CN219106525U - Test fixture for radio frequency module packaged by patch - Google Patents

Test fixture for radio frequency module packaged by patch Download PDF

Info

Publication number
CN219106525U
CN219106525U CN202223234341.4U CN202223234341U CN219106525U CN 219106525 U CN219106525 U CN 219106525U CN 202223234341 U CN202223234341 U CN 202223234341U CN 219106525 U CN219106525 U CN 219106525U
Authority
CN
China
Prior art keywords
radio frequency
frequency module
sliding
test
patch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202223234341.4U
Other languages
Chinese (zh)
Inventor
凌坚
曾抓纲
袁小红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Shoufei Electronics Co ltd
Original Assignee
Shenzhen Shoufei Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Shoufei Electronics Co ltd filed Critical Shenzhen Shoufei Electronics Co ltd
Priority to CN202223234341.4U priority Critical patent/CN219106525U/en
Application granted granted Critical
Publication of CN219106525U publication Critical patent/CN219106525U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model discloses a test fixture for a patch packaged radio frequency module, which is characterized by comprising the following components: a base; the grounding block is arranged in the middle of the bottom of the base, is grounded and is used for fixing the radio frequency module to be tested; the sliding guide rails are arranged at two sides of the grounding block; the sliding blocks are symmetrically arranged on the sliding guide rails on two sides of the grounding block, the sliding blocks on each side are respectively provided with a sliding bottom plate and a mounting plate, the mounting plates are fixed on the sliding bottom plates and are provided with a first mounting hole and a plurality of second mounting holes, a radio frequency connector for connecting a radio frequency port of a radio frequency module to be tested is arranged in the first mounting hole, a telescopic radio frequency test needle is arranged in the radio frequency connector, and a data test needle is arranged in the second mounting hole. The utility model can improve the contact performance and the grounding performance of the test fixture.

