CN113904191A - Tin coating tool and tin coating method for connector between gold-plated pin boards - Google Patents
Tin coating tool and tin coating method for connector between gold-plated pin boards Download PDFInfo
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- CN113904191A CN113904191A CN202111205626.2A CN202111205626A CN113904191A CN 113904191 A CN113904191 A CN 113904191A CN 202111205626 A CN202111205626 A CN 202111205626A CN 113904191 A CN113904191 A CN 113904191A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
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Abstract
A gold and tin removing tool for a connector between gold-plated pin boards comprises a body protection piece, a pin protection piece, a protection shell, an opposite insertion part, a first array opposite insertion hole and a first positioning hole; the pin protection piece is provided with a plug-in area, a positioning area and a tin flow receiving area; the opposite-inserting area is provided with a second array opposite-inserting hole, the positioning area is provided with a second positioning hole, and the tin flow receiving area is positioned on one side of the opposite-inserting area. The tin coating step is as follows: inserting a workpiece to be tinned on the first array type opposite insertion holes and the first positioning holes; connecting a contact pin protection piece with a workpiece to be tin-plated; starting a tin flow generating device, moving a workpiece to be tin-plated, and enabling soldering tin to wrap a region to be gold-removed and tin-plated; and taking out the pin protection piece and the body protection piece on the workpiece, and cleaning to remove gold and tin. The connector provided by the invention is provided with the protection piece of the connector body and the protection piece of the contact pin, so that the pollution to gold-plated areas in other areas is effectively avoided when gold and tin are removed. This frock, reasonable in design, the simple operation, it is efficient to ward off tin, and it is high to ward off tin quality.
Description
Technical Field
The invention belongs to the technical field of assembly and welding of electronic and electrical product components, and relates to a tin plating tool and a tin plating method for a connector between gold-plated pin boards.
Background
The gold plating layer has strong oxidation resistance, so gold is generally adopted as the surface plating layer of the connector lead wire between boards, the gold plated connector lead wire between boards is welded by tin solder to form a welding spot, and the gold plated lead wire is not subjected to gold removal, so that the welding spot is easy to generate a gold brittleness phenomenon, and the reliability of a product is influenced. In general operation, the gold-plated lead wire can not be directly welded, and needs to be tin-plated twice to achieve the purpose of removing gold. The gold and tin removing part of the connector between boards is only 3 mm-5 mm away from the root of the body according to different board thicknesses, and other opposite insertion parts are strictly prevented from being stained with tin. The temperature resistance of the connector body between boards is low, the temperature resistance time is short, the highest temperature born by different materials is different, and the temperature resistance range of the common connector between boards is 120-240 ℃.
At present, aiming at the structural characteristics and the tin plating process requirements of the connectors between boards, the tin plating modes of the connectors between boards are mainly divided into two types: one is manual iron tin coating; the other type is to protect the electric contact part of the gold-plated pin and then immerse the pin into a tin pot to remove gold and tin. However, in the former, the electric soldering iron is easy to touch the gold-plated part, so that the opposite-insertion part of the contact pin is stained with tin, the device is scrapped, and the efficiency is low. The latter uses various materials for protecting the electrical contact portion of the gold-plated pin, such as: preparing glue solution, a heat-shrinkable sleeve and the like. The protection of protection glue solution or sleeve pipe etc. and the operation of deprotection process consume a large amount of time, lead to inefficiency, and need rely on artifical handheld device to soak the tin pot in actual operation, the connector plastic housing is heated for a long time and has bulge, deformation risk, does not possess the operability.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a tin plating tool and a tin plating method for a connector among gold-plated pins, which realize effective gold and tin plating removal of connector pins among boards, have high efficiency, good consistency and high yield, and effectively solve the problems of bulging, deformation, device scrapping and the like caused by long-time heating of a plastic shell of the connector among boards.
