JP2014235126A - Substrate inspection device, substrate inspection method, and substrate inspection jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide technology capable of preventing the destruction of an electronic component when an oxide film pertaining to terminals of a substrate having a built-in component is removed.SOLUTION: A substrate inspection device 1 has a plurality of contact pieces 12a-12h to be contacted with a plurality of terminals 93 connected to an electronic component 95. The substrate inspection device 1 detects, from among two contact pieces 12e, 12f to be contacted with one terminal 93e, a poorly contacted contact piece 12f (a contact piece not contacted in good condition with the terminal 93e) and a well-contacted contact piece 12e (a contact piece contacted in good condition with the terminal 93e). A switch 22f between the poorly contacted contact piece 12f and an equi-potential wiring 21 is placed in an off state, and a switch 22e between the well-contacted contact piece 12e and the equi-potential wiring 21 and other switches 22a-22d, 22g, 22h are placed in an on state. A voltage for removing an oxide film is applied between the contact pieces 12e and 12f while the contact pieces 12a-12d, 12g, 12h and the well-contacted contact piece 12e are being connected at equal potential.

Description

  The present invention relates to a substrate inspection apparatus for performing an electrical inspection of a wiring pattern formed on a substrate containing an electronic component (IC or the like), and a related technology.

  Currently, an electronic component built-in substrate (also referred to as an embedded substrate) in which electronic components including a diode and a capacitor are incorporated is beginning to spread.

  Although such an inspection method for an electronic component built-in substrate has not yet been established, there is one disclosed in Patent Document 1 as one method.

  There is also a technique (oxide film removal technique (electric cleaning technique)) for removing an oxide film formed on the surface of a terminal on a substrate by applying a high voltage. Specifically, two contacts are brought into contact with a specific terminal on the substrate, and a high voltage for removing an oxide film is applied between the two contacts to form on the surface of the specific terminal. It is possible to remove the oxidized film. According to this technique, even if an oxide film (insulating film) is generated on the surface of the terminal due to oxygen in the air, the contact between the inspection contact (probe) and the terminal on the substrate It can prevent that a favorable contact is inhibited by the said oxide film.

JP 2007-309814 A

  However, when the above-described oxide film removal technique (electric cleaning technique) is applied to an electronic component built-in substrate, the following problems occur.

  For example, when two contacts are brought into contact with a specific terminal connected to an electronic component and a high voltage for removing an oxide film is applied between the two contacts, other contacts connected to the electronic component Other contacts may also be in contact with the terminal. In this case, when a high voltage is applied to a specific terminal using two contacts, not only a high voltage is generated between the two contacts, but also between the two contacts and the other contacts. A high voltage is also generated between the two contacts, and a high voltage is also generated in an electronic component provided between the specific terminal at the contact destination of the two contacts and the other terminal at the connection destination of the other contact. is there. And when such a high voltage (voltage for oxide film removal) is applied to an electronic component, there exists a problem that the said electronic component will be destroyed.

  Therefore, an object of the present invention is to provide a technique capable of preventing destruction of an electronic component when removing an oxide film related to a terminal of the electronic component built-in substrate.

  In order to solve the above-mentioned problems, the invention of claim 1 is a board inspection apparatus that performs an electrical inspection of a wiring pattern formed on a board containing an electronic component, and includes a plurality of terminals on the board. A plurality of contacts that contact a plurality of terminals that are electrically connected to the electronic component, and two contacts of the plurality of contacts that contact one terminal of the plurality of terminals The contact failure contact which is a contact which is not in good contact with the one terminal among the two contacts to be detected is detected, and the one terminal of the two contacts is in good contact A detection control means for detecting a contact good contact that is a contact, a plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate, and among the plurality of switches The previous contact with the poor contact The first switch between the same potential wiring is turned off, the second switch between the contact good contact and the same potential wiring is turned on, and the plurality of contacts Each switch between the one or two or more contacts other than the two contacts and the equipotential wiring is turned on, and the one or more contacts and the contact good contact are And oxide film removal control means for applying a voltage for removing an oxide film between the contact good contact and the poor contact contact while being connected to the same potential.

  According to a second aspect of the present invention, there is provided a substrate inspection apparatus for performing an electrical inspection of a wiring pattern formed on a substrate in which an electronic component is incorporated, wherein a plurality of terminals on the substrate are electrically connected to the electronic component. A plurality of contacts that contact a plurality of connected terminals, and two of the plurality of contacts, wherein the plurality of terminals are connected to the same wiring pattern in the substrate. Among the two contacts that should be in contact with two different terminals, a contact failure contact that is not in good contact with the terminal to be contacted is detected, and the contact with the terminal to be contacted with is good. Detection control means for detecting a contact good contact that is a contact, a plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate, and a plurality of switches Before A first switch between the poor contact and the equipotential line is turned off, and a second switch between the good contact and the equipotential line is turned on; and Each switch between the one or more contacts other than the two contacts and the equipotential wiring among the plurality of contacts is turned on, and the one or more contacts and the Oxide film removal control means for applying a voltage for removing an oxide film between the contact good contact and the poor contact contact in a state where the contact good contact is connected to the same potential. It is characterized by.

  According to a third aspect of the present invention, in the substrate inspection apparatus according to the first or second aspect of the present invention, the detection control means includes either one of the one or more contacts or one of the two contacts. When one of the contacts is detected as a good contact when the conduction state between the contacts is confirmed, any one of the one or more contacts and the two contacts are detected. When the conduction state with the other contact of the children is not confirmed, the other contact is detected as the poor contact contact.

  According to a fourth aspect of the present invention, there is provided a substrate inspection jig used for electrical inspection of a wiring pattern formed on a substrate incorporating an electronic component, the plurality of terminals on the substrate, wherein the electronic component is attached to the electronic component. A plurality of contacts that are in contact with a plurality of terminals that are electrically connected, the contacts including two contacts that are to contact one terminal of the plurality of terminals; A plurality of switches provided between each of the plurality of contacts and the same potential wiring on the outside, and a contact good contact that is a contact that is in good contact with the one terminal of the two contacts And a wiring part for applying a voltage for removing an oxide film between the two contacts and a poor contact that is not in good contact with the one terminal. Between the contact good contact and the poor contact contact When a voltage for removing a chemical film is applied, a first switch between the contact failure contact and the equipotential wiring among the plurality of switches is turned off and the contact is good. A second switch between the contact and the equipotential wiring is turned on, and one or more contacts other than the two contacts among the plurality of contacts and the equipotential wiring; Each of the switches is turned on, and the one or more contacts and the good contact are connected to each other at the same potential.

