity such as aluminium or copper, this pin heater block 2 is the different pin heater block 2 of difference customization of the module of sealing-off as required.
In preferred embodiment of the utility model, the module parts 9 of choosing include but not limited to one of following: the mechanical device of linkage, vacuum cap type device or adhesive device.
Above-mentioned preferred embodiment in, this sealing-off device mainly is to produce heat by being positioned at following thermal source parts, the heat that produces is continued to offer the pin heater block and remains on suitable temperature, simultaneously when placing pcb board on the support component, treat pin and the pin heat block correspondence of the module of sealing-off, preferably, this pin heat block can be special.The pin heat block melts the scolding tin of pin at short notice, then utilizes the module parts of choosing just can easily the module for the treatment of sealing-off be removed, and can not damage other elements on the PCB.
Embodiment 2
The utility model provides a kind of preferred embodiment to come further the utility model to be made an explanation, but it should be noted that the preferred embodiment just limits the utility model improperly in order better to describe the utility model, not consist of.
Based on preferred sealing-off device shown in Figure 1, the utility model also provides a kind of method of how utilizing this device to carry out sealing-off.Preferably, in the present embodiment, dull and stereotyped heating furnace 1 as a kind of optimal way of thermal source production part, module pin heat block 2 as a kind of optimal way of pin heater block, PCB pallet 3 as a kind of optimal way of pallet, power module 5 as a kind of optimal way for the treatment of the module of sealing-off, the PCB tray support plate 7 a kind of optimal way as gripper shoe, PCB hold-down devices 8 is chosen module 9 as choose a kind of optimal way of parts of module as a kind of optimal way, the power supply of hold-down devices.The method of removing power module from pcb board is described below with reference to above-mentioned preferred sealing-off device.
Place dull and stereotyped heating furnace 1 and support 6 at table top, PCB tray support plate 7, PCB hold-down devices 8 and power module pulling attachment 9 are installed on the support 6, preferably, PCB tray support plate 7, PCB hold-down devices 8 and power module pulling attachment 9 all can be laterally mobile on support, to adapt to different PCB sizes and the different diverse location of module on PCB.PCB pallet 3 is installed on the PCB tray support plate 7, is adjusting the position fixedly behind the PCB tray support plate 7, more special module pin heat block 2 is connected on the dull and stereotyped heating furnace 1 and corresponding with the position of power module 5 on the PCB pallet 3.Preferably, module pin heat block 2 can adopt device as shown in Figure 2.
In sealing-off, at first adjust the temperature of dull and stereotyped heating furnace 1, make the temperature of special module pin heat block 2 reach the temperature of melts soldering tin, the pcb board 4 that will be welded with again power module 5 is placed on the PCB pallet 3, thereby operation PCB hold-down devices 8 compresses pcb board 4 so that pcb board 4 is not mobile, by the time after the scolding tin on the pin all melts, can operating power module pulling attachment 9 upwards be mentioned by power module 5, finish the sealing-off action to power module 5.Preferably, power module pulling attachment 9 can adopt mechanical type power module pulling attachment as shown in Figure 3.
As can be seen from the above description, the utility model has been realized following technique effect:
When the module that needs sealing-off is carried out sealing-off, pin heater block and this pin for the treatment of the module of sealing-off are carried out correspondence, the heat that produces by the thermal source production part melts the scolding tin on the pin, treat the sealing-off module by what module chose that parts choose that scolding tin melted again, thereby realize the overall process of sealing-off, solved in the prior art in the sealing-off process, easily damage by on sealing-off inside modules or the pcb board by the device of sealing-off module periphery, the inefficient technical problem of sealing-off, reduced because of sealing-off and reprocessed the probability of introducing new fault, realized fast, safety, effectively sealing-off is reprocessed.
The above is preferred embodiment of the present utility model only, is not limited to the utility model, and for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the protection domain of the present utility model.
