CN111273065A - Radio frequency device testing system and method based on conductive adhesive clamp - Google Patents
Radio frequency device testing system and method based on conductive adhesive clamp Download PDFInfo
- Publication number
- CN111273065A CN111273065A CN202010278987.9A CN202010278987A CN111273065A CN 111273065 A CN111273065 A CN 111273065A CN 202010278987 A CN202010278987 A CN 202010278987A CN 111273065 A CN111273065 A CN 111273065A
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- China
- Prior art keywords
- radio frequency
- frequency device
- clamp
- board
- conductive adhesive
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
Abstract
The invention belongs to the technical field of radio frequency device test systems, and particularly relates to a radio frequency device test system and a radio frequency device test method based on a conductive adhesive clamp, wherein the radio frequency device working system comprises a power supply, a radio frequency device clamp and a radio frequency PCB test board, wherein the radio frequency PCB test board is provided with a power supply part, the power supply is connected with the radio frequency PCB test board through the power supply part, and the radio frequency device clamp is arranged on the radio frequency PCB test board; the vector network analyzer is characterized in that the radio frequency chip control board is connected with a power supply through a wire, the radio frequency chip control board is connected with a radio frequency PCB test board through a control port, and the vector network analyzer is connected with the radio frequency PCB test board through a coaxial connector. The invention can test the packaged chip without damaging the radio frequency chip, has low test cost and is beneficial to the test of the radio frequency chips in batches. The invention is used for testing the radio frequency device.
Description
Technical Field
The invention belongs to the technical field of radio frequency device testing systems, and particularly relates to a radio frequency device testing system and method based on a conductive adhesive clamp.
Background
With the continuous development of small-sized and high-performance weaponry integrated systems and radio communication products, the demand for military micro-assemblies and hybrid integrated circuits is more and more intense and vigorous, and especially the demand for radio frequency MEMS devices is greatest. For microwave characteristics of a radio frequency MEMS (Micro-Electro-Mechanical System), its main performance parameters include insertion loss, return loss, etc. At present, most research institutions adopt an Agilent B1500A semiconductor parameter tester and a cascade probe table to test various performance parameters of an unpackaged radio frequency MEMS device, but when the probe is used for testing, indexes of the tested MEMS device need to be known approximately, and then a proper current gear control probe is set. The test result of the unpackaged bare chip is greatly influenced by the environment when the probe test is carried out. Moreover, the probe station is extremely expensive. In addition, since the size of the MEMS device is extremely small, the MEMS device is very susceptible to the surrounding electromagnetic environment, and the radio frequency MEMS device needs to be packaged at a device level, so as to ensure good airtightness of the device, and to achieve the effect of preventing electromagnetic interference, so as to improve the environmental compatibility of the device. Therefore, a new requirement is put on the test of the radio frequency MEMS device, namely, the performance of the radio frequency MEMS device after being packaged at a certain level needs to be tested. In the prior market, a method for welding a radio frequency MEMS device on a circuit board for testing is mostly adopted for testing, but the whole structure of the MEMS device is extremely easy to damage, so that the radio frequency MEMS product after the test is qualified can not be reused, and the rapid test is not easy to realize.
Disclosure of Invention
Aiming at the technical problem that the integral structure of the MEMS device is easily damaged when the radio frequency MEMS device is welded on a circuit board for testing, the invention provides a radio frequency device testing system and a radio frequency device testing method based on a conductive adhesive clamp, which are simple in structure, high in utilization rate and high in efficiency.
In order to solve the technical problems, the invention adopts the technical scheme that:
a radio frequency device test system based on a conductive adhesive clamp comprises a radio frequency device working system and a radio frequency signal test system, wherein the radio frequency device working system is connected with the radio frequency signal test system, the radio frequency device working system comprises a power supply, a radio frequency device clamp and a radio frequency PCB test board, a power supply part is arranged on the radio frequency PCB test board, the power supply is connected with the radio frequency PCB test board through the power supply part, and the radio frequency device clamp is arranged on the radio frequency PCB test board;
the radio frequency signal testing system comprises a radio frequency chip control board, a coaxial connector and a vector network analyzer, wherein the radio frequency chip control board is connected with a power supply through a wire, the radio frequency chip control board is connected with a radio frequency PCB testing board through a control port, and the vector network analyzer is connected with the radio frequency PCB testing board through the coaxial connector.
The radio frequency device clamp comprises conductive adhesive and a radio frequency device clamp base, wherein a groove is formed in the radio frequency device clamp base, a chip limiting groove is formed in the groove, the conductive adhesive is embedded in the groove of the radio frequency device clamp base, and the conductive adhesive is arranged between the radio frequency PCB testing plate and the radio frequency device clamp base.
