CN215493906U - Aging board for IPM module high-temperature working life test - Google Patents
Aging board for IPM module high-temperature working life test Download PDFInfo
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- CN215493906U CN215493906U CN202122229866.8U CN202122229866U CN215493906U CN 215493906 U CN215493906 U CN 215493906U CN 202122229866 U CN202122229866 U CN 202122229866U CN 215493906 U CN215493906 U CN 215493906U
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Abstract
The utility model discloses an aging board for an IPM module high-temperature working life test, which belongs to the technical field of aging boards and comprises a motherboard, and is characterized in that: the intelligent IPM module comprises a mother board, a golden finger area, a detection area, a first voltage anode, a first voltage cathode, a first pulse signal input end, a first driving signal input end, a first leakage signal sampling end and a daughter board installation position, wherein the golden finger area is arranged on one side of the mother board, the detection area is arranged on the surface of the mother board, the first voltage anode and the first voltage cathode are arranged on the upper portion of the golden finger area, the first pulse signal input end is arranged on the side, away from the first voltage anode, of the first pulse signal input end, the first driving signal input end is arranged on the side, away from the first voltage cathode, of the first driving signal input end, the first leakage signal sampling end is arranged on the side, away from the first pulse signal input end, the daughter board installation position is arranged on the surface of the detection area, and the first voltage anode, the first voltage cathode, the first pulse signal input end, the first driving signal input end and the first leakage signal sampling end are respectively and electrically connected with the daughter board installation position.
Description
Technical Field
The utility model relates to the technical field of aging boards, in particular to an aging board for an IPM module high-temperature working life test.
Background
In order to ensure the reliability of the device, manufacturers can adopt a series of reliability tests to examine and screen the device before the device leaves a factory, and the types and conditions of the adopted reliability tests have certain differences aiming at different use environments of the device, for the integrated circuit device, a high-temperature working life test is one of tests which must be carried out before the device leaves the factory, and according to the standard of the international electrotechnical commission, the test conditions are as follows: according to different integrated circuits, different driving circuits need to be designed, so that the device works at high temperature, the checking duration is different according to different application environments of the device, the application in a power system generally reaches 1000h, for an IPM module device, each internal transistor works, short-time interruption and reverse high voltage application are carried out on a PN junction in the working process, the leakage condition is detected, and the product condition is judged, the test is particularly effective for eliminating early failure devices with surface effect defects, the failure of the devices is related to time and stress, if the test is not carried out, the devices can fail early under the normal use condition, but under the prior art condition, the test has some problems, for example, the high-temperature working life test aging stations of the IPM module in the market are few, and the test is not enough and inconvenient to install for some manufacturers with large test quantity, in addition, a pulse signal source is not provided, the reversing pressure application operation is inconvenient, and based on the condition, the condition that aging stations of the IPM module in a high-temperature working life test are too few and are not enough for manufacturers with large test quantity can be avoided, the installation and the reversing pressure application operation are more convenient, and the problem which needs to be solved by related technicians is more and more solved.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides an aging board for an IPM module high-temperature working life test.
The utility model provides an ageing board for IPM module high temperature working life test, includes the motherboard, its characterized in that: mother board one side sets up golden finger district, the mother board surface sets up the detection zone, golden finger district upper portion sets up positive, the first voltage negative pole of first voltage, the first voltage negative pole is kept away from positive one side of first voltage sets up first pulse signal input, first pulse signal input is kept away from first voltage negative pole one side sets up first drive signal input, first drive signal input is kept away from first pulse signal input one side sets up first leakage signal sampling end, the detection zone surface sets up daughter board installation position, positive, the first voltage negative pole of first voltage, first pulse signal input, first drive signal input, first leakage signal sampling end respectively with installation daughter board position electric connection.
Further, daughter board installation position surface sets up second voltage positive pole, second voltage negative pole, second pulse signal input, second drive signal input, second leakage signal sample terminal, the second voltage positive pole with the anodal electric connection of first voltage, the second voltage negative pole with first voltage negative pole electric connection, the second pulse signal input with first pulse signal input electric connection, the second drive signal input with first drive signal input electric connection, the second leakage signal sample terminal with first leakage signal sample terminal electric connection.
Furthermore, the number of the daughter board mounting positions is 12, and 3 second leakage signal sampling terminals are arranged on the surface of each daughter board mounting position.
Furthermore, banana sockets are symmetrically arranged on two sides of the daughter board mounting position.
Furthermore, a plug board detection end is arranged between the first voltage negative electrode and the first pulse signal input end.