Claims (9)
1. a sealing-off device is characterized in that, comprising:
Thermal source production part (1);
Pin heater block (2) links to each other with described thermal source production part (1);
Support component, be positioned at described pin heater block (2) top, the position the during pin of the module for the treatment of sealing-off (5) that described pin heater block (2) carries at the described support component of heating is corresponding with the position of the pin of the described module (5) for the treatment of sealing-off;
The module parts (9) of choosing, the described module position of parts (9) when choosing the described module (5) for the treatment of sealing-off of choosing is corresponding with the position of the described module (5) for the treatment of sealing-off.
2. sealing-off device according to claim 1 is characterized in that, described support component comprises:
Support (6) is positioned at the both sides of described sealing-off device;
Gripper shoe (7) is slidingly connected with described support (6);
Pallet (3) is installed on the described gripper shoe (7), has carried on it to be welded with the described pcb board for the treatment of the module (5) of sealing-off.
3. sealing-off device according to claim 2 is characterized in that, the described module parts (9) of choosing comprising:
Moving-member is slidingly connected with described support (6);
The module fixed part is fixedly connected with described moving-member by attaching parts, rotates between described module fixed part and the described attaching parts or is slidingly connected.
4. sealing-off device according to claim 2 is characterized in that, also comprises:
Press down parts (8), be slidingly connected with described support (6), the described parts (8) that press down will be welded with the described pcb board of the module (5) of sealing-off for the treatment of and be fixed on the described support component when choosing the described module (5) for the treatment of sealing-off.
5. sealing-off device according to claim 2 is characterized in that, the described module (5) of sealing-off for the treatment of is: the power module on the pcb board.
6. sealing-off device according to claim 1 is characterized in that, described thermal source production part (1) comprising: the dull and stereotyped heating furnace of aluminum heating wire and/or infrared heating furnace.
7. sealing-off device according to claim 1 is characterized in that, described pin heater block (2) is made by the material of thermal conductivity greater than predetermined threshold.
8. sealing-off device according to claim 7 is characterized in that, described material is aluminium or copper.
9. sealing-off device according to claim 1 is characterized in that, described module is chosen parts (9) for one of following: the mechanical device of linkage, vacuum cap type device or adhesive device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220009040 CN202684256U (en) | 2012-01-10 | 2012-01-10 | Sealing-off device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220009040 CN202684256U (en) | 2012-01-10 | 2012-01-10 | Sealing-off device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202684256U true CN202684256U (en) | 2013-01-23 |
Family
ID=47539927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220009040 Expired - Lifetime CN202684256U (en) | 2012-01-10 | 2012-01-10 | Sealing-off device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202684256U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105689832A (en) * | 2014-11-28 | 2016-06-22 | 宁波江丰电子材料股份有限公司 | Target sealing-off method |
| CN105813395A (en) * | 2014-12-29 | 2016-07-27 | 鸿富锦精密电子(郑州)有限公司 | Material removing equipment |
| CN108237282A (en) * | 2018-01-30 | 2018-07-03 | 深圳市牧激科技有限公司 | Laser sealing-off all-in-one machine and its processing method |
| CN108436211A (en) * | 2018-06-14 | 2018-08-24 | 深圳市微组半导体科技有限公司 | A kind of welding of PCB devices and sealing-off method and device |
| CN108581921A (en) * | 2018-04-27 | 2018-09-28 | 江苏长电科技股份有限公司 | Disassembling jig and its control method for large scale chip bga |
