CN221078865U - Packaged chip testing device - Google Patents
Packaged chip testing device Download PDFInfo
- Publication number
- CN221078865U CN221078865U CN202322895218.5U CN202322895218U CN221078865U CN 221078865 U CN221078865 U CN 221078865U CN 202322895218 U CN202322895218 U CN 202322895218U CN 221078865 U CN221078865 U CN 221078865U
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- China
- Prior art keywords
- box body
- chip
- circuit board
- microstrip line
- microstrip
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- 238000012360 testing method Methods 0.000 title claims abstract description 24
- 210000001503 joint Anatomy 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The utility model discloses a packaged chip testing device which comprises a base, a fixed box body, a sliding box body and a circuit board combination, wherein a first coaxial microstrip connector and a second coaxial microstrip connector are arranged on the fixed box body, the circuit board combination comprises a first microstrip line, a chip circuit board and a second microstrip line, the power-on pin group is used for being connected with an external power supply, the power input ends of the power-on pin group and the chip circuit board are connected through wires, and a connecting seat for detachably mounting a packaged chip to be tested is arranged on the chip circuit board. The device adopts the sliding box body output end, for chips with the same pin number and the same package, when the chip radio frequency output end and the radio frequency input end are not on the same horizontal line, the chip radio frequency output end and the clamp radio frequency output end can be on the same horizontal line through sliding the box body, and the radio frequency performance of the chip can be measured more accurately without replacing a circuit board and a clamp.
Description
Technical Field
The utility model relates to the technical field of chip testing, in particular to a packaged chip testing device.
Background
Most of the existing packaging chip testing fixtures are only suitable for testing chips of the same packaging type, the relative positions of the radio frequency input and output of the chips are fixed, and when the testing chips are replaced, if the relative positions of the radio frequency input and output pins of the chips are changed, better impedance matching is required, and the same circuit board and the same fixture cannot be used for testing. And when the S parameter of the chip is measured, the impedance matching between the chip and the 50 ohm microstrip in the testing device is required to be good, so that the S parameter of the chip can be accurately measured.
Disclosure of utility model
The technical purpose is that: aiming at the technical problems, the utility model provides a packaged chip testing device which can realize chips with different radio frequency input and output positions and uses the same circuit board and the same clamp for testing.
The technical scheme is as follows: in order to achieve the technical purpose, the utility model adopts the following technical scheme:
A packaged chip testing device is characterized in that: the sliding box body is slidably mounted on the slideway, and the sliding box body and the fixed box body are provided with a butt joint adjacent side in the translation process;
The fixed box body is provided with a first coaxial microstrip connector and a power-on needle group, the sliding box body is provided with a second coaxial microstrip connector, the circuit board combination comprises a first microstrip line, a chip circuit board and a second microstrip line, the power-on needle group is used for connecting an external power supply, the power-on needle group is connected with the power input end of the chip circuit board through a wire, and the chip circuit board is provided with a connecting seat for detachably mounting a packaged chip to be tested; the radio frequency input pin of the packaging chip to be tested is connected with the coaxial microstrip connector through the first microstrip line, and the radio frequency input pin of the packaging chip to be tested, the first microstrip line and the pin center of the coaxial microstrip connector I are positioned on the same central line; one end of the second microstrip line is connected with the coaxial microstrip connector II, the other end of the second microstrip line is in butt joint with a radio frequency output pin of the packaged chip to be tested by the translation of the sliding box body before the chip is tested, and the radio frequency output pin of the packaged chip to be tested, the second microstrip line and the pin center of the coaxial microstrip connector I are positioned on the same central line;
The first microstrip line and the second microstrip line are both 50 ohm microstrip lines.
Preferably, the two ends of the sliding box body in the translation direction are respectively provided with a first fixing stud and a second fixing stud, and the first fixing stud and the second fixing stud are used for locking the sliding box body after the sliding box body moves to a preset butt joint position.
