CN111707929A - PGA packaging microwave test fixture - Google Patents
PGA packaging microwave test fixture Download PDFInfo
- Publication number
- CN111707929A CN111707929A CN202010605551.6A CN202010605551A CN111707929A CN 111707929 A CN111707929 A CN 111707929A CN 202010605551 A CN202010605551 A CN 202010605551A CN 111707929 A CN111707929 A CN 111707929A
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- Prior art keywords
- pga
- test
- socket
- packaging
- insulator
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a PGA packaging microwave test fixture, including the test panel and PGA packaging test socket set in test panel, the terminal surface of the PGA packaging test socket has PGA slots and circuit junction devices, the said circuit junction device is arranged on terminal surface of the said PGA packaging test socket in the symmetrical and homogeneous form, the bottom surface of the said test panel has connectors, the terminal surface of the said PGA packaging test socket also covers the fixed clamping piece with opening size identical to PGA slot, wherein, the size of the said PGA slot is the multiple of 1.27mm, PGA packaging microwave test fixture developed in this invention, have the following advantages: 1. the PGA chip can be tested in a plugging mode, the chip is not damaged, and random errors are reduced; 2. the test end face and the calibration end face are unified, so that the measurement accuracy is improved; 3. the connector is arranged on the back of the PGA packaging socket, so that the length of the microstrip line is reduced, and the precision of the measurement result is improved.
Description
Technical Field
The invention relates to the technical field of radio frequency microwave chips, in particular to a PGA packaging microwave test fixture.
Background
With the rapid development of the radio frequency microwave technology, various radio frequency chips are widely applied to the fields of aerospace, modern communication systems and military, and the performance test of the radio frequency microwave chips is an important link in chip design, production and application.
Based on the traditional method, the chip is welded on the input microstrip line and the output microstrip line on the chip carrier, and the method is not easy to disassemble and is easy to damage the chip; measurement uncertainty and random errors caused by repeated welding, dismounting and mounting are large; the test end face and the calibration end face are not on the same end face, so that the calibration data of the test equipment is not the data of the test end face of the tested device, and measurement errors are introduced.
In order to achieve a fast and efficient test, corresponding test fixtures, fixtures for different chip packages, are necessary. Meanwhile, the testing equipment is generally a connector, and most of the chip packages are non-connectors, so that it is necessary to develop a testing fixture to convert the corresponding chip packages into coaxial structures. In chip packaging, a PGA package is a common one, and the invention develops a PGA package microwave test fixture to convert the PGA package into a coaxial package so as to meet the related test application requirements and higher technical requirements to the maximum extent.
Disclosure of Invention
Aiming at the technical defects in the background art, the invention provides a PGA packaging microwave test fixture, which solves the technical problems and meets the actual requirements, and the specific technical scheme is as follows:
a PGA packaging microwave test fixture comprises a test panel and a PGA packaging test socket arranged on the test panel, wherein a PGA slot and a circuit connecting device are arranged on the end face of the PGA packaging test socket, the circuit connecting device is symmetrically and uniformly arranged on the end face of the PGA packaging test socket, a connector which is fixedly connected with the PGA packaging test socket and is connected with the circuit connecting device through a circuit is arranged on the bottom face of the test panel, a fixing clamping piece with the opening size being consistent with that of the PGA slot is covered on the end face of the PGA packaging test socket, and the size of the PGA slot is a multiple of 1.27 mm.
As a further technical solution of the present invention, the circuit connection device includes pins and a metal sheet connected between the pins.
As a further technical solution of the present invention, the pins are symmetrically arranged in the countersunk holes in the two side edges of the PGA package test socket along the central line in the length direction of the end surface of the PGA package test socket, and symmetrically arranged at the two sides of the PGA socket along the length direction of the PGA socket and at the two ends of the PGA socket in the length direction, and the metal sheet is connected between the pins at the two ends of the PGA socket in the length direction.
As a further technical solution of the present invention, the connector includes a center conductor connected to the pin, an insulator is sleeved outside the center conductor, an upper outer conductor is sleeved on the insulator and then connected to the test panel, a lower outer conductor is sleeved on the insulator, and the outside of the upper outer conductor is fixed to the test panel by a fixing outer conductor.
As a further technical scheme of the invention, the insulator comprises an upper insulator and a lower insulator, wherein the upper insulator is sequentially provided with 3 positioning sections with gradually increased radius sizes from top to bottom, and the lower insulator is sequentially provided with 2 positioning sections with gradually increased radius sizes from top to bottom.
As a further technical solution of the present invention, the upper outer conductor and the lower outer conductor are provided with clamping sections on respective outer contours.
As a further technical solution of the present invention, the connector is connected with a coaxial transmission line, and the specification of the coaxial transmission line is 50 Ω.
