CN105689832A - Target sealing-off method - Google Patents
Target sealing-off method Download PDFInfo
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- CN105689832A CN105689832A CN201410713274.5A CN201410713274A CN105689832A CN 105689832 A CN105689832 A CN 105689832A CN 201410713274 A CN201410713274 A CN 201410713274A CN 105689832 A CN105689832 A CN 105689832A
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- backboard
- hydraulic press
- target base
- target
- sealing
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- Pressure Welding/Diffusion-Bonding (AREA)
- Gasket Seals (AREA)
Abstract
Provided is a target sealing-off method. The method includes the steps that a target comprising a target blank and a back plate is provided, the target blank is embedded and welded in the back plate, the surface, where the target blank is embedded and welded, of the back plate is regarded as the back plate front surface, and the other surface of the back plate is the back plate back surface; an oil press comprising an oil press platform and an oil press head is provided; the target is fixed on the oil press platform in a suspended mode, the target blank is made to face the oil press platform, and a gap is formed between the target blank and the oil press platform; and the oil press head is used for exerting pressure on the back plate back surface to enable the target blank to fall off from the back plate. According to the target sealing-off method, turning is not needed, pressure is directly adopted to take the target blank out of the back plate, damage to the target is small, sealing-off time is short, and the process is simple.
Description
Technical field
The present invention relates to field of semiconductor manufacture, particularly relate to a kind of sealing-off method of target。
Background technology
In vacuum splashing and plating process, target is a kind of conventional material, and target is generally target base and backboard welds together and forms。Diffusion Welding (DiffusionBonding, DB) a kind of method welding target commonly used for prior art, weldment is fitted tightly, keeps a period of time under uniform temperature and pressure, make the atom between contact surface mutually diffuse to form the welding method of connection。
The target that Diffusion Welding is formed, when failure welding occur, it is impossible to when reaching the standard-required of vacuum splashing and plating, target needs to scrap process, it is therefore desirable to by target sealing-off, separates by target base and backboard。The way of turning owing to target base uses high-purity material, it is worth higher, so generally can be utilized target sealing-off。
Prior art generally adopts the method sealing-off of turning, falls by the backboard turning of target, and the target base as high-purity material is then repeated utilizing。Easily the target base of high-purity material being caused damage when carrying out turning, so the target after sealing-off cannot function as original target and is repeated utilizing, can only change and make smaller size of target, back veneer material also cannot reuse。Additionally, turning process is consuming time longer, cost waste is more。
Accordingly, it would be desirable to the sealing-off method of the Diffusion Welding target of a kind of efficient economizing more, simplify the sealing-off process of existing target, improve the recovery utilization rate of target and backboard。
Summary of the invention
The problem that this invention address that is to provide a kind of sealing-off method of target, to simplify the sealing-off process of existing target, improves the recovery utilization rate of target and backboard。
For solving the problems referred to above, the present invention provides a kind of sealing-off method of target, including:
Thering is provided target, described target includes target base and backboard, and described target base is embedded to be welded in described backboard, and the embedded back plate surface being welded with described target base is backboard front, and the another side of described backboard is the backboard back side；
Thering is provided hydraulic press, described hydraulic press includes hydraulic press platform and hydraulic press head；
Be fixed on unsettled for described target on hydraulic press platform, make target base towards hydraulic press platform and and hydraulic press platform between there is space；
With hydraulic press head, the backboard back side is applied pressure to target base to come off from backboard。
Optionally, described backboard front includes marginal area and is embedded with the central area of target base, unsettled for the described target step being fixed on hydraulic press platform is included: multiple packing ring is set between the marginal area and hydraulic press platform in described backboard front, make, between target base and hydraulic press platform, there is space。
Optionally, described target base and backboard are rectangle, and the surface on surface and the marginal area in described backboard front that described target base is exposed to backboard flushes, and the marginal area in described backboard front is shaped as frame。Optionally, the plurality of packing ring is uniformly distributed on the marginal area in backboard front。