  The invention according to claim 5 is a substrate inspection jig used for electrical inspection of a wiring pattern formed on a substrate incorporating an electronic component, wherein the jig is a plurality of terminals on the substrate and is attached to the electronic component. A plurality of contacts that contact a plurality of terminals that are electrically connected, and two of the plurality of terminals that should contact each of two different terminals connected to the same wiring pattern in the substrate. A plurality of contacts including a contact, a plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate, and a contact target terminal of the two contacts. A voltage for removing an oxide film is provided between a contact good contact that is a contact that is in contact and a contact poor contact that is a contact that is not in good contact with a contact target terminal among the two contacts. Wiring part for applying and When a voltage for removing an oxide film is applied between the good contact and the poor contact, the poor contact and the equipotential wiring among the plurality of switches. And the second switch between the contact good contact and the equipotential wiring is turned on, and the second of the plurality of contacts is turned on. Each switch between one or two or more contacts other than one contact and the equipotential wiring is turned on so that the one or more contacts and the good contact contact are at the same potential. It is connected.

  According to a sixth aspect of the present invention, there is provided a substrate inspection method for performing an electrical inspection of a wiring pattern formed on a substrate incorporating an electronic component, wherein a) a plurality of terminals on the substrate are electrically connected to the electronic component. Two contacts among a plurality of contacts that contact a plurality of terminals connected to each other, and from among two contacts that should contact one terminal of the plurality of terminals, A contact poor contact which is a contact which is not in good contact with one terminal and which is in good contact with the one terminal among the two contacts. And b) among a plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate, between the poor contact contact and the same potential wiring. Turn off the first switch, and A second switch between the contact good contact and the equipotential wiring is turned on, and one or more contacts other than the two contacts out of the plurality of contacts and the same potential A step of turning on each switch between the wiring and connecting the one or more contacts and the contact good contact with each other at the same potential; c) the one or more contacts and the contact Applying a voltage for removing an oxide film between the good contact and the poor contact in a state where the good contact is connected to the same potential. .

  A seventh aspect of the present invention is a substrate inspection method for performing an electrical inspection of a wiring pattern formed on a substrate incorporating an electronic component, wherein a) a plurality of terminals on the substrate are electrically connected to the electronic component. Two of the plurality of contacts that contact a plurality of terminals connected to each other, and two different terminals connected to the same wiring pattern in the substrate among the plurality of terminals. A contact that is in good contact with the terminal to be contacted is detected while detecting a poor contact contact that is not in good contact with the terminal to be contacted from the two contacts to be contacted. B) detecting a contact good contact, and b) out of a plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate. With potential wiring And the second switch between the contact good contact and the equipotential wiring is turned on, and the plurality of contacts other than the two contacts Each switch between the one or two or more contacts and the equipotential wiring is turned on to connect the one or two or more contacts and the good contact to each other at the same potential; c) With the one or more contacts and the contact good contact connected to each other at the same potential, a voltage for removing an oxide film is applied between the contact good contact and the poor contact contact. And applying.

  According to an eighth aspect of the present invention, in the substrate inspection method according to the sixth or seventh aspect of the invention, the step a) includes: a-1) one of the one or two or more contacts and the two contacts. A step of detecting the one contact as the good contact when a conduction state with one of the contacts is confirmed; a-2) Among the one or more contacts Detecting the other contact as the poor contact when the conduction state between any contact of the contact and the other contact of the two contacts is not confirmed. It is characterized by.

 According to the first to eighth aspects of the invention, it is possible to prevent the electronic component from being destroyed when the oxide film on the terminal of the electronic component built-in substrate is removed.

It is the schematic which shows the internal structure of a board | substrate inspection apparatus. It is the schematic which shows the structure of the jig | tool for board | substrate inspection. It is a figure which shows the electronic circuit (inspection circuit) which test | inspects a board | substrate. It is a figure which shows the state in which the voltage for oxide film removal is applied with respect to one terminal. It is a figure which shows the state which two contacts are contacting the one terminal favorably. It is a figure which shows the state in which one of two contacts is in poor contact with one terminal. It is a figure which shows the state in which one of two contacts is not contacting the one terminal. It is a flowchart which shows the electrical cleaning procedure with respect to one terminal. It is a figure which shows the state in which the voltage for oxide film removal is applied between two terminals. It is a flowchart which shows the electrical cleaning procedure with respect to two terminals. It is a figure which shows the state which the two contactors are each contacting the terminal corresponding well. It is a figure which shows the state in which one of two contacts has poor contact with the corresponding terminal. It is a figure which shows the state which one of two contactors is not contacting the corresponding | compatible terminal.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<1. Overview of device configuration>
FIG. 1 is a schematic diagram showing an internal configuration of the substrate inspection apparatus 1. The board inspection apparatus 1 is an inspection apparatus that performs continuity inspection and insulation inspection between a plurality of wiring patterns provided on a substrate (circuit board) 90 to be inspected. The board inspection apparatus 1 can also test a board (an electronic part built-in board) in which an electronic component is built. Further, as will be described later, the substrate inspection apparatus 1 has a function (electric cleaning function) of removing an oxide film formed on the surface of the terminal on the substrate 90 by applying a high voltage.

  As shown in FIG. 1, the substrate inspection apparatus 1 includes a transfer table 3 on which a substrate 90 to be inspected is placed inside a substantially rectangular parallelepiped housing 8. The transport table 3 is supported by a support mechanism (not shown) and is driven in the horizontal direction (the left-right direction in the figure) by a drive mechanism (not shown).

  A jig driving mechanism 2 (specifically 2a, 2b) is provided above and below the transfer table 3. Specifically, a jig driving mechanism 2 a is disposed on the upper side in the vertical direction of the transport table 3, and a jig driving mechanism 2 b is disposed on the lower side in the vertical direction of the transport table 3. Each jig drive mechanism 2a, 2b is movable in the vertical direction (vertical direction in FIG. 1).