The invention is realized by the following technical scheme:
a gold and tin removing tool for a connector between gold-plated pin boards comprises a body protection piece and a contact pin protection piece;
the connector between the gold-plated pin boards comprises a contact pin and a positioning pin; the body protection piece comprises a protection shell and a plug-in part, wherein the protection shell is formed by sequentially connecting and enclosing protection surfaces, and the plug-in part is fixedly connected to one end of the protection shell; the opposite insertion part is provided with a first array type opposite insertion hole corresponding to the contact pin and a first positioning hole corresponding to the positioning pin;
the pin protection piece is provided with a plug-in area, a positioning area and a tin flow receiving area; the opposite-inserting area is provided with a second array type opposite-inserting hole corresponding to the contact pin, the positioning area is provided with a second positioning hole corresponding to the positioning pin, and the tin flow receiving area is located on one side of the opposite-inserting area.
Preferably, one side of at least one positioning area is provided with a limiting part.
Preferably, the diameter of the first array of pairs of jacks is greater than the diameter of the second array of pairs of jacks.
Preferably, the diameter of the first array to the receptacle is larger than that of the pinLarge diameter0.2mm～0.4mm；
Preferably, the diameter of the second array-type opposite insertion holes is 0.05 mm-0.1 mm larger than that of the pins.
Preferably, the thickness of the pin protector is 3mm to 5 mm.
Preferably, the tin flow receiving area is provided with a tin spraying starting position and a tin spraying ending position; the tin spraying starting position and the tin spraying stopping position are respectively positioned at two ends of the opposite insertion area at the same side; and the vertical distance between the tin spraying starting position and the tin spraying ending position and the opposite insertion area is equal.
Preferably, the body protector and/or the pin protector are made of any one of polytetrafluoroethylene, artificial stone and Rogers plate.
A tin coating method for a connector between gold-plated pin boards, which takes a bunch-shaped tin flow generating device as a molten tin generating device, and tin coating is carried out through the bunch-shaped tin flow generating device and the tin coating tool set forth in any one of claims 1-8 by the following steps:
s1: inserting a contact pin and a positioning pin to be tin-plated on a first array type opposite insertion hole and a first positioning hole of a body protection piece respectively, pushing the body protection piece to the root of the contact pin, and enabling a protection shell of the body protection piece to surround a body of a connector between gold-plated pin boards to be tin-plated;
s2: connecting the pin protection piece with the connector between the gold-plated pin plates to be subjected to tin plating after the step S1 through the second array type opposite insertion holes of the opposite insertion area and the second positioning holes of the positioning area, and enabling the area between the pin protection piece and the body protection piece in the step S1 to be a gold-to-be-removed tin plating area;
s3: opening the bunched tin flow generating device, adjusting the connector to be tin-plated after the step S2 is completed, so that the tin flow generated by the bunched tin flow generating device falls on the tin flow receiving area, and the soldering tin falling on the tin flow receiving area is transferred to the area to be gold-removed and tin-plated in the step S2 along the pin protection piece;
s4: moving the connector between the gold-plated pin plates to be subjected to tin enameling in the step S3 to enable the soldering tin to wrap the region to be subjected to gold and tin enameling of the contact pin in the step S2;
s5: repeating the processes of the steps S3-S4 at least once, so that the bunched tin flow generating device is closed after the gold-removed tin-lined area is coated by the soldering tin;
s6: and after the step S5 is completed, sequentially taking out the pin protection piece and the body protection piece on the gold-plated pin-to-board connector after gold tin plating is removed, cleaning the plate connector after gold tin plating is removed, and completing gold tin plating removal of the gold-plated pin-to-board connector.
Preferably, in the step S3, the connector between the gold-plated pin boards after the step S2 is adjusted so that an included angle between a side of the pin protector opposite to the bundled tin flow generator and the horizontal plane is 75 ° to 90 °.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a gold-removing tin-coating tool for a connector among gold-plated pin boards, which is provided with a protection piece of a connector body and a protection piece of a contact pin by taking the connector among the gold-plated pin boards as a design basis, has reasonable design, and effectively avoids the problems of pollution to gold-plated areas of other areas, bulging, deformation, scrapping of devices and the like caused by long-term heating of the connector when a molten tin flow is adopted to wash the gold-coated tin part of the connector.
