CN103002670A - Wave crest soldering technique of printed circuit board - Google Patents
Wave crest soldering technique of printed circuit board Download PDFInfo
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- CN103002670A CN103002670A CN201210492383XA CN201210492383A CN103002670A CN 103002670 A CN103002670 A CN 103002670A CN 201210492383X A CN201210492383X A CN 201210492383XA CN 201210492383 A CN201210492383 A CN 201210492383A CN 103002670 A CN103002670 A CN 103002670A
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Abstract
The invention relates to a wave crest soldering technique of a printed circuit board, comprising the following steps: sticking a paster device on a soldering surface to the soldering surface by using red gum; then roasting a printed board for curing; then performing tin coating of a through hole device, bending plug-in mounting, point fixing, shear pin and the like; and then enabling the printed board to pass through a crest soldering machine once so that the paster device and the through hole device are soldered together through soldering tin wave crest; and therefore, the time is saved, and the problems of secondary manual soldering and solder-reflow can be solved. The wave crest soldering technique of the printed circuit board disclosed by the invention has the beneficial effects that the wave crest soldering technique is simple in operation and easy to realize; the cold solder joint problem of manual soldering can be prevented; the problem that components and parts are heated in second time when solder-reflow is used also can be prevented; moreover, the efficiency is improved, and the cost is reduced. Therefore, the practicability is better. The technique is easy to popularize and relatively high in use value.
Description
Technical field
The invention belongs to the welding procedure that loads in mixture printed circuit board, relate to a kind of wave soldering process of printed circuit board, especially relate to the wave soldering process that solder side has the printed circuit board assembly of surface-mounted device.
Background technology
Solder side has the welding of the printed circuit board assembly of surface-mounted device, and present existing welding procedure is after using first wave soldering to finish via devices, make by hand or the welding of surface-mounted device is finished in Reflow Soldering, more than two kinds of techniques all have defective.Manual welding produces rosin joint easily, and Reflow Soldering then needs the device that wave-soldering is taken over is advanced reflow soldering together, causes like this via devices secondary to be heated, and can the performance of part of devices be exerted an influence, even causes a devastating effect.
Summary of the invention
The technical problem that solves
For fear of the deficiencies in the prior art part, the present invention proposes a kind of wave soldering process of printed circuit board, overcomes the problem of faulty soldering of manual welding and components and parts secondary that Reflow Soldering causes and is subjected to heat problem.
Technical scheme
A kind of wave soldering process of printed circuit board is characterized in that step is as follows:
Step 1: on the solder side of printed circuit board, red glue on the pad intermediate point of the soldering surface mounted device of wish, some glue amount is 0.0005ml ~ 0.008ml;
Step 2: then surface-mounted device is affixed on the pad, places baking oven, toast 30 minutes so that red adhesive curing at 85 ± 10 ℃;
Step 3: take out and treat the nature cold to room temperature, again the via devices of wanting to be welded on the printed circuit board is carried out bending, be inserted into the solid and shearing pin of rear point on the printed circuit board;
Step 4: the printed circuit board that step 3 is finished adopts wave soldering to carry out printed board again, so that surface-mounted device welds in the lump.
The pass of described some glue amount and components and parts size is: the size code is 0402 o'clock, and some glue amount is 0.0005ml; The size code is 0603 o'clock, and some glue amount is 0.001ml; The size code is 0805 o'clock, and some glue amount is 0.002ml; The size code is 1206 o'clock, and some glue amount is 0.003ml; The size code is 1812 o'clock, and some glue amount is 0.008ml.
Beneficial effect
The wave soldering process of a kind of printed circuit board that the present invention proposes, use red glue at solder side the surface-mounted device of solder side, again baking-curing is carried out in printed board, and then carry out via devices ward off tin, bending plug-in mounting, point is solid and shear pin etc., again crest welder is once crossed in printed board, the scolding tin crest is welded surface-mounted device and via devices in the lump, so not only saved time but also can solve the problem that secondary manual welding and Reflow Soldering exist.
Beneficial effect of the present invention: wave soldering process of the present invention is simple to operate, realizes easily, both can avoid the problem of faulty soldering of manual welding, and the secondary of components and parts is subjected to heat problem in the time of preventing from using Reflow Soldering again, and raises the efficiency, and reduces cost.Therefore practicality is better.This kind process is promoted easily, has larger practical value.
The applicable components and parts size code of the inventive method less than or equal to 1812 or actual size less than or equal to the components and parts of 4.5 * 3.2 * 3.5mm.
Description of drawings
Fig. 1 is embodiment of the invention components and parts face schematic diagram;
Fig. 2 is embodiment of the invention solder side schematic diagram;
Embodiment
Now in conjunction with the embodiments, the invention will be further described for accompanying drawing:
Embodiment 1: the size code of components and parts is 0402
Step 1: at the red glue of pad intermediate point of the surface-mounted device of solder side, some glue amount is 0.0005ml;
Step 2: then surface-mounted device is affixed on the pad, places baking oven, toast 30 minutes so that red adhesive curing at 85 ± 10 ℃;
Step 3: take out and treat the nature cold to room temperature, carry out again the solid and shearing pin of bending, plug-in mounting, point of via devices;
Step 4: adopt wave soldering to carry out again printed board, so that surface-mounted device welds in the lump.
Embodiment 2: the size code of components and parts is 0603
Step 1: at the red glue of pad intermediate point of the surface-mounted device of solder side, some glue amount is 0.001ml;
Step 2: then surface-mounted device is affixed on the pad, places baking oven, toast 30 minutes so that red adhesive curing at 85 ± 10 ℃;
Step 3: take out and treat the nature cold to room temperature, carry out again the solid and shearing pin of bending, plug-in mounting, point of via devices;
Step 4: adopt wave soldering to carry out again printed board, so that surface-mounted device welds in the lump.
Embodiment 3: the size code of components and parts is 0805
Step 1: at the red glue of pad intermediate point of the surface-mounted device of solder side, some glue amount is 0.002ml;
Step 2: then surface-mounted device is affixed on the pad, places baking oven, toast 30 minutes so that red adhesive curing at 85 ± 10 ℃;
Step 3: take out and treat the nature cold to room temperature, carry out again the solid and shearing pin of bending, plug-in mounting, point of via devices;
Step 4: adopt wave soldering to carry out again printed board, so that surface-mounted device welds in the lump.
Embodiment 4: the size code of components and parts is 1206
Step 1: at the red glue of pad intermediate point of the surface-mounted device of solder side, some glue amount is 0.003ml;
Step 2: then surface-mounted device is affixed on the pad, places baking oven, toast 30 minutes so that red adhesive curing at 85 ± 10 ℃;
Step 3: take out and treat the nature cold to room temperature, carry out again the solid and shearing pin of bending, plug-in mounting, point of via devices;
Step 4: adopt wave soldering to carry out again printed board, so that surface-mounted device welds in the lump.
Embodiment 5: the size code of components and parts is 1812
Rapid 1: at the red glue of pad intermediate point of the surface-mounted device of solder side, some glue amount is 0.008ml;
Step 2: then surface-mounted device is affixed on the pad, places baking oven, toast 30 minutes so that red adhesive curing at 85 ± 10 ℃;
Step 3: take out and treat the nature cold to room temperature, carry out again the solid and shearing pin of bending, plug-in mounting, point of via devices;
Step 4: adopt wave soldering to carry out again printed board, so that surface-mounted device welds in the lump.
Claims (2)
1. the wave soldering process of a printed circuit board is characterized in that step is as follows:
Step 1: on the solder side of printed circuit board, red glue on the pad intermediate point of the soldering surface mounted device of wish, some glue amount is 0.0005ml ~ 0.008ml;
Step 2: then surface-mounted device is affixed on the pad, places baking oven, toast 30 minutes so that red adhesive curing at 85 ± 10 ℃;
Step 3: take out and treat the nature cold to room temperature, again the via devices of wanting to be welded on the printed circuit board is carried out bending, be inserted into the solid and shearing pin of rear point on the printed circuit board;
Step 4: the printed circuit board that step 3 is finished adopts wave soldering to carry out printed board again, so that surface-mounted device welds in the lump.
2. the wave soldering process of described printed circuit board according to claim 1 is characterized in that: the pass of described some glue amount and components and parts size is: the size code is 0402 o'clock, and some glue amount is 0.0005ml; The size code is 0603 o'clock, and some glue amount is 0.001ml; The size code is 0805 o'clock, and some glue amount is 0.002ml; The size code is 1206 o'clock, and some glue amount is 0.003ml; The size code is 1812 o'clock, and some glue amount is 0.008ml.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210492383XA CN103002670A (en) | 2012-11-27 | 2012-11-27 | Wave crest soldering technique of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210492383XA CN103002670A (en) | 2012-11-27 | 2012-11-27 | Wave crest soldering technique of printed circuit board |
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| CN103002670A true CN103002670A (en) | 2013-03-27 |
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| CN201210492383XA Pending CN103002670A (en) | 2012-11-27 | 2012-11-27 | Wave crest soldering technique of printed circuit board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103447646A (en) * | 2013-09-05 | 2013-12-18 | 中国电子科技集团公司第十研究所 | Method for realizing welding between soft base chip circuit board and metal base body without special tool |
| CN104201539A (en) * | 2014-09-04 | 2014-12-10 | 上海航天电子通讯设备研究所 | Method for tin coating of connector inserting pins |
| CN104694029A (en) * | 2015-03-11 | 2015-06-10 | 河源西普电子有限公司 | SMT pasting technique |
| CN105120602A (en) * | 2015-07-30 | 2015-12-02 | 柳州市美源科技股份有限公司 | Small and medium-sized PCB components mixed installing technology |
| CN105234516A (en) * | 2015-10-14 | 2016-01-13 | 桂林市味美园餐饮管理有限公司 | Reflow soldering process for electronic component printed circuit board |
| CN105357899A (en) * | 2015-12-01 | 2016-02-24 | 南京洛普科技有限公司 | Double-face welding method preventing big chip from falling off |
| CN107949182A (en) * | 2017-11-06 | 2018-04-20 | 安徽华东光电技术研究所 | Method based on Reflow Soldering of double-clad board |
| CN110010017A (en) * | 2019-04-12 | 2019-07-12 | 湖南新亚胜光电股份有限公司 | A kind of LED light board fabrication method and product that external force resistance is hit |
| CN113904191A (en) * | 2021-10-15 | 2022-01-07 | 西安微电子技术研究所 | Tin coating tool and tin coating method for connector between gold-plated pin boards |
| CN114245603A (en) * | 2021-12-20 | 2022-03-25 | 中国电子科技集团公司第二十六研究所 | Radio frequency LC filter manufacturing method based on reflow soldering |
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| CN201659071U (en) * | 2010-03-09 | 2010-12-01 | 研祥智能科技股份有限公司 | Glue dispensing head |
| CN101932195A (en) * | 2010-09-28 | 2010-12-29 | 天津三星电子显示器有限公司 | Method for realizing integration of printed circuit boards of monitor |
| CN201718121U (en) * | 2010-07-09 | 2011-01-19 | 上海松下电工自动化控制有限公司 | PCB wave-soldering bracket |
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2012
- 2012-11-27 CN CN201210492383XA patent/CN103002670A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201659071U (en) * | 2010-03-09 | 2010-12-01 | 研祥智能科技股份有限公司 | Glue dispensing head |
| CN201718121U (en) * | 2010-07-09 | 2011-01-19 | 上海松下电工自动化控制有限公司 | PCB wave-soldering bracket |
| CN101932195A (en) * | 2010-09-28 | 2010-12-29 | 天津三星电子显示器有限公司 | Method for realizing integration of printed circuit boards of monitor |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103447646A (en) * | 2013-09-05 | 2013-12-18 | 中国电子科技集团公司第十研究所 | Method for realizing welding between soft base chip circuit board and metal base body without special tool |
| CN104201539A (en) * | 2014-09-04 | 2014-12-10 | 上海航天电子通讯设备研究所 | Method for tin coating of connector inserting pins |
| CN104694029A (en) * | 2015-03-11 | 2015-06-10 | 河源西普电子有限公司 | SMT pasting technique |
| CN105120602A (en) * | 2015-07-30 | 2015-12-02 | 柳州市美源科技股份有限公司 | Small and medium-sized PCB components mixed installing technology |
| CN105234516A (en) * | 2015-10-14 | 2016-01-13 | 桂林市味美园餐饮管理有限公司 | Reflow soldering process for electronic component printed circuit board |
| CN105357899B (en) * | 2015-12-01 | 2018-01-26 | 南京洛普科技有限公司 | A kind of two-sided welding method that anti-large chip comes off |
| CN105357899A (en) * | 2015-12-01 | 2016-02-24 | 南京洛普科技有限公司 | Double-face welding method preventing big chip from falling off |
| CN107949182A (en) * | 2017-11-06 | 2018-04-20 | 安徽华东光电技术研究所 | Method based on Reflow Soldering of double-clad board |
| CN110010017A (en) * | 2019-04-12 | 2019-07-12 | 湖南新亚胜光电股份有限公司 | A kind of LED light board fabrication method and product that external force resistance is hit |
| CN113904191A (en) * | 2021-10-15 | 2022-01-07 | 西安微电子技术研究所 | Tin coating tool and tin coating method for connector between gold-plated pin boards |
| CN113904191B (en) * | 2021-10-15 | 2023-06-06 | 西安微电子技术研究所 | Tin lining tool and tin lining method for connector between gold-plated pin plates |
| CN114245603A (en) * | 2021-12-20 | 2022-03-25 | 中国电子科技集团公司第二十六研究所 | Radio frequency LC filter manufacturing method based on reflow soldering |
| CN114245603B (en) * | 2021-12-20 | 2024-01-30 | 中国电子科技集团公司第二十六研究所 | Radio frequency LC filter manufacturing method based on reflow soldering |
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Application publication date: 20130327 |