Description

Test fixture for radio frequency module packaged by patch
Technical Field
The utility model relates to the technical field of radio frequency microwaves, in particular to a test fixture for a radio frequency module of a patch package.
Background
In the field of radio frequency microwaves, due to the trend of miniaturization, in order to reduce the assembly space of the whole machine, many radio frequency modules need to be in a patch (SMD) packaging mode, but the patch packaged radio frequency modules have testing difficulties, because the patch packaged radio frequency modules are tested in two modes generally, one is to weld the patch packaged radio frequency modules to a single board of the whole machine for testing, and the other is to use a special testing fixture to place the patch packaged radio frequency modules to a testing position for testing.
When the first welding mode is adopted for testing, although the module bonding pad can be well contacted with the testing bonding pad, the module bonding pad is difficult to disassemble and the risk of damage is caused. When the second clamp mode is used for testing, because the input/output impedance matching and grounding requirements of the radio frequency module are strict, the requirements of the radio frequency port and the grounding part of the radio frequency module are very high, in the microwave field, the characteristic impedance of the radio frequency port is generally 50 ohms, if the radio frequency port of the tested radio frequency module is not well contacted with the tested radio frequency port, or the impedance mismatch easily causes signal testing errors, and the poor grounding of the radio frequency module easily introduces interference signals, thereby causing testing errors. There is often a problem in that the module pads cannot be in good contact with the test pins (test pads/test interfaces), resulting in large test errors.
Disclosure of Invention
Aiming at the defect that measurement errors are easily generated due to poor contact in the test of the radio frequency module packaged by the patch by using the clamp in the prior art, the utility model provides the test clamp with small contact errors.
The technical scheme adopted by the utility model is as follows:
there is provided a test fixture for a radio frequency module of a chip package, comprising:
a base;
the grounding block is arranged in the middle of the bottom of the base, is grounded and is used for fixing the radio frequency module to be tested;
the sliding guide rails are arranged at two sides of the grounding block;
the sliding blocks are symmetrically arranged on the sliding guide rails on two sides of the grounding block, the sliding blocks on each side are respectively provided with a sliding bottom plate and a mounting plate, the mounting plates are fixed on the sliding bottom plates and are provided with a first mounting hole and a plurality of second mounting holes, a radio frequency connector for connecting a radio frequency port of a radio frequency module to be tested is arranged in the first mounting hole, a telescopic radio frequency test needle is arranged in the radio frequency connector, and a data test needle is arranged in the second mounting hole.
By adopting the technical scheme, the two sides of the base are also provided with the fixed baffle plates for limiting the maximum sliding travel of the sliding block.
According to the technical scheme, the fixed baffle is an insulating plate.
With the technical scheme, the sliding block is an insulating block.
By adopting the technical scheme, the characteristic impedance of the radio frequency test needle is 50 ohms.
According to the technical scheme, the sliding block is provided with the buckle on one side close to the middle grounding block, the grounding block is provided with the clamping seat, and the sliding block is fixedly connected to the grounding block through the cooperation of the buckle and the clamping seat after the sliding block is pushed to the grounding block in a sliding manner.
According to the technical scheme, the radio frequency connector is connected with an external test instrument through the radio frequency test wire, and the data test needle is connected to the power supply and the external data controller through the data wire.
By adopting the technical scheme, the telescopic travel of the radio frequency test needle is 2-5 mm.
According to the technical scheme, the sliding bottom plate is provided with the sliding groove matched with the sliding guide rail.
With the technical scheme, the plurality of second mounting holes are arranged in a straight line.
The utility model has the beneficial effects that: according to the utility model, a structural design that a telescopic radio frequency test needle, a large-area grounding block and a sliding rail are combined is adopted, before testing, two sliding blocks of a clamp are pulled apart, a radio frequency module to be tested is placed on the grounding block, then the sliding blocks on two sides are slid to be close to the radio frequency module to be tested, the radio frequency test needle and the data test needle on the sliding blocks respectively prop against an interface bonding pad corresponding to the radio frequency module to be tested, the structure of the utility model can better enable a radio frequency port of the radio frequency module to be tested to be in contact with the radio frequency port to be tested, and the radio frequency module to be tested is placed on the large-area grounding block without introducing interference signals, so that the contact performance and the grounding performance of the test clamp are improved.
Drawings
The utility model will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic structural diagram of a test fixture for a patch-packaged radio frequency module according to an embodiment of the present utility model;
FIG. 2 is a schematic illustration of a portion of a test fixture according to an embodiment of the present utility model;
FIG. 3 is a second schematic illustration of a portion of a test fixture according to an embodiment of the present utility model;
FIG. 4 is a schematic illustration of a portion of a test fixture according to an embodiment of the present utility model;