Preferably, the slide comprises a first slide and a second slide which are arranged in parallel.
Preferably, the fixed box body is provided with a first cavity with a top opening and a preset shape, the sliding box body is provided with a second cavity with a top opening and a preset shape, and when the sliding box body translates in a preset range, one adjacent side of the first cavity is in butt joint and communicated with one adjacent side of the second cavity; the power-on needle group, the first microstrip line and the chip circuit board are arranged in the first cavity, and the second microstrip line is arranged in the second cavity.
The beneficial effects are that: due to the adoption of the technical scheme, the utility model has the following beneficial effects:
The device adopts the sliding box body output end, for chips with the same pin number and the same package, when the chip radio frequency output end and the radio frequency input end are not on the same horizontal line, the chip radio frequency output end and the clamp radio frequency output end can be on the same horizontal line through sliding the box body, namely, the radio frequency performance of the chip can be measured more accurately without replacing a circuit board and a clamp.
Drawings
FIG. 1 is a schematic diagram of a packaged chip testing apparatus according to the present utility model;
Fig. 2 is a schematic structural view of the sliding box in fig. 1.
Detailed Description
Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.
The utility model provides a packaged chip testing device.
1. Product components and connection relation:
As shown in fig. 1 and 2, the device mainly comprises: the coaxial microstrip connector comprises a fixed box body 1, a coaxial microstrip connector I2, a power-on needle group 3, a sliding box body 4, a slide I5, a slide II 6, a fixed stud I7, a fixed stud II 8, a coaxial microstrip connector II 9, a circuit board combination 10, a fixed block I11 and a fixed block II 12.
The circuit board assembly 10 includes a first microstrip line 10-1, a chip circuit board 10-2, and a second microstrip line 10-3.
The fixed box body 1 is provided with a cavity with one surface open, and is combined with the sliding box body 4 to form a closed cavity. The fixed box body 1 is provided with a coaxial microstrip connector I2. The power pin group 3 is used for powering up the chip.
The first microstrip line 10-1 is arranged in the cavity of the fixed box body 1 and is a 50 ohm microstrip line, the 50 ohm microstrip line is connected with the first coaxial microstrip connector 2, and the center of the 50 ohm microstrip line and the center of the pin of the first coaxial microstrip connector 2 are positioned on the same horizontal line.
A 50 ohm microstrip line is arranged in the sliding box body 4 and is connected with the coaxial microstrip connector II 9. The center of the 50 ohm microstrip line and the center of the guide pin of the coaxial microstrip connector II 9 are positioned on the same horizontal line.
The center of the input microstrip line of the chip circuit board 10-2 is on the same horizontal line as the first microstrip line 10-1, and the sides of the two circuit boards are aligned.
The power-on pin group 3 is used for providing power and control for the chip, and the packaged chip to be tested can be sintered on the chip circuit board by using solder paste at 180 ℃.
2. Working process and principle:
The radio frequency output end of the testing device is changed into a sliding type. When testing different chips, the positions of the radio frequency output pins of the chips relative to the positions of the radio frequency input pins are not necessarily in a straight line. If the position of the second 9 coaxial microstrip connector at the output end is unchanged, the 50 ohm microstrip line at the output end of the chip and the 50 ohm microstrip line on the sliding box body 5 are dislocated and are not on the same straight line, and the impedance at the joint of the two is deviated from 50 ohm impedance, so that the circuit of the testing device cannot be well matched. Especially for high-frequency chips, poor impedance matching will seriously affect the accuracy of the chip test results.
When the form of the sliding box 4 is used, if the chip rf output pins are not necessarily aligned with respect to the rf input pins. Only the sliding box body 4 is required to move along the first slide way 5 and the second slide way 6, so that the second microstrip line 10-3 is aligned with the microstrip line output end of the chip circuit board 10-2 on the same horizontal line, the fixing stud II 7 is screwed with the fixing block I11, and the fixing stud II 8 is screwed with the fixing block II 12. And then connecting the microstrip line splice with a connecting sheet. The connection part of the 50 ohm microstrip line at the output end of the chip and the 50 ohm microstrip line 10-3 on the sliding box body 5 has no included angle between the two on the same horizontal line, so that the impedance can be well matched.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be appreciated by persons skilled in the art that the above embodiments are not intended to limit the utility model in any way, and that all technical solutions obtained by means of equivalent substitutions or equivalent transformations fall within the scope of the utility model.
Claims (4)
1. A packaged chip testing device is characterized in that: the sliding box comprises a base, a fixed box body (1), a sliding box body (4) and a circuit board combination (10), wherein the fixed box body (1) is fixedly arranged on the base (100), a slide way positioned at the outer side of the fixed box body (1) is arranged on the base (100), the sliding box body (4) is slidably arranged on the slide way, and an adjacent side which is in butt joint with the fixed box body (1) is arranged in the translation process of the sliding box body (4);
The circuit board assembly comprises a fixed box body (1), a sliding box body (4) and a circuit board assembly, wherein the fixed box body (1) is provided with a first coaxial microstrip connector (2) and a power-on needle group (3), the sliding box body (4) is provided with a second coaxial microstrip connector (9), the circuit board assembly (10) comprises a first microstrip line (10-1), a chip circuit board (10-2) and a second microstrip line (10-3), the power-on needle group (3) is used for connecting an external power supply, the power input ends of the power-on needle group (3) and the chip circuit board (10-2) are connected through a lead, and a packaged chip to be tested is sintered on the chip circuit board (10-2) by using solder paste; the radio frequency input pin of the packaging chip to be tested is connected with the coaxial microstrip connector I (2) through the first microstrip line (10-1), and the centers of the radio frequency input pin of the packaging chip to be tested, the first microstrip line (10-1) and the pin of the coaxial microstrip connector I (2) are positioned on the same central line; one end of the second microstrip line (10-3) is connected with the coaxial microstrip connector II (9), the other end of the second microstrip line (10-3) is in butt joint with a radio frequency output pin of the packaged chip to be tested by the translation of the sliding box body (4) before the chip test, and the radio frequency output pin of the packaged chip to be tested, the second microstrip line (10-3) and the pin center of the coaxial microstrip connector I (2) are positioned on the same central line;
the first microstrip line (10-1) and the second microstrip line (10-3) are both 50 ohm microstrip lines.
2. The packaged chip testing device according to claim 1, wherein: the sliding box body (4) is characterized in that a first fixing stud (7) and a second fixing stud (8) are respectively arranged at two ends of the sliding box body (4) in the translation direction, and the first fixing stud (7) and the second fixing stud (8) are used for locking the sliding box body (4) after the sliding box body (4) moves to a preset butt joint position.
3. The packaged chip testing device according to claim 1, wherein: the slide comprises a slide I (5) and a slide II (6) which are arranged in parallel.
4. The packaged chip testing device according to claim 1, wherein: the fixed box body (1) is provided with a first cavity with an opening at the top and a preset shape, the sliding box body (4) is provided with a second cavity with the opening at the top and the preset shape, and when the sliding box body (4) translates in a preset range, one side of the first cavity adjacent to the second cavity is butted and communicated; the power-on needle group (3), the first microstrip line (10-1) and the chip circuit board (10-2) are arranged in the first cavity, and the second microstrip line (10-3) is arranged in the second cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322895218.5U CN221078865U (en) | 2023-10-27 | 2023-10-27 | Packaged chip testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322895218.5U CN221078865U (en) | 2023-10-27 | 2023-10-27 | Packaged chip testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221078865U true CN221078865U (en) | 2024-06-04 |
Family
ID=91263986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322895218.5U Active CN221078865U (en) | 2023-10-27 | 2023-10-27 | Packaged chip testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221078865U (en) |
-
2023
- 2023-10-27 CN CN202322895218.5U patent/CN221078865U/en active Active
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