CN201138360Y - Aging device - Google Patents
Aging device Download PDFInfo
- Publication number
- CN201138360Y CN201138360Y CN 200720144359 CN200720144359U CN201138360Y CN 201138360 Y CN201138360 Y CN 201138360Y CN 200720144359 CN200720144359 CN 200720144359 CN 200720144359 U CN200720144359 U CN 200720144359U CN 201138360 Y CN201138360 Y CN 201138360Y
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- edge connector
- burn
- board
- contact head
- aging
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Abstract
An aging device includes an aging test board; the testing surface of the aging test board is provided with a plurality of edge connectors and a connecting plate which is vertical to the edge connectors; a plurality of connecting sockets are arranged on the plane of the connecting plate which is vertical to the testing surface of the aging test board and used to be connected with semiconductor devices or COB plates which need to be aged. The aging device prevents the COB plates in the prior art from being plugged in and pulled out from the edge connectors; even if the COB plates are plugged in and pulled out from the sockets of the connecting plate for a plurality of times, only the connecting plate needs to be replaced; therefore, the device increases the number of the semiconductor devices to be aged at the same time, can age COB plates and semiconductor devices in different specifications and improve the universality of the aging device.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly a kind of aging equipment.
Background technology
Along with high-tech flourish, the volume of semiconductor devices is tending towards gently, thin, short, little aspect develops, after semiconductor devices is made, semiconductor devices also must carry out burn-in test (Burn-in test), the environment of high temperature of semiconductor devices that its purpose is to provide to be measured, high voltage, high electric current, make life cycle than displaying that short semiconductor devices is done sth. in advance in the process of burn-in test, to eliminate the semiconductor devices that is easy to break down, reliability improves relatively to make semiconductor devices come into the market afterwards.Except volume production device aging, the reliability of products assessment also needs to use burn-in test.
Described burn-in test generally carries out on burn-in board (burn in board), and in the prior art, burn-in board is an element by Chip Packaging decision, a kind of burn-in board correspondence a kind of form of Chip Packaging.That is to say, in order to meet the form of various Chip Packaging, need to prepare many kinds of burn-in boards, and different chip products has many packing forms now, so corresponding different chip product provides various burn-in board can increase production cost, and the cycle that designs and produces of new burn-in board is long, and generally need just can be finished in about 5 months, influences chip reliability authentication and listing progress.
Chip Packaging that application number is 200710044557.5 Chinese patent application file description on a kind of support plate (chip on board, burn-in board COB), with reference to the accompanying drawings 1 and accompanying drawing 2 shown in, Fig. 1 is described burn-in board structural representation.Described burn-in board 5 mainly comprises: framework 7; Be positioned at the handle 6 of framework 7 one ends, this handle 6 can be inserted into the framework 7 of burn-in board 5 in the container of aging equipment calibration cell; Several evenly distributed edge connectors 8 (edge connector) in framework 7, wherein edge connector 8 is used for connecting external pin on the COB plate (application number is the golden finger 14a of 200710044557.5 patented claim), neighboring edge connector 8 is identical in the spacing of x direction, is a; Relative with handle 6 and be positioned at framework 7 other ends several connect finger 9, the drive plate (not shown) that connects finger 9 and aging equipment electrically connects, drive plate produces the test signal of voltage or regulation, thereby the performance of the chip on the test COB plate.
Fig. 2 is edge connector 8 structural representations in Fig. 1 burn-in board 5.This edge connector 8 mainly comprises insulating body 10; Be positioned at several contact heads 11 that are arranged in parallel of insulating body 10 inner both sides, the external pin on described contact head 11 and the COB plate electrically connects; With the stitch 12 that contact head 11 connects one to one, stitch 12 is connected to and connects on the finger 9 by establishing circuit in the framework 7.Described burn-in board can not only realize supporting the test of various chips, and can simplify design, layout and the manufacturing process of burn-in board.
Yet, in order to enhance productivity, when carrying out a burn-in test test, the quantity of the COB plate that connects on the burn-in board is more and more, make that the setting of burn-in board coboundary connector is more and more intensive, and, be accompanied by the trend of integrated circuit microminiaturization, under the ever-increasing situation of contact head quantity on the edge connector, just cause the size of contact head more and more littler, the distance between the contact head is also more and more littler, when carrying out burn-in test, when the external pin on the COB plate repeatedly plugs on the contact head of edge connector, damage the contact head of edge connector, make to be short-circuited between the contact head of edge connector or to open circuit, reduce the serviceable life of edge connector, no matter the edge connector of changing in enormous quantities is considered from technology or cost and is difficult to realize, thereby has to scrap burn-in board.And the design of burn-in board and manufacturing cost are all very high, cause man power and material's huge waste.
Therefore, reduce the loss that the COB plate plugs the edge connector that causes, and improve the quantity of the aging COB plate of a burn-in test test, become the problem of a key.
The utility model content
In view of this, the technical matters that the utility model solves provides a kind of aging equipment, the loss of the edge connector that the plug of reduction COB plate causes in the quantity that improves the aging COB plate of a burn-in test test.
A kind of aging equipment comprises burn-in board, and the test surfaces of described burn-in board is provided with some edge connectors; Web joint has first joint face, is connected with edge connector, and second joint face is provided with some gang sockets, and described gang socket semiconductor devices or the COB plate that some needs are aging is electrically connected to the edge connector that is connected with first joint face.
Wherein, described first joint face is connected with edge connector is vertical.
Wherein, described first joint face is vertical with second joint face.
Wherein, the size of the edge connector that is provided with on the described burn-in board test surfaces and the spacing between the neighboring edge connector can be the size of edge connector in the prior art and 1 to 4 times of the spacing between the neighboring edge connector.
Wherein, described edge connector comprises insulating body; Be positioned at several contact heads that are arranged in parallel of the inner both sides of insulating body; The stitch that connects one to one with contact head.
Wherein, the size of contact head and the spacing between the contact head are in the prior art on the edge connector 1 to 4 times of the size of contact head and the spacing between the contact head on the described edge connector.
Wherein, described web joint is electrically connected with edge connector by connecting finger.
Described gang socket comprises insulating body; Be positioned at several contact heads that are arranged in parallel of the inner both sides of insulating body; The stitch that connects one to one with contact head.
Compared with prior art, such scheme has the following advantages:
Because the web joint of described aging equipment, has first joint face, be connected with edge connector, second joint face, be provided with some gang sockets, described gang socket semiconductor devices or the COB plate that some needs are aging is electrically connected to the edge connector that is connected with first joint face, therefore, can there be some COB plates that are provided with semiconductor devices to wear out simultaneously, have improved quantity with the semiconductor devices that once wears out.Adopt the described aging equipment of present embodiment, owing to can connect some web joints simultaneously on the burn-in board, the specification of the web joint socket of different web joints also can have nothing in common with each other, can wear out the COB plate of different size and the semiconductor devices of different size have improved the versatility of aging equipment.
Owing to adopt web joint to utilize three dimensions, it is big that the size of described burn-in board coboundary connector becomes, density diminishes also can not reduce the quantity of same batch of semiconductor devices that wears out, and large-sized edge connector is lower to the requirement of manufacture craft, make than being easier to, usability is also reliable.
Further, adopt the described aging equipment of present embodiment, the COB plate that carries out aging test is connected on the web joint, avoided the plug of COB plate on edge connector in the prior art, even the COB plate repeatedly damages the web joint socket after the plug on the web joint socket, also only need redesign to make web joint and get final product; When the semiconductor devices of new specification and model and COB wear out, also only need the redesign web joint, and need not to change burn-in board, because the manufacturing of web joint and design and the manufacturing cost that design cost is far smaller than burn-in board, therefore, this aging equipment has reduced the production cost of enterprise.
Description of drawings
Fig. 1 is the burn-in board structural representation of prior art;
Fig. 2 is the edge connector structural representation in Fig. 1 burn-in board;
Fig. 3 is the utility model embodiment 1 described web joint structural representation;
Fig. 4 is the utility model embodiment 1 described aging equipment structural representation.
Embodiment
The purpose of this utility model is to provide a kind of aging equipment, reduces the loss that the COB plate plugs the edge connector that causes in the quantity that improves the aging COB plate of a burn-in test test.
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.
Embodiment 1
A kind of aging equipment comprises burn-in board, and the test surfaces of described burn-in board is provided with some edge connectors; Web joint has first joint face, is connected with edge connector, and second joint face is provided with some gang sockets, and described gang socket semiconductor devices or the COB plate that some needs are aging is electrically connected to the edge connector that is connected with first joint face.
The described aging equipment of present embodiment comprises burn-in board, and the structure of described burn-in board can be any burn-in board of the prior art, and for example, the burn-in board shown in accompanying drawing 1 and the accompanying drawing 2 comprises some edge connectors.Described edge connector comprises insulating body; Be positioned at several contact heads that are arranged in parallel of the inner both sides of insulating body; The stitch that connects one to one with contact head.Unlike the prior art be, the quantity of the edge connector that contains on the described burn-in board of present embodiment can be much smaller than burn-in board coboundary number of connectors in the prior art, therefore, under the identical situation of the area of burn-in board, spacing between the size of edge connector and the neighboring edge connector can be more than or equal to the size of edge connector in the prior art and the spacing between the neighboring edge connector, and the size of contact head and the spacing between the contact head also can be more than or equal to the size of contact head in the prior art and the spacings between the contact head on the edge connector.
In the concrete technology, spacing between the size of edge connector and the neighboring edge connector can be decided according to the design of burn-in board and the convenience of making, comparative optimization, spacing between the size of edge connector and the neighboring edge connector can be the size of edge connector in the prior art and 1 to 4 times of the spacing between the neighboring edge connector, preferably, be 2 to 3 times.
The size of contact head and the spacing between the contact head also can the corresponding increases according to the convenience of technological design and making on the edge connector, on edge connector, simply plug the described edge connector of not loss for well with first joint face of web joint, comparative optimization, the size of contact head and the spacing between the contact head are in the prior art on the edge connector 1 to 4 of the size of contact head and the spacing between the contact head on the edge connector, preferably, be 2 to 3 times times.
In the present embodiment, the quantity of contact head can be set as required on the edge connector, for example is 72, and 144,288 etc.
In the present embodiment, the plane that the definition burn-in board is provided with edge connector is the test surfaces of burn-in board.First joint face of web joint is connected on the described edge connector, and second joint face of described web joint is provided with some gang sockets, is used for being connected with aging semiconductor devices or the COB plate of needs.
With reference to the accompanying drawings shown in 3, structural representation for the described web joint of present embodiment, have first joint face and second joint face, described first joint face and second joint face only refer to any two planes of web joint, preferably, described first joint face and second joint face are mutually perpendicular two faces of web joint, are not defined as which concrete face.In the accompanying drawing 3, for the convenience of describing, definition 100 is first joint face of web joint, and 200 is second joint face of web joint.
In the present embodiment, described first joint face 100 directly links to each other with the edge connector of burn-in board, on second joint face 200, be provided with some gang sockets, be used for directly being connected with semiconductor devices or the COB plate that needs wear out, and described COB plate can plug in gang socket easily.The quantity of the gang socket on the described web joint is decided according to the needs of the size of web joint and actual process design.Described second joint face can be vertical with the test surfaces of burn-in board, also can have a certain degree with the test surfaces of burn-in board, for example, and 0 to 180 degree, preferably, second joint face is perpendicular to the test surfaces of burn-in board.
The structure of described gang socket can be identical with the structure of the edge connector of burn-in board, mainly comprises insulating body; Be positioned at several contact heads that are arranged in parallel of the inner both sides of insulating body, described contact head be used for the COB plate on external pin electrically connect; With the stitch that contact head connects one to one, establish line electricity in stitch and the web joint and be connected.The quantity of the contact head of described gang socket, the size of contact head, the distance between the adjacent contact is according to quantity, the spacing of the external pin of the COB plate that plugs in gang socket, size and deciding.For different COB plates, need different gang socket.
Easy to connect for described web joint and burn-in board, preferably, the position of intersecting with first joint face 100 on first joint face 100 and second joint face 200 is provided with and is connected finger 120, is electrically connected with the plug of convenient described web joint on edge connector.The structure of described connection finger 120 and form the connection on the COB plate in technology and the prior art to point the structure of (golden finger) identical with the formation method.
With reference to the accompanying drawings shown in 4, for the web joint of present embodiment is vertically connected on structural representation on the edge connector, in the accompanying drawing, burn-in board 300 is provided with some edge connectors 310, the structure of described edge connector is identical with the structure of prior art edge connector, but, the density of described edge connector can be much smaller than the density of edge connector in the prior art, and the spacing of contact head and size can be much larger than the spacing and the sizes of contact head in the edge connector in the prior art in the described edge connector; Be positioned at the handle 320 of burn-in board one end, be positioned at relative several of the burn-in board other end and handle 320 and connect finger 330, the drive plate (not shown) that connects finger 330 and aging equipment electrically connects, and drive plate produces the test signal of voltage or regulation.
In the accompanying drawing 4, web joint is vertically connected on the burn-in board, second joint face 200 of described web joint is vertical with the test surfaces of burn-in board, first joint face is inserted in the space between some plugs of edge connector (not seeing among the figure), second joint face 200 is provided with some gang sockets 110, in order to make accompanying drawing 4 seem simply clear, the only symbolistic gang socket 110 of having drawn among the figure, in fact, the quantity of gang socket 110 is decided according to the needs of technological design greater than 1.
When carrying out aging test, the semiconductor devices of the some COB encapsulation that need wear out links to each other with the gang socket of web joint in the mode of plug, it is parallel with the test surfaces of burn-in board that the COB plate is provided with the plane of semiconductor devices, therefore, the described aging equipment of present embodiment has utilized three dimensions cleverly, can there be some COB plates that are provided with semiconductor devices to wear out simultaneously, have improved quantity with the semiconductor devices that once wears out.
For described web joint, owing to contain some independently gang sockets mutually, therefore, the lead-in wire number and the spacing of each gang socket can have nothing in common with each other, and that is to say, as required the specification of the COB plate of Lian Jieing, the lead-in wire of gang socket can be 72pin, 144pin, 288pin etc., the lead-in wire of gang socket can also be that the specification according to COB customizes separately.For the device of other different packaged types (for example DIP, TSOP, BGA etc.),, just can under the situation of not changing burn-in board, realize aging function as long as select the web joint that complementary socket (Socket) is housed accordingly for use.Thereby significantly reduce the great number input of burn-in board, also improved the versatility of aging equipment.
And, in the present embodiment, because the web joint of described aging equipment has utilized three dimensions, it is big that the size of described burn-in board coboundary connector becomes, density diminishes also can not reduce the quantity of same batch of semiconductor devices that wears out, and large-sized edge connector is lower to the requirement of manufacture craft, make than being easier to, and usability is also reliable.
Further, adopt the described aging equipment of present embodiment, can increase the size of connecting line of burn-in board coboundary connector and spacing and do not reduce the quantity of the semiconductor devices that once wears out, reduce loss to edge connector, simultaneously, the COB plate that carries out aging test is connected on the web joint, therefore, avoided the plug of COB plate on edge connector in the prior art, even the COB plate repeatedly damages the web joint socket after the plug on the web joint socket, also only need scrap and change web joint and get final product; When the semiconductor devices of new specification and model and COB wear out, also only need the redesign web joint, and need not to change burn-in board, and different web joints can repeatedly reuse, because the manufacturing of web joint and design and the manufacturing cost that design cost is far smaller than burn-in board, therefore, this aging equipment has reduced the production cost of enterprise.
Though the utility model is to disclose as above with preferred embodiment, the utility model is not to be defined in this.Any those skilled in the art in not breaking away from spirit and scope of the present utility model, all can do various changes and modification, and therefore protection domain of the present utility model should be as the criterion with claim institute restricted portion.
Claims (8)
1. aging equipment, comprise burn-in board, the test surfaces of described burn-in board is provided with some edge connectors, it is characterized in that, also comprise: web joint has first joint face, be connected with edge connector, second joint face is provided with some gang sockets, and described gang socket semiconductor devices or the COB plate that some needs are aging is electrically connected to the edge connector that is connected with first joint face.
2. aging equipment according to claim 1 is characterized in that, described first joint face is connected with edge connector is vertical.
3. aging equipment according to claim 1 is characterized in that, described first joint face is vertical with second joint face.
4. aging equipment according to claim 1, it is characterized in that the size of the edge connector that is provided with on the described burn-in board test surfaces and the spacing between the neighboring edge connector can be the size of edge connector in the prior art and 1 to 4 times of the spacing between the neighboring edge connector.
5. aging equipment according to claim 1 is characterized in that described edge connector comprises insulating body; Be positioned at several contact heads that are arranged in parallel of the inner both sides of insulating body; The stitch that connects one to one with contact head.
6. aging equipment according to claim 5 is characterized in that, the size of contact head and the spacing between the contact head are in the prior art on the edge connector 1 to 4 times of the size of contact head and the spacing between the contact head on the described edge connector.
7. aging equipment according to claim 1 is characterized in that, described web joint is electrically connected with edge connector by connecting finger.