| CN112888190A (en) * | 2021-01-22 | 2021-06-01 | 国营芜湖机械厂 | Method for reliably dismounting large-area grounding plug-in module of high-frequency circuit board |
| CN113649661A (en) * | 2021-10-20 | 2021-11-16 | 徐州全达金属制品有限公司 | Electronic component dismounting device |
| CN113997129A (en) * | 2021-11-01 | 2022-02-01 | 杭州鸿星电子有限公司 | Surface mount type quartz crystal oscillator cover opening method |
-
2012
- 2012-01-10 CN CN 201220009040 patent/CN202684256U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105689832A (en) * | 2014-11-28 | 2016-06-22 | 宁波江丰电子材料股份有限公司 | Target sealing-off method |
| CN105689832B (en) * | 2014-11-28 | 2017-09-15 | 宁波江丰电子材料股份有限公司 | The sealing-off method of target |
| CN105813395A (en) * | 2014-12-29 | 2016-07-27 | 鸿富锦精密电子(郑州)有限公司 | Material removing equipment |
| CN108237282A (en) * | 2018-01-30 | 2018-07-03 | 深圳市牧激科技有限公司 | Laser sealing-off all-in-one machine and its processing method |
| CN108581921A (en) * | 2018-04-27 | 2018-09-28 | 江苏长电科技股份有限公司 | Disassembling jig and its control method for large scale chip bga |
| CN108581921B (en) * | 2018-04-27 | 2020-01-24 | 江苏长电科技股份有限公司 | Disassembling jig for large-size BGA (ball grid array) packaged chip and control method thereof |
| CN108436211A (en) * | 2018-06-14 | 2018-08-24 | 深圳市微组半导体科技有限公司 | A kind of welding of PCB devices and sealing-off method and device |
| CN112888190A (en) * | 2021-01-22 | 2021-06-01 | 国营芜湖机械厂 | Method for reliably dismounting large-area grounding plug-in module of high-frequency circuit board |
| CN113649661A (en) * | 2021-10-20 | 2021-11-16 | 徐州全达金属制品有限公司 | Electronic component dismounting device |
| CN113649661B (en) * | 2021-10-20 | 2021-12-24 | 徐州全达金属制品有限公司 | Electronic component dismounting device |
| CN113997129A (en) * | 2021-11-01 | 2022-02-01 | 杭州鸿星电子有限公司 | Surface mount type quartz crystal oscillator cover opening method |
| CN113997129B (en) * | 2021-11-01 | 2022-05-17 | 杭州鸿星电子有限公司 | Surface mount type quartz crystal oscillator cover opening method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202684256U (en) | Sealing-off device | |
| CN103934537B (en) | Plug-in unit welding procedure and welding carrier on a kind of pcb board | |
| CN102169809B (en) | BGA (Ball Grid Array) component repairing method and fixture | |
| JPWO2005096396A1 (en) | Manufacturing method of solar cell | |
| CN102123562B (en) | Method for manufacturing metal substrate by adopting reflow soldering | |
| CN103002670A (en) | Wave crest soldering technique of printed circuit board | |
| CN103108499A (en) | Packaging method and packaging device of flexible electronic circuit | |
| CN109588023B (en) | Heat dissipation structure and related equipment | |
| CN101573022B (en) | Heat-dissipation structure in closed box body and machining method thereof | |
| CN102065646B (en) | Surface mount technology of ratio frequency power amplification mainboard | |
| CN104084659B (en) | Hot air welding method is adopted to prepare the production method of transistor | |
| CN100573921C (en) | A kind of solar components and manufacture method thereof | |
| CN205454222U (en) | Circuit board temperature control device | |
| CN209291472U (en) | A kind of NG temporary storage machine | |
| JP2013171863A (en) | Electronic component mounting structure and manufacturing method of the same | |
| CN105120602A (en) | Small and medium-sized PCB components mixed installing technology | |
| CN103433590B (en) | A kind of crest welder | |
| CN217018967U (en) | Lead-free soldering hot air PCB (printed circuit board) reflow soldering machine | |
| CN202889802U (en) | Auxiliary device for solderless joint of two superimposed boards | |
| CN104640427A (en) | Energy-saving lamp manufacturing process | |
| CN107316820A (en) | A kind of process of microwave chip eutectic welding | |
| CN201940720U (en) | Reworking clamp for BGA elements | |
| CN207239425U (en) | Bull hot welding press | |
| CN207040017U (en) | A kind of surface-mounted integrated circuit processing unit (plant) | |
| CN201201087Y (en) | Infrared ray heat energy compensating mechanism of reflow machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130123 |
|
| CX01 | Expiry of patent term |