Furthermore, the diameter of the first array type opposite insertion holes is larger than that of the second array type opposite insertion holes, so that the disassembly of the body protection piece after gold removal and tin coating is completed is facilitated.
Further, the diameter ratio of the first array to the jack is 0.2mm ~ 0.4mm bigger than the diameter of the connector contact pin, plays the effect of protection to the connector body on the one hand, makes it avoid removing the pollution and the process of being heated of gold and boring tin process, is favorable to accomplishing simultaneously and removes the gold and bores the dismantlement of tin back, body protection piece.
Furthermore, the diameter of the second array type opposite jack is 0.05 mm-0.1 mm larger than that of the connector pin, and the size can effectively protect the gold-plated pins in the corresponding area from being polluted while realizing the smooth plugging and unplugging of the pin protection piece.
Furthermore, the thickness of the contact pin protection piece is 3 mm-5 mm, so that the stability of the device after the contact pin protection piece and the to-be-processed board connector are connected can be effectively ensured.
Furthermore, the tin flow receiving area is provided with a tin spraying starting position and a tin spraying stopping position, and the tin spraying starting position and the tin spraying stopping position are respectively positioned at two ends of the opposite insertion area on the same side; the tin spraying starting position and the tin spraying stopping position are equal to the vertical distance of the opposite insertion area, the tin spraying process is controlled, the consistency of products is improved, and the thickness of tin coating on the surface of the contact pin is consistent.
Furthermore, the body protection piece and/or the contact pin protection piece are made of any one of polytetrafluoroethylene, artificial stone and Rogers plates, and the material can resist high temperature and has good protection effect on a plate connector to be subjected to gold and tin removal.
The invention also provides a tin plating method of the connector between the gold-plated pin boards, and the method is based on the tin plating tool, is convenient to operate, high in tin plating efficiency and high in tin plating quality, and improves the welding reliability of products.
Further, in the step S3, the board-to-board connector after the step S2 is adjusted so that an included angle between a side of the pin protector opposite to the bundled tin flow generating device and the horizontal plane is 75 to 90 degrees, thereby effectively ensuring that the solder falling on the tin flow receiving area is transferred to an area to be gold-plated and tin-plated along the pin protector under the action of gravity.
Drawings
FIG. 1 is an enlarged view of the body protector and a portion thereof;
FIG. 2 is a diagram of an inter-board connector to be gold and tin plated;
FIG. 3 is a schematic view of a pin protector according to the present invention;
FIG. 4 is a top view of the pin protector of the present invention;
FIG. 5 is a schematic view of the connection between the body protector and the board-to-board connector to be deplated with gold and tin according to the present invention;
FIG. 6 is a schematic view of the connection between the body protector and the pin protector of the present invention and the board-to-board connector to be deplated with gold and tin;
FIG. 7 is a schematic structural diagram of a gold-removing tin-coating process in the present invention;
FIG. 8 is a schematic diagram showing the moving direction of the connector between tin-enameled plates to be gold-removed and the moving direction of the tin flow in the invention.
In the figure: 1. the body protection piece, 10, protection casing, 11, to inserting portion, 110, first array to the jack, 111, first locating hole, 2, contact pin protection piece, 20, to inserting district, 21, locating area, 22, tin flow receiving area, 200, second array to the jack, 210, second locating hole, 23, spacing part, 3, inter-plate connector, 30, connector contact pin, 31, connector locating pin, 4, restraint form tin flow generating device.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
A gold-plated and tin-plated tool for a connector between gold-plated pin boards comprises a body protection piece 1 and a contact pin protection piece 2; the gold-plated pin board-to-board connector 3 comprises a pin 30 and a positioning pin 31;
as shown in fig. 1 and 2, the body protection member 1 comprises a protection housing 10 and a plug-in part 11, wherein the protection housing 10 is formed by sequentially connecting and enclosing protection surfaces, and the plug-in part is fixedly connected to one end of the protection housing 10; the opposite insertion part 11 is provided with a first array-type opposite insertion hole 110 corresponding to the pin 30 and a first positioning hole 111 corresponding to the positioning pin 31. The diameter of the first array pair of receptacles 110 is 0.2mm to 0.4mm larger than the diameter of the connector pins 30. The connector has two positioning pins, and thus, a first positioning hole 111 is formed at each of both sides of the first array pair of insertion holes 110 in the length direction. The dimensions of the inner cavity of the protective housing 10 match the external dimensions of the connector body.
