CN213337905U - Chip testing device and system - Google Patents
Chip testing device and system Download PDFInfo
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- CN213337905U CN213337905U CN202022152722.2U CN202022152722U CN213337905U CN 213337905 U CN213337905 U CN 213337905U CN 202022152722 U CN202022152722 U CN 202022152722U CN 213337905 U CN213337905 U CN 213337905U
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- 238000012360 testing method Methods 0.000 title claims abstract description 175
- 238000004891 communication Methods 0.000 claims abstract description 27
- 238000013522 software testing Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 9
- 238000013461 design Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The utility model provides a chip test device and system relates to semiconductor technology field, and the device includes: the device comprises a power supply plug-in circuit board, a device testing circuit board, a device plug-in circuit board and a connecting piece; the power supply plug-in circuit board is in communication connection with the device testing circuit board; the device testing circuit board is respectively in communication connection with the device inserting circuit boards through a plurality of connecting pieces; the device plug-in circuit board is used for being in communication connection with a chip to be tested, obtaining test parameters of the chip to be tested and sending the test parameters to the device test circuit board through a connecting piece; the device test circuit board is used for receiving the test parameters and sending the test parameters to the test module so that the test module can generate a chip test result. The utility model discloses can connect a plurality of examination chips that await measuring simultaneously through a plurality of device cartridge circuit boards, acquire the test parameter of chip test process, easy operation, efficiency of software testing is high, is applicable to the chip test of multiple product.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor technology and specifically relates to a chip test device and system are related to.
Background
The working life of the chip can be estimated by a temperature accelerated aging method, voltage application at a certain temperature is a harsh working mode, devices with poor quality can lose effectiveness under the action of temperature and an electric field, and the mode can be used for judging the manufacturing level of the chip and also can be used for judging the quality of a production batch. The high-temperature aging test of the chip, in the end product, weld in the products and carry on the performance test of the products mostly, in order to reverse the performance test result of the chip through the test result of the products, this kind of test method, the efficiency is slow, the operation is difficult, and weld in the products and test, take up the space of the apparatus, is not suitable for the product test of the chip quantity too much.
SUMMERY OF THE UTILITY MODEL
The utility model provides a chip test device and system, the device can be used for testing a plurality of chips that await measuring simultaneously, easy operation, and efficiency of software testing is high, is applicable to the chip test of multiple product.
In a first aspect, an embodiment of the present invention provides a chip testing apparatus, the apparatus includes: the device comprises a power supply plug-in circuit board, a device testing circuit board, a device plug-in circuit board and a connecting piece; the power supply plug-in circuit board is in communication connection with the device testing circuit board; the device testing circuit board is respectively in communication connection with the device inserting circuit boards through the connecting pieces; the device plug-in circuit board is used for being in communication connection with a chip to be tested, obtaining test parameters of the chip to be tested and sending the test parameters to the device test circuit board through the connecting piece; the device test circuit board is used for receiving the test parameters and sending the test parameters to the test module so that the test module can generate a chip test result.
In a second aspect, the embodiment of the present invention further provides a chip testing system, which includes a testing module and the above chip testing apparatus.
The embodiment of the utility model provides a following beneficial effect has been brought: the embodiment of the utility model provides a chip test scheme, which comprises a power supply plug-in circuit board, a device test circuit board, a device plug-in circuit board and a connecting piece, wherein the power supply plug-in circuit board is in communication connection with the device test circuit board; the device testing circuit board is respectively in communication connection with the device inserting circuit boards through a plurality of connecting pieces; the device plug-in circuit board is in communication connection with the chip to be tested, so that test parameters of the chip to be tested are obtained, and the test parameters are sent to the device test circuit board through the connecting piece; the through device test circuit board receives the test parameters and sends the test parameters to the test module so that the test module generates a chip test result. The embodiment of the utility model provides a can connect a plurality of examination chips that await measuring simultaneously through a plurality of device cartridge circuit boards, acquire the test parameter of chip experimentation, easy operation, efficiency of software testing is high, is applicable to the chip test of multiple product.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a block diagram of a chip testing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a chip testing apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a device-mounted circuit board according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a power supply plug-in circuit board according to an embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The chip testing device has the advantages that a plurality of devices can be tested simultaneously, the cost is low, the equipment space is saved, and the testing is convenient particularly after the temperature test.
Based on this, the embodiment of the utility model provides a pair of chip test device and system can promote the efficiency of software testing of chip.
In order to facilitate understanding of the present embodiment, a chip testing apparatus disclosed in the embodiments of the present invention will be described in detail first.
The embodiment of the utility model provides a chip test device, see the chip test device structure block diagram shown in fig. 1, the device includes: a power supply cartridge circuit board 14, a device test circuit board 13, a device cartridge circuit board 11, and a connector 12.
The power supply plug-in circuit board is in communication connection with the device testing circuit board; the device testing circuit board is respectively in communication connection with the device inserting circuit boards through a plurality of connecting pieces; the device plug-in circuit board is used for being in communication connection with a chip to be tested, obtaining test parameters of the chip to be tested and sending the test parameters to the device test circuit board through a connecting piece; the device test circuit board is used for receiving the test parameters and sending the test parameters to the test module so that the test module can generate a chip test result.
The embodiment of the utility model provides an in, be provided with a plurality of connecting pieces on every device test circuit board, a device cartridge circuit board is connected to every connecting piece, every device cartridge circuit board can connect a chip that awaits measuring, thereby realize carrying out the test to a plurality of chips, device cartridge circuit board acquires the voltage of chip, the test parameter information of chips such as electric current and frequency, afterwards, send the test parameter to device test circuit board through the connecting piece, device test circuit board sends the test parameter to test module, test module will acquire the voltage, chip parameters such as electric current and frequency, compare with predetermined chip rated parameter, whether pass through the test with the confirmed chip quality of being surveyed, and then obtain the chip test result. The device can acquire the test parameters of a plurality of chips to be tested simultaneously to test a plurality of chips to be tested simultaneously, thus improving the chip test efficiency, being simple in operation and reducing the cost.
It should be noted that the device package circuit board may be soldered to a chip to be tested, for example, see the schematic diagram of the device package circuit board structure shown in fig. 3, in which D1-D7 are integrated circuit chips to be tested, C1-C7 are peripheral circuits required for normal operation of the integrated circuit chips, mainly including chip capacitors, and D1 and C1 are a group of experimental units.
The embodiment of the utility model provides a chip test scheme, which comprises a power supply plug-in circuit board, a device test circuit board, a device plug-in circuit board and a connecting piece, wherein the power supply plug-in circuit board is in communication connection with the device test circuit board; the device testing circuit board is respectively in communication connection with the device inserting circuit boards through a plurality of connecting pieces; the device plug-in circuit board is in communication connection with the chip to be tested, so that test parameters of the chip to be tested are obtained, and the test parameters are sent to the device test circuit board through the connecting piece; the through device test circuit board receives the test parameters and sends the test parameters to the test module so that the test module generates a chip test result. The embodiment of the utility model provides a can connect a plurality of examination chips that await measuring simultaneously through a plurality of device cartridge circuit boards, acquire the test parameter of chip experimentation, easy operation, efficiency of software testing is high, is applicable to the chip test of multiple product.
In order to improve the applicability of the device, the device testing circuit board and the power supply plug-in circuit board are fixedly connected or movably connected.
The embodiment of the utility model provides an in, device test circuit board can be integrated with power cartridge circuit board, sets up on power cartridge circuit board, also can be independent of on the other circuit board.
In order to improve the applicable scope of the device, considering that different test parameters are needed in different test processes, the device further comprises:
the at least one device plug-in circuit board is in communication connection with the power supply plug-in circuit board through at least one connecting piece; the at least one device plug-in circuit board is used for being in communication connection with the chip to be tested, acquiring a second test parameter of the chip to be tested, and sending the second test parameter to the power supply plug-in circuit board through the at least one connecting piece; the power supply plug-in circuit board is also used for receiving second test parameters and sending the second test parameters to the test module so that the test module can generate a chip test result.
The embodiment of the utility model provides an in, the data type that contains in the second test parameter is less than the test parameter, in order to carry out different demand tests simultaneously, and power cartridge circuit board can acquire the second test parameter of the chip that awaits measuring through device cartridge circuit board through connecting piece and device cartridge circuit board communication connection, with this second test parameter send to test module to obtain the chip test result, thereby further promote the efficiency of software testing of chip.
In order to facilitate the operation, the connecting piece is movably connected with the device inserting circuit board.
Referring to the schematic structural diagram of the chip testing device shown in fig. 2, the broken lines are shown as the movable connections, and the solid lines are shown as the fixed connections.
In order to save space, the power supply plug-in circuit board is provided with a positioning hole.
The embodiment of the utility model provides an in, there are four locating holes in the four corners of power cartridge circuit board, can adopt the reference column to stack a plurality of power cartridge circuit boards according to certain high perpendicular to through the locating hole to save space.
It should be noted that, the locating hole can be decided according to the reference column size of using in practice, and the general diameter is 3 mm.
In order to facilitate connection, the power plug-in circuit board comprises a power circuit module and a plug-in pad circuit module; the plug-in pad circuit module comprises a standby jumper unit and a device plug-in circuit connecting unit.
The embodiment of the utility model provides an in, power cartridge circuit board comprises two way circuits, is power supply circuit all the way, directly is connected with the power, is the same cartridge pad circuit parallel connection circuit of a plurality of ways all the way in addition. The minimum interval between the plug-in pad circuits is 6 mm; the maximum interval is determined according to the total length of the circuit board and the number of the circuit board.
The specific structure of the power plug-in circuit board is shown in fig. 4, wherein P1-P8 are connectors fixedly connected with the power plug-in circuit board; p _ test is a connector fixedly connected with the device test circuit board, P1, P11, R11, P12, R12: are a set of experimental units.
The plug-in pad circuit comprises a standby jumper circuit and a design circuit correspondingly connected with the device plug-in circuit. The standby jumper circuit comprises a jumper pin and a jumper cap which are matched, or comprises two welding pads, wherein devices are not welded between the two welding pads or the two welding pads are directly short-circuited by soldering tin; the standby jumper circuit is used for short circuit test. The device plug-in circuit connecting unit is a design circuit correspondingly connected with the device plug-in circuit.
In order to ensure the reliable connection of the circuits, the size of the device plug-in circuit connection unit is consistent with that of the connecting piece.
The embodiment of the utility model provides an in, the length and the width of the design circuit who is connected corresponding with device cartridge circuit need keep unanimous with the length and the width of connecting piece to it is reliable to do benefit to circuit connection.
In order to facilitate connection, the device test circuit board includes an external equipment connection module and a device insertion circuit connection module.
In the embodiment of the utility model, the device test circuit board is composed of two circuits and a connecting piece, wherein one circuit corresponds to the device plug-in pad circuit and is used for the insertion test of the device plug-in circuit board; the other path is a conventional plug-in circuit with the distance of 2.54mm and is used for being connected with external test equipment; the connecting piece is the same as the connecting piece.
In order to facilitate connection, the device plug-in circuit board comprises a power plug-in circuit connection module and a device pad circuit module; the power plug-in circuit connecting module is in communication connection with the device plug-in circuit connecting unit; the device pad circuit module is in communication connection with the device plug-in circuit connection module.
The embodiment of the utility model provides an in, device cartridge circuit board comprises two way circuits, is the same device pad circuit in a plurality of ways all the way, is the corresponding design circuit who is connected with power cartridge circuit all the way. One side of each device bonding pad circuit is connected with the design circuit correspondingly connected with the power plug-in mounting circuit. The device pad circuit is designed corresponding to the packaging specification, size and application condition of the device. The device is an integrated circuit material, particularly a clock chip.
The minimum spacing distance between the pad circuits of the device is +3mm of the width of the device, and the maximum spacing distance is determined according to the length of the plug-in circuit board of the device and the number of the welded devices. The design circuit correspondingly connected with the power plug-in circuit adopts a golden finger plug-in mode so as to be beneficial to realizing quick connection or disconnection with the connecting piece. The internal circuit of the connecting piece needs the consistency of a power supply plug-in circuit and a device plug-in circuit, so that the circuit connection is reliable. The connecting piece is a golden finger socket bus slot. The pin end of the connecting piece is welded and fixed with the power supply plug-in circuit board. The slot end of the connecting piece is inserted with the device inserting circuit board. The device plug-in circuit board can be pulled out from the socket end of the connecting piece for testing as required. The connecting piece is a plug board type golden finger socket bus slot, generally 44 cores, and the distance between every two cores is 3.96 mm.