As a further technical scheme of the invention, the number of the connectors is not less than 1, and the connectors are uniformly arranged on the bottom surface of the test panel.
According to the PGA packaging microwave test fixture, two ends of the test fixture are coaxial connectors and are connected with a test instrument, the PGA socket is located in the middle of the fixture, and a tested device is connected with the fixture in a plugging mode, so that conversion between a connector and PGA packaging is effectively achieved. Has the following advantages:
1. the PGA chip can be tested in a plug-in mode, welding is not needed, the PGA chip is easy to disassemble, the chip is not damaged, and measurement uncertainty and random errors are effectively reduced;
2. the testing end face extends to the jack, and is combined with the PGA packaged calibration piece, so that the testing end face and the calibration end face can be unified, the influence brought by a testing clamp can be eliminated by using a de-embedding mode, and the accuracy of measurement is improved;
3. the connector is arranged on the back of the PGA packaging socket, so that the length of the microstrip line is reduced to the maximum extent, and the accuracy and the stability of the measurement result are improved.
Drawings
Fig. 1 is a schematic view 1 of the overall structure of the present invention.
Fig. 2 is a schematic view 2 of the overall structure of the present invention.
Fig. 3 is a schematic structural diagram of the PGA package test socket 2.
Fig. 4 is a schematic sectional structure diagram of the connector 4.
Wherein: the testing panel 1, the PGA package testing socket 2, the PGA socket 3, the connector 4, the central conductor 40, the upper insulator 41, the lower insulator 42, the upper outer conductor 43, the lower outer conductor 44, the fixed outer conductor 45, the positioning section 46, the clamping section 47, the fixed clip 5, the pin 6, the metal sheet 7 and the countersunk hole 8.
Detailed Description
Embodiments of the present invention will be described below with reference to the accompanying drawings and related embodiments, wherein the following related embodiments are merely preferred embodiments for better illustrating the present invention itself, and the embodiments of the present invention are not limited to the following embodiments, and the present invention relates to the related essential parts in the technical field, which should be regarded as the known technology in the technical field and can be known and grasped by those skilled in the art.
In the description of the present invention, it is to be understood that the terms "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "inner," and the like are used in the orientations and positional relationships indicated in the drawings only for the purpose of sub-description of the present invention and to simplify the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore, should not be taken as limiting the present invention.
Referring to fig. 1 and 2, a PGA package microwave test fixture includes a test panel 1 and a PGA package test socket 2 disposed on the test panel 1, where an end surface of the PGA package test socket 2 is provided with a PGA socket 3 and a circuit connection device, the circuit connection device is symmetrically and uniformly disposed on the end surface of the PGA package test socket 2, a connector 4 fixedly connected to the PGA package test socket 2 and having a circuit connected to the circuit connection device is disposed on a bottom surface of the test panel 1, and the end surface of the PGA package test socket 2 is covered with a fixing clip 5 having an opening size identical to that of the PGA socket 3, where the PGA socket 3 is a multiple of 1.27mm in size.
Referring to fig. 3 and 4, the test fixture of the present invention is a device for connecting a test device to a coaxial cable, and is composed of two completely symmetrical coaxial systems and a part for holding the device under test therebetween.
In order to ensure the accuracy of the measured data, the tested device is ensured to be in the center position of the test fixture, and for PGA packaged tested devices with different sizes, the corresponding test fixture needs to be designed, and the central axis of the coaxial system is welded to the microstrip line, so that the conversion from the coaxial to the microstrip line is realized. When designing a test fixture, because the access of the coaxial interface and the microstrip line introduces a system error, the pin end reaching the tested device is not a standard 50 Ω impedance, so when designing the test fixture of the radio frequency device, a proper and efficient fixture is designed according to the test requirement of coplanarity and non-coaxiality, and a corresponding calibration piece is designed to carry out reasonable error de-embedding.
A typical measuring fixture is generally made up of three parts: including a coaxial connector, i.e., connector 4, a circuit board transmission line, such as a microstrip line, a coplanar waveguide, and a strip line, and a jig portion of the middle portion, for placing the rf device under test.
In the present invention, the test fixture includes a test base 1, a PGA package test fixture 2, and a connector 4 as a coaxial connector, and preferably, a pair of connectors 4 are provided as shown in fig. 1 and 4; the test base 1 should be provided with a circuit board and a microstrip line correspondingly connected with the connector 4, and the connection mode adopts welding and is properly grounded.
The clamp is connected with a test instrument in a coaxial rotating microstrip mode, a tested device can be connected with the clamp PGA slot 3 in a plugging mode, and chips are respectively inserted into corresponding interfaces in the PGA slot 3 of the clamp to be tested without welding, so that the test is convenient and quick. In the radio frequency microwave chip test, the test signal is a radio frequency microwave signal, the signal frequency is high, the length of the microstrip line of the test fixture and the compactness of the structure have great influence on the test result, so the connector 4 is positioned at the bottom surface of the test base 1 and at the back side of the PGA packaging test socket 3, the length of the microstrip line is greatly shortened, the structure is compact, and the accuracy and the stability of the test result are improved.
The size of the PGA socket 3 is a multiple of 1.27mm, which means that the package size of the PGA chip adapted to the PGA socket 3 is a multiple of 1.27mm, which indicates that the pitch of the pin sockets of the PGA socket 3 is adapted to the minimum distance of 1.27mm from the pins of the PGA, and therefore, the size, i.e., the length and width, of the PGA socket 3 is a multiple of 1.27mm, so that the PGA socket can be adapted to the insertion of the existing PGA chip and the PGA chip can be tested correspondingly.
Referring to fig. 1 and 2, the fixing clip 5 plays a role of stabilizing the PGA chip, and is engaged with the test socket 1 in a screw connection manner, so that the PGA chip can be conveniently placed on the jig body through the opening corresponding to the PGA socket 3.
Referring to fig. 3, in a preferred embodiment of the present invention, the circuit connection device includes pins 6 and a metal plate 7 connected between the pins 6, the pins 6 and the metal plate 7 can conduct the electrical signals of the pins of the PGA chip from the circuit board and the microstrip line to the testing apparatus, and can be adapted to PGA chips with various package specifications, so that the flexibility is high, and the testing effect is good.
Referring to fig. 3, in a preferred embodiment of the present invention, the pins 6 are symmetrically arranged in the countersunk holes 8 in the two side edges of the PGA package test socket 2 along the length direction of the end surface, symmetrically arranged at the two sides of the PGA socket 3 along the length direction, and arranged at the two ends of the PGA socket 3 along the length direction, and the metal sheets 7 are connected between the pins 6 at the two ends of the PGA socket 3 along the length direction, so that the pins 6 and the metal sheets 7 are arranged in a manner that the package sizes of different PGA chips are taken into consideration to the maximum extent, thereby achieving high flexibility and good test effect.
Referring to fig. 4, in a preferred embodiment of the present invention, the connector 4 includes a central conductor 40 connected to the pins 6, an insulator is sleeved outside the central conductor 40, an upper outer conductor 43 is sleeved on the insulator and then connected to the test panel 1, and a lower outer conductor 44 is sleeved on the insulator, and the outside of the upper outer conductor 43 is fixed to the test panel 1 through a fixing outer conductor 45, so as to ensure that the conduction of electrical signals is fast, accurate and stable during the testing process of the PGA chip, and avoid the influence of an interference source on signal transmission, and meanwhile, the number of the connectors 4 is one pair to adapt to the packaging size of the PGA chip and the arrangement rule of the pins.
Referring to fig. 4, according to a preferred embodiment of the present invention, the insulator includes an upper insulator 41 and a lower insulator 42, the upper insulator 41 is sequentially provided with 3 positioning segments 46 with increasing radius sizes from top to bottom, the lower insulator 42 is sequentially provided with 2 positioning segments 46 with increasing radius sizes from top to bottom, the positioning segments 46 facilitate connection and positioning between the upper and lower outer conductors and the fixed outer conductor 45 and the insulator, and a technical effect of a more stable structure is achieved.
Referring to fig. 4, in a preferred embodiment of the present invention, the upper outer conductor 43 and the lower outer conductor 44 are respectively provided with a clamping section 47 on their outer contours, and the arrangement of the clamping section 47 facilitates the disassembly and assembly of the connector 4 and the installation and positioning between the connector and the test socket 1, so that the parts can be repaired or replaced.
In a preferred embodiment of the present invention, the connector 4 is connected to a coaxial transmission line, and the coaxial transmission line has a specification of 50 Ω, so as to match the testing requirements of the PGA chip required by the present invention, and provide stable line conditions for the accuracy and stability of the testing results.
In a preferred embodiment of the present invention, the circuit connecting device is electrically connected to the connector 4, that is, the pins 6 and the metal sheets 7 are electrically connected to the central conductor 40 of the connector 4 by an electrical principle suitable for small space and high precision, such as wire connection or other contact connection media, so as to meet the use requirement of the test fixture of the present invention.