  The jig driving mechanism 2 is provided with a board inspection jig 10 (specifically, 10a and 10b). Specifically, the substrate inspection jig 10a is fixed to the lower surface side of the jig driving mechanism 2a, and the substrate inspection jig 10b is fixed to the upper surface side of the jig driving mechanism 2b.

  Each of the substrate inspection jigs 10a and 10b is provided with a plurality (for example, 100) of contactors (probes) 12 for inspecting the substrate 90, which are in contact with the terminals (inspection points) of the wiring pattern of the substrate 90. ing.

  When the substrate inspection jig 10a is lowered in accordance with the lowering operation of the jig driving mechanism 2a, a plurality of contacts 12 on the lower end side of the substrate inspection jig 10a are provided on the upper surface side of the substrate 90. The terminals (also referred to as lands or pad electrodes) are in contact with each other. At this time, appropriate physical pressure and electrical contact are ensured by applying an appropriate pressure.

  Similarly, when the substrate inspection jig 10b is raised according to the raising operation of the jig driving mechanism 2b, a plurality of contacts 12 on the upper end side of the substrate inspection jig 10b are provided on the lower surface side of the substrate 90. Contact each of the multiple terminals. At this time, appropriate physical pressure and electrical contact are ensured by applying an appropriate pressure. Note that a through-opening is formed in the central portion of the transport table 3 for bringing the contact 12 of the substrate inspection jig 10b into contact with the terminal of the wiring pattern on the lower surface (back surface) of the substrate 90.

  In this way, the electrical inspection of the wiring pattern formed on the substrate is performed in the state where the contacts 12 of the substrate inspection jigs 10a and 10b are in contact with the upper and lower surfaces (front and back surfaces) of the substrate 90, respectively.

<2. Jig>
FIG. 2 is a schematic view showing the configuration of the substrate inspection jig 10 (10a). Here, the substrate inspection jig 10a will be described, but the substrate inspection jig 10b has the same configuration.

  The substrate inspection jig 10 includes a plurality of contacts 12, a holding body 13 that holds the plurality of contacts 12, an electrode body 14 that has a plurality of electrode portions 14 a, and a column portion 15 that supports the electrode body 14. And a wiring unit 16, a base unit 17, and a switch circuit 20.

  One end (the lower end in FIG. 2) of the contact 12 is in conduction connection with a predetermined inspection point set on the inspection object (substrate), and the other end (the upper end in FIG. 2) of the contact 12 is Abutting on the electrode portion 14a to be conductively connected. The contact 12 is made of a conductive material.

  The contact 12 has an elongated bar shape. The contact 12 is covered with insulation over the entire circumference except for both ends. Further, the contact 12 has flexibility, and when attached to the holding body 13, the contact 12 is attached while being slightly bent in a certain direction. Thus, when the contact 12 is bent and mounted, a restoring force is generated, and a pressing force or the like from the contact 12 to the inspection point is generated according to the restoring force.

  The holding body 13 guides one end (lower end) of the plurality of contacts 12 to each predetermined inspection point, and guides the other end (upper end) to each predetermined electrode portion 14a. The holding body 13 includes an electrode side plate portion 13a, an inspection side plate portion 13b, and a support column 13c. The electrode side plate portion 13a and the inspection side plate portion 13b are fixed using a predetermined number of support columns 13c while being separated from each other. The contact 12 is curved in the space between the electrode side plate portion 13a and the inspection side plate portion 13b.

  The electrode side plate portion 13a is made of an insulating material and has a through hole (guide hole) for guiding the other end (upper end) of the contact 12 to the electrode portion 14a.

  The inspection side plate portion 13b is made of an insulating material and has a through hole (guide hole) for guiding one end (lower end) of the contact 12 to the inspection point. The contact 12 protrudes from the through hole of the inspection side plate portion 13b. At the time of inspection, the tip of the contact 12 comes into contact with the inspection point of the substrate 90.

  The electrode body 14 includes a plurality of electrode portions 14a that are in conductive contact with the other ends (upper ends) of the plurality of contacts 12, respectively, and an electrode holding portion 14b that holds the plurality of electrode portions 14a. The electrode portion 14a is formed so as to be disposed at a predetermined position on the front surface (here, the lower surface) side of the electrode body 14, and is connected to the wiring portion 16 from the back surface (upper surface) side of the electrode body 14. (Details are electrically connected (the same applies hereinafter)). The electrode holding portion 14b is formed in a plate shape with an insulating material, and has a plurality of through holes (not shown) for holding the plurality of electrode portions 14a, respectively.

  The support column 15 supports the electrode body 14 and thus also supports the holding body 13 and the contact 12. Specifically, the column part 15 has a structure for supporting the electrode body 14 by having columns at the four corners of the electrode body 14.

  The wiring part 16 is comprised by the wiring extended from the electrode part 14a, and electrically connects the electrode part 14a and the controller 30 (refer FIG. 3) of the board | substrate inspection apparatus 1. FIG. The wiring portion 16 is made of an insulating-coated copper (Cu) wire (so-called conducting wire) or the like.

  The wiring part 16 has a plurality of wirings connected to each of the plurality of contacts 12. By applying a voltage between two wirings respectively connected to two contacts (for example, the contact good contact 12e and the contact poor contact 12f) of the plurality of contacts 12, the two contacts A voltage (such as a voltage for removing an oxide film) is applied between the children.

  The base portion 17 is configured as a base for the plurality of contacts 12, the holding body 13, the electrode body 14, and the column portion 15. The base portion 17 has a function of fixing the substrate inspection jig 10 to the jig driving mechanism 2.

  The switch circuit 20 will be described later.

<3. Substrate>
In this embodiment, an electronic component built-in substrate is exemplified as the substrate 90 to be inspected. The substrate 90 is a substrate (an electronic component-embedded substrate) in which an electronic component (here, an integrated circuit (IC)) 95 is embedded (see FIG. 3).

  In the electronic component 95, various electronic component elements (diodes, capacitors, resistors, etc.) are provided. However, in FIG. 3, only a diode is shown for convenience of illustration. In FIG. 3, four diodes 96 a to 96 d are provided in the electronic component 95. The diodes 96a to 96d inside the electronic component 95 are also referred to as internal diodes. The electronic component 95 is provided with four IC terminals (also referred to as electronic component terminals) 97a to 97d.

  In addition, a plurality of terminals 93 and 94 are provided on the surface of the substrate 90 (specifically, an upper surface and a lower surface). The plurality of terminals 93 and 94 are electrically connected to a wiring pattern inside the substrate. Some of the plurality of terminals 93 and 94 are electrically connected to each other via a wiring pattern or the like inside the substrate, and other parts of the plurality of terminals 93 and 94 are electrically connected to each other inside the substrate. Not. Each of the plurality of terminals 93 is electrically connected to one of the plurality of IC terminals 97a to 97d (inside the board) of the electronic component 95 built in the board. On the other hand, each of the plurality of terminals 94 is not electrically connected to the electronic component 95 built in the substrate.

  For example, two terminals 93 (93a, 93b) are electrically connected to the IC terminal 97b inside the substrate via the wiring pattern PT1. Similarly, two terminals 93 (93g, 93h) are electrically connected to the IC terminal 97a inside the substrate via the wiring pattern PT2, and the two terminals 93 ( 93c, 93d) are electrically connected via the wiring pattern PT3. Further, one terminal 93 (93e) is electrically connected to the IC terminal 97d inside the substrate via the wiring pattern PT4. Further, the terminals 93a and 93b are electrically connected to each other, and the terminals 93c and 93d are also electrically connected to each other. Similarly, the terminals 93g and 93h are also electrically connected to each other. On the other hand, the plurality of terminals 94 are not electrically connected to any of the plurality of IC terminals 97a to 97d inside the substrate of the electronic component 95 built in the substrate.

  Here, the terminals 93 and 94 on the substrate 90 are used as inspection points in the insulation inspection and the continuity inspection.

  For example, in the continuity test between the terminals 93, the terminal (electrode) 93c and the terminal (electrode) 93d are used as inspection points, and the continuity state (good conductive state) between the two terminals 93c and 93d is confirmed. Is done. Further, the terminal 93e and the terminal 93h are used as inspection points, and the conduction state (good conduction state) between the two terminals 93e and 93h is confirmed. The same applies to the continuity test for other terminals 93, and each terminal 93 is used as an inspection point in the continuity test.

  In the insulation inspection, at least some of the plurality of terminals 93 are used as inspection points. For example, an arbitrary terminal (for example, 93c) of the two terminals 93c and 93d provided for the wiring pattern PT3 in the substrate 90 and two terminals 93g and 93h provided in the wiring pattern PT2 in the substrate 90. Any of these terminals (eg, 93h) is used as an inspection point, and an insulation inspection between the two wiring patterns PT3 and PT2 is performed. Alternatively, a terminal 93e provided for the wiring pattern PT4 in the substrate 90 and an arbitrary terminal (for example, 93h) of the two terminals 93g and 93h provided in the wiring pattern PT2 in the substrate 90 are inspection points. As a result, an insulation inspection between the two wiring patterns PT4 and PT2 is performed. The insulation test for the terminal 93 is performed in a state where no current flows through the diode 96 by applying a voltage (for example, 0.2 V (volt)) smaller than the forward voltage Vf of the diode 96.

  Similarly, the terminal 94 is used as an inspection point in the continuity inspection and the insulation inspection.

  Thus, the terminals 93 and 94 are used as inspection points in various inspections (including continuity inspection and insulation inspection).

<4. Inspection circuit>
FIG. 3 is a diagram showing an electronic circuit (inspection circuit) for inspecting the substrate 90.

  As shown in FIG. 3, the board inspection apparatus 1 also includes a controller 30. In FIG. 3, the substrate inspection jig 10 is not shown.

  The controller 30 is a control unit that controls various inspections. The controller 30 controls the output (output current and / or output voltage) and the like of the power supply 31, and performs a continuity test and an insulation test between the wiring patterns.

  The controller 30 includes an inspection control unit 34, a storage unit 35, a detection control unit 36, and an oxide film removal control unit 37.

  In the storage unit 35 of the controller 30, inspection pattern data (for example, applied voltage in insulation inspection) in each inspection is stored for each combination of inspection target terminals. The inspection control unit 34 controls the continuity inspection and the insulation inspection based on the inspection pattern data stored in the storage unit 35. The detection control unit 36 is a processing unit that detects a good contact and a poor contact that will be described later. The oxide film removal control unit 37 is a processing unit that controls the oxide film removal operation.

  The power supply 31 is configured as a constant current source. The power supply 31 can adjust the supply current at the time of voltage application to a constant value.

  In the continuity test, the power supply 31 allows a constant current to flow while adjusting the applied voltage between the wiring patterns subject to insulation inspection (insulation inspection target wiring patterns) sequentially selected from a plurality of wiring patterns. To supply power.

  Further, in the insulation test, the power supply 31 has various magnitudes of voltages (for example, for the insulation test target wiring patterns) sequentially selected from a plurality of wiring patterns (for example, the insulation test target wiring patterns). , 0.2V, 200V, etc.).

  The power source 31 is also used for applying a voltage for removing an oxide film, as will be described later.

<5. Switch circuit>
As shown in FIG. 3, the switch circuit 20 is provided between each contact 12 and the controller 30 (power source 31 or the like) outside the substrate 90. The switch circuit 20 includes a wiring 21 and a plurality of switches 22 and 23. Each of the switches 22 and 23 can be opened and closed independently of each other in accordance with a command signal from the controller 30 (can be switched between an off state and an on state).

  Since the wiring 21 is a wiring that connects a good contact connector (described later) and one or more contacts other than the poor contact contact (described later) among the plurality of contacts to the same potential. Called.

  The switch 23 is a switch for switching between a connection state between the equipotential wiring 21 and the ground potential and a release state of the both. The equipotential wiring 21 is connected (grounded) to the ground by turning on the switch 23.

  The plurality of switches 22 (specifically, 22a to 22h) are provided between each of the plurality of contacts 12 and the same potential wiring 21 outside the substrate 90. Specifically, one end of each switch 22 is connected to a branch portion (also referred to as a wiring connection portion) Q provided in the middle of the wiring portion 16 connected to each contact 12, and the other end of each switch 22. Are connected to the same potential wiring 21.

