CN102981129B - Testing tool for power supply - Google Patents

Testing tool for power supply Download PDF

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Publication number
CN102981129B
CN102981129B CN201210530213.6A CN201210530213A CN102981129B CN 102981129 B CN102981129 B CN 102981129B CN 201210530213 A CN201210530213 A CN 201210530213A CN 102981129 B CN102981129 B CN 102981129B
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CN
China
Prior art keywords
power supply
probe
pcb substrate
supply test
test instrument
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Expired - Fee Related
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CN201210530213.6A
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Chinese (zh)
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CN102981129A (en
Inventor
雷震
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Nantong Fort point sensor Co. Ltd.
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Huawei Technologies Co Ltd
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Priority to CN201210530213.6A priority Critical patent/CN102981129B/en
Publication of CN102981129A publication Critical patent/CN102981129A/en
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Abstract

The invention discloses a testing tool for a power supply. The testing tool for the power supply comprises a PCB (printed circuit board) substrate (101;201), a connector (102;202), a direct-current isolation capacitor (103;203), a positive-electrode coating probe (104;204) and a negative-electrode coating probe (105;205) that are located on the PCB substrate (101;201), wherein the positive-electrode coating probe (104;204) is electrically connected with one end of the direct-current isolation capacitor (103;203); the other end of the direct-current isolation capacitor (103;203) is electrically connected with a positive electrode of the connector (102;202); the PCB substrate (101;201) is laid with copper and grounded; the negative-electrode coating probe (105;205) is electrically connected with a negative electrode of the connector (102;202) through a copper layer on the PCB substrate (101;201). The testing tool for the power supply is designed based on the PCB substrate, is small in testing loop, high in testing accuracy and convenient to use, and can improve the testing efficiency.

Description

Power supply test instrument
Technical field
The present invention relates to power supply test field, and more specifically, relate to power supply test instrument.
Background technology
Power supply ripple and noise are one of most important parameter index of power supply, and qualified power supply makes veneer circuit and chip normally work.Because chip integration is more and more higher, supply voltage is more and more lower, noise margin is more and more less, more and more higher to test request, and the interference in test process is easy to cause test result defective.
Existing power supply Ripple Noise method of testing is more and more difficult to meet the requirement that testing efficiency and test accuracy meet simultaneously, needs to introduce the balance that new measuring technology solves testing efficiency and test accuracy.As used the method at substantial time operation of welding coaxial cable test loaded down with trivial details, and passive probe test easy introducing interference is used to cause test inaccurate.
Summary of the invention
Embodiments provide a kind of power supply test instrument, can testing efficiency be improved.
First aspect, provides a kind of power supply test instrument, comprising: printed circuit board (Printed Circuit Board, PCB) substrate 101,201; Be positioned at this PCB substrate 101, the connector 102,202 on 201, DC-isolation electric capacity 103,203, positive pole coating probe 104,204 and negative pole coating probe 105,205; This positive pole coating probe 104,204 is electrically connected with one end of this DC-isolation electric capacity 103,203, this DC-isolation electric capacity 103, and the positive pole of the other end of 203 and this connector 102,202 is electrically connected; This PCB substrate 101,201 upper berth copper ground connection, this negative pole coating probe 105,205 is by this PCB substrate 101, and the negative electricity of the layers of copper on 201 and this connector 102,202 connects.
In the implementation that the first is possible, this power supply test instrument also comprises a pair probe 106,206, is welded on this positive pole coating probe 104,204 and this negative pole coating probe 105 respectively, on 205.
In the implementation that the second is possible, in conjunction with the first possible implementation of first aspect or first aspect, this PCB substrate 101 side has opening, and this positive pole coating probe 104 and this negative pole coating 105 symmetries of popping one's head in are positioned at this opening both sides.
In the implementation that the third is possible, the implementation that the second in conjunction with first aspect is possible, this probe 106 Parallel Symmetric distribution or symmetrical in opposite directions.
In the 4th kind of possible implementation, in conjunction with the second or the third possible implementation of first aspect, this power supply test instrument also comprises handle installing hole 113, is positioned in this PCB substrate 101, for mounting handle shell.
In the 5th kind of possible implementation, in conjunction with the first possible implementation of first aspect or first aspect, this PCB substrate 201 comprises the first PCB substrate 2011 and the second PCB substrate 2012, this positive pole coating probe 204, this DC-isolation electric capacity 203 and this connector 202 are positioned in this first PCB substrate 2011, this negative pole coating probe 205 is positioned in this second PCB substrate 2012, is connected altogether between this first PCB substrate 2011 and this second PCB substrate 2012 by wire 207.
In the 6th kind of possible implementation, in conjunction with the 5th kind of possible implementation of first aspect, this power supply test instrument also comprises support 208, and this first PCB substrate 2011 and this second PCB substrate 2012 are individually fixed in the both sides of this support 208.
In the 7th kind of possible implementation, in conjunction with the 5th kind or the 6th kind of possible implementation of first aspect, this wire 207 is compliant conductive metal or cable.
In the 8th kind of possible implementation, in conjunction with the 5th kind or the 6th kind or the 7th kind of possible implementation of first aspect, this support 208 also comprises spacing adjusting device 209, to regulate the spacing of this positive pole coating probe 204 and this negative pole coating probe 205.
In the 9th kind of possible implementation, in conjunction with any one the possible implementation in the five to eight kind of first aspect possible implementation, this power supply test instrument also comprises alignment mounting hole 213, be positioned in this first PCB substrate 2011 and this second PCB substrate 2012, this positive pole coating probe 204 and this negative pole coating probe 205 are installed for aliging.
In the tenth kind of possible implementation, in conjunction with any one the possible implementation in the first to nine kind of first aspect or first aspect possible implementation, this power supply test instrument also comprise be positioned at this positive pole coating probe 104, the polarity mark 110,210 near 204.
In the 11 kind of possible implementation, in conjunction with any one the possible implementation in the first to ten kind of first aspect or first aspect possible implementation, this power supply test instrument also comprise be positioned at this positive pole coating probe 104, positive pole indication light diode (Light Emitting Diode near 204, LED) 111,211.
In the 12 kind of possible implementation, in conjunction with the 11 kind of possible implementation of first aspect, this power supply test instrument also comprises LED power 112,212, for giving the power supply of this positive pole indication LED 111,211.
In the 13 kind of possible implementation, in conjunction with any one the possible implementation in the first to ten two kind of possible implementation of first aspect or first aspect, this positive pole coating probe 104,204 and this negative pole coating probe 105,205 are gold-plated probe.
In the 14 kind of possible implementation, in conjunction with any one the possible implementation in the first to ten three kind of possible implementation of first aspect, this probe 106,206 is telescopic probe.
In the 15 kind of possible implementation, in conjunction with any one the possible implementation in the first to ten four kind of possible implementation of first aspect, this probe 106,206 is gold-plated reed.
Based on technique scheme, the power supply test instrument Based PC B substrate design of the embodiment of the present invention, negative pole coating probe is connected with the negative electricity of connector by the layers of copper in PCB substrate, thus ground wire is short, test loop is little, and test accuracy is high, and uses the power supply test instrument of the embodiment of the present invention not need welding, convenient test, thus can testing efficiency be improved.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, be briefly described to the accompanying drawing used required in the embodiment of the present invention below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the power supply test instrument according to the embodiment of the present invention.
Fig. 2 is the using method schematic diagram of the power supply test instrument according to the embodiment of the present invention.
Fig. 3 A and Fig. 3 B is the schematic diagram of the probe of power supply test instrument according to the embodiment of the present invention.
Fig. 4 A and Fig. 4 B is another schematic diagram of the probe of power supply test instrument according to the embodiment of the present invention.
