CN204673196U - Ball grid array packaged chip erection welding fixture - Google Patents
Ball grid array packaged chip erection welding fixture Download PDFInfo
- Publication number
- CN204673196U CN204673196U CN201520207676.8U CN201520207676U CN204673196U CN 204673196 U CN204673196 U CN 204673196U CN 201520207676 U CN201520207676 U CN 201520207676U CN 204673196 U CN204673196 U CN 204673196U
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- square
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- circuit board
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Abstract
Ball grid array packaged chip erection welding fixture, it relates to a kind of electrical equipment assembling jig, cover weld pads misplace to solve ball grid array packaged chip and circuit board, chip and the underproof problem of welding circuit board, described fixture is square plate, the middle part of square plate is processed with square through hole, the size and shape of square through hole mates with the outline of chip, the shape matching in the size and shape of square through hole and the solder joint district of circuit board, the edge of square plate is processed with a manhole, and the center of circle of manhole is positioned on the diagonal at an angle in plate face.The utility model is used for the erection welding of ball grid array packaged chip.
Description
Technical field
The utility model relates to a kind of electrical equipment assembling jig, is specifically related to a kind of ball grid array packaged chip erection welding fixture, belongs to electrical equipment assembly production technical field.
Background technology
Certain series of products that our factory is produced, there is an electric component, this electric component is made up of one piece of circuit board and a chip parts, chip and circuit board need to weld together, what chip was connected employing with circuit board is the cover type way of contact, namely flush with respective plate face with the leg on chip and circuit board, not protruding plate face, and in spot distribution, interval between points only has about 1mm, very intensive, each chip and circuit board have 100 ~ 200 points not, so chip is connected very difficult with circuit board, before chip core and circuit board weld toward together with, need respectively the pad solder ball of chip core and circuit board to be done balling-up coral, namely each solder joint welds the solder ball that a diameter is φ 0.5, then the method that the point that chip is corresponding with circuit board adopts hot blast to blow weldering is welded, the outline that the point that originally chip is corresponding with circuit board aligns by chip aligns with square contour line drawn on circuit board, this locate mode is very unreliable, frequent generation problem of misalignment, corresponding point is not to upper, point that should not be relative is on the contrary to upper, frequent generation open circuit or short circuit phenomenon, weld assembly testing result is defective, disqualification rate reaches more than 50%, defective work can not be reprocessed, defectively namely to scrap, because chip and circuit board expensive, so economic loss is very serious.
Utility model content
The utility model misplaces for solution ball grid array packaged chip and circuit board cover weld pads, chip and the underproof problem of welding circuit board, and then provide ball grid array packaged chip erection welding fixture.
The utility model is the technical scheme taked that solves the problem: ball grid array packaged chip erection welding fixture of the present utility model is square plate, the middle part of square plate is processed with square through hole, the size and shape of square through hole mates with the outline of chip, the shape matching in the size and shape of square through hole and the solder joint district of circuit board, the edge of square plate is processed with a manhole, the center of circle of manhole is positioned on the diagonal at an angle in plate face, and the thickness of square plate is 2mm ~ 4mm.
The beneficial effects of the utility model: the utility model structure is simple, reasonable in design, during use, the square through hole of square plate is the outline of chip, square through hole is also the square contour on circuit board drawn by solder joint district, the utility model efficiently solves ball grid array packaged chip and circuit board covers weld pads problem of misalignment, by using ball grid array packaged chip erection welding fixture, can ensure that the chip point corresponding with circuit board aligns completely, the weld assembly after chip and welding circuit board reaches 100% qualified.
Accompanying drawing explanation
Fig. 1 is ball grid array packaged chip erection welding fixture front view, Fig. 2 is the top view of Fig. 1, Fig. 3 is first place's chip soldering contact of circuit board and the schematic diagram of second place's chip soldering contact, Fig. 4 is the main TV structure schematic diagram of a kind of chip and pad thereof, Fig. 5 is the top view of Fig. 4, Fig. 6 is the rearview of Fig. 5, Fig. 7 is the main TV structure schematic diagram of another kind of chip and pad thereof, Fig. 8 is the top view of Fig. 7, Fig. 9 is the rearview of Fig. 8, Figure 10 is the working state schematic representation utilizing ball grid array packaged chip erection welding Fixture assembly soldered circuit board of the present utility model and chip.
Detailed description of the invention
Detailed description of the invention one: composition graphs 1-Fig. 2 and Figure 10 explanation, the ball grid array packaged chip erection welding fixture of present embodiment is square plate 1, the middle part of square plate 1 is processed with square through hole 2, the size and shape of square through hole 2 mates with the outline of chip 3, the size and shape of square through hole 2 mates with the outline line 7 in the solder joint district of circuit board 4, the edge of square plate 1 is processed with a manhole 5, the center of circle of manhole 5 is positioned on the diagonal at an angle in plate face, and the thickness of square plate 1 is 2mm ~ 4mm.
The circle hole shape through hole of present embodiment, for ensureing that chip and circuit board direction is on request welded.Shape and size and the chip form size of the square through hole of present embodiment match, and match with the appearance profile line 7 that welding circuit board assembling place (solder joint district) is drawn.The thickness of the square plate of present embodiment selects 2mm ~ 4mm, can meet the circuit board of different-thickness and the erection welding needs of chip.
Detailed description of the invention two: composition graphs 1 illustrates, described in present embodiment, square plate 1 is square plate.Setting like this, meets the needs of circuit board outline location and circuit board and chip erection welding, meets design requirement.Other is identical with detailed description of the invention one.
Detailed description of the invention three: composition graphs 1 illustrates, described in present embodiment, square through hole 2 is square through-hole.Setting like this, meets the needs of chip outline location and circuit board and chip erection welding, meets design requirement.Other is identical with detailed description of the invention one or two.
Detailed description of the invention four: composition graphs 1 illustrates, described in present embodiment, the thickness of square plate 1 is 3mm.Setting like this, meets the needs of circuit board location.Other is identical with detailed description of the invention three.
The course of work: composition graphs 1-Figure 10 explanation, wherein, chip soldering contact 4-1 on circuit board, chip soldering contact 3-1, manhole 5 in Figure 10 and welding direction mark 6 consistent, represent chip, circuit board and weld jig and must be in same position, guarantee chip and circuit board exact connect ion at welding tense marker.When ball grid array packaged chip erection welding fixture uses, be placed on circuit board 4 side to be welded (in Figure 10, circuit board inserts the back side of square plate according to the straight direction of arrow, also namely chips on circuit boards pad is arranged in the front (paper opposing face) of chip 3), the outline line of the square through hole 2 of square plate 1 aligns with circuit board 4 chip place to be welded outline line, then bond together with circuit board 4 with the square plate 1 of adhesive tape by ball grid array packaged chip erection welding fixture, the square plate 1 of ball grid array packaged chip erection welding fixture and adhesive tape with the use of, with adhesive tape, the square plate 1 of ball grid array packaged chip erection welding fixture is pasted on the circuit board 4 during use, the profile of the square through hole 2 of the square plate 1 of ball grid array packaged chip erection welding fixture need be alignd with the square contour line 7 that circuit board 4 is drawn during stickup, chip 3 mates with the size and shape of square through hole 5 and arranges, chip 3 to be welded is put into the square through hole 5 of ball grid array packaged chip erection welding fixture square plate, with air-heater, chip 3 is heated, when the temperature of chip 3 is elevated to 300 ~ 350 DEG C, stop heating, to be cooled after normal temperature, adhesive tape is removed, ball grid array packaged chip erection welding fixture is removed from chip 3, completes welding of chip 3 and circuit board 4.
Claims (4)
1. ball grid array packaged chip erection welding fixture, it is characterized in that: described fixture is square plate (1), the middle part of square plate (1) is processed with square through hole (2), the size and shape of square through hole (2) mates with the outline of chip (3), the size and shape of square through hole (2) mates with the outline line (7) in the solder joint district of circuit board (4), the edge of square plate (1) is processed with a manhole (5), the center of circle of manhole (5) is positioned on the diagonal at an angle in plate face, the thickness of square plate (1) is 2mm ~ 4mm.
2. ball grid array packaged chip erection welding fixture according to claim 1, is characterized in that: described square plate (1) is square plate.
3. ball grid array packaged chip erection welding fixture according to claim 1 and 2, is characterized in that: described square through hole (2) is square through-hole.
4. ball grid array packaged chip erection welding fixture according to claim 3, is characterized in that: the thickness of described square plate (1) is 3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520207676.8U CN204673196U (en) | 2015-04-09 | 2015-04-09 | Ball grid array packaged chip erection welding fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520207676.8U CN204673196U (en) | 2015-04-09 | 2015-04-09 | Ball grid array packaged chip erection welding fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204673196U true CN204673196U (en) | 2015-09-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520207676.8U Active CN204673196U (en) | 2015-04-09 | 2015-04-09 | Ball grid array packaged chip erection welding fixture |
Country Status (1)
| Country | Link |
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| CN (1) | CN204673196U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105414700A (en) * | 2016-01-17 | 2016-03-23 | 孙晓玮 | Electronic component welding clamp of circuit board |
| CN106141529A (en) * | 2015-04-09 | 2016-11-23 | 哈尔滨建成集团有限公司 | Ball grid array encapsulation chip erection welding fixture |
-
2015
- 2015-04-09 CN CN201520207676.8U patent/CN204673196U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106141529A (en) * | 2015-04-09 | 2016-11-23 | 哈尔滨建成集团有限公司 | Ball grid array encapsulation chip erection welding fixture |
| CN105414700A (en) * | 2016-01-17 | 2016-03-23 | 孙晓玮 | Electronic component welding clamp of circuit board |
| CN105414700B (en) * | 2016-01-17 | 2018-03-23 | 青龙满族自治县泰龙电子科技有限公司 | A kind of circuit board electronic component weld jig |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |