CN201622288U - Clamp for radio-frequency testing of semiconductor chip - Google Patents
Clamp for radio-frequency testing of semiconductor chip Download PDFInfo
- Publication number
- CN201622288U CN201622288U CN 201020143802 CN201020143802U CN201622288U CN 201622288 U CN201622288 U CN 201622288U CN 201020143802 CN201020143802 CN 201020143802 CN 201020143802 U CN201020143802 U CN 201020143802U CN 201622288 U CN201622288 U CN 201622288U
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- radio frequency
- frequency component
- output terminal
- input end
- chip
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Abstract
The utility model discloses a clamp for radio-frequency testing of a semiconductor chip, which comprises a clamp body, an input-end radio-frequency component, an output-end radio-frequency component and a chip carrier. The input-end radio-frequency component and the output-end radio-frequency component are arranged on the two ends of the clamp body, the chip carrier is arranged on the clamp body and is connected with the input-end radio-frequency component and the output-end radio-frequency component, the clamp body is of a gib shape, and the input-end radio-frequency component and the output-end radio-frequency component are respectively connected with gib-shaped end faces through fasteners. The utility model has the advantages of simple structure, easy realization, low cost, reliable measurement data and convenient debugging. Moreover, the size of the testing clamp can be adjusted according to the size of the chip to be tested, so as to adapt to testing of various chips.
Description
Technical field
The utility model relates to a kind of anchor clamps of semiconductor die testing, especially a kind of anchor clamps that are applied to the radio frequency testing field of microwave, millimeter wave SIC (semiconductor integrated circuit).
Background technology
Semiconductor integrated circuit chip method of testing commonly used at present has probe in built-in testing and two kinds of methods of test fixture test.Probe chip test method be adopt the co-planar waveguide probe directly to after machining not the chip of burst measure, because chip does not assemble, this method of testing is very high for the conditional request of test: whether chip ground connection is good, probe and contacting of chip etc. all can have influence on final measuring accuracy; For the unsettled chip of electrical property, in test process, be easy to occur problems such as self-sustained oscillation; Because chip assembles and can not guarantee good heat radiation, be easy to generate heat accumulation and cause device to burn, power chip existed certain technical difficulty at built-in testing.
The method of testing of test fixture is that chip is assemblied on the test carrier, chip is carried out the test of performance by microstrip line and radio-frequency joint.Because chip assembles, its ground connection is connected with signal well, can guarantee the precision of testing and the consistance of repeated test.Particularly for the bigger device of power consumptions such as power amplifier by being welded on the carrier with golden tin solder, good heat-conducting guarantees that enough the test of long period can not burn device yet, so just can comprehensively test the performance index of chip.Adopt the power supply biasing of the method chip of anchor clamps test to add separately, can adjust the working point of device flexibly, can therefrom find the working point of device the best by the performance that compares different operating point.
The semiconductor test anchor clamps major part of China's use at present is from external import, comprise chuck body in its structure, an end face of chuck body is the input end radio frequency component fixedly, the other end is by the track output terminal radio frequency component that is slidingly connected, above-mentioned output terminal radio frequency component is by the circular straight-bar control of band knob, can promote the output terminal radio frequency component and closely be connected by rotating circular straight-bar with chuck body, fixed chip carrier on the chuck body, the all fixing microstrip line of weld length and shape on the chip carrier, and be provided with the filter capacitor of fixed number.Above-mentioned anchor clamps cost an arm and a leg; The Outside Dimensions and the dimension of microstrip line of chip carrier are fixed, and can not adjust according to the size of difference chip to be measured; When the slit between chip to be measured and the microstrip line is big, can influence test result; The input and output joint is easy to wearing and tearing, is not suitable for using in daily chip testing.
The utility model content
The technical problems to be solved in the utility model provides the anchor clamps that a kind of with low cost, reliable test result, debugging are used for the semi-conductor chip radio frequency testing easily.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: the input end radio frequency component that comprise chuck body, is arranged on the chuck body two ends and output terminal radio frequency component and the chip carrier that is arranged on the chuck body and links to each other with the output terminal radio frequency component with the input end radio frequency component, described chuck body is " recessed " font, and input end radio frequency component and output terminal radio frequency component are connected on two " recessed " font end faces of chuck body by means of securing member respectively.
Above-mentioned input end radio frequency component comprises input end baffle plate and the input end coaxial fitting that is located on the input end baffle plate.
Above-mentioned output terminal radio frequency component comprises output terminal baffle plate and the output terminal coaxial fitting that is located on the output terminal baffle plate.
The metal material that above-mentioned chuck body, input end radio frequency component, output terminal radio frequency component and chip carrier all adopt.
Chip carrier is provided with input microstrip line and the output microstrip line that links to each other with chip to be measured, and the input microstrip line links to each other with the output terminal coaxial fitting with described input end coaxial fitting respectively with the other end of output microstrip line.
Above-mentioned input, output microstrip line adopt conducting resinl or golden tin solder to be fixed on the chip carrier.
The utility model is compared with the inlet fixture of costliness, and cost is lower, has reduced the test cost significantly; The chuck body of " recessed " font closely is connected with the output terminal radio frequency component with the input end radio frequency component, forms a cavity, can simulate the actual user mode of chip to be measured, makes the data of test more reliable; And the input end radio frequency component all can separate with chuck body with the output terminal radio frequency component, and is more convenient when adopting mounting technology to assemble chip to be measured or debugging.
In the further improved measure, input, output microstrip line adopt conducting resinl or golden tin solder to fix, be convenient to the position and the length of input, output microstrip line be adjusted according to the size of chip to be measured, to be suitable for the test of multiple different size chip, and minimum is arrived in the gap that can adjust easily between chip to be measured and input, the output microstrip line, and test data is more accurate; Pilot hole is set to rectangle, be convenient to according to the input of the thickness adjusted of chip to be measured, output terminal coaxial fitting with input, export the situation that contacts between the microstrip line, realize the chip carrier that same chuck body can supporting a plurality of different-thickness.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is that master of the present utility model looks synoptic diagram;
Fig. 2 is a left view of the present utility model;
Fig. 3 be among Fig. 1 A-A to sectional view;
Fig. 4 is a stereographic map of the present utility model;
Wherein, 1, chuck body, 2, input end baffle plate, 3, chip to be measured, 4, the input end coaxial fitting, 5, screw, 6, chip carrier, 7, the output terminal baffle plate, 8, the output terminal coaxial fitting, 9, input microstrip line, 10, the output microstrip line, 11, elastic yarn, 12, feedthrough capacitor, 13, pilot hole, 14, threaded hole, 15, coaxial probe.
Embodiment
Referring to Fig. 1～Fig. 4, as can be seen, the utility model comprises chuck body 1, and chuck body is " recessed " shape, and the both ends of the surface of " recessed " font connect input end radio frequency component and output terminal radio frequency component respectively, the groove internal fixation chip carrier 6 of " recessed " font.
Described input end radio frequency component is made up of input end baffle plate 2 and the input end coaxial fitting 4 that is located on the input end baffle plate 2, and its function is that the microwave signal that will import converts the microstrip line transmission to by input end coaxial fitting 4.Described output terminal radio frequency component is made up of output terminal baffle plate 7 and the output terminal coaxial fitting 8 that is arranged on the output terminal baffle plate 7, and its function is that the microstrip line with chip output to be measured transmits the form that converts radio-frequency (RF) coaxial to and outputs to testing tool.
Above-mentioned input end baffle plate 2 and output terminal baffle plate 7 are rectangular metal plates, have two pilot holes 13 on it.
Further improved plan: above-mentioned pilot hole 13 is set to rectangle or flute profile.The straight flange of the long limit of rectangular pilot hole or the pilot hole of flute profile is parallel with a limit of described input end baffle plate 2 or output terminal baffle plate 7.
Input end baffle plate 2 is connected with output terminal baffle plate 7 and is locked on the chuck body 1 by above-mentioned pilot hole 13 and by means of screw 5.Pilot hole 13 is set to rectangle or flute profile, then can be according to the thickness difference of chip carrier 6, the upper-lower position in set screw 5 relative positioning holes 13, it is the relative position up and down between scalable input end baffle plate 2 and the chuck body 1, to guarantee input end baffle plate 2 and close-connected while of chuck body 1 left and right sides, guarantee that the coaxial probe 15 of input end coaxial fitting 4 accurately is connected with the input microstrip line 9 of chip carrier 6.Can guarantee that in like manner output terminal coaxial fitting 8 is connected with output the accurate of microstrip line 10.
Described chuck body 1 adopts conduction good metal materials processing moulding, and its xsect is " recessed " font, and is promptly middle low, front and back two wall height.The end face of " recessed " font is provided with and above-mentioned pilot hole 13 threaded holes 14 corresponding and that match with screw 5.Above-mentioned input end radio frequency component closely contacts with chuck body 1 with the output terminal radio frequency component during test, forms a cavity.Because the actual environment for use of chip is in airtight narrow and small cavity, not in the environment that opens wide, the utility model has formed a similar cavity body structure by input end baffle plate 2, output terminal baffle plate 7 with chuck body 1, actual user mode near chip to be measured makes the data of test more reliable.
For contacting of the reliability that guarantees assembling and each several part good, at the surface gold-plating or the silver of input end radio frequency component and output terminal radio frequency component and chuck body 1.
Adopt conducting resinl or golden tin solder with above-mentioned input microstrip line 9, output microstrip line 10 is fixed on the chip carrier 6, be convenient to size according to chip 3 to be measured, the input and output position of the position of the input/output signal port of chip 3 to be measured and the coaxial probe of input and output side coaxial fitting, position to input microstrip line 9 and output microstrip line 10, length and direction are adjusted, make the input of chip 3 to be measured, gap between output signal port and input microstrip line 9 or/and the output microstrip line 10 is very little, test data is more accurate, and can realize that same chip carrier is suitable for the test of a plurality of different size chips.
To sum up, when adopting the utility model,, be assemblied on the chip carrier 6 with mounting technology chip 3 to be measured then, the said chip carrier is installed in the chuck body 1 by means of screw at first according to the suitable chip carrier of the size Selection of chip 3 to be measured.Position according to chip carrier 6 installs input end baffle plate 2 and output terminal baffle plate 7 again, make input end coaxial fitting 4, output terminal coaxial fitting 8 coaxial probe respectively with the input microstrip line 9, output microstrip line 10 link to each other, with lock-screw with all movable partial fixings.
Connect power supply then, the output of power supply is connected with feed assembly, comprises with the matching used power feed assembly of the utility model adding electric connection, power supply ripple filtering circuit and elastic yarn 11.The power supply ripple filtering circuit is the ripple fluctuation of filter out power effectively, has reduced because power supply to the influence of device performance index, has improved measuring accuracy; The function of elastic yarn 11 is the bias points that the direct current that power supply is loaded into the power feed assembly are fed to chip.Power filter of the present utility model can adopt feedthrough capacitor, and referring to Fig. 1, power supply is added on the test chip 3 by feedthrough capacitor 12 and elastic yarn 11.According to the test needs, feedthrough capacitor 12 can be installed on input end baffle plate 2, output metal baffle 7 or the chuck body 1, and quantity also can increase and decrease as required.
The other end with input end coaxial fitting 4 and output terminal coaxial fitting 8 is connected testing tool at last, adjusts dc offset voltage to desired value, and chip 3 to be measured is tested.
Wherein test signal enters from input end coaxial fitting 4, and by importing the input end that microstrip line 9 is added to chip 3 to be measured, the output signal of chip to be measured is through output microstrip line 10,8 outputs of output terminal coaxial fitting.
Employing the utility model is simple in structure, is easy to realize, with low cost, test data is reliable, and debugging is convenient, can be fit to carry out the test of various chips according to the size of the adjusted size test fixture of test chip.
Claims (9)
1. anchor clamps that are used for the semi-conductor chip radio frequency testing, the input end radio frequency component that comprise chuck body (1), is arranged on chuck body (1) two ends is with the output terminal radio frequency component and the chip carrier (6) that is arranged on that chuck body (1) goes up and links to each other with the output terminal radio frequency component with the input end radio frequency component, it is characterized in that, described chuck body (1) is " recessed " font, and input end radio frequency component and output terminal radio frequency component are connected on two " recessed " font end faces of chuck body (1) by means of securing member respectively.
2. the anchor clamps that are used for the semi-conductor chip radio frequency testing according to claim 1 is characterized in that described input end radio frequency component comprises input end baffle plate (2) and is located at input end coaxial fitting (4) on the input end baffle plate (2).
3. the anchor clamps that are used for the semi-conductor chip radio frequency testing according to claim 1 is characterized in that described output terminal radio frequency component comprises output terminal baffle plate (7) and is located at output terminal coaxial fitting (8) on the output terminal baffle plate (7).
4. according to claim 2 or the 3 described anchor clamps that are used for the semi-conductor chip radio frequency testing, it is characterized in that described input end baffle plate (4) and output terminal baffle plate (7) are rectangular flat board, above-mentioned flat board is provided with pilot hole (13).
5. the anchor clamps that are used for the semi-conductor chip radio frequency testing according to claim 4, it is characterized in that described pilot hole (13) is set to rectangle or flute profile, and the straight flange of the pilot hole of the long limit of rectangular pilot hole or flute profile is parallel with a limit of described input end baffle plate (4) or output terminal baffle plate (7).
6. the anchor clamps that are used for the semi-conductor chip radio frequency testing according to claim 5 is characterized in that described chuck body (1) is provided with corresponding and that match with securing member threaded hole with pilot hole (13) (14).
7. the anchor clamps that are used for the semi-conductor chip radio frequency testing according to claim 1 is characterized in that described chuck body (1), input end radio frequency component, output terminal radio frequency component and chip carrier (6) all adopt metal material.
8. the anchor clamps that are used for the semi-conductor chip radio frequency testing according to claim 1, it is characterized in that described chip carrier (6) is provided with input microstrip line (9) and the output microstrip line (10) that links to each other with chip to be measured (3), input microstrip line (9) links to each other with output terminal coaxial fitting (8) with described input end coaxial fitting (4) respectively with the other end of output microstrip line (10).
9. the anchor clamps that are used for the semi-conductor chip radio frequency testing according to claim 8 is characterized in that described input microstrip line (9) and output microstrip line (10) adopt conducting resinl or golden tin solder to be fixed on the chip carrier (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020143802 CN201622288U (en) | 2010-03-30 | 2010-03-30 | Clamp for radio-frequency testing of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020143802 CN201622288U (en) | 2010-03-30 | 2010-03-30 | Clamp for radio-frequency testing of semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201622288U true CN201622288U (en) | 2010-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020143802 Expired - Lifetime CN201622288U (en) | 2010-03-30 | 2010-03-30 | Clamp for radio-frequency testing of semiconductor chip |
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| Country | Link |
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| CN (1) | CN201622288U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102621470A (en) * | 2012-03-31 | 2012-08-01 | 中国电子科技集团公司第十三研究所 | Method for testing performance of semiconductor microwave power chip packaging shell |
| CN103323630A (en) * | 2013-06-25 | 2013-09-25 | 苏州速腾电子科技有限公司 | Radio-frequency filter test fixture |
| CN103453924A (en) * | 2013-09-18 | 2013-12-18 | 镇江艾科半导体有限公司 | Semiconductor chip test baseboard |
| CN104034925A (en) * | 2014-06-24 | 2014-09-10 | 中国科学院上海微系统与信息技术研究所 | W-waveband multiport planar circuit test clamp |
| CN104375028A (en) * | 2014-11-07 | 2015-02-25 | 江苏博普电子科技有限责任公司 | Device for verifying performance of test board used for C-waveband GaN microwave power device |
| CN104753609A (en) * | 2013-12-26 | 2015-07-01 | 希姆通信息技术（上海）有限公司 | Communication module production development board |
| CN105301415A (en) * | 2015-11-27 | 2016-02-03 | 廊坊中电熊猫晶体科技有限公司 | Method for improving test of SMD quartz crystal resonator by employing network analyzer |
| CN106707134A (en) * | 2016-11-28 | 2017-05-24 | 中国电子科技集团公司第五十五研究所 | Terahertz (THz) frequency range power amplification chip on-chip power test system and test method |
| CN107942105A (en) * | 2017-11-23 | 2018-04-20 | 中国电子科技集团公司第四十研究所 | A kind of waveguide-to-coaxial adapter test fixture and test method |
| CN113835015A (en) * | 2021-09-09 | 2021-12-24 | 电子科技大学 | Reusable microwave chip test fixture with water cooling structure |
| US11815546B2 (en) | 2021-07-01 | 2023-11-14 | Changxin Memory Technologies, Inc. | Fixing device and fixing method for fixing chip in two orthogonal directions within horizontal plane and chip tester |
| US11874324B2 (en) | 2021-07-01 | 2024-01-16 | Changxin Memory Technologies, Inc. | Device for carrying chip, and device and method for testing chip |
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2010
- 2010-03-30 CN CN 201020143802 patent/CN201622288U/en not_active Expired - Lifetime
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102621470B (en) * | 2012-03-31 | 2014-06-11 | 中国电子科技集团公司第十三研究所 | Method for testing performance of semiconductor microwave power chip packaging shell |
| CN102621470A (en) * | 2012-03-31 | 2012-08-01 | 中国电子科技集团公司第十三研究所 | Method for testing performance of semiconductor microwave power chip packaging shell |
| CN103323630B (en) * | 2013-06-25 | 2016-07-06 | 苏州速腾电子科技有限公司 | Radio-frequency filter test fixture |
| CN103323630A (en) * | 2013-06-25 | 2013-09-25 | 苏州速腾电子科技有限公司 | Radio-frequency filter test fixture |
| CN103453924A (en) * | 2013-09-18 | 2013-12-18 | 镇江艾科半导体有限公司 | Semiconductor chip test baseboard |
| CN104753609B (en) * | 2013-12-26 | 2019-03-05 | 芯讯通无线科技（上海）有限公司 | Communication module production development plate |
| CN104753609A (en) * | 2013-12-26 | 2015-07-01 | 希姆通信息技术（上海）有限公司 | Communication module production development board |
| CN104034925A (en) * | 2014-06-24 | 2014-09-10 | 中国科学院上海微系统与信息技术研究所 | W-waveband multiport planar circuit test clamp |
| CN104375028A (en) * | 2014-11-07 | 2015-02-25 | 江苏博普电子科技有限责任公司 | Device for verifying performance of test board used for C-waveband GaN microwave power device |
| CN105301415A (en) * | 2015-11-27 | 2016-02-03 | 廊坊中电熊猫晶体科技有限公司 | Method for improving test of SMD quartz crystal resonator by employing network analyzer |
| CN105301415B (en) * | 2015-11-27 | 2018-06-22 | 廊坊中电熊猫晶体科技有限公司 | Improve the method using Network Analyzer test patch quartz-crystal resonator |
| CN106707134A (en) * | 2016-11-28 | 2017-05-24 | 中国电子科技集团公司第五十五研究所 | Terahertz (THz) frequency range power amplification chip on-chip power test system and test method |
| CN106707134B (en) * | 2016-11-28 | 2019-09-20 | 中国电子科技集团公司第五十五研究所 | Terahertz frequency range power amplifier chip is in piece power test system and test method |
| CN107942105A (en) * | 2017-11-23 | 2018-04-20 | 中国电子科技集团公司第四十研究所 | A kind of waveguide-to-coaxial adapter test fixture and test method |
| US11815546B2 (en) | 2021-07-01 | 2023-11-14 | Changxin Memory Technologies, Inc. | Fixing device and fixing method for fixing chip in two orthogonal directions within horizontal plane and chip tester |
| US11874324B2 (en) | 2021-07-01 | 2024-01-16 | Changxin Memory Technologies, Inc. | Device for carrying chip, and device and method for testing chip |
| CN113835015A (en) * | 2021-09-09 | 2021-12-24 | 电子科技大学 | Reusable microwave chip test fixture with water cooling structure |
| CN113835015B (en) * | 2021-09-09 | 2023-09-29 | 电子科技大学 | Reusable microwave chip test fixture with water cooling structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101103 |
|
| CX01 | Expiry of patent term |