According to the PGA packaging microwave test fixture, two ends of the test fixture are coaxial connectors and are connected with a test instrument, the PGA socket 3 is located in the middle of the fixture, and a tested device is connected with the fixture in a plugging mode, so that conversion between a connector and PGA packaging is effectively achieved. Has the following advantages:
1. the PGA chip can be tested in a plug-in mode, welding is not needed, the PGA chip is easy to disassemble, the chip is not damaged, and measurement uncertainty and random errors are effectively reduced;
2. the testing end face extends to the jack, and is combined with the PGA packaged calibration piece, so that the testing end face and the calibration end face can be unified, the influence brought by a testing clamp can be eliminated by using a de-embedding mode, and the accuracy of measurement is improved;
3. the connector 4 is arranged on the back of the PGA packaging socket, so that the length of the microstrip line is reduced to the maximum extent, and the accuracy and the stability of the measurement result are improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. The PGA packaging microwave test fixture comprises a test panel and a PGA packaging test socket arranged on the test panel, and is characterized in that the end face of the PGA packaging test socket is provided with PGA slots and a circuit connecting device, the circuit connecting device is symmetrically and uniformly arranged on the end face of the PGA packaging test socket, the bottom surface of the test panel is provided with a connector which is fixedly connected with the PGA packaging test socket and is connected with the circuit connecting device, the end face of the PGA packaging test socket is also covered with a fixing clamping piece with the opening size consistent with that of the PGA slots, and the size of the PGA slots is a multiple of 1.27 mm.
2. The PGA package microwave test fixture of claim 1, wherein the circuit connection means includes pins and a metal plate connected between the pins.
3. The microwave PGA package test fixture of claim 2, wherein the pins are uniformly disposed in the countersunk holes in the two sides symmetrically to the center line of the PGA package test socket in the length direction of the end surface, and disposed at the two sides symmetrically to the length direction of the PGA socket and at the two ends of the PGA socket in the length direction, and the metal plate is connected between the pins at the two ends of the PGA socket in the length direction.
4. The PGA package microwave test jig of claim 1, wherein the connector includes a center conductor connected to the pins, an insulator is sleeved on an outer portion of the center conductor, an upper outer conductor is sleeved on an upper portion of the insulator and then connected to the test panel, a lower outer conductor is sleeved on a lower portion of the insulator, and an outer portion of the upper outer conductor is fixed to the test panel by a fixing outer conductor.
5. The PGA package microwave test fixture of claim 4, wherein the insulator comprises an upper insulator and a lower insulator, the upper insulator is provided with 3 positioning segments with increasing radius sizes in sequence from top to bottom, and the lower insulator is provided with 2 positioning segments with increasing radius sizes in sequence from top to bottom.
6. The PGA package microwave test fixture of claim 1, wherein the upper and lower outer conductors are each provided with a clamping section at their respective outer profiles.
7. The PGA package microwave test fixture of claim 1, wherein the connector is coupled to a coaxial transmission line having a gauge of 50 Ω.
8. The PGA package microwave test jig of claim 1, wherein the number of the connectors is not less than 1, and the connectors are uniformly arranged on a bottom surface of the test panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010605551.6A CN111707929A (en) | 2020-06-29 | 2020-06-29 | PGA packaging microwave test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010605551.6A CN111707929A (en) | 2020-06-29 | 2020-06-29 | PGA packaging microwave test fixture |
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| Publication Number | Publication Date |
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| CN111707929A true CN111707929A (en) | 2020-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010605551.6A Pending CN111707929A (en) | 2020-06-29 | 2020-06-29 | PGA packaging microwave test fixture |
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| CN (1) | CN111707929A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113406485A (en) * | 2021-08-19 | 2021-09-17 | 深圳飞骧科技股份有限公司 | Chip test fixture and chip test fixture combination |
| CN114113974A (en) * | 2021-11-01 | 2022-03-01 | 海光信息技术股份有限公司 | Chip system level test method and device |
| WO2023020100A1 (en) * | 2021-08-19 | 2023-02-23 | 深圳飞骧科技股份有限公司 | Chip test system |
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| CN210668281U (en) * | 2019-12-06 | 2020-06-02 | 加特兰微电子科技(上海)有限公司 | Chip testing device and antenna packaging chip |
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| CN113406485A (en) * | 2021-08-19 | 2021-09-17 | 深圳飞骧科技股份有限公司 | Chip test fixture and chip test fixture combination |
| WO2023020101A1 (en) * | 2021-08-19 | 2023-02-23 | 深圳飞骧科技股份有限公司 | Chip test fixture and chip test fixture combination |
| WO2023020100A1 (en) * | 2021-08-19 | 2023-02-23 | 深圳飞骧科技股份有限公司 | Chip test system |
| CN114113974A (en) * | 2021-11-01 | 2022-03-01 | 海光信息技术股份有限公司 | Chip system level test method and device |
| CN114113974B (en) * | 2021-11-01 | 2023-10-27 | 海光信息技术股份有限公司 | Chip system level test method and device |
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