  More specifically, one end of the switch 22e is connected to a branch portion (also referred to as a wiring connection portion) Q5 provided in the middle of the wiring portion 16 connected to the contact 12e, and the other end of the switch 22e is Are connected to the same potential wiring 21. One end of the switch 22f is connected to a branch portion (wiring connection portion) Q6 provided in the middle of the wiring portion 16 connected to the contact 12f, and the other end of the switch 22f is connected to the same potential wiring 21. It is connected. Furthermore, one end of the switch 22c is connected to a branch portion (wiring connecting portion) Q3 provided in the middle of the wiring portion 16 connected to the contact 12c, and the other end of the switch 22c is connected to the same potential wiring 21. It is connected. One end of the switch 22d is connected to a branch portion (wiring connecting portion) Q4 provided in the middle of the wiring portion 16 connected to the contact 12d. The other end of the switch 22d is connected to the same potential wiring 21. It is connected. The same applies to the other switches 22a, 22b, 22g, and 22h. One end of each switch 22a, 22b, 22g, 22h is connected to the wiring connection part Q1, Q2, Q7, Q8, respectively, and the other end of each switch 22a, 22b, 22g, 22h is connected to the same potential wiring 21. Yes.

  Each switch 22 is switched between its on state and off state, whereby each contactor 12 and the same potential wiring 21 are electrically connected to each other, and the both potentials 12 and 21 are set to the same potential. The state in which the connection between the two is released can be individually switched for each contact 12.

<6. Oxide film removal operation (electric cleaning operation)>
In this embodiment, prior to the continuity test and the insulation test, an operation (oxide film removal operation) for removing the oxide film (insulating film) formed on the surface of each terminal on the substrate 90 by applying a high voltage. ) Is performed. According to such an oxide film removing operation, the oxide film (insulating film) generated on the terminal surface can be removed, and the contact between the inspection contact (probe) and the terminal on the substrate can be ensured. As a result, it is possible to improve the accuracy of subsequent continuity inspection and insulation inspection. Hereinafter, such an oxide film removing operation (also referred to as an electric cleaning operation) will be described in detail.

<6-1. Oxide Film Removal Operation for One Terminal 93e>
First, an oxide film removal operation related to one terminal 93e of the plurality of terminals 93 will be described with reference to the flowchart of FIG. This oxide film removing operation is performed mainly using the two contacts 12e and 12f that contact one terminal 93e of the plurality of terminals 93 among the plurality of contacts 12.

  Specifically, in step S <b> 11, the controller 30 performs a continuity test between the two contacts 12 e and 12 f that are in contact with the terminal 93 e on the substrate 90. In addition, at the time of execution of each process of steps S11-S16, each switch 22 and 23 is set to an OFF state (refer FIG. 3).

  In step S12, a branch process based on the result of the continuity test is performed.

  When a good conduction state is detected between the two contacts 12e and 12f (see FIG. 5), the routine is terminated without performing the oxide film removal operation. For example, as shown in FIG. 5, when both the contacts 12e and 12f are in good contact with the terminal 93e, a good conduction state is detected. In this case, the oxide film removing operation is not performed.

  On the other hand, when the conduction state between the two contacts 12e and 12f is poor (see FIGS. 6 and 7), the process proceeds to step S13. For example, as shown in FIG. 6, when the oxide film 99 is formed on the contact portion of the contact 12f on the surface of the terminal 93e, a conduction failure is detected. Further, as shown in FIG. 7, a conduction failure is also detected when the contact 12f and the terminal 93e are not in contact due to a positional shift in the left-right direction in the figure. In these cases, the process proceeds to step S13 and subsequent steps in order to perform the oxide film removing operation.

  In steps S13 to S16, the detection control unit 36 detects the “contact failure contact” and the “contact good contact” from the two contacts 12e and 12f that should contact the terminal 93e. Here, a contact that is not in good contact with a terminal to be contacted (also referred to as a contact target terminal) 93 is also referred to as a “contact failure contact” (or “contact failure probe”). Further, a contact that is in good contact with the terminal to be contacted (contact target terminal) 93 is also referred to as a “contact good contact” (or “contact good probe”). Here, it is assumed that one of the two contacts 12 is a “contact good contact”.

  Specifically, first, in step S13, one contact 12e of the two contacts 12e and 12f and two or more of the plurality of contacts 12a to 12h other than the two contacts 12e and 12f ( Here, the conductive state with the six contacts 12a to 12d, 12g, and 12h is confirmed. In other words, the contact state between the contact 12e and the terminal 93e is confirmed.

  For example, first, a continuity test is performed between the contact 12e and the contact 12a, and then a continuity test is performed between the contact 12e and the contact 12b. Furthermore, a continuity test between the contact 12e and the contact 12c, a continuity test between the contact 12e and the contact 12d, and a continuity test between the contact 12e and the contact 12g are performed, and the contact 12e. And the contact 12h are inspected for continuity. In this way, the conduction state between the contact 12e and each of the contacts 12a to 12d, 12g, and 12h is sequentially confirmed.

  Note that the present invention is not limited to this, and a plurality of contacts 12a to 12d, 12g, and 12h are set to the same potential V1 (first potential). By applying a potential V2) different from the potential V1, the conduction state between the contact 12e and the contacts 12a to 12d, 12g, and 12h may be confirmed all at once.

  In step S14, the other contact 12f of the two contacts 12e and 12f and two or more contacts 12a to 12d other than the two contacts 12e and 12f of the plurality of contacts 12a to 12h, The conduction state with 12g and 12h is confirmed. In other words, the contact state between the contact 12f and the terminal 93e is confirmed. In detail, the process similar to step S13 should just be performed except the point which changes the contact 12e into the contact 12f.

  Then, based on the results of the continuity test in steps S13 and S14, “contact failure contact” and “contact good contact” are detected.

  In step S15, a “contact good contact” is detected. Specifically, any one of two or more contacts 12a to 12d, 12g, and 12h other than two contacts among a plurality of contacts 12a to 12h and one of the two contacts 12e and 12f, and When the conduction state between the two contacts is confirmed, the one contact is detected as a contact good contact. For example, when a conduction state between the contact 12e and at least one of the contacts 12a to 12d, 12g, and 12h is confirmed, the contact 12e is detected as a “contact good contact”. In other words, it is confirmed that the contact 12e is in good contact with the terminal 93e.