Fig. 5 is the schematic diagram of power supply test instrument according to another embodiment of the present invention.
Fig. 6 is the using method schematic diagram of power supply test instrument according to another embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is a part of embodiment of the present invention, instead of whole embodiment.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all should belong to the scope of protection of the invention.
Fig. 1 is the schematic diagram of the power supply test instrument 100 according to the embodiment of the present invention.As shown in Figure 1, this power supply test instrument 100 comprises:
PCB substrate 101;
Be positioned at the connector 102 in this PCB substrate 101, DC-isolation electric capacity 103, positive pole coating probe 104 and negative pole coating probe 105;
This positive pole coating probe 104 is electrically connected with one end of this DC-isolation electric capacity 103, and the other end of this DC-isolation electric capacity 103 is electrically connected with the positive pole of this connector 102;
This PCB substrate 101 upper berth copper ground connection, this negative pole coating probe 105 is connected with the negative electricity of this connector 102 by the layers of copper in this PCB substrate 101.
In embodiments of the present invention, power supply test instrument 100 designs in one piece of PCB substrate 101, and PCB substrate 101 side has opening, and positive pole coating probe 104 and negative pole coating 105 symmetries of popping one's head in are positioned at opening both sides.Connector 102 is for connecting oscillograph.Positive pole coating probe 104, DC-isolation electric capacity 103 are connected with the positive pole of connector 102.PCB substrate 101 upper berth copper ground connection, makes negative pole coating probe 105 be connected with the negative electricity of connector 102.That is, PCB substrate 101 upper berth copper ground connection, forms layers of copper, and negative pole coating probe 105 is connected by the negative electricity of layers of copper with connector 102.Carry out impedance Control when PCB substrate 101 designs, by impedance Control, make the impedance from probe to connector continuously and and concentric cable or oscillograph input impedance be consistent, thus guarantee that test result is accurate.
During testing single-board power supply ripple noise, connector 102 is connected oscillograph.Such as, connector 102 can adopt coaxial cable connector.Connector 102 is connected oscillograph by concentric cable, and positive pole coating probe 104 contacts the positive and negative power supply end (as shown in Figure 2) of tested power supply respectively with negative pole coating probe 105.Alternatively, positive pole coating probe 104 and negative pole coating probe 105 can adopt gold-plated probe, to reduce contact impedance.Power supply ripple noise, through DC-isolation electric capacity 103, enters oscillograph for signal testing by the concentric cable be connected with connector 102.
In embodiments of the present invention, the ground wire based on PCB design is short, and test loop is little, and test accuracy is high; The mode of non-solder by probe contacts, significantly reduces test setup time and environment removes the time, and the mounting or dismounting repeatedly of welding and environment can also be avoided to move, and eliminates the veneer damage because pad stress causes, thus greatly improves testing efficiency.
In embodiments of the present invention, as shown in Figure 1, alternatively, this power supply test instrument 100 also comprises a pair probe 106, is welded on respectively on this positive pole coating probe 104 and negative pole coating probe 105.During testing single-board power supply ripple noise, two probes 106 are contacted respectively the positive-negative power end of tested power supply, such as via hole or patch capacitor both positive and negative polarity, can contact better, convenient test and also accuracy high.Alternatively, probe 106 can select telescopic probe, spring can be used also can to use flexible metal shell fragment, such as, gold-plated reed, gold-plated flexible sheet metal piece, gold-plated flexible metal probe and automatic on-line tester (In Circuit Tester, ICT) probe etc.
In embodiments of the present invention, alternatively, probe 106 can Parallel Symmetric distribution (as shown in Figure 3 A and Figure 3 B), also can symmetrical in opposite directions (as shown in Figure 4 A and 4 B shown in FIG.).In the embodiment of probe 106 Parallel Symmetric distribution, test spacing is fixed, and as shown in Figure 3 B, two probes can be inserted the via hole of tested power supply positive and negative terminal or contact tested power supply positive and negative terminal during test.In the embodiment that probe 106 is symmetrical in opposite directions, test gap variable, as shown in Figure 4 B, can by two tested power supply positive and negative terminals of probes touch during test, according to different test spacing, the different parts of two probes can be contacted tested power supply positive and negative terminal, such as, spacing hour, can by tested for the nib contacts of two probes power supply positive and negative terminal, when spacing is larger, the middle part of two probes can be contacted tested power supply positive and negative terminal.
In embodiments of the present invention, as shown in Figure 1, alternatively, this power supply test instrument 100 also comprises polarity mark 110, and polarity mark 110 is positioned near positive pole coating probe 104.Guarantee that polarity is correct in order to avoid reverse polarity connection causes Damage by Short Circuit tested single board or instrument by polarity mark 110.
Should be understood that polarity mark also can be positioned near negative pole coating probe, mark negative pole, this equivalent transformation mode also should be encompassed in protection scope of the present invention.
In embodiments of the present invention, as shown in Figure 1, alternatively, this power supply test instrument 100 also comprises positive pole indication LED 111, and positive pole indication LED 111 is positioned near positive pole coating probe 104.During testing single-board power supply ripple noise, the both positive and negative polarity of tested single board power supply can be soundd out in advance by positive pole coating probe 104, represent that the power supply of contact is positive pole when positive pole indication LED 111 lamp is bright.
Alternatively, this power supply test instrument 100 also comprises LED power 112, powers for giving positive pole indication LED 111.That is, positive pole indication LED 111 only requires that tested power supply does voltage and judges to be not used in driving LED, and independently-powered by LED power 112, does not affect one-board power supply test result like this.
The implementation of electric power polarity indication LED can have multiple, as by small current driving mos field effect transistor (metal-oxid-semiconductor, MOS), triode even the method such as simple door circuit reach the object of micro-loading driving LED instruction.
The power supply test instrument of the embodiment of the present invention, is identified by positive pole indication LED and polarity mark and confirms the both positive and negative polarity of veneer electric power network, can guarantee can not to connect and instead cause short circuit by both positive and negative polarity.
In embodiments of the present invention, as shown in Figure 1, alternatively, this power supply test instrument 100 also comprises handle installing hole 113, is positioned in PCB substrate 101, for mounting handle shell.The quantity of mounting hole 113 can need to determine according to installation.Shell selective metal material electromagnetic screen internal layer, and with PCB hold and be electrically connected, maskable external interference.That is, shell not only can handled easily, also effectively can shield external disturbance, thus improves test accuracy.
The power supply test instrument Based PC B substrate design of the embodiment of the present invention, negative pole coating probe is connected with the negative electricity of connector by the layers of copper in PCB substrate, thus ground wire is short, test loop is little, test accuracy is high, and use the power supply test instrument of the embodiment of the present invention not need welding, convenient test, thus testing efficiency can be improved.
Above composition graphs 1 to Fig. 4, describes first embodiment of the power supply test instrument of the embodiment of the present invention in detail, below in conjunction with Fig. 5 and Fig. 6, describes second embodiment of the power supply test instrument of the embodiment of the present invention in detail.
Fig. 5 is the schematic diagram of the power supply test instrument 200 according to the embodiment of the present invention.As shown in Figure 2, this power supply test instrument 200 comprises:
PCB substrate 201;
Be positioned at the connector 202 in this PCB substrate 201, DC-isolation electric capacity 203, positive pole coating probe 204 and negative pole coating probe 205;
This positive pole coating probe 204 is electrically connected with one end of this DC-isolation electric capacity 203, and the other end of this DC-isolation electric capacity 203 is electrically connected with the positive pole of this connector 202;
This PCB substrate 201 upper berth copper ground connection, this negative pole coating probe 205 is connected with the negative electricity of this connector 202 by the layers of copper in this PCB substrate 201.
In embodiments of the present invention, power supply test instrument 200 designs in two pieces of PCB substrate, namely PCB substrate 201 comprises the first PCB substrate 2011 and the second PCB substrate 2012, positive pole coating probe 204, DC-isolation electric capacity 203 and connector 202 are positioned in the first PCB substrate 2011, negative pole coating probe 205 is positioned in the second PCB substrate 2012, is connected altogether between two pieces by wire 207.Connector 202 is for connecting oscillograph.PCB substrate 201 upper berth copper ground connection, form layers of copper, like this, positive pole coating probe 204, DC-isolation electric capacity 203 are electrically connected with the positive pole of connector 202, and negative pole coating probe 205 is connected with the negative electricity of connector 202 by the layers of copper in PCB substrate 201 and wire 207.Impedance Control is carried out when PCB substrate 201 designs, wire 207 can select high bandwidth cable or compliant conductive metal, such as, soft coaxial cable, soft PCB, soft arranging wire etc., can make ground wire short like this, test loop is little, test accuracy is high, and both positive and negative polarity coating probe lays respectively in two pieces of PCB substrate, probe spacing can be adjusted, with the requirement of satisfied difference test spacing.
In embodiments of the present invention, as shown in Figure 5, alternatively, this power supply test instrument 200 also comprises support 208, first PCB substrate 2011 and the second PCB substrate 2012 are individually fixed in the both sides of support 208, and positive pole coating probe 204 and negative pole coating are popped one's head in 205 symmetrical.Support 208 is double does operating grip, two pieces of PCB substrate 201 is individually fixed in the both sides of support 208, convenient operation.Alternatively, support 208 also comprises spacing adjusting device 209, can be made the spacing change of positive pole coating probe 204 and negative pole coating probe 205, to meet the requirement of different test scenes by spacing regulating device 209.Alternatively, this power supply test instrument 200 also comprises alignment mounting hole 213, is positioned in the first PCB substrate 2011 and the second PCB substrate 2012, installs positive pole coating probe 204 and negative pole coating probe 205 for aliging.Alignment mounting hole 213 such as, in the first PCB substrate 2011 and the second PCB substrate 2012 can be symmetrical arranged, and is convenient to alignment and installs.Positive pole coating probe 204 and negative pole coating probe 205 alignment are installed to facilitate test.
In embodiments of the present invention, alternatively, positive pole coating probe 204 and negative pole coating probe 205 can adopt gold-plated probe, to reduce contact impedance.As shown in Figure 5, alternatively, this power supply test instrument 200 also comprises a pair probe 206, is welded on respectively on positive pole coating probe 204 and negative pole coating probe 205.During testing single-board power supply ripple noise, two probes 206 are contacted respectively the positive-negative power end of tested power supply, such as via hole or patch capacitor both positive and negative polarity, can contact better, convenient test and also accuracy high.Alternatively, probe 206 can select telescopic probe, and spring can be used also can to use flexible metal shell fragment, such as, and gold-plated reed, gold-plated flexible sheet metal piece, gold-plated flexible metal probe and ICT probe etc.
Fig. 6 is the schematic diagram using power supply test instrument 200.During test, connector 202 is connected oscillograph.Such as, connector 202 can adopt coaxial cable connector.Be connected with oscillograph by concentric cable, the other end is connected with the connector of power supply test instrument, directly puts test at test position with power supply testing tool.Do not need extra power supply DC-isolation plate, do not need concentric cable to be welded on tested veneer yet.
In embodiments of the present invention, as shown in Figure 5, alternatively, this power supply test instrument 200 also comprises polarity mark 210, and polarity mark 210 is positioned near positive pole coating probe 204.Guarantee that polarity is correct in order to avoid reverse polarity connection causes Damage by Short Circuit tested single board or instrument by polarity mark 210.
Should be understood that polarity mark also can be positioned near negative pole coating probe, mark negative pole, this equivalent transformation mode also should be encompassed in protection scope of the present invention.
In embodiments of the present invention, as shown in Figure 5, alternatively, this power supply test instrument 200 also comprises positive pole indication LED 211, and positive pole indication LED 211 is positioned near positive pole coating probe 204.During testing single-board power supply ripple noise, the both positive and negative polarity of tested single board power supply can be soundd out in advance by positive pole coating probe 104, represent that the power supply of contact is positive pole when positive pole indication LED 211 lamp is bright.
Alternatively, this power supply test instrument 200 also comprises LED power 212, powers for giving positive pole indication LED 211.That is, positive pole indication LED 211 only requires that tested power supply does voltage and judges to be not used in driving LED, and independently-powered by LED power 212, does not affect one-board power supply test result like this.
The implementation of electric power polarity indication LED can have multiple, as by small current driving MOS, triode even the method such as simple door circuit reach the object of micro-loading driving LED instruction.
Identified by positive pole indication LED and polarity mark and confirm the both positive and negative polarity of veneer electric power network, can guarantee can not to connect and instead cause short circuit by both positive and negative polarity.
The power supply test tool design of the embodiment of the present invention is in two pieces of PCB substrate, and two pieces of PCB substrate connect altogether, and ground wire is short, and test loop is little, test accuracy is high, and probe spacing is adjustable, the requirement of different test spacing can be met, convenient test, thus can testing efficiency be improved.
Those of ordinary skill in the art can recognize, in conjunction with unit and the algorithm steps of each example of embodiment disclosed herein description, can realize with electronic hardware, computer software or the combination of the two, in order to the interchangeability of hardware and software is clearly described, generally describe composition and the step of each example in the above description according to function.These functions perform with hardware or software mode actually, depend on application-specific and the design constraint of technical scheme.Professional and technical personnel can use distinct methods to realize described function to each specifically should being used for, but this realization should not thought and exceeds scope of the present invention.
Those skilled in the art can be well understood to, and for convenience of description and succinctly, the specific works process of the system of foregoing description, device and unit, with reference to the corresponding process in preceding method embodiment, can not repeat them here.
In several embodiments that the application provides, should be understood that disclosed system, apparatus and method can realize by another way.Such as, device embodiment described above is only schematic, such as, the division of described unit, be only a kind of logic function to divide, actual can have other dividing mode when realizing, such as multiple unit or assembly can in conjunction with or another system can be integrated into, or some features can be ignored, or do not perform.In addition, shown or discussed coupling each other or direct-coupling or communication connection can be indirect coupling by some interfaces, device or unit or communication connection, also can be electric, machinery or other form connect.
The described unit illustrated as separating component or can may not be and physically separates, and the parts as unit display can be or may not be physical location, namely can be positioned at a place, or also can be distributed in multiple network element.Some or all of unit wherein can be selected according to the actual needs to realize the object of embodiment of the present invention scheme.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, and also can be that the independent physics of unit exists, also can be that two or more unit are in a unit integrated.Above-mentioned integrated unit both can adopt the form of hardware to realize, and the form of SFU software functional unit also can be adopted to realize.
If described integrated unit using the form of SFU software functional unit realize and as independently production marketing or use time, can be stored in a computer read/write memory medium.Based on such understanding, technical scheme of the present invention is in essence in other words to the part that prior art contributes, or all or part of of this technical scheme can embody with the form of software product, this computer software product is stored in a storage medium, comprising some instructions in order to make a computer equipment (can be personal computer, server, or the network equipment etc.) perform all or part of step of method described in each embodiment of the present invention.And aforesaid storage medium comprises: USB flash disk, portable hard drive, ROM (read-only memory) (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disc or CD etc. various can be program code stored medium.
The above; be only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; can expect amendment or the replacement of various equivalence easily, these amendments or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claim.

Claims (16)

1. a power supply test instrument, is characterized in that, comprising:
Printing board PCB substrate (101; 201);
Be positioned at described PCB substrate (101; 201) connector (102 on; 202), DC-isolation electric capacity (103; 203), positive pole coating probe (104; 204) and negative pole coating probe (105; 205);
Described positive pole coating probe (104; 204) with described DC-isolation electric capacity (103; 203) one end electrical connection, described DC-isolation electric capacity (103; 203) the other end and described connector (102; 202) positive pole electrical connection;
Described PCB substrate (101; 201) upper berth copper ground connection, described negative pole coating probe (105; 205) by described PCB substrate (101; 201) layers of copper on and described connector (102; 202) negative electricity connects.
2. power supply test instrument according to claim 1, is characterized in that, described power supply test instrument also comprises a pair probe (106; 206) described positive pole coating probe (104, is welded on respectively; 204) and described negative pole coating probe (105; 205) on.
3. power supply test instrument according to claim 2, it is characterized in that, described PCB substrate (101) side has opening, and described positive pole coating probe (104) and described negative pole coating probe (105) symmetry are positioned at described opening both sides.
4. power supply test instrument according to claim 3, is characterized in that, described probe (106) Parallel Symmetric distribution or symmetrical in opposite directions.
5. power supply test instrument according to claim 3, is characterized in that, described power supply test instrument also comprises handle installing hole (113), is positioned in described PCB substrate (101), for mounting handle shell.
6. power supply test instrument according to claim 1, it is characterized in that, described PCB substrate (201) comprises the first PCB substrate (2011) and the second PCB substrate (2012), described positive pole coating probe (204), described DC-isolation electric capacity (203) and described connector (202) are positioned on described first PCB substrate (2011), described negative pole coating probe (205) is positioned on described second PCB substrate (2012), connected altogether by wire (207) between described first PCB substrate (2011) and described second PCB substrate (2012).
7. power supply test instrument according to claim 6, it is characterized in that, described power supply test instrument also comprises support (208), and described first PCB substrate (2011) and described second PCB substrate (2012) are individually fixed in the both sides of described support (208).
8. power supply test instrument according to claim 6, is characterized in that, described wire (207) is compliant conductive metal or cable.
9. power supply test instrument according to claim 7, it is characterized in that, described support (208) also comprises spacing adjusting device (209), to regulate the spacing of described positive pole coating probe (204) and described negative pole coating probe (205).
10. power supply test instrument according to claim 6, it is characterized in that, described power supply test instrument also comprises alignment mounting hole (213), be positioned in described first PCB substrate (2011) and described second PCB substrate (2012), described positive pole coating probe (204) and described negative pole coating probe (205) are installed for aliging.
11. power supply test instruments according to any one of claim 1 to 10, is characterized in that, described power supply test instrument also comprise be positioned at described positive pole coating probe (104; 204) polarity mark (110 near; 210).
12. power supply test instruments according to any one of claim 1 to 10, is characterized in that, described power supply test instrument also comprise be positioned at described positive pole coating probe (104; 204) the positive pole indication LED (111 near; 211).
13. power supply test instruments according to claim 12, is characterized in that, described power supply test instrument also comprises LED power (112; 212), for giving described positive pole indication LED (111; 211) power.
14. power supply test instruments according to any one of claim 1 to 10, is characterized in that, described positive pole coating probe (104; 204) and described negative pole coating probe (105; 205) be gold-plated probe.
15. power supply test instruments according to any one of claim 2 to 5, is characterized in that, described probe (106; 206) be telescopic probe.
16. power supply test instruments according to any one of claim 2 to 5, is characterized in that, described probe (106; 206) be gold-plated reed.
CN201210530213.6A 2012-12-11 2012-12-11 Testing tool for power supply Expired - Fee Related CN102981129B (en)

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