As shown in fig. 3 and 4, the pin protector 2 is provided with a mating region 20, a positioning region 21 and a tin flow receiving region 22; the opposite insertion area 20 is provided with a second array opposite insertion holes 200 corresponding to the pins 30, the positioning area 21 is provided with second positioning holes 210 corresponding to the positioning pins 31, and the diameter of the second array opposite insertion holes 200 is 0.05 mm-0.1 mm larger than that of the pins 30. The tin flow receiving area 22 is located on one side of the counter insertion area 20. The thickness of the pin protection piece is 3 mm-5 mm. There are two positioning pins on the connector, so that a second positioning hole 210 is respectively disposed at both sides of the second array-type counter jack 200 in the length direction. One side of at least one location area 21 is equipped with spacing part 23, can fix a position fast and wait to go gold enameling region. The thickness of the limiting part 23 is consistent with the height of an area to be subjected to gold and tin removing on the contact pin, namely the thickness of the printed board to be soldered is related, and the thickness of the limiting part 23 is 1.5-2.5 mm larger than that of the printed board generally. In this embodiment, two limiting members are disposed at two ends of the extension line formed after the two second positioning holes 210 are connected.
As shown in fig. 3 to 8, the orthogonal projection of the board-to-board connector on the pin protector is located inside the outline of the pin protector, and the distribution of the opposite insertion area 20, the positioning area 21, the solder flow receiving area 22 and the limiting member 23 on the pin protector 2 can be referred to the dimensions as shown in fig. 4: a1 is more than or equal to 30mm, a2 is more than or equal to 10mm, and c1 is more than or equal to c2 and more than or equal to 10 mm. Where a1 is the width of the solder flow receiving area 22, a2 is the distance from the longitudinal direction of the mating area 20 to the length side of the pin protector 2, and c1 and c2 are the distances from the stop members 23 to the width side of the pin protector 2, respectively. The diameter of the first array-type counter insertion hole 110 is larger than that of the second array-type counter insertion hole 200, because the diameter of the pin becomes thicker after tin coating, and the diameter of the first array-type counter insertion hole 110 is too small, the body protector 1 is not easy to be taken down after tin coating of the pin. The body protection piece 1 adopts polytetrafluoroethylene, can also adopt arbitrary one kind of material of high temperature resistance such as rostone and Rogers 'panel simultaneously, and the material of contact pin protection piece 2 also can be the material of arbitrary difference in polytetrafluoroethylene, rostone and the Rogers' panel in addition, and this material heat transfer performance is poor and can bear 300 ℃ high temperature.
The tin flow receiving area 22 is provided with a tin spraying starting position and a tin spraying stopping position; the tin spraying starting position and the tin spraying stopping position are respectively positioned at two ends of the opposite insertion area 20 at the same side; the tin spraying start position and the tin spraying end position are equal to the vertical distance of the opposite insertion area 20. The vertical distance from the connecting line of the tin spraying starting position and the tin spraying ending position to the opposite insertion area is 5-20 mm.