Optionally, the material of described packing ring is metal。
Optionally, the height of described packing ring is in the scope of 30-100mm。
Optionally, executing in stressed step with hydraulic press head to the backboard back side, the pressure that backboard is applied by hydraulic press head is in the scope of 100000 Ns to 250000 Ns。
Optionally, after described target is fixed on hydraulic press platform, before backboard being executed stressed step with hydraulic press head, backing plate is placed at the back side of described backboard, with hydraulic press head, backboard is being executed in stressed step, with hydraulic press head, described backing plate being applied pressure, pressure is delivered on backboard by backing plate。
Optionally, place in the step of backing plate at the back side of described backboard, described backing plate is positioned over the back side central authorities of described backboard, with hydraulic press head, backboard is being executed in stressed step, with hydraulic press head, described backing plate central authorities are being applied pressure。
Optionally, the material of described backing plate is aluminum。
Optionally, described backing plate is shaped to circle, and the area of described backing plate is more than the area of described hydraulic press head。
Optionally, the material of described backboard is copper alloy, stainless steel alloy or titanium alloy。
Optionally, with hydraulic press head, backboard is being applied pressure, after target base comes off from backboard, first described backboard and target base are being carried out smooth process, then the solder side of backboard Yu target base is smoothed。
Optionally, described backboard and target base are carried out in the step of smooth process, adopt described hydraulic press head that described backboard and target base are applied pressure, so that described backboard and target base are driven plain。
Compared with prior art, the invention have the advantages that and be fixed on unsettled for described target on hydraulic press platform, make target base towards hydraulic press platform and and hydraulic press platform between there is space；With hydraulic press head, the backboard back side is applied pressure to target base to come off from backboard。The sealing-off method of target of the present invention, without turning, directly adopts pressure to be taken out from backboard by target base, and the damage of target base is less, and the sealing-off time is shorter, and technique is simple。
Accompanying drawing explanation
Fig. 1 is the flow chart of the sealing-off method of target provided by the invention；
Fig. 2 is the schematic diagram of sealing-off method one embodiment of target of the present invention；
Fig. 3 is the schematic top plan view of embodiment illustrated in fig. 2。
Detailed description of the invention
As stated in the Background Art, the sealing-off method time of existing target is longer, and the damage of target base is bigger。
The present invention provides a kind of sealing-off method of target, simplifies the sealing-off process of existing target, improves the recovery utilization rate of target and backboard。
The present invention is fixed on unsettled for described target on hydraulic press platform, make target base towards hydraulic press platform and and hydraulic press platform between there is space；With hydraulic press head, the backboard back side is applied pressure, make backboard deform, so that target base comes off from backboard。The sealing-off method of target of the present invention, without turning, directly adopts pressure to be taken out from backboard by target base, and the damage of target base is less, and the sealing-off time is shorter, and technique is simple。
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail。
Fig. 1 is the flow chart of the sealing-off method of target provided by the invention, and the sealing-off method of target of the present invention generally comprises:
Step S1, it is provided that target, described target includes target base and backboard, and described target base is embedded to be welded in described backboard, and the embedded back plate surface being welded with described target base is backboard front, and the another side of described backboard is the backboard back side；
Step S2, it is provided that hydraulic press, described hydraulic press includes hydraulic press platform and hydraulic press head；
Step S3, is fixed on unsettled for described target on hydraulic press platform, make target base towards hydraulic press platform and and hydraulic press platform between there is space；
Step S4, applies pressure to target base with hydraulic press head to the backboard back side and comes off from backboard。
Fig. 2 is the schematic diagram of sealing-off method one embodiment of target of the present invention, below in conjunction with Fig. 2, the specific embodiment of the present invention is discussed in detail。
With reference to Fig. 2, perform step S1, it is provided that target, described target includes target base 101 and backboard 100, described target base 101 is embedded to be welded in described backboard 100, and embedded backboard 100 surface being welded with described target base 101 is backboard front, and the another side of described backboard 100 is the backboard back side。
It is to say, be provided with an opening on described backboard 100 front, described target base 101 is embedded to be welded in described opening。
In conjunction with reference to Fig. 3, it is shown that the top view of the present embodiment sealing-off method。In the present embodiment, described target is LCD target, and therefore described target base 101 (in Fig. 3 shown in rectangular broken line frame) and backboard 100 are rectangle。Described backboard 100 front includes marginal area and central area, the embedded central area being welded in backboard 100 of described target base 101。Described target base 101 is exposed to the surface of backboard 100 and flushes with described backboard frontside edge region surface, and described backboard frontside edge region is shaped as frame。In other embodiments, described target can also be semiconductor crystal wafer target, and the shape of described target base 101 and backboard 100 can also be circular, the invention is not limited in this regard。
In the present embodiment, the material of described backboard 100 is copper alloy, stainless steel alloy or titanium alloy, but the invention is not limited in this regard。
In the present embodiment, the material of described target base 101 includes tungsten-titanium alloy, chrome molybdenum etc., but the invention is not limited in this regard。It should be noted that the target base 101 of the present embodiment is high-purity target base, the material purity of described target base 101 is more than 99.5%, but the present invention is to whether target base 101 is that high-purity target base is not limited as。
With continued reference to Fig. 2, perform step S2, it is provided that hydraulic press, described hydraulic press includes hydraulic press platform 200 and hydraulic press head 201。
The hydraulic press that the present embodiment hydraulic press can be commonly used for prior art。Described hydraulic press platform 200 has smooth upper surface so that when the target on hydraulic press platform 200 is applied pressure by hydraulic press head 201, target is not easily moveable, and pressure is comparatively uniform。It should be noted that in order to make Fig. 3 succinctly clear, not shown hydraulic press head in figure 3。
The maximum pressure of the hydraulic press head 201 of the present embodiment hydraulic press is in the scope of 200000 Ns to 250000 Ns。But the present invention is without limitation。
It should be noted that the order of step S1 and step S2 is not limited by the present invention, optionally, step S1 and step S2 can successively carry out carrying out simultaneously。
With continued reference to Fig. 2, perform step S3, described target be placed on hydraulic press platform 200, be fixed on unsettled for described target on hydraulic press platform 200, make target base 101 towards hydraulic press platform 200 and and hydraulic press platform 200 between there is space。Specifically, in conjunction with reference to Fig. 3, in the present embodiment, make target base 101 towards hydraulic press platform 200, multiple packing ring 102 is placed between the marginal area and hydraulic press platform 200 in backboard 100 front, making to have between target base 101 and hydraulic press platform 200 space, described target is unsettled to be fixed on hydraulic press platform 200。
It should be noted that owing to Fig. 3 is the top view of the present embodiment sealing-off method, packing ring 102 therefore actually cannot be seen, in order to illustrate that clear multiple packing rings 102 are in the distribution of the marginal area in backboard 100 front, illustrate multiple packing ring 102 with dotted line in figure 3。
In conjunction with reference to Fig. 3, in the present embodiment, the plurality of packing ring 102 is uniformly distributed on the marginal area in backboard 100 front。Owing to described backboard frontside edge region is shaped as frame, the relative both sides in backboard frontside edge region can respectively be distributed the packing ring 102 of equal number so that target is placed steadily on hydraulic press platform 200, it is not easy to drop from packing ring 102 because of stress。
It should be noted that, owing to the plurality of packing ring 102 needs indirectly to bear the pressure that the target on hydraulic press platform 200 is applied by hydraulic press head 201, and multiple packing rings 102 are less with the contact area in backboard frontside edge region, pressure is bigger, so multiple packing rings 102 need to adopt firm material to make, in the present embodiment, the material of the plurality of packing ring 102 is metal, such as hard metal materials such as rustless steel, cast iron or steel。