FIG. 5 is a schematic drawing showing a slide block of a test fixture according to an embodiment of the present utility model pulled to one side;
fig. 6 is a schematic measurement diagram of a radio frequency module to be tested mounted on the test fixture according to the embodiment of the utility model.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
The clamp is designed in a mode of combining the telescopic test needle, the large-area grounding block and the sliding track, so that the test clamp has good contact and grounding performance.
As shown in fig. 1, the test fixture for a patch-packaged radio frequency module according to an embodiment of the present utility model includes a base 10, a ground block 20, a slide rail 30, and a slide block 40. Wherein the slider 40 is provided with a radio frequency connector 41, a radio frequency test needle 42 and a data test needle 43. The assembly relationship is as follows:
the base 10 is made of insulating or metal material as a supporting member of the entire test fixture.
The grounding block 20 is made of a large block of metal conductive material (such as aluminum/copper, etc.), and is mounted on the bottom of the base 10, so as to mount the radio frequency module 100 to be tested and ensure that the radio frequency module 100 to be tested is well grounded. The tested radio frequency module is contacted with the whole grounding block, so that the grounding performance can be improved.
The slide rail 30 is made of an insulating material (e.g., bakelite) and is installed at both sides of the bottom of the base 10 (i.e., both sides of the ground block 20) to provide a sliding stroke for the slide block 40.
The sliding block 40 is made of insulating material (such as bakelite) and is mounted on the sliding guide rails 30 on two sides, a sliding bottom plate 401 and a mounting plate 402 are arranged on the sliding block 40, the mounting plate 402 is fixed on the sliding bottom plate 401, a first mounting hole 421 and a plurality of second mounting holes 422 are arranged on the mounting plate 402, and the plurality of second mounting holes 422 can be arranged in a straight line. The first mounting hole 421 is internally provided with a radio frequency connector 41 for connecting a radio frequency port of the radio frequency module 100 to be tested, the radio frequency connector 41 is internally provided with a telescopic radio frequency test needle 42, and the second mounting hole 422 is internally provided with a data test needle 43. The radio frequency connector 41 is connected to an external test instrument via a radio frequency test line, and the data test needle 43 is connected to a power supply and an external data controller via a data line.
The rf connector 41 is used for connecting to an rf port of the rf module 100 to be tested, and generally adopts an SMA rf interface, and the rf test needle 42 is installed inside the rf connector 41. In the embodiment of the utility model, the characteristic impedance of the radio frequency test needle 42 is 50 ohms, and is a telescopic needle, and the telescopic travel is 2-5 mm.
The data testing pin 43 is made of a metal conductive material and is used for connecting a data port and a power port of the radio frequency module 100 to be tested.
As shown in fig. 2, in order to protect the sliding block 40 from exceeding the sliding stroke, fixing baffles 50 are further provided at both sides of the base 10, which are installed above the base, one at each end, and the fixing baffles 50 are made of an insulating material (e.g., bakelite).
In another embodiment of the present utility model, as shown in fig. 3, a sliding groove matched with the sliding guide rail 30 is formed on the sliding base 401. The sliding guide rail 30 is a flat guide rail, and only one sliding rail is arranged on the sliding bottom plate 401, and the sliding guide rail and the sliding bottom plate are matched.
Alternatively, in other embodiments of the present utility model, the sliding guide 30 may further include two parallel rails, and the two grooves on the sliding bottom plate 401 are respectively inverted on the parallel rails.
Further, as shown in fig. 4, a buckle 44 is provided on a side of the sliding block 40 close to the middle grounding block, the grounding block 20 is provided with a clamping seat 21, and after the sliding block 40 slides and advances toward the grounding block 20, the sliding block 40 is fixedly connected to the grounding block 20 through the cooperation of the buckle 44 and the clamping seat 21. The grounding block 20 is also provided with a plurality of limit grooves 22 which correspond to the second mounting holes 422 and are on the same straight line, and the data testing needle 43 passes through the second mounting holes 422 and then abuts against the interface bonding pad on the radio frequency module 100 to be tested through the limit grooves 22.
The use process of the test fixture is as follows:
(1) Before testing, the two sliding blocks of the clamp are pulled apart, and the radio frequency module to be tested is placed on the fixed and grounding block, as shown in fig. 5.
(2) The sliding block on one side is slid to be close to the radio frequency module to be tested, and the radio frequency test needle and the data test needle on the sliding block are respectively propped against the interface bonding pad corresponding to the radio frequency module to be tested.
(3) The slider is then pushed toward the fixed and ground block and is fixedly attached thereto by a snap, as shown in fig. 6.
(4) The other slider is then operated in two steps (2) (3) above.
(5) One end of the radio frequency test wire is connected with a radio frequency connector on the clamp, the other end of the radio frequency test wire is connected with the test instrument, and the data test needle is connected to a data terminal (power supply and control) through a data wire. The data terminal is connected with the power supply and an external data controller.
The power supply is powered on and is provided with a control function, so that the radio frequency parameters of the radio frequency module to be tested can be tested.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.