The thickness of the conductive adhesive is larger than the depth of the groove on the base of the radio frequency device clamp.
The radio frequency PCB test board adopts a high frequency circuit board.
The radio frequency device clamp is fixed on the radio frequency PCB test board through a bolt and a nut.
The radio frequency device clamp is made of polyvinyl chloride.
A radio frequency device testing method based on a conductive adhesive clamp comprises the following steps:
s1, calibrating the vector network analyzer;
s2, fixing the radio frequency device clamp on the radio frequency PCB test board through a bolt and a nut, and further compressing the conductive adhesive;
s3, opening the radio frequency device clamp, putting the radio frequency chip into the radio frequency device clamp, and fully contacting the radio frequency chip with the radio frequency PCB test board through the conductive adhesive;
s4, firstly, supplying power to the radio frequency chip, and then controlling the radio frequency chip through the radio frequency chip control board to enable the radio frequency chip to work;
and S5, reading and recording the data by the vector network analyzer.
Compared with the prior art, the invention has the following beneficial effects:
the invention can test the packaged chip without damaging the radio frequency chip, has low test cost and is beneficial to the test of radio frequency chips in batches; the size of the chip limiting groove can be changed according to different chips, the used conductive adhesive does not need to be changed, the chip limiting groove can be suitable for testing the same type of packaged multiple chips, and the reusability of the clamp is greatly improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural diagram of the RF device clamp of the present invention;
wherein: the device comprises a radio frequency chip control board 1, a power supply 2, a control port 3, a power supply part 4, a radio frequency PCB test board 5, a radio frequency device clamp 6, a coaxial connector 7, a vector network analyzer 8, a conductive adhesive 9, a radio frequency device clamp base 10, a radio frequency chip 11, a groove 12 and a chip limiting groove 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A radio frequency device testing system based on a conductive adhesive clamp is shown in figure 1 and comprises a radio frequency device working system and a radio frequency signal testing system, wherein the radio frequency device working system is connected with the radio frequency signal testing system, the radio frequency device working system comprises a power supply 2, a radio frequency device clamp 6 and a radio frequency PCB testing plate 5, the radio frequency PCB testing plate 5 is provided with a power supply part 4, the power supply 2 is connected with the radio frequency PCB testing plate 5 through the power supply part 4, and the radio frequency device clamp 6 is arranged on the radio frequency PCB testing plate 5. The radio frequency signal testing system comprises a radio frequency chip control board 1, a coaxial connector 7 and a vector network analyzer 8, wherein the radio frequency chip control board 1 is connected with a power supply 2 through a wire, the radio frequency chip control board 1 is connected with a radio frequency PCB (printed circuit board) testing board 5 through a control port 3, a high-low voltage control radio frequency chip 11 is controlled and converted through an FPGA (field programmable gate array), and the vector network analyzer 8 is connected with the radio frequency PCB testing board 5 through the coaxial connector 7. The vector network analyzer 8 is calibrated, connected to the radio frequency PCB test board 5 through a cable, controlled by the radio frequency chip control board 1, and the vector network analyzer 8 obtains a result.
Further, as shown in fig. 2, the radio frequency device clamp 6 includes a conductive adhesive 9 and a radio frequency device clamp base 10, a groove 12 is provided on the radio frequency device clamp base 10, a chip limiting groove 13 is provided in the groove 12, the size of the chip limiting groove 13 can be changed according to different radio frequency chips 11, and the used conductive adhesive does not need to be changed. Conductive adhesive 9 is embedded in a groove 12 of a base 10 of the radio frequency device clamp, the conductive adhesive 9 is arranged between the radio frequency PCB test board 5 and the base 10 of the radio frequency device clamp, the conductive adhesive is used as a medium for connecting the radio frequency chip 11 and the radio frequency PCB test board 5, the test can be carried out under the condition that the radio frequency chip 11 is not damaged and the package is available, the limitation of a probe test method is avoided, and the probe can be used for multiple times.
Further, preferably, the thickness of the conductive adhesive 9 is greater than the depth of the groove 12 on the base 10 of the radio frequency device clamp, so as to ensure the sufficient contact between the radio frequency chip 11 and the radio frequency PCB test board 5.
Further, preferably, the radio frequency PCB test board 5 is a high frequency circuit board.
Further, preferably, the rf device holder 6 is fixed to the rf PCB test board 5 by a bolt and a nut.
Further, preferably, the radio frequency device clamp 6 is made of polyvinyl chloride.
A radio frequency device testing method based on a conductive adhesive clamp comprises the following steps:
and S1, calibrating the vector network analyzer.
S2, the radio frequency device clamp is fixed on the radio frequency PCB test board through bolts and nuts, and then the conductive adhesive is compressed.