It should be noted that in the present embodiment, in order to make target place on hydraulic press platform 200 steadily, the height of the plurality of packing ring 102 is identical。If the excessive height of packing ring 102, then target is not easy steadily, if the height of packing ring 102 is too low, then target is being executed in stressed process, target slightly deforms, and target base 101 is it is possible to touch hydraulic press platform 200 so that target base 101 may not be completely out from backboard 100。In the present embodiment, the height of described packing ring 102 is 50mm。Optionally, the height of packing ring 102 can also in the scope of 30-100mm。
It can further be stated that, in the present embodiment, in the way of the plurality of packing ring 102 is set, make that described target is unsettled to be fixed on hydraulic press platform 200, but the present invention does not limit making the unsettled mode being fixed on hydraulic press platform 200 of described target, in other embodiments, multiple spacer block can also placed between the marginal area and hydraulic press platform 200 in backboard 100 front, making to have between target base 101 and hydraulic press platform 200 space, described target is unsettled to be fixed on hydraulic press platform 200。
Or, in other embodiments, interconnective hook, peg and suspension arrangement can also be set at described backboard 100 back side, target is made to be suspended to above hydraulic press platform 200, make to be mutually permanently connected between suspension arrangement, peg, hook and described backboard 100, be fixed on hydraulic press platform 200 so that described target is unsettled。Executing in stressed step with hydraulic press head to the backboard back side, described target is unsettled fixing, and described target base 101 can also successfully come off from backboard 100。
With continued reference to Fig. 2, in the present embodiment, after being placed on hydraulic press platform 200 by described target, place backing plate 103 at the back side of described backboard 100。Described backing plate 103 is for executing in stressed step with hydraulic press head 201 to backboard 100, applying pressure with hydraulic press head 201 to described backing plate 103, and pressure is delivered on backboard 100 by backing plate 103。
In the present embodiment, the area of described backing plate 103 is more than the area of hydraulic press head 201。
In conjunction with reference to Fig. 3, in the present embodiment, described backing plate 103 is positioned over the back side central authorities of described backboard 100, executes in stressed process at the follow-up back side to backboard 100, makes pressure be more uniformly distributed。
In the present embodiment, the material of described backing plate 103 is aluminum。The backing plate 103 of aluminum is softer, follow-up backboard 100 executed, stressed process is not easy damage backboard 100, described backing plate 103 is shaped to circle, stressed process makes backboard 100 stress evenly follow-up backboard 100 executed, but material and the shape of backing plate 103 are not limited by the present invention。
With continued reference to Fig. 2, performing step S4, with hydraulic press head 201, backboard 100 is applied pressure, target base 101 comes off from backboard 100。Specifically, executing in stressed process with hydraulic press head 201 to backboard 100, there is visible or sightless deformation in backboard 100 so that the opening in described backboard 100 front widens, space is produced, so that target base 101 comes off from backboard 100 between backboard 100 and target base 101。
Compared with the turning of prior art, the present embodiment directly adopts and backboard 100 back side is applied pressure, makes the mode that backboard 100 deforms be taken out from backboard 100 by target base 101, and the damage of target base 101 is less, and the sealing-off time is shorter, and technique is simple。After target base 101 takes out from backboard 100, volume, substantially without reduction, saves the material of target base 101。
It should be noted that when the material of backboard 100 is copper alloy, stainless steel alloy or titanium alloy, backboard 100 is comparatively hard and flexible, is easily deformed when being under pressure but will not rupture so that target base 101 drops after backboard 100 deforms。Target base 101 so can be made but without when coming off, and backboard 100 is because excessive deformation is subject to crushing。Therefore the method for the present embodiment is more suitable for that copper alloy, stainless steel alloy or titanium alloy be hard and backboard 100 material of flexible。
In the present embodiment, as shown by the arrows in Figure 2, executing in stressed step with hydraulic press head 201 to backboard 100, with hydraulic press head 201, described backing plate 103 is applied pressure, pressure is delivered on backboard 100 by backing plate 103, and the direction of described pressure is perpendicular to backboard 100 back side。
The pressure area of hydraulic press head 201 is big compared with little, pressure, and the area of backing plate 103 is more than the area of hydraulic press head 201。Described backing plate 103 is applied pressure by the present embodiment hydraulic press head 201, and pressure is delivered on backboard 100 by backing plate 103, reduces the pressure that backboard 100 is subject to, makes backboard 100 uniform force so that backboard 100 is easily deformed and is not easy damage。