A tin coating method for a connector between gold-plated pin boards takes a beam-shaped tin flow generating device 4 as a molten tin generating device, and tin coating is carried out through the beam-shaped tin flow generating device and a tin coating tool in the invention through the following steps:
s1: as shown in fig. 5, the pins 30 and the positioning pins 31 to be tin-plated are respectively inserted into the first array-type opposite insertion holes 110 and the first positioning holes 111 of the body protection member 1, and the body protection member 1 is pushed to the root of the pins, so that the protection shell 10 of the body protection member 1 encloses the body of the board-to-board connector 3 to be tin-plated;
s2: as shown in fig. 6, the pin protectors 2 are connected to the connectors 3 between the boards to be tin-plated after the step S1 is completed through the second array-type pair of insertion holes 200 of the insertion region 20 and the second positioning holes 210 of the positioning region 21, so that the region between the pin protectors 2 and the body protector 1 in the step S1 is the region to be gold-plated and tin-plated; in this embodiment, the two position-limiting parts 23 on the pin protector 2 are abutted to the body protector 1, so that the position where gold and tin are required to be removed can be quickly positioned, and the operation efficiency is improved.
S3: as shown in FIG. 7, the bundled tin flow generating device is turned on to form a bundled tin flow with a specific shape at the tin spraying opening, the bundled tin flow with different widths can be generated by changing the size of the tin spraying opening, and the solder material can be SnPb or SnPbAg or the like. After the bunched tin flow is stable, the connector 3 between the plates to be enameled after the step S2 is adjusted, so that the tin flow generated by the bunched tin flow generating device falls on the tin flow receiving area 22, in this embodiment, the tin flow can fall on the tin spraying start position in the tin flow receiving area 22. Meanwhile, the adjusting process enables the included angle between the side, opposite to the bunched tin flow generating device, of the contact pin protecting piece 2 and the horizontal to be 75-90 degrees, the soldering tin falling on the tin flow receiving area 22 is guaranteed to be transferred to the area to be subjected to gold and tin removing in the step S2 along the contact pin protecting piece 2 under the action of gravity, the distance between the tin spraying starting position and the opposite insertion area 20 is 5-20 mm, and the thickness of the soldering tin coated on the contact pin can be effectively controlled through the distance.
S4: as shown in fig. 8, the inter-board connector 3 to be tin-plated in step S3 is moved along the extending line direction connecting the start position of tin spraying to the end position of tin spraying, i.e. the horizontal u direction, and the solder falling on the inter-board connector is moved under the action of gravity, i.e. the v direction, to the region to be gold-plated of the pin, so that the solder wraps the region to be gold-plated of the pin in step S2. Wherein the moving speed of the connector 3 to be tinned is 5-40 mm/s.
S5: repeating the processes of the steps S3-S4 at least once, so that the bunched tin flow generating device is closed after the gold-removed tin-lined area is coated by the soldering tin; in addition, before coating the soldering tin, the soldering flux needs to be uniformly brushed on the part to be enameled of the connector, and the brushing tool can be an oil painting brush, a soft brush and the like.
S6: and after the step S5 is completed, sequentially taking out the pin protection piece 2 and the body protection piece 1 on the gold tin-plated rear plate connector 3, cleaning the gold tin-plated rear plate connector, and completing gold tin plating removal of the plate connector 3.
Another embodiment is a printed circuit board 2mm thick, the connector used for soldering is 100 cores, and the diameter of the pin is 0.76 mm. Design processing body protection piece and connector contact pin protection piece in advance, the rostone material is chooseed for use to the body protection piece, body protection piece inner chamber size and connector body external dimension phase-match, and the body protection piece is to jack array opening and connector contact pin range position keep unanimous, and the opening diameter is 1.0 mm. Connector contact pin protection piece selects for use the Rogers panel, and contact pin protection piece thickness design is 3mm, and the panel enlarges the size and does: a 1-30 mm, a 2-15 mm, and C1-C2-10 mm. The array opening of the jack and the array position of the connector pins are kept consistent, and the diameter of the opening is 0.82 mm. The spacing platform of connector contact pin protection piece bonds on the panel, and the size height is 4 mm. And then, assembling a body protection piece and a connector pin protection piece on the connector according to the schematic diagram shown in fig. 6, wherein the body protection piece is pushed to the heel part of the connector, the whole connector body is wrapped by the inner wall of the protection shell, the limiting table of the connector pin protection piece is contacted with the body protection piece, the part to be subjected to tin coating of the pin is exposed, and the height is 4 mm.