And S3, opening the radio frequency device clamp, putting the radio frequency chip into the radio frequency device clamp, and fully contacting the radio frequency chip with the radio frequency PCB test board through the conductive adhesive.
And S4, supplying power to the radio frequency chip, and controlling the radio frequency chip by the radio frequency chip control board to enable the radio frequency chip to work.
And S5, reading and recording the data by the vector network analyzer.
Although only the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art, and all changes are encompassed in the scope of the present invention.
Claims (7)
1. The utility model provides a radio frequency device test system based on conducting resin anchor clamps which characterized in that: the radio frequency device working system is connected with the radio frequency signal testing system and comprises a power supply (2), a radio frequency device clamp (6) and a radio frequency PCB testing board (5), wherein the radio frequency device working system is provided with a power supply part (4), the power supply (2) is connected with the radio frequency PCB testing board (5) through the power supply part (4), and the radio frequency device clamp (6) is arranged on the radio frequency PCB testing board (5);
the radio frequency signal test system comprises a radio frequency chip control board (1), a coaxial connector (7) and a vector network analyzer (8), wherein the radio frequency chip control board (1) is connected with a power supply (2) through a wire, the radio frequency chip control board (1) is connected with a radio frequency PCB test board (5) through a control port (3), and the vector network analyzer (8) is connected with the radio frequency PCB test board (5) through the coaxial connector (7).
2. The conductive adhesive clamp-based radio frequency device testing system of claim 1, wherein: radio frequency device anchor clamps (6) include conducting resin (9), radio frequency device anchor clamps base (10), be provided with recess (12) on radio frequency device anchor clamps base (10), be provided with chip spacing groove (13) in recess (12), conducting resin (9) inlay in recess (12) of radio frequency device anchor clamps base (10), conducting resin (9) set up and survey between board (5) and radio frequency device anchor clamps base (10) at radio frequency PCB.
3. The conductive adhesive clamp-based radio frequency device testing system of claim 2, wherein: the thickness of the conductive adhesive (9) is larger than the depth of the groove (12) on the base (10) of the radio frequency device clamp.
4. The conductive adhesive clamp-based radio frequency device testing system of claim 1, wherein: the radio frequency PCB test board (5) adopts a high-frequency circuit board.
5. The conductive adhesive clamp-based radio frequency device testing system of claim 1, wherein: and the radio frequency device clamp (6) is fixed on the radio frequency PCB test board (5) through a bolt and a nut.
6. The conductive adhesive clamp-based radio frequency device testing system of claim 1, wherein: the radio frequency device clamp (6) is made of polyvinyl chloride.
7. A radio frequency device testing method based on a conductive adhesive clamp is characterized in that: comprises the following steps:
s1, calibrating the vector network analyzer;
s2, fixing the radio frequency device clamp on the radio frequency PCB test board through a bolt and a nut, and further compressing the conductive adhesive;
s3, opening the radio frequency device clamp, putting the radio frequency chip into the radio frequency device clamp, and fully contacting the radio frequency chip with the radio frequency PCB test board through the conductive adhesive;
s4, firstly, supplying power to the radio frequency chip, and then controlling the radio frequency chip through the radio frequency chip control board to enable the radio frequency chip to work;
and S5, reading and recording the data by the vector network analyzer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010278987.9A CN111273065A (en) | 2020-04-10 | 2020-04-10 | Radio frequency device testing system and method based on conductive adhesive clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010278987.9A CN111273065A (en) | 2020-04-10 | 2020-04-10 | Radio frequency device testing system and method based on conductive adhesive clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111273065A true CN111273065A (en) | 2020-06-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010278987.9A Pending CN111273065A (en) | 2020-04-10 | 2020-04-10 | Radio frequency device testing system and method based on conductive adhesive clamp |
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| CN (1) | CN111273065A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116961784A (en) * | 2023-09-21 | 2023-10-27 | 成都爱旗科技有限公司 | System and method for testing receiving channel of radio frequency chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206684193U (en) * | 2017-04-10 | 2017-11-28 | 中国电子技术标准化研究院 | Radio frequency chip test fixture |
-
2020
- 2020-04-10 CN CN202010278987.9A patent/CN111273065A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206684193U (en) * | 2017-04-10 | 2017-11-28 | 中国电子技术标准化研究院 | Radio frequency chip test fixture |
Non-Patent Citations (1)
| Title |
|---|
| 钱志萍等: "FOG邦定工艺及其不良分析", 《光电技术》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116961784A (en) * | 2023-09-21 | 2023-10-27 | 成都爱旗科技有限公司 | System and method for testing receiving channel of radio frequency chip |
| CN116961784B (en) * | 2023-09-21 | 2023-12-29 | 成都爱旗科技有限公司 | System and method for testing receiving channel of radio frequency chip |
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Application publication date: 20200612 |