Furthermore, a fuse is arranged on one side of the daughter board mounting position and electrically connected with the daughter board mounting position.
Furthermore, a first blank end is arranged between the first pulse signal input end and the first driving signal input end, and a second blank end is arranged on the surface of the daughter board mounting position.
The aging board for the IPM module high-temperature working life test has the beneficial effects that:
1. the detection area is provided with 12 groups of daughter board installation positions, so that the conditions that the aging stations of a high-temperature working life test of the traditional IPM module are less and the aging stations are not enough for manufacturers with large test quantity are effectively avoided, before detection, the daughter boards are only required to be placed on the surfaces of the daughter board installation positions, and the adaptive banana plugs are inserted into the banana sockets, so that the installation of the daughter boards can be completed, and the daughter boards are kept stable;
2. the first pulse signal input end and the second pulse signal input end effectively solve the problem of inconvenience in reversing and pressing operation in a traditional high-temperature working life test, and the design that 3 second leakage signal sampling ends are arranged on the surface of each group of daughter board mounting positions is combined, so that convenience in operation is improved, and meanwhile, accuracy of leakage signal sampling is effectively improved;
3. the fuse has promoted the security of this ageing board effectively, simultaneously, even a small amount of ports on golden finger district, daughter board installation site surface break down, first blank end, the second blank end also can accomplish the established function of trouble port, have promoted the stability of this ageing board work from this effectively.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, but the scope of the present invention is not limited thereto.
FIG. 1 is a schematic structural diagram of an aging board for an IPM module high temperature service life test according to the present invention;
fig. 2 is an enlarged structural diagram of a daughter board mounting site of an aging board for an IPM module high temperature operation life test according to the present invention.
The system comprises a mother board 1, a golden finger area 2, a first voltage positive electrode 3, a first voltage negative electrode 4, a plug board detection end 5, a first pulse signal input end 6, a first blank end 7, a first driving signal input end 8, a first leakage signal sampling end 9, a fuse 10, a detection area 11, a daughter board mounting position 12, a second voltage negative electrode 13, a banana socket 14, a second driving signal input end 15, a second leakage signal sampling end 16, a second blank end 17, a second pulse signal input end 18 and a second voltage positive electrode 19.
Detailed Description
For the sake of clarity, the aging board for IPM module high temperature operation life test according to the present invention will be further described with reference to fig. 1 to 2 of the drawings attached to the specification.
The utility model provides an ageing board for IPM module high temperature working life test, includes motherboard 1, its characterized in that: 1 one side of motherboard sets up golden finger district 2, 1 surface of motherboard sets up detection zone 11, 2 upper portions in golden finger district set up the anodal 3 of first voltage, first voltage negative pole 4 is kept away from the anodal 3 one side of first voltage sets up first pulse signal input 6, first pulse signal input 6 is kept away from 4 one side of first voltage negative pole sets up first drive signal input 8, first drive signal input 8 is kept away from 6 one side of first pulse signal input sets up first electric leakage signal sample terminal 9, detection zone 11 surface sets up daughter board installation position 12, the anodal 3 of first voltage, first voltage negative pole 4, first pulse signal input 6, first drive signal input 8, first electric leakage signal sample terminal 9 respectively with daughter board installation position 12 electric connection.
Further, the surface of the daughter board mounting position 12 is provided with a second voltage anode 19, a second voltage cathode 13, a second pulse signal input end 18, a second driving signal input end 15, and a second leakage signal sampling end 16, the second voltage anode 19 is electrically connected to the first voltage anode 3, the second voltage cathode 13 is electrically connected to the first voltage cathode 4, the second pulse signal input end 18 is electrically connected to the first pulse signal input end 6, the second driving signal input end 15 is electrically connected to the first driving signal input end 8, and the second leakage signal sampling end 16 is electrically connected to the first leakage signal sampling end 9.
Further, the number of the daughter board mounting positions 12 is 12, and 3 second leakage signal sampling terminals 16 are arranged on the surface of each daughter board mounting position 12.
Furthermore, banana sockets 14 are symmetrically arranged on two sides of the daughter board mounting position 12.
Further, a plug board detection end 5 is arranged between the first voltage cathode 4 and the first pulse signal input end 6.
Further, a fuse 10 is disposed on one side of the daughter board mounting location 12, and the fuse 10 is electrically connected to the daughter board mounting location 12.
Further, a first blank end 7 is arranged between the first pulse signal input end 6 and the first driving signal input end 8, and a second blank end 17 is arranged on the surface of the daughter board mounting position 12.