The solder material used for tin coating is Sn63Pb37, the bunch-shaped tin flow generating device is opened, the size of a tin spraying opening is 4mm multiplied by 4mm square, and the bunch-shaped tin flow with a specific shape is formed at the tin spraying opening. And uniformly brushing the soldering flux on the part to be tin-plated of the connector pin. After the bunched tin flow is stabilized, the protected connector is held by hand, and the pin protection tool panel is adjusted to form an angle of about 80 degrees with the horizontal plane and is close to the tin spraying opening, as shown in fig. 7. The bunched tin flow falls on the panel, the position of the panel is adjusted, the bunched tin flow just falls at the initial position of the panel of the contact pin protection tool within the range of 5 mm-20 mm above the contact pin, and the tin flow flows downwards along the protection tool. And then keeping the angle of the connector, slowly and uniformly moving the connector along the direction parallel to the connector at the speed of 5-15 mm/s, preferably 10mm/s, flushing the part of the connector to be tin-plated by using tin flow until the connector moves to the end, and finishing gold removal and tin plating. And taking out the connector pin protection tool and the body protection cover in sequence, cleaning the connector, closing the bunched tin flow generating device, and finishing tin coating work. The tin coating effect is checked under a microscope, gold removal is finished at the part of the connector to be subjected to tin coating, and the connector body at the root of the contact pin has no phenomena of bubbling, color change and the like. The surface solder of the contact pin is bright and uniform, the opposite insertion part of the contact pin is free from tin, and the contact pin can be easily inserted into the corresponding through hole of the printed board through on-site verification.
The tin plating tool and the tin plating method for the connector between the gold-plated pin plates, provided by the invention, have the advantages that the tin blocking device is used for protecting the gold-plated contact pins, the bunched tin flow is manufactured, the flowing molten tin flow is used for washing the welding part of the connector, and then a mode of removing gold and tin plating is completed. Compared with the existing tin coating mode, the tin coating method avoids the phenomenon that the opposite insertion part of the contact pin is stained with tin to cause device scrap due to the fact that a manual iron touches the gold-plated part when coating tin; only the tin-coating part is contacted with a heat source, so that the phenomenon that the plastic package shell of the device is bulged and deformed due to heat concentration when the contact pin is immersed into a tin pot for tin coating after protection is avoided, and the device is scrapped. The connector pin protection piece can be used for preventing the diffusion of soldering tin and controlling the tin coating height; the tin coating time of the welding part is controlled by controlling the moving speed of the connector, the technological parameters are controllable, and the consistency is good.
Claims (10)
1. A gold and tin removing tool for a connector between gold-plated pin boards is characterized by comprising a body protection piece (1) and a contact pin protection piece (2);
the gold-plated pin board-to-board connector (3) comprises a pin (30) and a positioning pin (31); the body protection piece (1) comprises a protection shell (10) and an opposite insertion part (11), wherein the protection shell (10) is formed by sequentially connecting and enclosing protection surfaces, and the opposite insertion part is fixedly connected to one end of the protection shell (10); a first array type opposite insertion hole (110) corresponding to the inserting pin (30) and a first positioning hole (111) corresponding to the positioning pin (31) are formed in the opposite insertion part (11);
the pin protection piece (2) is provided with a plug-in area (20), a positioning area (21) and a tin flow receiving area (22); the opposite insertion area (20) is provided with a second array type opposite insertion hole (200) corresponding to the insertion pin (30), the positioning area (21) is provided with a second positioning hole (210) corresponding to the positioning pin (31), and the tin flow receiving area (22) is located on one side of the opposite insertion area (20).
2. The tin-coating tool for the gold-plated pin board-to-board connector is characterized in that a limiting part (23) is arranged on one side of at least one positioning area (21).
3. The tin-coating tool for gold-plated pin to board connectors as claimed in claim 1, wherein the diameter of the first array-type counter-insertion holes (110) is larger than the diameter of the second array-type counter-insertion holes (200).
