CN207281106U - Small lead pin pitch semiconductor devices bare chip aging test socket - Google Patents
Small lead pin pitch semiconductor devices bare chip aging test socket Download PDFInfo
- Publication number
- CN207281106U CN207281106U CN201721204659.4U CN201721204659U CN207281106U CN 207281106 U CN207281106 U CN 207281106U CN 201721204659 U CN201721204659 U CN 201721204659U CN 207281106 U CN207281106 U CN 207281106U
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- bare chip
- clamping piece
- pedestal
- semiconductor devices
- pin
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Abstract
The utility model discloses a kind of small lead pin pitch semiconductor devices bare chip aging test socket, including wiring board；The side of the wiring board is equipped with the pin hole of normal pitch, and testing needle is welded with the pin hole, and the center of the wiring board bottom surface is equipped with cantilever spring pin, and the testing needle connects the cantilever spring pin；The lower section of the wiring board, which is equipped with, to be used to fix bare chip, and the input and output pin leads of the bare chip is contacted the clamper of the cantilever spring pin.It has the technical effect that：It can ensure that contact of the bare chip with testing wedge contact is flexible contact, ensure the reliability of contact, 0.40 millimeter of manufacture craft is less than suitable for lead pin pitch, ensure that contact does not influence to reuse because of permanent deformation.
Description
Technical field
It the utility model is related to the small lead pin pitch semiconductor devices bare chip aging in semiconductor devices burn-in test field
Test jack.
Background technology
Definition is made to several Key Terms in the utility model first：
Distance between the adjacent input and output pin leads of small lead pin pitch, i.e. semiconductor devices bare chip is less than 0.40 milli
Rice.
Semiconductor devices bare chip, i.e., cut down also unencapsulated single semiconductor devices silicon wafer on semiconductor wafers
Piece.
Semiconductor devices bare chip aging test socket, i.e., fix semiconductor devices bare chip and semiconductor devices is defeated
Enter output pin lead and draw the device for being used for high/low temperature burn-in test.
The miniaturization of electronic system is integrated to bring the demand vigorous to multi-chip module (MCM).With multiple bare chip groups
Into the reliability of multi-chip module depend greatly on the reliability of the single bare chip in component because component
In any one bare chip failure then mean component failures.The method of bare chip quality is improved mainly by existing to bare chip
Aging at temperature is carried out under powering state, rejects the bare chip of initial failure and existing defects, stability parameter, ensures to pick out
Bare chip quality it is consistent with desired level of quality.Needed during to single bare chip burn-in test one can be with
Fixed bare chip simultaneously draws the input and output pin leads of bare chip follow-up in order to measure and do not influence known-good die piece
The device used.
The principle of current technology scheme is:A flexible PCB, flexible circuit are fixed on a stable pedestal
One contact consistent with the point position for the bare chip back-off that needs are tested of center deposition of plate top surface.Two phases of flexible PCB
To side be equipped with the test PAD that is connected with contact, for test.Bare chip is fixed on flexible circuit by a posting
Being set on the top surface of plate, above posting can be fixed with a compact heap for carrying spring, compact heap by screw and posting,
And bare chip is compressed by spring.
Its shortcoming is：
First, the contact Hard link in bare chip input and output pin leads and flexible PCB, height when contact makes
Low injustice directly affects the reliability of contact.
Second, the spacing minimum for making the contact of the technique making of contact at present can be 0.40 millimeter.It is small for spacing
In 0.40 millimeter of contact manufacture craft also without the example of practical application.
3rd, since the contact on bare chip input and output pin leads and flexible PCB is Hard link, contact is being done
After one ageing cycle, contact can produce permanent deformation under the action of contact and temperature, influence to reuse.
4th, when bare chip is put into posting, positioned by the dimensional fits of bare chip shape and posting inside casing.Due to naked
All there are mismachining tolerance for chip shape and posting inside casing size, it is ensured that bare chip can be conveniently located into posting, naked
There is certain gap between chip shape and posting inside casing, and the presence in this gap can cause contact and bare chip to input
Output pin wire contacts are unreliable.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, there is provided a kind of small lead pin pitch semiconductor devices
Bare chip aging test socket, it can ensure that contact be flexible contact to bare chip with test wedge contact, and ensure to contact can
By property, suitable for manufacture craft of the lead pin pitch less than 0.40 millimeter, ensure that contact does not influence to reuse because of permanent deformation.
Realizing a kind of technical solution of above-mentioned purpose is：A kind of small lead pin pitch semiconductor devices bare chip burn-in test is inserted
Seat, including wiring board；The side of the wiring board is equipped with the pin hole of normal pitch, is welded with testing needle on the pin hole, institute
The center for stating wiring board bottom surface is equipped with cantilever spring pin, and the testing needle connects the cantilever spring pin；
The lower section of the wiring board, which is equipped with, to be used to fix bare chip, and connects the input and output pin leads of the bare chip
Touch the clamper of the cantilever spring pin.
Further, the clamper includes pedestal and bare chip positioning seat, and the center of the pedestal is equipped with positioning through hole,
The position of the positioning through hole and the position correspondence of the cantilever spring pin, the bare chip positioning seat is in the lower section of the pedestal
With the positioning through hole grafting, and fixed with the pedestal, the top surface of the bare chip positioning seat is to applied to positioning bare chip
Bare chip test position.
Further, the top surface of the pedestal is equipped with spring through hole, and outer clamping is additionally provided with the top surface of the pedestal
Piece and the interior clamping piece positioned at the outer clamping piece radially inner side, are equipped with the spring through hole and connect the pedestal and described
Shape between the distal end base of the spring on the distal end base of outer clamping piece, the distal end base of the outer clamping piece and the interior clamping piece
Into the bare chip test position；
A horizontal push parallel with the telescopic direction of the spring is additionally provided with the pedestal, the horizontal push
One end connects the interior clamping piece, and other end stretches out the pedestal；
Between two sides of the interior clamping piece and the outer clamping piece, it is correspondingly provided with one and is used to drive the inner clip
Hold piece and the swing component of the outer clamping piece synchronous backward horizontal displacement.
Further, the shape of the swing component is dual kidney-shaped.
Further, the top surface of the pedestal is equipped with two the first caging bolts, the distal end base of the outer clamping piece
Both ends be respectively provided with one can with corresponding first caging bolt be clamped the first limiting section.
Further, the top surface of the pedestal is equipped with positioned at the near-end base of the interior clamping piece and the outer clamping piece
Near-end base between the second caging bolt, the near-end base of the interior clamping piece is equipped with can be with second caging bolt
Second limiting section of clamping.
Further, the horizontal push is set along the diagonal of the base top surface.
Further, the top of the wiring board sets pressing plate, and the lower section of the wiring board sets positioning framework, described
Positioning framework is equipped with through hole corresponding with the cantilever spring pin position, the pressing plate, the wiring board and the positioning framework
Fixed by screw.
Further, the positioning framework is fixed by adjustable bolt and the pedestal.
Employ a kind of technical side of small lead pin pitch semiconductor devices bare chip aging test socket of the utility model
Case, including wiring board；The side of the wiring board is equipped with the pin hole of normal pitch, is welded with testing needle on the pin hole, institute
The center for stating wiring board bottom surface is equipped with cantilever spring pin, and the testing needle connects the cantilever spring pin；Under the wiring board
Side, which is equipped with, to be used to fix bare chip, and the input and output pin leads of the bare chip is contacted the clamping of the cantilever spring pin
Device.It has the technical effect that：It is flexible contact that it, which can ensure that bare chip is contacted with test wedge contact, ensures the reliable of contact
Property, suitable for manufacture craft of the lead pin pitch less than 0.40 millimeter, ensure that contact does not influence to reuse because of permanent deformation.
Brief description of the drawings
Fig. 1 is a kind of exploded view of small lead pin pitch semiconductor devices bare chip aging test socket of the utility model.
Fig. 2 is a kind of clamper of small lead pin pitch semiconductor devices bare chip aging test socket of the utility model
Exploded view.
Fig. 3 is a kind of clamper of small lead pin pitch semiconductor devices bare chip aging test socket of the utility model
General assembly drawing.
Fig. 4 is a kind of pin card component of small lead pin pitch semiconductor devices bare chip aging test socket of the utility model
Stereogram
Fig. 5 is a kind of pin card component of small lead pin pitch semiconductor devices bare chip aging test socket of the utility model
Side view
Fig. 6 is a kind of stereogram of small lead pin pitch semiconductor devices bare chip aging test socket of the utility model.
Embodiment
Please refer to Fig.1 to Fig. 6, the inventor of the utility model in order to preferably to the technical solution of the utility model into
Row understands, is described in detail below by specifically embodiment, and with reference to attached drawing：
Please refer to Fig.1 to Fig. 6, a kind of small lead pin pitch semiconductor devices bare chip burn-in test of the utility model and insert
Seat, including wiring board 4, the pin hole of normal pitch is equipped with four sides of wiring board 4, test is welded with the pin hole
Pin 3.The center of 4 bottom surface of wiring board is equipped with cantilever spring pin 16, and testing needle 3 is connected by line with cantilever spring pin 16.Cantilever
The tip of elastic needle 16 corresponds to the center of the corresponding input and output pin leads of bare chip.When the pin end of cantilever spring pin 16
Can be by welding the testing needle 3 in assist side 4 to naked during input and output pin leads reliable contacts corresponding to bare chip
Chip is tested.
The effect of cantilever spring pin 16 is：It can ensure that contact of the bare chip with testing wedge contact is that flexibility connects
Touch, ensure the reliability of contact, 0.40 millimeter of manufacture craft is less than suitable for lead pin pitch, ensure contact not because of permanent deformation
And influence to reuse.
The small lead pin pitch semiconductor devices bare chip aging test socket of the utility model further includes a clamper, institute
Stating clamper includes pedestal 13 and bare chip positioning seat 14, and the center of pedestal 13 is equipped with a positioning through hole 131, logical positioned at positioning
The spring through hole 132 on the side of hole 131, bare chip positioning seat 14 is in the lower section of pedestal 13 and 131 grafting of positioning through hole, and by tight
Gu screw 15 is fixed with pedestal 13.
The center of 13 top surface of pedestal is equipped with outer clamping piece 11.Outer 45 degree of 13 horizontal deflection of clamping piece opposite base.Spring leads to
Spring 12 is equipped with hole 132, one end of spring 12 connects the distal end base of outer clamping piece 11 in connection pedestal 13, other end.
Outer 11 radially inner side of clamping piece is equipped with interior clamping piece 8.The near-end base of interior clamping piece 8 and the near-end of outer clamping piece 11
The second caging bolt 72 for being used for compressing interior clamping piece 8 and outer clamping piece 11, the near-end base of interior clamping piece 8 are equipped between base
It is equipped with the second limiting section 81 that can be clamped with the second caging bolt 72.The top surface of pedestal 13 is additionally provided with two and is used to compress outer clip
The first caging bolt 71 of piece 11 is held, the both ends on the distal end base of outer clamping piece 11 are respectively provided with one can be with the corresponding first spacing spiral shell
The first limiting section 111 that bolt 71 is clamped.Bare chip is clamped in the distal end base of outer clamping piece 11 and the distal end bottom of interior clamping piece 8
Between side, and in the bare chip test position 17 of 131 position correspondence of positioning through hole.
It is equipped with a diagonal with 13 top surface of pedestal in pedestal 13, and the parallel level of telescopic direction of spring 12 pushes away
Bar 10.One end of horizontal push 10 is that the apex angle from pedestal 13 close to the near-end base side of outer clamping piece 11 stretches out pedestal 13,
Clamping piece 8 in other end connection.
Between two sides of interior clamping piece 8 and outer clamping piece 11, outer 11 He of clamping piece can be compressed at the same time by being respectively provided with one
Interior clamping piece 8, can horizontal hunting, drive the dual kidney-shaped of outer clamping piece 11 and interior clamping piece 8 synchronous backward horizontal displacement
Swing component 9.
Need to bare chip test position 17 open when linkage process：Horizontal push 10 to close to spring 12 1 lateral movement,
Clamping piece 8 is stirred swing component 9 and is swung to away from 12 side horizontal displacement of spring, interior clamping piece 8 in promotion, and swing component 9 promotes outer
Clamping piece 11 compresses spring 12, bare chip test position 17 is opened to close to 12 side reverse sync horizontal displacement of spring.
In clamping process：Horizontal push 10 is to away from spring 12 1 lateral movement, and clamping piece 8 is to close to spring 12 1 in promotion
Side horizontal displacement, interior clamping piece 8 are stirred swing component 9 and are swung, and swing component 9 promotes outer clamping piece 11 in the same direction to remote 12 side of spring
Horizontal displacement, bare chip test position 17 are returned to and 131 corresponding position of positioning through hole and step up, should during spring 12 all the time
In compressive state.
The effect of above-mentioned design is：Avoid the dimensioned error due to bare chip shape and posting inside casing and shape
Into bare chip shape and posting inside casing between fixed gap, ensure contact and bare chip input and output pin leads contact
Reliability.
Positioning framework 6 is coaxially disposed between the clamper and wiring board 4, the center of positioning framework 6 is equipped with and wiring board 4
The through hole 61 of 16 position correspondence of cantilever spring pin of bottom center, positioning framework 6 pass through adjustable bolt 62 and the clamper
Pedestal 13 fix.The top of wiring board 4 is coaxially disposed pressing plate 2, and pressing plate 2, wiring board 4 and positioning framework 6 are fixed by screw,
Constitute pin card component.By the adjustable bolt 62 set bare chip input and output pin leads and cantilever spring pin 16 it
Between the relative position of in the vertical direction carry out the accurate deflection for controlling contact back boom elastic needle 16, so as to ensure cantilever spring
The pin end of pin 16 is effectively contacted with bare chip input and output pin leads, and guarantee does not influence to reuse because of contact deflection.
The small lead pin pitch semiconductor devices bare chip aging test socket of the utility model, is made using cantilever spring pin 16
For the contact contacted with bare chip input and output pin leads, realized by controlling the juxtaposition metamorphose amount of cantilever spring pin 16
Meet bare chip follow-up requirement while reliable contacts again.Using the clamper, bare chip input and output pin is realized
Accurate positionin between lead and cantilever spring pin 16, realizes the repeatability positioned in burn-in test, is the more product of small lot
The small lead pin pitch bare chip burn-in test of kind provides a kind of reusable socket device.
Can be with by the testing needle 3 on the small lead pin pitch semiconductor devices bare chip aging test socket of the utility model
The test of bare chip is carried out, or the small lead pin pitch semiconductor devices bare chip aging test socket of the utility model is installed on
In burn-in board, aging at temperature case is put into, is tested under ageing state.
Those of ordinary skill in the art is it should be appreciated that the embodiment of the above is intended merely to illustrate that this practicality is new
Type, and be not used as the restriction to the utility model, as long as in the spirit of the utility model, to the above
Change, the modification of embodiment will all fall in the Claims scope of the utility model.
Claims (9)
1. a kind of small lead pin pitch semiconductor devices bare chip aging test socket, including wiring board, it is characterised in that：The line
The side of road plate is equipped with the pin hole of normal pitch, is welded with testing needle on the pin hole, the center of the wiring board bottom surface is set
There is cantilever spring pin, the testing needle connects the cantilever spring pin；
The lower section of the wiring board, which is equipped with, to be used to fix bare chip, and the input and output pin leads of the bare chip is contacted institute
State the clamper of cantilever spring pin.
2. a kind of small lead pin pitch semiconductor devices bare chip aging test socket according to claim 1, its feature exist
In：The clamper includes pedestal and bare chip positioning seat, and the center of the pedestal is equipped with positioning through hole, the positioning through hole
Position and the position correspondence of the cantilever spring pin, the bare chip positioning seat is in the lower section of the pedestal and the positioning through hole
Grafting, and fixed with the pedestal, the top surface of the bare chip positioning seat is to the bare chip test position applied to positioning bare chip.
3. a kind of small lead pin pitch semiconductor devices bare chip aging test socket according to claim 2, its feature exist
In：The top surface of the pedestal is equipped with spring through hole, outer clamping piece is additionally provided with the top surface of the pedestal and positioned at described outer
The interior clamping piece of clamping piece radially inner side, the distal end bottom for connecting the pedestal and the outer clamping piece is equipped with the spring through hole
The bare chip test is formed between the distal end base of the spring on side, the distal end base of the outer clamping piece and the interior clamping piece
Position；
A horizontal push parallel with the telescopic direction of the spring, one end of the horizontal push are additionally provided with the pedestal
The interior clamping piece is connected, other end stretches out the pedestal；
Between two sides of the interior clamping piece and the outer clamping piece, it is correspondingly provided with one and is used to drive the interior clamping piece
With the swing component of the outer clamping piece synchronous backward horizontal displacement.
4. a kind of small lead pin pitch semiconductor devices bare chip aging test socket according to claim 3, its feature exist
In：The shape of the swing component is dual kidney-shaped.
5. a kind of small lead pin pitch semiconductor devices bare chip aging test socket according to claim 3, its feature exist
In：The top surface of the pedestal is equipped with two the first caging bolts, and the both ends on the distal end base of the outer clamping piece are respectively provided with one
The first limiting section that can be clamped with corresponding first caging bolt.
6. a kind of small lead pin pitch semiconductor devices bare chip aging test socket according to claim 3, its feature exist
In：The top surface of the pedestal is equipped between the near-end base of the interior clamping piece and the near-end base of the outer clamping piece
Second caging bolt, the near-end base of the interior clamping piece are spacing equipped with can be clamped with second caging bolt second
Portion.
7. a kind of small lead pin pitch semiconductor devices bare chip aging test socket according to claim 3, its feature exist
In：The horizontal push is set along the diagonal of the base top surface.
8. a kind of small lead pin pitch semiconductor devices bare chip aging test socket according to claim 2, its feature exist
In：The top of the wiring board sets pressing plate, and the lower section of the wiring board sets positioning framework, and the positioning framework is equipped with and institute
The corresponding through hole of cantilever spring pin position is stated, the pressing plate, the wiring board and the positioning framework are fixed by screw.
9. a kind of small lead pin pitch semiconductor devices bare chip aging test socket according to claim 8, its feature exist
In：The positioning framework is fixed by adjustable bolt and the pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721204659.4U CN207281106U (en) | 2017-09-20 | 2017-09-20 | Small lead pin pitch semiconductor devices bare chip aging test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721204659.4U CN207281106U (en) | 2017-09-20 | 2017-09-20 | Small lead pin pitch semiconductor devices bare chip aging test socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207281106U true CN207281106U (en) | 2018-04-27 |
Family
ID=61982271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721204659.4U Active CN207281106U (en) | 2017-09-20 | 2017-09-20 | Small lead pin pitch semiconductor devices bare chip aging test socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207281106U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110518397A (en) * | 2019-08-29 | 2019-11-29 | 中国科学院长春光学精密机械与物理研究所 | The assembly system of the focal plane plate of limited space is unstressed socket |
| CN110994223A (en) * | 2019-11-13 | 2020-04-10 | 北京时代民芯科技有限公司 | Burn-in test socket for switching power supply circuit |
| CN112083313A (en) * | 2020-09-11 | 2020-12-15 | 苏州韬盛电子科技有限公司 | Test fixture of ultra-thin naked die IGBT chip |
| CN114062907A (en) * | 2022-01-18 | 2022-02-18 | 江山季丰电子科技有限公司 | Chip aging test monitoring method, electronic device and storage medium |
| CN114137396A (en) * | 2021-12-07 | 2022-03-04 | 华东光电集成器件研究所 | Bare chip testing device and testing method based on testing system |
-
2017
- 2017-09-20 CN CN201721204659.4U patent/CN207281106U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110518397A (en) * | 2019-08-29 | 2019-11-29 | 中国科学院长春光学精密机械与物理研究所 | The assembly system of the focal plane plate of limited space is unstressed socket |
| CN110994223A (en) * | 2019-11-13 | 2020-04-10 | 北京时代民芯科技有限公司 | Burn-in test socket for switching power supply circuit |
| CN110994223B (en) * | 2019-11-13 | 2021-08-13 | 北京时代民芯科技有限公司 | Burn-in test socket for switching power supply circuit |
| CN112083313A (en) * | 2020-09-11 | 2020-12-15 | 苏州韬盛电子科技有限公司 | Test fixture of ultra-thin naked die IGBT chip |
| CN114137396A (en) * | 2021-12-07 | 2022-03-04 | 华东光电集成器件研究所 | Bare chip testing device and testing method based on testing system |
| CN114062907A (en) * | 2022-01-18 | 2022-02-18 | 江山季丰电子科技有限公司 | Chip aging test monitoring method, electronic device and storage medium |
| CN114062907B (en) * | 2022-01-18 | 2022-04-26 | 江山季丰电子科技有限公司 | Chip aging test monitoring method, electronic device and storage medium |
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