  In step S16, “contact failure contact” is detected. Specifically, when the conduction state between any contact among the contacts 12a to 12d, 12g, and 12h and the other contact among the two contacts 12e and 12f is not confirmed, the other contact Are detected as good contacts. For example, when the contact 12f is not conducting well with any of the contacts 12a to 12d, 12g, and 12h, the contact 12f is detected as a “contact failure contact”. In other words, it is confirmed that the contact 12f is not in good contact with the terminal 93e.

  If both of the two contacts 12e and 12f are “contact failure contacts”, the process of FIG. 8 may be interrupted. Then, the substrate inspection apparatus 1 once releases the contact state between the plurality of contacts 12 and the plurality of terminals 93, and further performs the positioning operation of the contact 12 with respect to the substrate 90, and then the plurality of contacts 12 and the plurality of contacts 12. The terminal 93 may be brought into contact again, and the above-described operations from step S11 to step S18 may be executed again.

  In step S17 after steps S13 to S16, the states of the switches 22 and 23 are set by the oxide film removal controller 37 as follows.

  Specifically, it is set as shown in FIG. First, among the plurality of switches 22, the switch 22 f between the “contact failure contact” (here, 12 f) and the same potential wiring 21 is turned off. On the other hand, the switch 22e between the “contact good contact” (here 12e) and the same potential wiring 21 is turned on. In addition, the switches 22a to 22d, 22g, and 22h between the contacts 12a to 12d, 12g, and 12h other than the two contacts 12e and 12f and the same potential wiring 21 among the plurality of contacts 12a to 12h are also turned on. Put into a state. Thereby, each contactor 12a-12d, 12g, 12h and the contact favorable contact 12e are mutually connected to the same electric potential. Further, the switch 23 is turned on. Thereby, the equipotential wiring 21 (as a result, the contacts 12a to 12d, 12e, 12g, and 12h) is grounded.

  In the next step S18, the oxide film removal control unit 37 is in contact with the contact good contact 12e in a state where the contacts 12a to 12d, 12g, 12h and the contact good contact 12e are connected to each other at the same potential. A voltage Vh for removing the oxide film is applied by the power source 31 between the defective contact 12f. For example, the potential Vh is applied to the poor contact contact 12f. The oxide film on the terminal 93e is removed by electrical energy applied by applying a relatively large voltage Vh (for example, 250 V (volts)) between the good contact 12e and the poor contact 12f.

  If no current flows despite the application of a voltage in step S18, the situation shown in FIG. 7, that is, one of the two contacts 12e and 12f contacts the terminal 93. What is necessary is just to determine that it is not. Then, the substrate inspection apparatus 1 once releases the contact state between the plurality of contacts 12 and the plurality of terminals 93, and further performs the positioning operation of the contact 12 with respect to the substrate 90, and then the plurality of contacts 12 and the plurality of contacts 12. The terminal 93 may be brought into contact again, and the above-described operations from step S11 to step S18 may be executed again.

  In the operation as described above, the contacts 12a to 12d, 12g, 12h and the good contact 12e are connected to the same potential when the voltage is applied in step S18. Therefore, when each of the contacts 12a to 12d, 12g, 12h, and 12e is in good contact with the corresponding terminals 93a to 93d, 93g, 93h, and 93e, a plurality of terminals 93a to 93d, 93g, 93h and 93e have the same potential. Therefore, even when a potential difference is generated between the contact 12e and the contact 12f by applying the voltage Vh for removing the oxide film, the plurality of terminals 93a to 93d, 93g, 93h, and 93e have the same potential. It can be avoided that a relatively large voltage Vh is applied to the electronic component 95. That is, it is possible to avoid the destruction of the electronic component due to the high voltage application.

  Temporarily, some of the contacts 12a to 12d, 12g, and 12h (for example, the contact 12h) are in good contact with the corresponding terminals 93a to 93d, 93g, and 93h (for example, the terminal 93h). When there is not, the voltage by the power supply 31 is not applied between the said terminal 93 (93h) and the other terminals 93 (93a-93g). Therefore, the electronic component 95 is not destroyed.

<6-2. Oxide Film Removal Operation for Two Terminals 93c and 93d>
Similarly, it is possible to perform an oxide film removing operation on two terminals 93c and 93d of the plurality of terminals 93. This oxide film removing operation mainly uses two contacts 12c and 12d of the plurality of contacts 12 (contacts 12c and 12d to be in contact with the two terminals 93c and 93d of the plurality of terminals 93, respectively). Done with. In this operation, the two contacts 12c and 12d are in contact with one terminal 93e of the plurality of terminals 93 in that they should be in contact with two different terminals 93c and 93d among the plurality of terminals 93, respectively. This is different from the above-described operation performed mainly using the two contacts 12e and 12f to be performed.

  Hereinafter, such an operation will be described with reference to the flowchart of FIG.

  In steps S21 to S28 in FIG. 10, the same processes as in steps S11 to S18 in FIG. 8 are performed.

  In step S <b> 21, the controller 30 performs a continuity test between the two contacts 12 c and 12 d that are in contact with two different terminals 93 c and 93 d on the substrate 90, respectively. Here, it is assumed that the two different terminals 93 c and 93 d are connected to the same wiring pattern (PT 3) in the substrate 90. That is, the terminals 93c and 93d are connected to the same potential by the wiring in the substrate 90. In addition, at the time of execution of each process of step S21-S26, each switch 22 and 23 is set to an OFF state (refer FIG. 3).

  In step S22, a branch process based on the result of the continuity test is performed as in step S12.

  When a good conduction state between the two contacts 12c and 12d is detected (see FIG. 11), the oxide film removing operation is not performed, and this routine ends. For example, as shown in FIG. 11, when the contact 12c is in good contact with the terminal 93c and the contact 12d is in good contact with the terminal 93d, a good conduction state is detected. In this case, the oxide film removing operation is not performed.

  On the other hand, when the conduction state between the two contacts 12e and 12f is poor (see FIGS. 12 and 13), the process proceeds to step S13. For example, as shown in FIG. 12, when the oxide film 99 is formed on the contact portion of the contact 12d on the surface of the terminal 93d, a conduction failure is detected. Further, as shown in FIG. 13, a conduction failure is also detected when the contact 12d and the terminal 93d are not in contact with each other due to a positional shift in the left-right direction in the figure. In these cases, the process proceeds to step S13 and subsequent steps in order to perform the oxide film removing operation.