8. aging equipment according to claim 1 is characterized in that described gang socket comprises insulating body; Be positioned at several contact heads that are arranged in parallel of the inner both sides of insulating body; The stitch that connects one to one with contact head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720144359 CN201138360Y (en) | 2007-12-13 | 2007-12-13 | Aging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720144359 CN201138360Y (en) | 2007-12-13 | 2007-12-13 | Aging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201138360Y true CN201138360Y (en) | 2008-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200720144359 Expired - Lifetime CN201138360Y (en) | 2007-12-13 | 2007-12-13 | Aging device |
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|---|---|
| CN (1) | CN201138360Y (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102128991B (en) * | 2010-01-12 | 2013-01-23 | 北大方正集团有限公司 | Aging test device and test method thereof |
| CN103048611A (en) * | 2013-01-21 | 2013-04-17 | 烟台正海科技有限公司 | Universal COB module testing mode |
| CN103837810A (en) * | 2012-11-27 | 2014-06-04 | 江苏绿扬电子仪器集团有限公司 | A device for testing characteristics of transistors in different packaging modes |
| CN104267332A (en) * | 2014-10-13 | 2015-01-07 | 华东光电集成器件研究所 | Integrated circuit shell temperature balancing burn-in device |
| CN104569512A (en) * | 2013-10-25 | 2015-04-29 | 特克特朗尼克公司 | Releaseable probe connection |
| CN105277863A (en) * | 2014-07-17 | 2016-01-27 | 中国运载火箭技术研究院 | Aging device for power amplifier |
| CN106571166A (en) * | 2016-11-09 | 2017-04-19 | 中国空间技术研究院 | MT29F series NAND FLASH test aging system with customizable process |
| CN107817366A (en) * | 2017-09-15 | 2018-03-20 | 北方电子研究院安徽有限公司 | A kind of Can thick film integrated circuit pull-up |
| CN109061233A (en) * | 2018-07-27 | 2018-12-21 | 广州华望汽车电子有限公司 | A kind of multipurpose drawer and its trolley |
| CN109975691A (en) * | 2019-03-29 | 2019-07-05 | 成都天奥技术发展有限公司 | Integrated circuit universal burn-in experimental rig |
| CN113125936A (en) * | 2021-03-04 | 2021-07-16 | 杭州长川科技股份有限公司 | Aging test device |
| CN113219314A (en) * | 2021-04-23 | 2021-08-06 | 深圳市时代速信科技有限公司 | Semiconductor batch test system |
-
2007
- 2007-12-13 CN CN 200720144359 patent/CN201138360Y/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102128991B (en) * | 2010-01-12 | 2013-01-23 | 北大方正集团有限公司 | Aging test device and test method thereof |
| CN103837810A (en) * | 2012-11-27 | 2014-06-04 | 江苏绿扬电子仪器集团有限公司 | A device for testing characteristics of transistors in different packaging modes |
| CN103048611A (en) * | 2013-01-21 | 2013-04-17 | 烟台正海科技有限公司 | Universal COB module testing mode |
| CN104569512A (en) * | 2013-10-25 | 2015-04-29 | 特克特朗尼克公司 | Releaseable probe connection |
| CN105277863A (en) * | 2014-07-17 | 2016-01-27 | 中国运载火箭技术研究院 | Aging device for power amplifier |
| CN104267332B (en) * | 2014-10-13 | 2017-06-06 | 华东光电集成器件研究所 | A kind of integrated circuit shell temperature equilibrium ageing device |
| CN104267332A (en) * | 2014-10-13 | 2015-01-07 | 华东光电集成器件研究所 | Integrated circuit shell temperature balancing burn-in device |
| CN106571166A (en) * | 2016-11-09 | 2017-04-19 | 中国空间技术研究院 | MT29F series NAND FLASH test aging system with customizable process |
| CN106571166B (en) * | 2016-11-09 | 2020-02-14 | 中国空间技术研究院 | MT29F series NAND FLASH test aging system with customizable flow |
| CN107817366A (en) * | 2017-09-15 | 2018-03-20 | 北方电子研究院安徽有限公司 | A kind of Can thick film integrated circuit pull-up |
| CN109061233A (en) * | 2018-07-27 | 2018-12-21 | 广州华望汽车电子有限公司 | A kind of multipurpose drawer and its trolley |
| CN109975691A (en) * | 2019-03-29 | 2019-07-05 | 成都天奥技术发展有限公司 | Integrated circuit universal burn-in experimental rig |
| CN113125936A (en) * | 2021-03-04 | 2021-07-16 | 杭州长川科技股份有限公司 | Aging test device |
| CN113219314A (en) * | 2021-04-23 | 2021-08-06 | 深圳市时代速信科技有限公司 | Semiconductor batch test system |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20121120 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20121120 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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| CX01 | Expiry of patent term |
Granted publication date: 20081022 |
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| CX01 | Expiry of patent term |