In the present embodiment, described backing plate 103 is positioned over the back side central authorities of described backboard 100, is executing in stressed process to the back side of backboard 100, the central authorities of backing plate 103 is applied pressure, makes backboard 100 pressure experienced be more uniformly distributed。Further, adopt and so execute stressed mode, the pressure of backboard 100 is concentrated on the back side central authorities of backboard 100 so that the opening in backboard 100 front is easier to expand, and then makes target base 101 be easier to come off。
In the present embodiment, the material of described backing plate 103 includes aluminum, and the backing plate 103 of aluminum is softer, it is not easy to damage backboard 100, described backing plate 103 generally circular in shape so that backboard 100 stress evenly, but material and the shape of backing plate 103 are not limited by the present invention。
In the present embodiment, the pressure that backboard applies is 200000 Ns by hydraulic press head 201, at this pressure, the deformation quantity of backboard 100 is sufficient so that target base 101 and comes off, but the invention is not limited in this regard, optionally, the pressure that backboard is applied by hydraulic press head can in the scope of 100000 Ns to 250000 Ns。
After target base 101 comes off, target base 101 and backboard 100 can be recycled, but after 200000 Ns of pressure, target base 101 and backboard 100 are likely to all produce certain deformation, in the present embodiment, after target base 101 comes off from backboard 100, first described backboard 100 and target base 101 are carried out smooth process, again the solder side of backboard 100 with target base 101 is smoothed, target base 101 and backboard 100 is made to regain the shape of rule, and the surface that backboard 100 is smooth with the solder side acquisition of target base 101, is beneficial to the infiltration welded next time。
Carry out described backboard 100 and target base 101, in the step of smooth process, adopting described hydraulic press that described backboard 100 and target base 101 are carried out smooth process。Specifically, it is possible to adopt hydraulic press head 201, the position tilted at sealing-off process dorsulum 100 and target base 101 is applied pressure, make the position that backboard 100 and target base 101 tilt be driven plain, with smooth backboard 100 and target base 101。But whether the present invention does not limit adopting hydraulic press that described backboard 100 and target base 101 are carried out smooth process, in other embodiments, it is also possible to adopt other devices that described backboard 100 and target base 101 are carried out smooth process。
Although present disclosure is as above, but the present invention is not limited to this。Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range。
Claims (14)
1. the sealing-off method of a target, it is characterised in that including:
Thering is provided target, described target includes target base and backboard, and described target base is embedded to be welded in described backboard, and the embedded back plate surface being welded with described target base is backboard front, and the another side of described backboard is the backboard back side；
Thering is provided hydraulic press, described hydraulic press includes hydraulic press platform and hydraulic press head；
Be fixed on unsettled for described target on hydraulic press platform, make target base towards hydraulic press platform and and hydraulic press platform between there is space；
With hydraulic press head, the backboard back side is applied pressure to target base to come off from backboard。
2. sealing-off method according to claim 1, it is characterized in that, described backboard front includes marginal area and is embedded with the central area of target base, unsettled for the described target step being fixed on hydraulic press platform is included: multiple packing ring is set between the marginal area and hydraulic press platform in described backboard front, make, between target base and hydraulic press platform, there is space。
3. sealing-off method according to claim 2, it is characterised in that described target base and backboard are rectangle, the surface on surface and the marginal area in described backboard front that described target base is exposed to backboard flushes, and the marginal area in described backboard front is shaped as frame。
4. sealing-off method according to claim 2, it is characterised in that the plurality of packing ring is uniformly distributed on the marginal area in backboard front。
5. sealing-off method according to claim 2, it is characterised in that the material of described packing ring is metal。
6. sealing-off method according to claim 2, it is characterised in that the height of described packing ring is in the scope of 30-100mm。