  In steps S23 to S26, the detection control unit 36 determines “contact failure contact” and “good contact” from the contact 12c that should contact the terminal 93c and the contact 12d that should contact the terminal 93d. To detect. In steps S23 to S26, processing similar to that in steps S13 to S16 is performed.

  For example, when a conduction state between any one of the contacts 12a, 12b, 12e to 12h and the contact 12c is confirmed, the contact 12c is detected as a “contact good contact” (step S25). Further, when the contact 12d is not well connected to any of the contacts 12a, 12b, 12e to 12h, the contact 12d is detected as a “contact failure contact” (step S26).

  In step S27, the states of the switches 22 and 23 are set as follows by the oxide film removal controller 37 (see FIG. 9).

  Specifically, as shown in FIG. 9, among the plurality of switches 22, the switch 22 d between the “contact failure contact” (here, 12 d) and the same potential wiring 21 is turned off. On the other hand, the switch 22c between the “contact good contact” (here, 12c) and the equipotential wiring 21 is turned on. Also, the switches 22a, 22b, 22e-22h between the contacts 12a, 12b, 12e-12h other than the two contacts 12c, 12d and the same potential wiring 21 among the plurality of contacts 12a-12h are also turned on. Put into a state. Thereby, each contactor 12a, 12b, 12e-12h and the contact favorable contact 12c are mutually connected to the same electric potential. Further, the switch 23 is turned on. Thereby, the equipotential wiring 21 (as a result, the contacts 12a, 12b, 12c, 12e to 12h) is grounded.

  In the next step S28, the oxide film removal control unit 37 makes contact with the contact good contact 12c in a state where the contacts 12a, 12b, 12e to 12h and the contact good contact 12c are connected to the same potential. A voltage Vh for removing the oxide film is applied between the defective contact 12d. The oxide film 99 on the terminal 93d is removed by the electrical energy applied by applying a relatively large voltage Vh (for example, 250V (volt)) between the good contact 12c and the poor contact 12d. 11 is realized.

  In step S28, if no current flows even though a voltage is applied, the situation shown in FIG. 13, that is, one of the two contacts 12c and 12d contacts the terminal 93. What is necessary is just to determine that it is not. Then, the substrate inspection apparatus 1 once releases the contact state between the plurality of contacts 12 and the plurality of terminals 93, and further performs the positioning operation of the contact 12 with respect to the substrate 90, and then the plurality of contacts 12 and the plurality of contacts 12. The terminal 93 may be brought into contact again, and the operations from step S21 to step S28 may be performed again.

  In the operation as described above, the contacts 12a, 12b, 12e to 12h and the good contact 12c are connected to each other at the same potential when the voltage is applied in step S28. Accordingly, when the contacts 12a, 12b, 12e, 12f, 12g, and 12h are in good contact with the corresponding terminals 93a, 93b, 93e, 93e, 93g, and 93h, a plurality of terminals 93c, 93a, 93b, 93e, 93g, and 93h have the same potential. Therefore, even when a potential difference is generated between the contact 12c and the contact 12d by applying the voltage Vh for removing the oxide film, the plurality of terminals 93c, 93a, 93b, 93e, 93g, and 93h have the same potential. In addition, it is possible to avoid the voltage Vh being applied to the electronic component 95 through these terminals 93. That is, it is possible to avoid the destruction of the electronic component due to the high voltage application.

<7. Modified example>
Although the embodiments of the present invention have been described above, the present invention is not limited to the contents described above.

  For example, in the above embodiment, the switch 23 for making the equipotential wiring 21 equal to the ground potential is provided, but the present invention is not limited to this, and the switch 23 may not be provided. In addition, when step S17 (S27) is executed, the equipotential wiring 21 is preferably grounded, but the equipotential wiring 21 may not be grounded.

  Moreover, in the said embodiment, although eight contacts 12a-12h are used, it is not limited to this, You may make it provide a different number of contacts 12. FIG. In the above embodiment, the seven terminals 93 are provided on the substrate 90. However, the present invention is not limited to this, and a different number of terminals 93 may be provided.

  For example, only two terminals 93e, 93h may be provided on the substrate 90, and only three contacts 12e, 12f, 12h may be used. In this case, in steps S13 to S16, a continuity test is performed between the contact 12e and one of the plurality of contacts 12e, 12f, and 12h, and one contact 12h other than the two contacts 12e and 12f. The continuity test between the child 12f and the one contact 12h may be performed. In step S18, an oxide film is removed between the good contact 12e and the poor contact 12f with the one contact 12h and the good contact 12e connected to each other at the same potential. The voltage Vh may be applied.

  Alternatively, only the three terminals 93c, 93d, and 93h may be provided on the substrate 90, and only the three contacts 12c, 12d, and 12h may be used. In this case, in steps S23 to S26, a continuity test is performed between the contact 12c and the contact 12h other than the two contacts 12c and 12d among the plurality of contacts 12c, 12d, and 12h, and the contact is made. The continuity test between the child 12d and the one contact 12h may be performed. In step S18, an oxide film is removed between the good contact 12c and the poor contact 12d with the one contact 12h and the good contact 12c connected to each other at the same potential. The voltage Vh may be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Jig drive mechanism 10 Board | substrate inspection jig | tool 12 Contactor 20 Switch circuit 21 Equipotential wiring 22 Switch (for setting same potential) 23 (Switch for grounding) 30 Controller 31 Power supply 93 (Electronic component 95) 95) Electronic parts 99 Oxide film

Claims (8)