The embodiment of the utility model provides a chip testing device and a system, and the device is very convenient in specific application through the ingenious design and layout of a circuit; the testing device can be used for simultaneously testing a plurality of devices, each device plug-in circuit board can be welded with a plurality of devices according to requirements, for example, 7 devices are arranged in one embodiment, each power supply plug-in circuit board can be simultaneously connected with a plurality of device plug-in circuit boards, for example, 8 devices are arranged in one embodiment, 56 devices can be simultaneously tested by one testing device, more devices can be welded according to actual conditions, the number of samples tested simultaneously is increased, and the testing efficiency is greatly improved; the power supply plug-in circuit board is provided with positioning holes, and a plurality of test devices can be vertically connected according to a certain height through the positioning columns, so that horizontal space-occupying devices placed in the test box body are saved; the device plug-in circuit boards connected to each power supply plug-in circuit board are connected in parallel, so that the device plug-in circuit boards can be arbitrarily extracted to be placed on the device test circuit board for testing according to the bad condition or test requirement of devices, other circuit boards are not influenced, and the operation is convenient; the device test circuit can realize the test under the test condition if being designed together with the device plug-in circuit board; the device pad circuit of the device plug-in circuit board can be designed and changed according to the adopted integrated circuit package, is suitable for other types of package types, and has good applicability; in addition, the whole experimental device is easy to obtain materials and low in cost, and compared with a method for testing a circuit welded into a finished product, the time and the cost are greatly saved.
The embodiment of the utility model provides a still provide a chip test system, this system includes any kind of above-mentioned chip test device.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the technical solution of the present invention, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still modify or easily conceive of changes in the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A chip testing apparatus, comprising: the device comprises a power supply plug-in circuit board, a device testing circuit board, a device plug-in circuit board and a connecting piece;
the power supply plug-in circuit board is in communication connection with the device testing circuit board; the device testing circuit board is respectively in communication connection with the device inserting circuit boards through the connecting pieces;
the device plug-in circuit board is used for being in communication connection with a chip to be tested, obtaining test parameters of the chip to be tested and sending the test parameters to the device test circuit board through the connecting piece;
the device test circuit board is used for receiving the test parameters and sending the test parameters to the test module so that the test module can generate a chip test result.
2. The apparatus of claim 1, wherein the device test circuit board is fixedly or movably connected to the power strip.
3. The apparatus of claim 1, further comprising: the at least one device plug-in circuit board is in communication connection with the power supply plug-in circuit board through at least one connecting piece;
the at least one device plug-in circuit board is used for being in communication connection with a chip to be tested, acquiring a second test parameter of the chip to be tested, and sending the second test parameter to the power supply plug-in circuit board through the at least one connecting piece;
the power supply plug-in circuit board is further used for receiving the second test parameters and sending the second test parameters to the test module, so that the test module generates a chip test result.
4. The apparatus of any of claims 1-3, wherein the connector is removably connected to the device cartridge circuit board.
5. The device of claim 1, wherein the power supply cartridge circuit board is provided with a positioning hole.
6. The apparatus of claim 1, wherein the power cartridge circuit board comprises a power circuit module and a cartridge pad circuit module; the plug-in pad circuit module comprises a standby jumper unit and a device plug-in circuit connecting unit.
7. The apparatus of claim 6, wherein the device-in-circuit connection unit has a size corresponding to a size of the connector.
8. The apparatus of claim 6, wherein the device test circuit board comprises an external equipment connection module and a device plugged circuit connection module.
9. The apparatus of claim 8, wherein the device cartridge circuit board comprises a power cartridge circuit connection module and a device pad circuit module;
the power plug-in circuit connecting module is in communication connection with the device plug-in circuit connecting unit;
the device pad circuit module is in communication connection with the device plug-in circuit connection module.
10. A chip testing system comprising a test module and the chip testing apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022152722.2U CN213337905U (en) | 2020-09-27 | 2020-09-27 | Chip testing device and system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022152722.2U CN213337905U (en) | 2020-09-27 | 2020-09-27 | Chip testing device and system |
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| CN213337905U true CN213337905U (en) | 2021-06-01 |
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| CN202022152722.2U Active CN213337905U (en) | 2020-09-27 | 2020-09-27 | Chip testing device and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022062852A1 (en) * | 2020-09-27 | 2022-03-31 | 国网冀北电力有限公司计量中心 | Chip testing apparatus, system and method |
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2020
- 2020-09-27 CN CN202022152722.2U patent/CN213337905U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022062852A1 (en) * | 2020-09-27 | 2022-03-31 | 国网冀北电力有限公司计量中心 | Chip testing apparatus, system and method |
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