7. sealing-off method according to claim 1, it is characterised in that execute in stressed step to the backboard back side with hydraulic press head, the pressure that backboard is applied by hydraulic press head is in the scope of 100000 Ns to 250000 Ns。
8. sealing-off method according to claim 1, it is characterized in that, after described target is fixed on hydraulic press platform, before backboard being executed stressed step with hydraulic press head, backing plate is placed at the back side of described backboard, executing in stressed step with hydraulic press head to backboard, with hydraulic press head, described backing plate is being applied pressure, pressure is delivered on backboard by backing plate。
9. sealing-off method according to claim 8, it is characterized in that, place at the back side of described backboard in the step of backing plate, described backing plate is positioned over the back side central authorities of described backboard, with hydraulic press head, backboard is being executed in stressed step, with hydraulic press head, described backing plate central authorities are being applied pressure。
10. sealing-off method according to claim 8, it is characterised in that the material of described backing plate is aluminum。
11. sealing-off method according to claim 8, it is characterised in that described backing plate is shaped to circle, the area of described backing plate is more than the area of described hydraulic press head。
12. sealing-off method according to claim 1, it is characterised in that the material of described backboard is copper alloy, stainless steel alloy or titanium alloy。
13. sealing-off method according to claim 1, it is characterised in that after with hydraulic press head backboard being applied pressure to target base and comes off from backboard, first described backboard and target base are carried out smooth process, then the solder side of backboard Yu target base is smoothed。
14. sealing-off method according to claim 13, it is characterised in that described backboard and target base are carried out in the step of smooth process, adopt described hydraulic press head that described backboard and target base are applied pressure, so that described backboard and target base are driven plain。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410713274.5A CN105689832B (en) | 2014-11-28 | 2014-11-28 | The sealing-off method of target |
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| CN201410713274.5A CN105689832B (en) | 2014-11-28 | 2014-11-28 | The sealing-off method of target |
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| CN105689832A true CN105689832A (en) | 2016-06-22 |
| CN105689832B CN105689832B (en) | 2017-09-15 |
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| CN201410713274.5A Active CN105689832B (en) | 2014-11-28 | 2014-11-28 | The sealing-off method of target |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109207729A (en) * | 2018-09-03 | 2019-01-15 | 宁波创润新材料有限公司 | A kind of sputtering target material recovery method |
| CN110270730A (en) * | 2019-07-26 | 2019-09-24 | 宁波江丰电子材料股份有限公司 | A kind of pipe target desoldering device and its application method |
| CN115255854A (en) * | 2022-08-03 | 2022-11-01 | 宁波江丰电子材料股份有限公司 | Desoldering method for target material assembly with welding defects |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3629543A (en) * | 1969-06-27 | 1971-12-21 | Marconi Co Ltd | Soldering and unsoldering machines |
| CN101014227A (en) * | 2007-02-02 | 2007-08-08 | 清华大学 | Method and equipment for disassembling circuit board using contacted impact |
| CN201895152U (en) * | 2010-11-15 | 2011-07-13 | 深圳市格林美高新技术股份有限公司 | Desoldering equipment |
| CN202129524U (en) * | 2011-06-27 | 2012-02-01 | 华为终端有限公司 | Fixture for detaching large-size module and jacking device |
| CN202199876U (en) * | 2011-05-30 | 2012-04-25 | 深圳市格林美高新技术股份有限公司 | Improved desoldering equipment |
| CN202684256U (en) * | 2012-01-10 | 2013-01-23 | 中兴通讯股份有限公司 | Sealing-off device |
-
2014
- 2014-11-28 CN CN201410713274.5A patent/CN105689832B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3629543A (en) * | 1969-06-27 | 1971-12-21 | Marconi Co Ltd | Soldering and unsoldering machines |
| CN101014227A (en) * | 2007-02-02 | 2007-08-08 | 清华大学 | Method and equipment for disassembling circuit board using contacted impact |
| CN201895152U (en) * | 2010-11-15 | 2011-07-13 | 深圳市格林美高新技术股份有限公司 | Desoldering equipment |
| CN202199876U (en) * | 2011-05-30 | 2012-04-25 | 深圳市格林美高新技术股份有限公司 | Improved desoldering equipment |
| CN202129524U (en) * | 2011-06-27 | 2012-02-01 | 华为终端有限公司 | Fixture for detaching large-size module and jacking device |
| CN202684256U (en) * | 2012-01-10 | 2013-01-23 | 中兴通讯股份有限公司 | Sealing-off device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109207729A (en) * | 2018-09-03 | 2019-01-15 | 宁波创润新材料有限公司 | A kind of sputtering target material recovery method |
| CN110270730A (en) * | 2019-07-26 | 2019-09-24 | 宁波江丰电子材料股份有限公司 | A kind of pipe target desoldering device and its application method |
| CN115255854A (en) * | 2022-08-03 | 2022-11-01 | 宁波江丰电子材料股份有限公司 | Desoldering method for target material assembly with welding defects |
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|---|---|
| CN105689832B (en) | 2017-09-15 |
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