A board inspection apparatus that performs an electrical inspection of a wiring pattern formed on a board containing electronic components,
A plurality of contacts on a plurality of terminals on the substrate that are in contact with a plurality of terminals electrically connected to the electronic component;
Two of the plurality of contacts that are not in good contact with the one terminal among the two contacts that should contact one terminal of the plurality of terminals. A detection control means for detecting a contact poor contact and detecting a contact good contact which is a contact which is in good contact with the one terminal among the two contacts;
A plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate;
Of the plurality of switches, a first switch between the poor contact contact and the equipotential wiring is turned off, and a second switch between the good contact contact and the equipotential wiring The switch is turned on, and each switch between the one or more contacts other than the two contacts and the equipotential wiring among the plurality of contacts is turned on, and the 1 Or an oxide film that applies a voltage for removing an oxide film between the good contact and the poor contact in a state where two or more contacts and the good contact are connected to each other at the same potential. Removal control means;
A board inspection apparatus comprising: A board inspection apparatus that performs an electrical inspection of a wiring pattern formed on a board containing electronic components,
A plurality of contacts on a plurality of terminals on the substrate that are in contact with a plurality of terminals electrically connected to the electronic component;
Two of the plurality of contacts, and two of the plurality of terminals to be in contact with two different terminals connected to the same wiring pattern in the substrate, Detection control means for detecting a poor contact that is a contact that is not in good contact with the terminal to be contacted, and detecting a good contact that is a contact that is in good contact with the terminal that is to be in contact When,
A plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate;
Of the plurality of switches, a first switch between the poor contact contact and the equipotential wiring is turned off, and a second switch between the good contact contact and the equipotential wiring The switch is turned on, and each switch between the one or more contacts other than the two contacts and the equipotential wiring among the plurality of contacts is turned on, and the 1 Or an oxide film that applies a voltage for removing an oxide film between the good contact and the poor contact in a state where two or more contacts and the good contact are connected to each other at the same potential. Removal control means;
A board inspection apparatus comprising: In the board | substrate inspection apparatus of Claim 1 or Claim 2,
The detection control means includes
When a conduction state between one of the one or two or more contacts and one of the two contacts is confirmed, the one contact is detected as the good contact. ,
When the conduction state between any one of the one or more contacts and the other contact of the two contacts is not confirmed, the other contact is connected to the poor contact. A substrate inspection apparatus for detecting as a child. A substrate inspection jig used for electrical inspection of a wiring pattern formed on a substrate containing electronic components,
A plurality of contacts on a plurality of terminals on the substrate that are in contact with a plurality of terminals that are electrically connected to the electronic component, and are to contact one terminal of the plurality of terminals. A plurality of contacts including one contact;
A plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate;
Among the two contacts, a contact good contact that is in good contact with the one terminal, and a contact that does not make good contact with the one terminal out of the two contacts A wiring portion for applying a voltage for removing an oxide film between the poorly contacted contacts,
With
When a voltage for removing an oxide film is applied between the good contact and the poor contact, among the plurality of switches, between the poor contact and the same potential wiring The first switch is turned off, the second switch between the contact good contact and the equipotential wiring is turned on, and the two contacts among the plurality of contacts Each of the switches between the other one or more contacts and the equipotential wiring is turned on, and the one or more contacts and the good contact are connected to the same potential. A board inspection jig. A substrate inspection jig used for electrical inspection of a wiring pattern formed on a substrate containing electronic components,
A plurality of contacts that are in contact with a plurality of terminals that are electrically connected to the electronic component and that are a plurality of terminals on the substrate, and the same wiring pattern in the substrate among the plurality of terminals. A plurality of contacts including two contacts to be in contact with two different connected terminals, respectively;
A plurality of switches provided between each of the plurality of contacts and the same potential wiring outside the substrate;
A contact failure that is a contact that is in good contact with the contact target terminal of the two contacts and a contact failure that is not in good contact with the contact target terminal of the two contacts. A wiring portion for applying a voltage for removing an oxide film between the contact and the contact;
With
When a voltage for removing an oxide film is applied between the good contact and the poor contact, among the plurality of switches, between the poor contact and the same potential wiring The first switch is turned off, the second switch between the contact good contact and the equipotential wiring is turned on, and the two contacts among the plurality of contacts Each of the switches between the other one or more contacts and the equipotential wiring is turned on, and the one or more contacts and the good contact are connected to the same potential. A board inspection jig. A board inspection method for performing an electrical inspection of a wiring pattern formed on a board containing electronic components,
a) Two contacts among a plurality of contacts on the substrate that are in contact with a plurality of terminals that are electrically connected to the electronic component, of the plurality of terminals A contact failure contact that is a contact that is not in good contact with the one terminal is detected from the two contacts to be in contact with the one terminal, and the one of the two contacts is Detecting a contact good contact that is a contact that is in good contact with the terminals of
b) Turn off the first switch between the contact failure contact and the equipotential wiring among the plurality of switches provided between the contacts and the equipotential wiring outside the substrate. And a second switch between the contact good contact and the equipotential wiring is turned on, and one or more contacts other than the two contacts among the plurality of contacts A step of turning on each switch between a child and the equipotential wiring to connect the one or more contacts and the contact good contact to each other at the same potential;
c) With the one or more contacts and the contact good contact connected to each other at the same potential, a voltage for removing an oxide film is applied between the contact good contact and the poor contact contact. Applying, and
A substrate inspection method comprising: A board inspection method for performing an electrical inspection of a wiring pattern formed on a board containing electronic components,
a) Two contacts among a plurality of contacts on the substrate that are in contact with a plurality of terminals that are electrically connected to the electronic component, of the plurality of terminals A contact failure contact which is a contact which is not in good contact with the terminal to be contacted among the two contacts which are to be in contact with two different terminals connected to the same wiring pattern in the substrate. Detecting a contact good contact that is a contact that is in good contact with the terminal to be contacted, and
b) Turn off the first switch between the contact failure contact and the equipotential wiring among the plurality of switches provided between the contacts and the equipotential wiring outside the substrate. And a second switch between the contact good contact and the equipotential wiring is turned on, and one or more contacts other than the two contacts among the plurality of contacts A step of turning on each switch between a child and the equipotential wiring to connect the one or more contacts and the contact good contact to each other at the same potential;
c) With the one or more contacts and the contact good contact connected to each other at the same potential, a voltage for removing an oxide film is applied between the contact good contact and the poor contact contact. Applying, and
A substrate inspection method comprising: In the board | substrate inspection method of Claim 6 or Claim 7,
Said step a)
a-1) When a conduction state between one of the one or two or more contacts and one of the two contacts is confirmed, contact the one contact with the good contact Detecting as a child;
a-2) When the conduction state between any one of the one or more contacts and the other contact of the two contacts is not confirmed, the other contact is Detecting as the poor contact contact;
A substrate inspection method characterized by comprising:

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