CN105277863A - Aging device for power amplifier - Google Patents
Aging device for power amplifier Download PDFInfo
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- CN105277863A CN105277863A CN201410341436.7A CN201410341436A CN105277863A CN 105277863 A CN105277863 A CN 105277863A CN 201410341436 A CN201410341436 A CN 201410341436A CN 105277863 A CN105277863 A CN 105277863A
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Abstract
The invention discloses an aging device for a power amplifier. The device comprises an aging circuit board and an aging circuit. The aging circuit board comprises a plug card, an aging plate, an aging clamp and a test end. The aging clamp is positioned on the aging plate, and is connected to the plug card through a wire on the aging plate. A to-be-aging power amplifier is connected to the aging circuit by means of the aging clamp. The aging clamp comprises a lower pedestal, an upper pedestal, pins and a plug pin. When the upper and lower pedestals are assembled, the pins in a groove of the lower pedestal are closed to press the lead wire of the to-be-aging power amplifier. The plug pin is welded below the pins, and is connected to the wire on the aging plate. An external signal generator generates signals, and the signals are loaded to the to-be-aging power amplifier and output by the to-be-aging power amplifier after undergoing current amplification. The output signals are transmitted to the test end via the wire on the aging plate, and then the to-be-aging power amplifier is monitored. The problem of junction temperature control when a power amplifier is aging and the problem of damage to a coating of a lead wire due to plugging and unplugging are solved, and the aging screening efficiency is improved.
Description
Technical field
The invention belongs to power amplifier field, particularly a kind of aging equipment of semiconductor power amplifier.
Background technology
Aging is the fundamental test of electronic devices and components reliability screening, its objective is to reject because manufacturing process controls the improper defective components and parts of the tool of starting material introducing defect or use own.In order to make components and parts before use by defective screening of electric components out, general needs tests in high temperature, high pressure, the pilot scale of high electric current environment, and the components and parts making the life-span shorter show in advance in aging test.General semiconductor devices, usually use hot test to carry out aging, namely the junction temperature of control device chip is in certain temperature range.
Semiconductor power device, its junction temperature is often wayward, and time aging, power is large, easily causes device temperature too high, may burn device.At present, the aging mostly of power amplifier are with reference to product manual design circuit, do not consider actual service condition.Such as, disclose a kind of aging circuit arrangement of switch triode in Chinese utility model patent instructions CN201340448Y, the aging circuit of power device is designed, but it devises aging circuit, and do not consider the junction temperature of device, accurately can not control junction temperature in actual applications, aging differing produces a desired effect surely.
And for the power device of the encapsulated types such as TO-8, not only junction temperature is wayward, and not only the lead-in wire of device long but also thin, when carrying out aging, if device wire jig Design is improper, very easily damages lead-in wire coating when device carries out plug.Such as Chinese utility model patent instructions CN201138360Y discloses a kind of aging equipment, adds the quantity of aging components and parts, and adds the life-span of fixture, but it does not solve the problem of component down-lead coating damage.
Therefore, to a kind of aging equipment of the device layout of the encapsulated types such as TO-8, junction temperature control problem and the lead-in wire coating damage problem of the encapsulated type components and parts such as TO-8 need be solved.
Summary of the invention
For above-mentioned prior art, the object of the present invention is to provide a kind of power amplifier aging equipment, for overcoming in prior art, wayward for junction temperature in the power amplifier aging test of the encapsulated types such as TO-8, component down-lead coating easily damages, ageing efficiency is low, can not meet the shortcomings such as screening requirement in enormous quantities.
In order to achieve the above object, the present invention by the following technical solutions.
A kind of power amplifier aging equipment of the present invention, this device comprises aging circuit plate and aging circuit;
Described aging circuit plate comprises: for connect the plug-in card of external power source, the burn-in board be made up of insulating material, for load power amplifier to be aging aging clamp, for carrying out monitoring and test end and the wiring for interface unit to power amplifier to be aging; Plug-in card is positioned at the upper end of burn-in board, and aging clamp is assemblied in burn-in board, and aging clamp is connected with plug-in card and test lead respectively by the wiring in burn-in board, and test lead is positioned at burn-in board lower end;
Described aging circuit comprises: resistance R1, R2, R3, R4, R5, R
l, electric capacity C1, C2, C3; One end of resistance R1 is connected with external pulse generator, and the other end connects power amplifier reverse input end to be aging; Positive supply V
+with negative supply V
-for power amplifier to be aging is powered, positive supply V
+connect with regulating resistance R4, be connected with positive power source terminal current controling end with power amplifier positive power source terminal to be aging; Negative supply V
-connect with regulating resistance R5, be connected with negative power end current controling end with power amplifier negative power end to be aging; Filter capacitor C1 one end connects power amplifier positive power source terminal to be aging, other end ground connection; Electricity filtering capacity C2 one end connects power amplifier negative supply to be aging, other end ground connection; One end ground connection of resistance R3, the other end connects power amplifier in-phase input end to be aging; Feedback resistance R2 one end connects power amplifier reverse input end to be aging, and the other end connects power amplifier output to be aging; Electric capacity C3 one end connects power amplifier compensation end to be aging, and the other end connects power amplifier output to be aging; Resistance R
lone end connects power amplifier output to be aging, other end ground connection.
Described aging clamp comprises bottom base, top base, pin and contact pin; Bottom base is boss shape structure, comprises bottom base core body, bottom base base plate and clamp; Bottom base core body is connected on bottom base base plate, and bottom base core body is cube structure, and its four sides are processed with vertical groove respectively, and groove runs through upper bottom surface and the bottom surface of bottom base core body, and bottom base base plate is each side processed with a pair clamp; Top base is the cube-shaped structure of hollow, and the shape of through holes of the centre of top base is rectangle, and each limit in rectangular through-hole cross section is parallel with each limit of the top base being in same cross section, and rectangular through-hole size is corresponding to bottom base core body; Four sides are processed with fitting recess to rectangular through-hole respectively, and fitting recess is blind hole, and top base bottom surface is run through in its one end, but does not run through top base upper bottom surface, and blind via bottom is outward-dipping, and fitting recess is corresponding with the groove of bottom base core body side; Top base left and right lateral surface is processed with a pair slot respectively, and slot upper end is processed with V-shaped groove, corresponding to the clamp of the bottom base base plate left and right sides; In bottom base and top base assembling process, when top base presses down, the upper bottom surface of bottom base base plate contacts with the bottom surface of top base, the upper bottom surface of top base is concordant with the upper bottom surface of bottom base core body, be positioned at the clamp of the bottom base base plate left and right sides, meeting automatic clamping lives in the slot upper end V-shaped groove of pedestal lateral surface; Pin is arranged in the groove of bottom base side, is welded with contact pin bottom pin, and contact pin exposes the bottom surface of bottom base, is connected with the wiring in burn-in board.
In described aging circuit, resistance R1 Standard resistance range is 4.7 ± 0.5K Ω, and resistance R2 Standard resistance range is 10.0 ± 0.5K Ω, and resistance R3 Standard resistance range is 3.0 ± 0.5K Ω, and resistance R4 Standard resistance range is 50 ± 10 Ω, and resistance R5 Standard resistance range is 50 ± 10 Ω, resistance R
lstandard resistance range is 100 ± 10 Ω, and the span of the value of electric capacity C1 to be the value of 0.1 μ F, electric capacity C2 be 0.1 μ F, electric capacity C3 is 680 ± 50pF.
Bottom base and the top base of described aging clamp are made up of insulating material.
The quantity basis power amplifier pin count to be aging of each side of groove of described bottom base is determined.
The quantity of each side of groove of described bottom base is 3 or 4.
The pin of described aging clamp is U-shaped structure, be made up of elastic conducting material, there is external part its side, pin is arranged in the groove of bottom base side, in bottom base and top base assembling process, the fitting recess of top base can compress the external part of pin, and pin is closed gradually, clamps power amplifier to be aging lead-in wire.
The contact pin of described aging clamp is made up of conductive material.
According to quantity multiple installation in parallel of power amplifier to be aging, for each Pin pin lead-in wire of power amplifier to be aging, aging clamp there is corresponding pin and contacts with this Pin pin in described aging clamp.
The input signal that external signal generator produces, load on power amplifier reverse input end to be aging, carry out after Current amplifier through power amplifier to be aging, exported by power amplifier output, output to test lead by the wiring in burn-in board again, the ageing process of power amplifier to be aging is monitored.
The beneficial effect that the technical scheme that the embodiment of the present invention provides is brought is:
(1) by carrying out aging test to the power amplifier of the encapsulated types such as TO-8, it is 115 DEG C ~ 125 DEG C that calculating monitoring obtains aging junction temperature, meet the aging requirement to junction temperature of semiconductor devices, therefore, aging circuit of the present invention, meets the control overflow to semiconductor devices junction temperature in screening.
(2) jack on this aging test fixture belongs to non-immediate plug type, the lead-in wire of device is clamped by U-shaped pin, reduce the damage of plug to lead-in wire coating, and this mode reduces the set-up time when installing device, grip size is suitable with device size, multiple fixture can be settled on aging circuit plate, substantially increase the efficiency of burn-in screen.
Accompanying drawing explanation
Fig. 1 is the aging circuit plate structure schematic diagram of a kind of power amplifier aging equipment of the present invention;
Fig. 2 is the aging test fixture stereographic map of a kind of power amplifier aging equipment of the present invention;
Fig. 3 is the fixture diagrammatic cross-section of the aging test fixture of a kind of power amplifier aging equipment of the present invention when closing;
Fig. 4 is the aging circuit figure of a kind of power amplifier aging equipment of the present invention.
In figure: 1-plug-in card, 2-burn-in board, 3-aging clamp, 4-test lead, 5-power amplifier positive power source terminal, 6-power amplifier reverse input end, 7-power amplifier in-phase input end, 8-power amplifier negative power end, 9-positive power source terminal current controling end, 10-power amplifier compensation end, 11-negative power end current controling end, 12-power amplifier output, 31-bottom base, 32-top base, 33-pin, 34-contact pin, 311-bottom base core body, 312-bottom base base plate, 313-groove, 314-clamp, 321-fitting recess, 322-slot.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is elaborated.
A kind of embodiment of power amplifier aging equipment of the present invention comprises: aging circuit plate and aging circuit.
As shown in Figure 1, the aging circuit plate of power amplifier aging equipment of the present invention comprise the plug-in card 1 for connecting external power source, the burn-in board 2 be made up of insulating material, for load power amplifier to be aging aging clamp 3, for the test lead 4 of monitoring power amplifier to be aging and the wiring for interface unit; Burn-in board 2 is made up of insulating material, and plug-in card 1 is positioned at the upper end of burn-in board 2, for connecting external power source; Aging clamp 3 is assemblied in burn-in board 2, in order to load power amplifier to be aging, for each Pin pin lead-in wire of power amplifier to be aging, aging clamp 3 exist corresponding pin and this Pin pin wire contacts, aging clamp 3 can, according to the quantity of device to be aging, be installed multiple; Aging clamp 3 is connected with plug-in card 1 by the wiring in burn-in board 2, for power amplifier to be aging is powered; Aging clamp 3 is connected with the test lead 4 being positioned at burn-in board 2 lower end by the wiring in burn-in board 2, in ageing process, for monitoring power amplifier to be aging.
As shown in Figures 2 and 3, aging clamp 3 comprises bottom base 31, top base 32, pin 33 and contact pin 34; Bottom base 31, in boss shape structure, is made up of insulating material, is comprised bottom base core body 311, bottom base base plate 312 and clamp 314; Bottom base core body 311 is connected on bottom base base plate 312, bottom base core body 311 is cube structure, vertical groove 313 is processed with respectively in its four sides, groove 313 runs through bottom surface on bottom base core body 311, the quantity basis power amplifier pin count to be aging of each side of groove 313 is determined, the quantity of each lateral grooves 313 can be different, and the quantity of each lateral grooves 313 that the present embodiment provides is 3; Top base 32 is cube-shaped structure, is made up of insulating material, and have in the middle of the upper bottom surface of top base 32 and run through rectangular through-hole, four limits in four limits and bottom surface on top base 32 in rectangular through-hole cross section are parallel, and rectangular through-hole size is corresponding to bottom base core body 311; Four sides are processed with fitting recess 321 to rectangular through-hole respectively, fitting recess 321 is blind hole, and it runs through top base 32 bottom surface, but does not run through top base 32 upper bottom surface, blind via bottom is outward-dipping, and fitting recess 321 is corresponding with the groove 313 of bottom base core body 311 side; Top base about 32 lateral surface is processed with two slots 322 respectively, and slot 322 upper end is processed with V-shaped groove, corresponding to the clamp 314 that bottom base base plate 311 left and right sides processes respectively; When top base 32 presses down, the upper bottom surface of bottom base base plate 312, contacts with the bottom surface of top base 32, and the upper bottom surface of top base 32 is concordant with the upper bottom surface of bottom base core body 311; Pin 33 is U-shaped structure, be made up of elastic conducting material, there is external part its side, pin 33 is arranged in the groove 313 of bottom base 31 side, press down in process at top base 32, the assembling groove 321 of top base 32 can compress the external part of pin 33, and pin 33 is closed gradually, clamps power amplifier to be aging lead-in wire; Be welded with contact pin 34 bottom pin 33, contact pin is also made up of conductive material, and contact pin 34 exposes the bottom surface of bottom base 31, is connected with the wiring in burn-in board 2; When top base 32 presses down, be positioned at the clamp 314 of bottom base base plate 312 left and right sides, automatic clamping lives in the groove 322 upper end V-shaped groove of pedestal lateral surface, ensure that the stability that in process of the test, device is installed.
As shown in Figure 4, aging circuit comprises resistance R1, R2, R3, R4, R5, R
lwith electric capacity C1, C2, C3, wherein, resistance R1 Standard resistance range is 4.7 ± 0.5K Ω, resistance R2 Standard resistance range is 10.0 ± 0.5K Ω, and resistance R3 Standard resistance range is 3.0 ± 0.5K Ω, and resistance R4 Standard resistance range is 50 ± 10 Ω, resistance R5 Standard resistance range is 50 ± 10 Ω, resistance R
lstandard resistance range is 100 ± 10 Ω, and the span of the value of electric capacity C1 to be the value of 0.1 μ F, electric capacity C2 be 0.1 μ F, electric capacity C3 is 680 ± 50pF; One end of resistance R1 is connected with external pulse generator, and the other end connects power amplifier reverse input end 6 to be aging; External signal generator produces input signal, load on power amplifier reverse input end 6 to be aging, carry out after Current amplifier through power amplifier to be aging, exported by power amplifier output 12 to be aging, be connected to test lead 4 by the wiring in burn-in board 2, the ageing process treating aging device is monitored; Positive supply V
+with negative supply V
-for power amplifier to be aging is powered, positive supply V
+connect with regulating resistance R4, be connected with positive power source terminal current controling end 9 with power amplifier positive power source terminal 5 to be aging; Negative supply V
-connect with regulating resistance R5, be connected with negative power end current controling end 11 with power amplifier negative power end 8 to be aging; Resistance R4 and resistance R5 function prevent power amplifier output 12 electric current to be aging excessive and damage circuit; Filter capacitor C1 one end connects power amplifier positive power source terminal 5 to be aging, other end ground connection, for eliminating the ripple of positive supply; Electricity filtering capacity C2 one end connects power amplifier negative supply 8 to be aging, other end ground connection, for eliminating the ripple of negative supply; One end ground connection of resistance R3, the other end connects power amplifier in-phase input end 7 to be aging; Feedback resistance R2 one end connects power amplifier reverse input end 6 to be aging, and the other end connects power amplifier output 12 to be aging, for regulating feedback current size; Electric capacity C3 one end connects power amplifier compensation end 10 to be aging, and the other end connects power amplifier output 12 to be aging; Resistance R
lone end connects power amplifier output 12 to be aging, other end ground connection.
Time aging to power amplifier, the computing formula of junction temperature is as follows:
T
j＝R
th(jc)×(P
out+P
D)+T
C
In formula: T
jfor the aging junction temperature of power amplifier, unit DEG C; R
th(jc) be thermal resistance between power amplifier chip knot with shell, unit DEG C/W; P
outfor power amplifier output power, unit W; P
dfor power amplifier oneself power consumption, unit W; T
cfor power amplifier shell temperature, unit DEG C.