4. The tin-coating tool for gold-plated pin board-to-board connectors as claimed in claim 1, wherein the diameter of the first array-type counter-insertion holes (110) is 0.2mm to 0.4mm larger than the diameter of the pins (30).
5. The tin-coating tool for the gold-plated pin board-to-board connector as recited in claim 1, wherein the diameter of the second array-type counter-insertion holes (200) is 0.05mm to 0.1mm larger than the diameter of the pins (30).
6. The tin coating tool for gold-plated pin board-to-board connectors as claimed in claim 1, wherein the thickness of the pin protector (2) is 3mm to 5 mm.
7. The tin coating tool for the gold-plated pin-to-board connector according to claim 1, wherein the tin flow receiving area (22) is provided with a tin spraying start position and a tin spraying end position; the tin spraying starting position and the tin spraying terminating position are respectively positioned at two ends of the opposite insertion area (20) at the same side; the vertical distance between the tin spraying starting position and the tin spraying ending position and the opposite insertion area (20) is equal.
8. The tin coating tool for the gold-plated pin-to-board connector according to claim 1, wherein the body protection member (1) and/or the pin protection member (2) are made of any one of polytetrafluoroethylene, artificial stone and Rogers plate.
9. A tin coating method for a connector between gold-plated pin boards, which uses a bunch-shaped tin flow generating device (4) as a molten tin generating device, and is characterized in that tin coating is carried out by the bunch-shaped tin flow generating device (4) and the tin coating tool of any one of claims 1 to 8 through the following steps:
s1: inserting a contact pin (30) to be tin-plated and a positioning pin (31) on a first array type opposite insertion hole (110) and a first positioning hole (111) of a body protection piece (1) respectively, pushing the body protection piece (1) to the root of the contact pin, and enabling a protection shell (10) of the body protection piece (1) to surround a body of a gold-plated pin inter-plate connector (3) to be tin-plated;
s2: connecting the pin protector (2) with the gold-plated pin inter-board connector (3) to be subjected to tin enameling after the step S1 through the second array type pair jack (200) of the opposite insertion area (20) and the second positioning hole (210) of the positioning area (21), and enabling an area between the pin protector (2) and the body protector (1) in the step S1 to be a gold and tin enameling area to be subjected to gold removal;
s3: opening the bunch-shaped tin flow generating device, adjusting the connector (3) to be enameled between the tin plates after the step S2 is completed, enabling the tin flow generated by the bunch-shaped tin flow generating device to fall on the tin flow receiving area (22), and transferring the soldering tin falling on the tin flow receiving area (22) to the area to be gold-removed and tin-enameled in the step S2 along the pin protection piece (2);
s4: moving the connector (3) between the gold-plated pin plates to be subjected to tin enameling in the step S3 to enable the soldering tin to wrap the region to be subjected to gold and tin enameling of the contact pin in the step S2;
s5: repeating the processes of the steps S3-S4 at least once, so that the bunched tin flow generating device is closed after the gold-removed tin-lined area is coated by the soldering tin;
s6: and after the step S5 is completed, sequentially taking out the pin protection piece (2) and the body protection piece (1) on the gold-plated pin-to-board connector (3) after gold and tin plating is removed, cleaning the plate connector after gold and tin plating is removed, and completing gold and tin plating removal of the gold-plated pin-to-board connector (3).
10. The method of claim 9, wherein the connector (3) after completion of step S2 is adjusted in step S3 such that an angle between a side of the pin protector (2) opposite to the bundled tin flow generator and a horizontal plane is 75 ° to 90 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111205626.2A CN113904191B (en) | 2021-10-15 | 2021-10-15 | Tin lining tool and tin lining method for connector between gold-plated pin plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111205626.2A CN113904191B (en) | 2021-10-15 | 2021-10-15 | Tin lining tool and tin lining method for connector between gold-plated pin plates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113904191A true CN113904191A (en) | 2022-01-07 |
| CN113904191B CN113904191B (en) | 2023-06-06 |
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| CN113904191B (en) | 2023-06-06 |
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