The working principle of the aging board for the IPM module high-temperature working life test is as follows: the daughter board to be tested is placed on the surface of the daughter board mounting position 12, an adaptive banana plug is selected to be inserted into the banana socket 14, the daughter board mounting and the electrical connection between the daughter board and the daughter board mounting position 12 can be completed, the aging board is placed in a test space of test equipment until the plug board detection end 5 displays that the aging board is normally mounted, the test space is set according to test conditions, the electrical connection between the first voltage anode 3 and the second voltage anode 19 and the electrical connection between the first voltage cathode 4 and the second voltage cathode 13 apply forward high voltage to the daughter board, then the electrical connection between the second pulse signal input end 18 and the first pulse signal input end 6 applies reverse high voltage to the daughter board, the second leakage signal sampling end 16 transmits the leakage condition to the first leakage signal sampling end 9 and further to an upper system, and then the test on the daughter board to be tested can be completed.
The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.
Claims (7)
1. The utility model provides an ageing-resistant plate for IPM module high temperature working life test, includes motherboard (1), its characterized in that: motherboard (1) one side sets up golden finger district (2), motherboard (1) surface sets up detection zone (11), golden finger district (2) upper portion sets up positive (3) of first voltage, first voltage negative pole (4), keep away from first voltage negative pole (4) positive (3) one side sets up first pulse signal input (6), first pulse signal input (6) are kept away from first voltage negative pole (4) one side sets up first drive signal input (8), first drive signal input (8) are kept away from first pulse signal input (6) one side sets up first leakage signal sampling end (9), detection zone (11) surface sets up daughter board installation position (12), positive (3) of first voltage, first voltage negative pole (4), first pulse signal input (6), The first driving signal input end (8) and the first leakage signal sampling end (9) are electrically connected with the daughter board mounting position (12) respectively.
2. The burn-in board for IPM module high temperature service life test as claimed in claim 1, the daughter board installation structure is characterized in that a second voltage positive electrode (19), a second voltage negative electrode (13), a second pulse signal input end (18), a second driving signal input end (15) and a second leakage signal sampling end (16) are arranged on the surface of the daughter board installation position (12), the second voltage anode (19) is electrically connected with the first voltage anode (3), the second voltage cathode (13) is electrically connected with the first voltage cathode (4), the second pulse signal input end (18) is electrically connected with the first pulse signal input end (6), the second driving signal input end (15) is electrically connected with the first driving signal input end (8), the second leakage signal sampling end (16) is electrically connected with the first leakage signal sampling end (9).
3. The burn-in board for IPM module high temperature operation life test according to claim 2, wherein said daughter board mounting sites (12) are 12 groups, and each group of said daughter board mounting sites (12) has 3 said second leakage signal sampling terminals (16) disposed on its surface.
4. The burn-in board for IPM module high temperature operation life test according to claim 1, wherein said daughter board mounting sites (12) are bilaterally symmetrically disposed banana sockets (14).
5. The burn-in board for IPM module high temperature operation life test according to claim 1, wherein an board detection terminal (5) is provided between said first voltage negative electrode (4) and said first pulse signal input terminal (6).
6. The burn-in board for IPM module high temperature service life test as claimed in claim 1, wherein a fuse (10) is disposed at one side of the daughter board mounting site (12), and the fuse (10) is electrically connected to the daughter board mounting site (12).
7. The burn-in board for IPM module high temperature service life test as claimed in claim 1, wherein a first blank end (7) is arranged between said first pulse signal input end (6) and said first driving signal input end (8), and a second blank end (17) is arranged on the surface of said daughter board mounting site (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122229866.8U CN215493906U (en) | 2021-09-15 | 2021-09-15 | Aging board for IPM module high-temperature working life test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122229866.8U CN215493906U (en) | 2021-09-15 | 2021-09-15 | Aging board for IPM module high-temperature working life test |
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| Publication Number | Publication Date |
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| CN215493906U true CN215493906U (en) | 2022-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122229866.8U Active CN215493906U (en) | 2021-09-15 | 2021-09-15 | Aging board for IPM module high-temperature working life test |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114839401A (en) * | 2022-03-12 | 2022-08-02 | 江苏宝浦莱半导体有限公司 | High-density arrangement aging board of service life test experiment golden finger plug structure with acceleration |
-
2021
- 2021-09-15 CN CN202122229866.8U patent/CN215493906U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114839401A (en) * | 2022-03-12 | 2022-08-02 | 江苏宝浦莱半导体有限公司 | High-density arrangement aging board of service life test experiment golden finger plug structure with acceleration |
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