P
out＝(V
cc-V
out)×(V
out/R
L)
In formula: V
ccfor power supply voltage, unit V; V
outfor output voltage, unit V; R
lfor aging circuit resistance, unit Ω.Be that the junction temperature of the power amplifier of MSK0041 is carried out monitoring calculation and obtained to model, R
th(jc)=85 DEG C/W, P
d=0.105W, T
c=72 DEG C, P
out=(15V-5.6V) × (5.6V/100 Ω)=0.526W, obtains junction temperature T
jbe about 125 DEG C, meet the aging requirement to junction temperature of semiconductor devices.
Claims (10)
1. a power amplifier aging equipment, is characterized in that: this device comprises aging circuit plate and aging circuit;
Described aging circuit plate comprises: for the plug-in card (1) connecting external power source, the burn-in board (2) be made up of insulating material, for load power amplifier to be aging aging clamp (3), for the test lead (4) of monitoring power amplifier to be aging and the wiring for interface unit; Plug-in card (1) is positioned at the upper end of burn-in board (2), aging clamp (3) is assemblied in burn-in board (2), aging clamp (3) is connected with plug-in card (1) and test lead (4) respectively by the wiring in burn-in board (2), and test lead (4) is positioned at burn-in board (2) lower end;
Described aging circuit comprises: resistance R1, R2, R3, R4, R5, R
l, electric capacity C1, C2, C3; One end of resistance R1 is connected with external pulse generator, and the other end connects power amplifier reverse input end (6) to be aging; Positive supply V
+with negative supply V
-for power amplifier to be aging is powered, positive supply V
+connect with regulating resistance R4, be connected with positive power source terminal current controling end (9) with power amplifier positive power source terminal (5) to be aging; Negative supply V
-connect with regulating resistance R5, be connected with negative power end current controling end (11) with power amplifier negative power end (8) to be aging; Filter capacitor C1 one end connects power amplifier positive power source terminal (5) to be aging, other end ground connection; Filter capacitor C2 one end connects power amplifier negative supply (8) to be aging, other end ground connection; One end ground connection of resistance R3, the other end connects power amplifier in-phase input end (7) to be aging; Feedback resistance R2 one end connects power amplifier reverse input end (6) to be aging, and the other end connects power amplifier output to be aging (12); Electric capacity C3 one end connects power amplifier compensation end (10) to be aging, and the other end connects power amplifier output to be aging (12); Resistance R
lone end connects power amplifier output to be aging (12), other end ground connection.
2. power amplifier aging equipment according to claim 1, is characterized in that: described aging clamp (3) comprises bottom base (31), top base (32), pin (33) and contact pin (34); Bottom base (31), in boss shape structure, comprises bottom base core body (311), bottom base base plate (312) and clamp (314); Bottom base core body (311) is connected on bottom base base plate (312), bottom base core body (311) is cube structure, its four sides are processed with vertical groove (313) respectively, groove (313) runs through upper bottom surface and the bottom surface of bottom base core body (311), and bottom base base plate (312) is each side processed with a pair clamp (314); The cube-shaped structure that top base (32) is hollow, the shape of through holes of the centre of top base (32) is rectangle, each limit in rectangular through-hole cross section is parallel with each limit of the top base (32) being in same cross section, and rectangular through-hole size is corresponding to bottom base core body (311); Four sides are processed with fitting recess (321) to rectangular through-hole respectively, fitting recess (321) is blind hole, top base (32) bottom surface is run through in its one end, but do not run through top base (32) upper bottom surface, blind via bottom is outward-dipping, and fitting recess (321) is corresponding with the groove (313) of bottom base core body (311) side; Top base (32) left and right lateral surface is processed with respectively a pair slot (322), slot (322) upper end is processed with V-shaped groove, corresponding to the clamp (314) of bottom base base plate (311) left and right sides; In bottom base (31) with top base (32) assembling process, when top base (32) presses down, the upper bottom surface of bottom base base plate (312) contacts with the bottom surface of top base (32), the upper bottom surface of top base (32) is concordant with the upper bottom surface of bottom base core body (311), be positioned at the clamp (314) of bottom base base plate (311) left and right sides, meeting automatic clamping lives in slot (322) the upper end V-shaped groove of pedestal (32) lateral surface; Pin (33) is arranged in the groove (313) of bottom base (31) side, pin (33) bottom is welded with contact pin (34), contact pin (34) exposes the bottom surface of bottom base (31), is connected with the wiring in burn-in board (2).
3. power amplifier aging equipment according to claim 1, it is characterized in that: in described aging circuit, resistance R1 Standard resistance range is 4.7 ± 0.5K Ω, resistance R2 Standard resistance range is 10.0 ± 0.5K Ω, resistance R3 Standard resistance range is 3.0 ± 0.5K Ω, resistance R4 Standard resistance range is 50 ± 10 Ω, and resistance R5 Standard resistance range is 50 ± 10 Ω, resistance R
lstandard resistance range is 100 ± 10 Ω, and the span of the value of electric capacity C1 to be the value of 0.1 μ F, electric capacity C2 be 0.1 μ F, electric capacity C3 is 680 ± 50pF.
4. power amplifier aging equipment according to claim 2, is characterized in that: bottom base (31) and the top base (32) of described aging clamp (3) are made up of insulating material.
5. power amplifier aging equipment according to claim 2, is characterized in that: the quantity basis power amplifier pin count to be aging of groove (313) each side of described bottom base (31) is determined.
6. power amplifier aging equipment according to claim 2, is characterized in that: the quantity of groove (313) each side of described bottom base (31) is 3 or 4.
7. power amplifier aging equipment according to claim 2, it is characterized in that: the pin (33) of described aging clamp (3) is U-shaped structure, be made up of elastic conducting material, there is external part its side, pin (33) is arranged in the groove (313) of bottom base (31) side, in bottom base (31) with top base (32) assembling process, the fitting recess (321) of top base (32) can compress the external part of pin (33), pin (33) is closed gradually, clamps power amplifier to be aging lead-in wire.
8. power amplifier aging equipment according to claim 2, is characterized in that: the contact pin (35) of described aging clamp (3) is made up of conductive material.
9. power amplifier aging equipment according to claim 1, it is characterized in that: described aging clamp (3) is according to quantity multiple installation in parallel of power amplifier to be aging, for each Pin pin lead-in wire of power amplifier to be aging, the upper pin that there is correspondence of aging clamp (3) contacts with this Pin pin.
10. power amplifier aging equipment according to claim 1, it is characterized in that: the input signal that external signal generator produces, load on power amplifier reverse input end (6) to be aging, carry out after Current amplifier through power amplifier to be aging, exported by power amplifier output (12), output to test lead (4) by the wiring in burn-in board (2) again, the ageing process of power amplifier to be aging is monitored.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410341436.7A CN105277863B (en) | 2014-07-17 | 2014-07-17 | A kind of power amplifier aging equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410341436.7A CN105277863B (en) | 2014-07-17 | 2014-07-17 | A kind of power amplifier aging equipment |
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| Publication Number | Publication Date |
|---|---|
| CN105277863A true CN105277863A (en) | 2016-01-27 |
| CN105277863B CN105277863B (en) | 2018-06-01 |
Family
ID=55147219
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|---|---|---|---|
| CN201410341436.7A Active CN105277863B (en) | 2014-07-17 | 2014-07-17 | A kind of power amplifier aging equipment |
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| CN106405360A (en) * | 2016-06-01 | 2017-02-15 | 中国振华集团永光电子有限公司（国营第八七三厂） | Aging test method of semiconductor product with bolt profile |
| CN110133403A (en) * | 2019-05-15 | 2019-08-16 | 西北核技术研究院 | A kind of operational amplifier on-line testing circuit and method suitable for radiation environment |
| CN111060808A (en) * | 2019-12-26 | 2020-04-24 | 无锡锐科光纤激光技术有限责任公司 | Aging device and aging method for circuit board of pulse fiber laser |
| CN111060808B (en) * | 2019-12-26 | 2022-02-22 | 无锡锐科光纤激光技术有限责任公司 | Aging device and aging method for circuit board of pulse fiber laser |
| CN115856567A (en) * | 2022-10-11 | 2023-03-28 | 杭州中安电子有限公司 | Vehicle-gauge-grade MCU device TDBI test method |
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