Claims (10)

1. A test fixture for a radio frequency module for chip packaging, comprising:
a base;
the grounding block is arranged in the middle of the bottom of the base, is grounded and is used for fixing the radio frequency module to be tested;
the sliding guide rails are arranged at two sides of the grounding block;
the sliding blocks are symmetrically arranged on the sliding guide rails on two sides of the grounding block, the sliding blocks on each side are respectively provided with a sliding bottom plate and a mounting plate, the mounting plates are fixed on the sliding bottom plates and are provided with a first mounting hole and a plurality of second mounting holes, a radio frequency connector for connecting a radio frequency port of a radio frequency module to be tested is arranged in the first mounting hole, a telescopic radio frequency test needle is arranged in the radio frequency connector, and a data test needle is arranged in the second mounting hole.
2. The test fixture for a patch-packaged radio frequency module according to claim 1, wherein the base is further provided with a maximum sliding travel fixing baffle for limiting the sliding block on both sides thereof.
3. The test fixture for a patch-packaged radio frequency module of claim 2, wherein the retaining plate is an insulating plate.
4. The test fixture for a patch-packaged radio frequency module of claim 1, wherein the slider is an insulating block.
5. The test fixture for a patch-packaged radio frequency module of claim 1, wherein the characteristic impedance of the radio frequency test pin is 50 ohms.
6. The test fixture for a patch-packaged radio frequency module according to claim 1, wherein the slider is provided with a clip on a side thereof adjacent to the middle ground block, the ground block is provided with a holder, and the slider is fixedly connected to the ground block by the clip and the holder being engaged with each other after the slider is slidably pushed toward the ground block.
7. The test fixture for a patch packaged rf module of claim 1, wherein the rf connector is connected to an external test instrument by an rf test line and the data test pin is connected to a power supply and an external data controller by a data line.
8. The test fixture for a patch-packaged radio frequency module of any one of claims 1-7, wherein the telescopic travel of the radio frequency test needle is 2-5 mm.
9. The test fixture for a patch-packaged radio frequency module as recited in claim 1, wherein the sliding bottom plate is provided with a sliding slot that mates with the sliding guide rail.
10. The test fixture for a patch-packaged radio frequency module of claim 1, wherein the plurality of second mounting holes are aligned.
CN202223234341.4U 2022-12-01 2022-12-01 Test fixture for radio frequency module packaged by patch Active CN219106525U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223234341.4U CN219106525U (en) 2022-12-01 2022-12-01 Test fixture for radio frequency module packaged by patch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223234341.4U CN219106525U (en) 2022-12-01 2022-12-01 Test fixture for radio frequency module packaged by patch

Publications (1)

Publication Number Publication Date
CN219106525U true CN219106525U (en) 2023-05-30

Family

ID=86467265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223234341.4U Active CN219106525U (en) 2022-12-01 2022-12-01 Test fixture for radio frequency module packaged by patch

Country Status (1)

Country Link
CN (1) CN219106525U (en)

Similar Documents

Publication Publication Date Title
US6798223B2 (en) Test methods, systems, and probes for high-frequency wireless-communications devices
CN201622288U (en) Clamp for radio-frequency testing of semiconductor chip
CN111584992B (en) Radiation device and multi-band array antenna
US7786741B2 (en) Measuring tip for high-frequency measurement
CN112327139A (en) Chip testing device
CN111707929A (en) PGA packaging microwave test fixture
US6791317B1 (en) Load board for testing of RF chips
CN112485646A (en) BGA chip vertical interconnection test module based on hair button
CN102013930A (en) Radio-frequency (RF) signal test connection structure and radio-frequency signal test optimization method
CN219106525U (en) Test fixture for radio frequency module packaged by patch
US5945835A (en) Radio frequency test probe with integral mount for circuit board under test
CN108205081B (en) Device for measuring return loss of microscale solder balls
CN116601503A (en) Chip testing device and chip testing method
CN210956937U (en) Filter module and AFU antenna
CN215415758U (en) High-power carrier plate type bare chip module testing device
JP2734412B2 (en) Semiconductor device socket
CN216217697U (en) Switching device
CN213068911U (en) Amplifier test switching device
CN205374533U (en) Microwave millimeter wave DC bias probe
CN210111018U (en) Double-ridge waveguide and bare chip testing device
CN216870677U (en) Mixer testing device
CN111830400A (en) Chip testing device
KR100714569B1 (en) Semiconductor ic tester
CN111273065A (en) Radio frequency device testing system and method based on conductive adhesive clamp
CN219320339U (en) Communication module test fixture

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant