JP2008008773A - Substrate inspection method and substrate inspecting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection method and a substrate inspection device capable of shortening an inspection time by reducing the number of inspection times at a conduction inspection time of wiring patterns provided on the substrate. <P>SOLUTION: The conduction inspection of the wiring patterns is performed by classifying the wiring patterns provided on the substrate 10 into the first to third groups based on net information stored in a storage part. In the first group, wiring patterns for connecting only each upper terminal T on the surface 11 side are classified, and in the second group, wiring patterns for connecting only each upper terminal B on the back 12 side are classified, and in the third group, wiring patterns for connecting each upper terminal T on the surface 11 side to each lower terminal B on the back 12 side are classified. The wiring patterns in the first group and the wiring patterns in the second group are inspected in parallel. This device has a configuration wherein one contactor 32 is equipped with two contact terminals 32a, 32b, and prior to the conduction inspection, contact inspection between the terminals 32a, 32b and the terminals T, B is performed based on the conduction state between the two contact terminals 32a, 32b. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate inspection method and a substrate inspection apparatus for inspecting electrical characteristics of a substrate having a plurality of wiring patterns.

  The present invention is not limited to a printed wiring board, but includes, for example, electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, package substrates for semiconductor packages, and film carriers. In this specification, these various wiring boards are collectively referred to as “substrates”.

  In recent years, as electrical components arranged on a substrate have become more complex and sophisticated, the substrate itself has become multilayered and complicated. For this reason, nets and the like arranged on the substrate are formed more finely, and more nets and the like are formed.

  Since the inspection of the continuity or short circuit of the wiring patterns that make up this net must be performed for each wiring pattern, the number of inspections increases and the inspection time significantly increases as the number of wiring patterns increases. Had a problem to do.

  In order to solve the problem that the inspection time increases as described above, a technique as disclosed in Patent Document 1 relates to an insulation inspection method for inspecting insulation of wiring patterns arranged side by side in a mutually insulated state. Has been proposed.

  However, the technique disclosed in Patent Document 1 relates to an insulation test, and is not applied to a wiring pattern continuity test.

In particular, in the wiring pattern continuity inspection, it is necessary to inspect all the wiring patterns in order to improve the inspection accuracy, and how to efficiently perform all the inspections has been a big problem.
JP 2006-105795 A

  The present invention has been made in view of such circumstances, and provides a substrate inspection method and a substrate inspection apparatus capable of reducing the number of inspections at the time of continuity inspection of a wiring pattern provided on a substrate and shortening the inspection time. To do.

  In order to solve the above-mentioned problem, in the invention of claim 1, there is provided a substrate on which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals. A board inspection method for inspecting electrical characteristics, wherein the plurality of wiring patterns are connected between a group of wiring patterns connecting the terminals formed on the one surface and the terminals formed on the other surface. And the wiring pattern group for connecting the terminal formed on the one surface and the terminal formed on the other surface, and connecting the terminals formed on the one surface. A first inspection process for inspecting a wiring pattern, a second inspection process for inspecting a wiring pattern for connecting the terminals formed on the other surface, and forming on the one surface Performing a third test process for testing the wiring pattern for connecting the terminal formed on the terminal and the other surface being.

  According to a second aspect of the present invention, in the substrate inspection method according to the first aspect of the invention, the wiring pattern that is the object of the first inspection process is different from the wiring pattern that is the object of the second inspection process. The first inspection process and the second inspection process are performed in parallel at the same time.

  According to a third aspect of the present invention, in the substrate inspection method according to the first or second aspect of the invention, the third inspection process includes the terminal on the one surface and the other surface connected by different nets. A step of simultaneously inspecting electrical characteristics of wiring patterns connecting the terminals for a plurality of combinations with the terminals.

  According to a fourth aspect of the present invention, in the substrate inspection method according to any one of the first to third aspects, in the first inspection process, the second inspection process, and the third inspection process, Two contact terminals provided so as to be simultaneously contactable with one of the terminals are brought into contact with the terminal to be inspected, and a current is passed between the terminals through one of the two contact terminals. The voltage characteristic between the terminals is measured through the other contact terminal while supplying the voltage, thereby inspecting the electrical characteristics of the wiring pattern connecting the terminals.

  According to a fifth aspect of the invention, in the substrate inspection method according to the fourth aspect of the invention, prior to the inspection of the electrical characteristics between the terminals, the conduction state between the two contact terminals that are in contact with the same terminal. The contact state of the two contact terminals to the terminal is determined based on the above.

  According to the invention of claim 6, the electrical characteristics of the substrate on which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals are inspected. A board inspection apparatus, comprising: a storage unit for storing net information on the net provided on the board; and a plurality of contacts that are brought into contact with the terminals to be inspected. And at least two inspection means for inspecting the electrical characteristics, and a control unit for controlling the order of the terminals to be inspected by the at least two inspection means based on the net information stored in the storage unit, The control unit connects the plurality of wiring patterns between the first group that is connected between the terminals formed on the one surface and the terminals formed on the other surface. Classifying into a second set consisting of things and a third set consisting of connecting the terminals formed on the one surface and the terminals formed on the other surface, based on the classification result, Control the order of terminal inspection.

  According to the first aspect of the present invention, the inspection on the plurality of wiring patterns formed on the substrate is performed on the wiring pattern connecting between the terminals formed on one surface and between the terminals formed on the other surface. The wiring pattern on the substrate is inspected for the inspection of the wiring pattern that connects the wiring pattern and the inspection of the wiring pattern that connects the terminal formed on the one surface and the terminal formed on the other surface. The number of inspections can be reduced and the inspection time can be shortened.

  According to the second aspect of the present invention, the inspection of the wiring pattern connecting the terminals formed on one surface and the inspection of the wiring pattern connecting the terminals formed on the other surface are simultaneously performed in parallel. Since this is done, the inspection time can be further shortened.

  According to the third aspect of the present invention, the third inspection process is performed by connecting the terminals of the wiring pattern for connecting a plurality of combinations of the terminals on the one surface and the terminals on the other surface connected by different nets. The inspection time can be further shortened because it includes a step of simultaneously inspecting the target characteristic.

  According to the invention described in claim 4, since the contact terminal for supplying current and the contact terminal for measuring voltage are provided, the influence of the contact resistance between the contact terminal and the terminal at the time of voltage measurement is substantially reduced. The voltage applied between the terminals can be measured accurately. As a result, electrical characteristics such as resistance between terminals can be accurately measured, and the reliability of the continuity test can be improved.

  According to the invention described in claim 5, prior to the inspection of the electrical characteristics between the terminals, the contact of the two contact terminals to the terminal based on the conduction state between the two contact terminals in contact with the same terminal. Since the state is determined, it is possible to prevent an error in the continuity test between the terminals due to poor contact between the contact terminals.

  According to the invention described in claim 6, the inspection for the plurality of wiring patterns formed on the substrate is performed on the wiring pattern connecting between the terminals formed on one surface and between the terminals formed on the other surface. The wiring pattern on the substrate is inspected for the inspection of the wiring pattern that connects the wiring pattern and the inspection of the wiring pattern that connects the terminal formed on the one surface and the terminal formed on the other surface. The number of inspections can be reduced and the inspection time can be shortened.

  A substrate inspection method and a substrate inspection apparatus used therefor according to an embodiment of the present invention will be described.

  The substrate inspection method according to the present embodiment inspects the electrical characteristics of a substrate on which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals. Applies to

  FIG. 1 is a diagram schematically illustrating an example of a substrate to which the substrate inspection method according to the present embodiment is applied. A substrate 10 shown in FIG. 1 is a substrate to be inspected by a substrate inspection apparatus, for example, a package substrate used for a BGA (Ball Grid Array) package. One surface 11 (surface 11) of the substrate 10 in FIG. 1 is an element disposition surface to which a semiconductor chip is attached, and is a conductor portion for connecting the semiconductor chip by flip chip bonding or wire bonding, for example. The upper terminal T (terminal T1 ... T13) is provided.

  The other surface 12 (back surface 12) of the substrate 10 is provided with lower terminals B (terminals B1... B13), which are pads for soldering solder ball terminals, for example.

  The upper terminals T, the lower terminals B, the upper terminals T, and the lower terminals are connected wirings such as internal vias and interior wiring patterns (hereinafter referred to as wiring patterns) provided on the inside and the surface of the substrate 10, respectively. ).

  In the substrate 10 shown in FIG. 1, since the upper terminals T provided on the surface A are on the side where the semiconductor chip is attached, the pitch at which the upper terminals T are provided is smaller than the lower terminals B. It has become. Moreover, although 13 pieces of the upper terminal T and the lower terminal B are shown in the board | substrate 10 of FIG. 1, this is on account of description and is not specifically limited.

  1, the upper terminal T1 is connected to the lower terminals B1 and B4, the upper terminal T2 is connected to the upper terminal T3, the upper terminal T4 is connected to the upper terminal T5, and the lower terminals B5 and B6. T6 is connected to upper terminal T9, lower terminals B7, B8, upper terminal T10 is connected to lower terminals B9, B10, upper terminal T11 is connected to upper terminal T12, upper terminal T13 is connected to lower terminal B13, The lower terminal B2 is connected to the lower terminal B3, and the lower terminal B11 is connected to the lower terminal B12.

  In the substrate 10 of FIG. 1, a plurality of nets N (nets N1... N10) are formed by an upper terminal T, a lower terminal B, and a wiring pattern that electrically connects these terminals.

  In FIG. 1, ten nets are formed, but the number of nets is not particularly limited.

  In the substrate inspection method according to the present embodiment, a continuity inspection is performed to inspect whether the wiring pattern of the net N provided on the substrate 10 has a problem in electrical connection. For this reason, the test | inspection which confirms the electrical connection between the two terminals (upper terminals, lower terminals, or an upper terminal and lower terminals) used as the both ends of a wiring pattern is performed. In the continuity test between the terminals, the current state (resistance value, etc.) between the terminals is inspected by measuring the voltage between the terminals in a state where a current is passed between the terminals.

  Next, the configuration of the substrate inspection apparatus 20 used in the substrate inspection method according to the present embodiment will be described. FIG. 2 is a block diagram of the substrate inspection apparatus 1. As shown in FIG. 2, the substrate inspection apparatus 20 includes a storage unit 21, a control unit 22, an output unit 23, first and second current supply units 24 and 25, and first and second voltage measurement units. 26, 27, first and second switching portions 28, 29, and first and second contact portions 30, 31. The inspection means according to the present invention includes first and second current supply units 24 and 25, first and second voltage measurement units 26 and 27, first and second switching units 28 and 29, first and second The second contact portions 30 and 31 correspond to each other.

  The storage unit 21 stores rewritable net information regarding the terminal positions of the substrate 10 and the arrangement pattern of the wiring patterns. The net information stored in the storage unit 21 is appropriately updated as the type of the substrate 10 to be inspected is changed. The output unit 23 is used for outputting inspection results and the like, and is configured by a display device or the like.

  As shown in FIG. 3, the first and second contact portions 30 and 31 include a plurality of contacts 32 (see FIG. 4) and a jig 33 that holds the contacts 32. The contact 32 is provided such that its tip protrudes from a substrate facing surface 33 a that faces the substrate 10 of the jig 33. Further, the arrangement positions of the contacts 32 are set so as to correspond to the arrangement positions of the terminals T and B provided on the front surface 11 and the back surface 12 of the substrate 10. Thus, as the substrate facing surface 33a of the jig 30 is brought close to the substrate 10, each contact 32 comes into contact (contact) with the corresponding terminal T, B. In the example shown in FIG. 3, the contact 32 is placed on the substrate 10 by bringing the jig 32 from above and below to the substrate 10 set at a predetermined position in the apparatus 1 as indicated by arrows A <b> 1 and A <b> 2. For example, one of the jigs 33 (for example, the lower jig 33) is fixed, and the substrate 10 is set at a predetermined position. Accordingly, the contact 32 provided on the fixed jig 33 may contact the terminals T and B of the substrate 10.

  Further, as shown in FIG. 4, each contact 32 provided in the first and second contact portions 30, 31 is provided with two contact terminals 32a, 32b that simultaneously contact one terminal T, B. Yes. For example, one of the two contact terminals 32a and 32b is used for current supply, and the other is used for voltage measurement. In FIG. 4, the jig 33 is omitted for simplification of the drawing, and only some of the contacts 32 are shown, and the other contacts 32 are not shown (FIG. 5, The same applies to FIG.

  As described above, by arranging the two contact terminals 32a and 32b on the terminals T and B, respectively, the influence of the contact resistance generated between the terminals T and B and the contact terminals 32a and 32b is ignored, and a predetermined wiring pattern is obtained. Can be measured (a four-terminal measurement method can be implemented).

  Each contact terminal 32a, 32b provided in the first contact part 30 is connected to a switch 28a in the first switching part 28 via a wiring, and the first and second current supply parts 24, 25, And the connection relationship with the 1st and 2nd voltage measurement parts 26 and 27 is switched. Similarly, each contact terminal 32a, 32b provided in the second contact portion 31 is connected to a switch 29a in the second switching portion 29 via a wiring, and the first and second current supply is performed by the switch 29a. The connection relationship between the units 24 and 25 and the first and second voltage measuring units 26 and 27 is switched.

  The first and second current supply units 24 and 25 include, for example, a power supply circuit (for example, a power supply circuit capable of adjusting the output voltage) and a current control circuit that controls the current value of the output current. The current supply operation is performed under the control of the control unit 22. For example, the current supply units 24 and 25 are configured to output a predetermined constant current by the action of the current control circuit.

  In the first current supply unit 24, any two contact terminals 32a and 32b in the first and second contact units 30 and 31 form a circuit by the first and second switching units 28 and 29. The current supplied by the first current supply unit 24 is supplied to the corresponding terminals T and B of the substrate 10 through the contact terminals 32a and 32b. Similarly, any two contact terminals 32a, 32b in the first and second contact portions 30, 31 are connected by the first and second switching portions 28, 29 so as to form a circuit, and the second current. The current supplied by the supply unit 25 is supplied to the corresponding terminals T and B of the substrate 10 through the contact terminals 32a and 32b.

  The first voltage measurement unit 26 is connected to any two contact terminals 32a and 32b in the first and second contact units 30 and 31 via the first and second switching units 28 and 29, and the contact terminal 32a. , 32b is measured, the voltage between the terminals T, B of the substrate 10 is measured, and the measurement result is given to the control unit 22. Similarly, the second voltage measurement unit 27 is connected to any two contact terminals 32 a and 32 b in the first and second contact units 30 and 31 via the first and second switching units 28 and 29. The voltage between the terminals T and B of the substrate 10 with which the contact terminals 32 a and 32 b are in contact is measured, and the measurement result is given to the control unit 22.

  The first switching unit 28 includes a plurality of switches 28 a composed of semiconductor switching elements or the like that operate independently under the control of the control unit 22. The first switching unit 28 includes a plurality of contact terminals 32 a and 32 b provided in the first contact unit 30. The connection relationship between the first and second current supply units 24 and 25 and the first and second voltage measurement units 26 and 27 is switched. Similarly, the second switching unit 29 includes a plurality of switches 29 a composed of semiconductor switching elements that operate independently under the control of the control unit 22, and a plurality of contacts provided in the second contact unit 31. The connection relationship between the terminals 32a and 32b, the first and second current supply units 24 and 25, and the first and second voltage measurement units 26 and 27 is switched.

  The control unit 22 determines an inspection procedure for the wiring pattern provided on the substrate 10 based on the net information stored in the storage unit 21 (this inspection procedure will be described in detail later). The first and second contacts connected to the first and second current supply units 24 and 25 and the first and second voltage measurement units 26 and 27 by operating the switches 28a and 29b of the first and second switching units 28 and 29. The contact terminals 32a and 32b in the parts 30 and 31 are sequentially switched. In synchronization with this switching operation, the control unit 22 causes the first and second current supply units 24 and 25 to supply current between the terminals of the substrate 10 corresponding to the inspection procedure via the contact terminals 32a and 32b. The voltage between the terminals is measured by the first and second voltage measuring units 26 and 27 via the contact terminals 32a and 32b, and the quality determination regarding the electrical characteristics of each wiring pattern is performed based on the measurement result and the like. It has become.

  The quality determination is performed based on, for example, the current value supplied by the current supply units 24 and 25 and the voltage value measured by the voltage measurement units 26 and 27. More specifically, for example, the resistance value of the wiring pattern is calculated based on the current value and the voltage value, and whether or not the resistance value is within a predetermined allowable range, or the resistance value and the predetermined threshold value. The quality is determined based on the magnitude relationship between and the like.

  For example, as shown in FIG. 4, when a continuity test is performed on the wiring pattern connecting the upper terminals T4 and T5, one of the contact terminals 32a and 32b (for example, the contact 32A corresponding to the upper terminal T4) The terminal 32a) and one contact terminal 32a, 32b (for example, terminal 32b) of the contact 32B corresponding to the upper terminal T5 are connected to the positive / negative current output part of the first current supply part 24 by the first switching part 28, respectively. Is done. At the same time, the other contact terminals 32a and 32b (for example, the terminal 32b) of the contactor 32A and the other contact terminals 32a and 32b (for example, the terminal 32a) of the contactor 32B are applied to the first voltage by the first switching unit 28. The positive and negative voltage input units of the measurement unit 24 are connected to each other. Then, the voltage between the upper terminals T4 and T5 is measured by the first voltage measuring unit 26 in a state where the current is supplied between the upper terminals T4 and T5 by the first current supply unit 24.

  In addition, when the contact terminals 32a and 32b of the first and second contact portions 30 and 31 are brought into contact with the terminals T and B of the substrate 10, the control unit 22 prior to conducting a continuity test on the wiring pattern of the substrate 10, A contact inspection for confirming whether or not the contact terminals 32a and 32b are in contact with the terminals T and B is performed.

  In this contact inspection, for example, an inspection for the upper terminal T on the front surface 11 side of the substrate 10 and an inspection for the lower terminal B on the rear surface 12 side are performed in parallel. More specifically, with respect to the one surface 11, an order is given to the plurality of terminals T with which the contact 32 is contacted, and the contact terminals 32 a and 32 b that are in contact with the terminals T according to the order are the first switching unit. 28 is connected to the first current supply unit 24, and current is supplied between the contact terminals 32 a and 32 b via the terminal T. For example, by determining whether or not a current flows between the contact terminals 32a and 32b, it is determined whether or not the contact terminals 32a and 32b are in contact with the terminal T. . Similarly, for the terminal B on the other surface 12 side of the substrate 10, an order is given to the plurality of terminals B with which the contact 32 is contacted, and according to the order, the contact terminals 32 a and 32 b that are in contact with each terminal B are provided. The second switching unit 29 is connected to the second current supply unit 25, and it is determined whether or not a current flows between the contact terminals 32a and 32b via the terminal B.

  For example, as shown in FIG. 5, when the contact inspection of the contact 32A with respect to the upper terminal T4 is performed, the contact terminals 32a and 32b of the contact 32A corresponding to the upper terminal T4 are first switched by the first switching unit 28. The current supply unit 24 is connected to positive and negative current output units, respectively. The first current supply unit 24 performs an inspection by determining whether or not a current flows between the contact terminals 32a and 32b of the contact 32A via the upper terminal T4. In this way, the contact inspection for the lower terminal B is performed in parallel with the contact inspection for the upper terminal T being performed.

  Next, a specific procedure of the continuity inspection for the wiring pattern of the substrate 10 will be described. First, the control unit 22 classifies the wiring patterns provided on the substrate 10 into first to third groups based on the net information stored in the storage unit 21.

  In the first group, wiring patterns that connect only the upper terminals T on the surface 11 side are classified. In the example shown in FIG. 1, as shown in the table of FIG. 6, the wiring pattern connecting the upper terminal T2 and the upper terminal T3, the wiring pattern connecting the upper terminal T4 and the upper terminal T5, and the wiring connecting the upper terminal T6 and the upper terminal T9. The pattern, the wiring pattern connecting the upper terminal T7 and the upper terminal T8, and the wiring pattern connecting the upper terminal T11 and the upper terminal T12 are classified into the first set.

  In the second group, wiring patterns that connect only the upper terminals B on the back surface 12 side are classified. In the example shown in FIG. 1, as shown in the table of FIG. 6, a wiring pattern connecting the lower terminal B1 and the lower terminal B4, a wiring pattern connecting the lower terminal B2 and the lower terminal B3, and a wiring connecting the lower terminal B5 and the lower terminal B6. A pattern, a wiring pattern that connects the lower terminal B7 and the lower terminal B8, a wiring pattern that connects the lower terminal B9 and the lower terminal B10, and a wiring pattern that connects the lower terminal B11 and the lower terminal B12 are classified.

  In the third group, wiring patterns that connect between the upper terminal T on the front surface 11 side and the lower terminal B on the rear surface 12 side are classified. However, when there are a plurality of upper terminals T classified into the third group in one net, any one of the terminals T (here, the smallest terminal of the symbol “T1...”) Is used. T) is representatively classified into a third group as an inspection object. As for the lower terminal B, when there are a plurality of lower terminals B classified into the third group in one net, any one of the terminals B (here, “B1... The smallest terminal B) is representatively classified into the third group as an inspection object. That is, when there are a plurality of wiring patterns that connect the upper terminal T and the lower terminal B in one net, the continuity test is performed only on one of the wiring patterns. Inspection efficiency has been improved.

  Describing based on a specific example, in the example shown in FIG. 1, as a wiring pattern for connecting the upper terminal T and the lower terminal B, a wiring pattern connecting the upper terminal T1 and the lower terminal B1 or the lower terminal B4 in the net N1, Wiring pattern connecting upper terminal T4 or upper terminal T5 and lower terminal B5 or lower terminal B6 in net N3, wiring pattern connecting upper terminal T6 or upper terminal T9 and lower terminal B7 or lower terminal B8 in net N4, upper in net N6 The wiring pattern connecting the terminal T10 and the lower terminal B9 or the lower terminal B10 and the wiring pattern connecting the upper terminal T13 and the lower terminal B13 in the net N8 are applicable. However, by performing the selection as described above, what is finally classified into the third group is a wiring pattern connecting the upper terminal T1 and the lower terminal B1 of the net N1, and the upper terminal T4 and the lower terminal B5 of the net N3. A wiring pattern connecting the upper terminal T6 and the lower terminal B7 of the net N4, a wiring pattern connecting the upper terminal T10 and the lower terminal B9 of the net N6, and a wiring connecting the upper terminal T13 and the lower terminal B13 of the net N8. It becomes a pattern.

  Next, an actual continuity test will be described. First, the continuity test of the wiring patterns classified into the first group and the second group will be described.

  The continuity test of the wiring patterns classified as the first set is performed using the two upper terminals T connected to the first set of wiring patterns, and the continuity test of the wiring patterns classified as the second set is performed. The inspection is performed using the two lower terminals B to which the second set of wiring patterns are connected. The continuity test for the first set of wiring patterns and the continuity test for the second set of wiring patterns are performed in parallel by performing tests on the wiring patterns belonging to the mutually independent nets. It is like that.

  For example, in the case of the substrate 10 having the wiring pattern shown in FIG. 1, as shown in FIG. 4, the wiring pattern connecting the upper terminal T4 and the upper terminal T5 classified into the first set is tested at the same time as the second pattern. A wiring pattern that is classified into a set and does not belong to the net N3 to which the wiring pattern that connects the upper terminal T4 and the upper terminal T5 belongs, for example, a wiring pattern that connects the lower terminal B1 and the lower terminal B4, and connects the lower terminal B9 and the lower terminal B10. The continuity inspection of the wiring pattern (or the wiring pattern connecting the lower terminal B7 and the lower terminal B8) is performed.

  In this manner, at least one wiring pattern (upper terminal T or lower terminal B) that does not belong to the same net N can be selected from the first group and the second group, and the continuity test can be performed at the same time. For this reason, it becomes possible to shorten the time of a normal continuity test.

  As a specific example of the continuity test for the wiring patterns belonging to the first group and the continuity test for the wiring patterns belonging to the second group, for example, there is the one shown in FIG. In the inspection process shown in FIG. 4, the continuity test for the wiring pattern connecting the upper terminals T4 and T5 and the continuity test for the wiring pattern connecting the lower terminals B9 and B10 are simultaneously performed.

  More specifically, one contact terminal 32a of the contact 32A corresponding to the upper terminal T4 and one contact terminal 32b of the contact 32B corresponding to the upper terminal T5 are connected by the first switching unit 28 to the first current supply unit 24. Are connected to the positive and negative current output sections, respectively. At the same time, the other contact terminal 32b of the contact 32A and the other contact terminal 32a of the contact 32B are connected to the positive and negative voltage input units of the first voltage measuring unit 26 by the first switching unit 28, respectively. Then, the voltage between the upper terminals T4 and T5 is measured by the first voltage measuring unit 26 in a state where the current is supplied between the upper terminals T4 and T5 by the first current supply unit 24.

  At the same time, one contact terminal 32a of the contact 32C corresponding to the lower terminal B9 and one contact terminal 32b of the contact 32D corresponding to the lower terminal B10 are connected by the second switching unit 29 to the second current supply unit. 25 positive and negative current output units are connected to each other. At the same time, the other contact terminal 32b of the contact 32D and the other contact terminal 32a of the contact 32D are connected to the positive and negative voltage input units of the second voltage measuring unit 27 by the second switching unit 29, respectively. Then, the voltage between the lower terminals B9 and B10 is measured by the second voltage measuring unit 27 in a state where the current is supplied between the lower terminals B9 and B10 by the second current supply unit 25.

  When the continuity test for the wiring pattern belonging to the first group for one process (one set in the upper and lower directions) and the continuity test for the wiring pattern belonging to the second group are completed, the connection of the first and second switching units 28 and 29 is completed. The combination of the contact terminals 32a and 32b corresponding to the terminals T and B to which the state is switched and the wiring pattern to be inspected next is connected is the first and second current supply units 24 and 25, and the first and second Two voltage measuring units 26 and 27 are connected.

  Next, the continuity test of the third set of wiring patterns will be described. Since the wiring patterns classified into the third group are all wiring patterns belonging to different nets N, even if a plurality of wiring patterns are arbitrarily selected, the selected wiring patterns can be inspected at the same time. ing.

  A specific example of the continuity test for the wiring patterns belonging to the third group is shown in FIG. In the inspection process shown in FIG. 7, a continuity test for the wiring pattern connecting the terminals T6 and B7 and a continuity test for the wiring pattern connecting the terminals T10 and B10 are simultaneously performed.

  More specifically, one contact terminal 32b of the contact 32E corresponding to the upper terminal T6 and one contact terminal 32b of the contact 32F corresponding to the lower terminal B7 are connected to each other by the first and second switching units 28 and 29. The positive and negative current output units of one current supply unit 24 are connected to each other. At the same time, the other contact terminal 32a of the contact 32E and the other contact terminal 32a of the contact 32F are respectively connected to the positive and negative voltage input sections of the first voltage measuring section 26 by the first and second switching sections 28 and 29, respectively. Connected. Then, the voltage between the terminals T6 and B7 is measured by the first voltage measuring unit 26 in a state where the current is supplied between the terminals T6 and B7 by the first current supply unit 24.

  At the same time, one contact terminal 32b of the contact 32B corresponding to the upper and lower terminals T10 and one contact terminal 32b of the contact 32D corresponding to the lower terminal B10 are moved by the first and second switching units 28 and 29. The positive and negative current output units of the second current supply unit 25 are respectively connected. At the same time, the other contact terminal 32a of the contact 32B and the other contact terminal 32a of the contact 32D are respectively connected to the positive and negative voltage input units of the second voltage measuring unit 27 by the first and second switching units 28 and 29. Connected. The voltage between the terminals T10 and B10 is measured by the second voltage measuring unit 27 in a state where a current is supplied between the terminals T10 and B10 by the second current supply unit 25.

  When the continuity test for the wiring pattern belonging to the third set for one process (two nets) is completed, the connection state of the first and second switching units 28 and 29 is switched, and the next wiring to be inspected The combination of the contact terminals 32a and 32b corresponding to the terminals T and B to which the pattern is connected is connected to the first and second current supply units 24 and 25 and the first and second voltage measurement units 26 and 27. It has become.

  FIG. 8 is a table (table) showing a procedure of continuity inspection for the wiring pattern of the substrate 10 of FIG. Prior to the continuity test, a contact test for confirming the contact state between the contact terminals 32a and 32b of the first and second contact portions 30 and 31 and the terminals T and B is performed. Yes.

  In the first continuity test, a wiring pattern connecting the upper terminal T4 and the upper terminal T5 and a wiring pattern connecting the lower terminal B9 and the lower terminal B10 are simultaneously tested. In the second continuity test, the wiring pattern connecting the upper terminal T6 and the upper terminal T9 and the wiring pattern connecting the lower terminal B1 and the lower terminal B4 are simultaneously tested.

  In the third continuity test, the wiring pattern by the lower terminal B remains, but the wiring pattern by the upper terminal T does not exist. Therefore, the inspection of the wiring pattern connected to the lower terminal B7 and the lower terminal B8 belonging to different nets N, It is set so that the inspection of the wiring pattern connecting the lower terminal B5 and the lower terminal B6 is performed simultaneously. The above is the inspection for the wiring patterns belonging to the first group and the second group.

  Next, inspection for wiring patterns belonging to the third group will be described. Since the third set of wiring patterns all belong to the independent net N, for example, the first current supply unit 24 and the first voltage measurement for each of the two wiring patterns in the order of identification given to the upper terminal T. The set of the unit 26 and the set of the second current supply unit 25 and the second voltage measurement unit 27 are assigned. In the table of FIG. 8, the assignment is performed according to the order of the codes of the upper terminals T, and the inspection of all the wiring patterns is completed at the sixth time.

  FIG. 7 shows the state of the fifth continuity test in FIG. 10. The wiring pattern for connecting the upper terminal T6 and the lower terminal B7 and the wiring pattern for connecting the upper terminal T10 and the lower terminal B10 are shown. The inspection is performed at the same time.

  FIG. 9 is a flowchart showing the operation of the substrate inspection apparatus 20. First, the net information of the board 10 to be inspected is stored in the storage unit 21.

  When the information is stored in the inspected substrate 10, the information in the storage unit 21 is read by the control unit 22 in order to perform a continuity inspection of the inspected substrate 10 (S <b> 1).

  The first and second contact portions 30 and 31 having a multi-needle contact 32 so that the inspected substrate 10 is actually set in the substrate inspecting apparatus 1 and the continuity inspection can be performed are the inspected substrate. 10 is pressed against each terminal T and B. In the case of using an inspection means such as a flying probe that does not have a multi-needle contact, the operation is controlled so that the contact of the flying probe contacts the predetermined terminals T and B.

  Next, the check inspection of the contact state between the terminals T and B of the set substrate 10 to be inspected and the contact terminals 32a and 32b of the first and second contact portions 30 and 31 is performed as described above ( S2). At this time, if there is a contact failure in any of the contacts 32, the first and second contact portions 30, 31 are re-pressed against the substrate 10 to be inspected, and there is a contact failure through the output unit 23. Processing such as display output is performed (S3).

  As a result of the contact inspection, if there is no contact failure, the control unit 22 classifies the wiring patterns into the first group, the second group, and the third group from the information stored in the storage unit 21 (S4). And the control part 22 sets the inspection process of the wiring pattern for performing a continuity inspection according to the group of the classified wiring pattern. At this time, as described above, at least one wiring pattern of each set is inspected for the first set and the second set. For this reason, the inspection time can be shortened by the substrate inspection apparatus 1.

  Subsequently, the continuity inspection of the first set and the second set of wiring patterns is performed. If a defect is found, the presence of a defect is displayed by the output unit 23 (S8). If no defect is found, the third set of wiring patterns is displayed. The wiring pattern is inspected (S6).

  When the continuity test for the first and second wiring patterns is completed, the continuity test for the third set of wiring patterns is performed (S6). At this time, one third wiring pattern is set for each net, but if the first and second wiring patterns are confirmed to be conductive, this third wiring pattern The net continuity test can be performed simply by performing the continuity test.

  The first and second switching units 28 and 29, the first current supply unit 24, and the first voltage measurement unit 26, and the second current supply unit 25 and the second voltage measurement unit 27 included in the substrate inspection apparatus 1 Can be used without separation between the front surface and the back surface of the substrate 10, the inspection time of the continuity inspection of the substrate 10 can be shortened, and the current supply units 24 and 25 and the voltage measuring units 26 and 27 can be efficiently used. Can be used for inspection.

  If a defect is found as a result of the continuity test for the third set of wiring patterns, the output unit 23 indicates that there is a defect (S8). If no defect is found, the inspected substrate 10 does not have a continuity defect. It is determined (displayed) as the substrate 10 (S7).

  As described above, according to the present embodiment, the inspection on the plurality of wiring patterns formed on the substrate 10 is performed on the wiring pattern connecting the terminals T formed on the front surface 11 and the back surface 12. Since the inspection is performed separately on the wiring pattern connecting between the terminals B and the inspection regarding the wiring pattern connecting the terminal T formed on the front surface 11 and the terminal B formed on the back surface 12, it is provided on the substrate 10. The number of inspections at the time of continuity inspection of the wiring pattern can be reduced, and the inspection time can be shortened.

  Further, since the inspection for the wiring pattern connecting the terminals T formed on the front surface 11 and the inspection for the wiring pattern connecting the terminals B formed on the back surface 12 are performed in parallel, the inspection time is reduced. It can be further shortened.

  In addition, a wiring pattern that connects between the terminals T on the front surface 11 connected by the nets N independent of each other and a wiring pattern that connects between the terminals B on the back surface 12 are selected, and the selected at least two wiring patterns are selected. Since inspection of electrical characteristics is performed at the same time, inspection time can be shortened effectively.

  In addition, for the wiring patterns belonging to the third group, since the continuity inspection is performed simultaneously for every two wiring patterns, the inspection time can be further shortened.

  In addition, since the contact 32 that is in contact with one terminal T, B is provided with two contact terminals 32a, 32b, either one of the contact terminals 32a, 32b is used for current supply, and the other contact terminal 32a, 32b is used. The contact terminals 32a and 32b can be used for voltage measurement, thereby substantially eliminating the influence of contact resistance between the contact terminals 32a and 32b and the terminals T and B at the time of voltage measurement. The voltage applied between B can be accurately measured. As a result, electrical characteristics such as the resistance value between the terminals T and B can be accurately measured, and the reliability of the continuity test can be improved.

  Prior to the conduction test between the terminals T and B, the terminals T and B of the two contact terminals 32a and 32b are based on the conduction state between the two contact terminals 32a and 32b that are in contact with the same terminals T and B. Therefore, it is possible to prevent an error in the continuity test between the terminals T and B due to poor contact between the contact terminals 32a and 32b and the terminals T and B.

  In the above-described embodiment, the two sets of current supply units 24 and 25 and the voltage measurement units 26 and 27 are connected to the contact units 30 and 31 via the switching units 28 and 29. You may make it connect a current supply part and a voltage measurement part to the contact parts 30 and 31 via the switch parts 28 and 29. FIG.

  In the above-described embodiment, the contact portions 30 and 31 having the multi-needle contact 32 are used. However, a flying probe that can move in the x direction, the y direction, and the z direction and can rotate about the z axis is used. A plurality of (for example, two) pieces may be provided on the front surface 11 side and the back surface 12 side of the substrate 10.

  In the above-described embodiment, the contact 32 that contacts the terminals T and B includes the two contact terminals 32a and 32b. However, the contact 32 may include a single contact terminal. In this case, the current supply unit and the voltage measurement unit are commonly connected to one contact terminal for each of the positive electrode side and the negative electrode side.

It is a figure which shows typically an example of the board | substrate with which the board | substrate inspection method concerning one Embodiment of this invention is applied. It is a block diagram of the board | substrate inspection apparatus used for the board | substrate inspection method which concerns on one Embodiment of this invention. It is a figure which shows the structure of the 1st and 2nd board | substrate contact part etc. of the board | substrate inspection apparatus of FIG. It is explanatory drawing regarding a continuity test | inspection. It is explanatory drawing regarding a contact test | inspection. It is a figure which shows the classification | category result of the wiring pattern of the board | substrate of FIG. It is explanatory drawing regarding a continuity test | inspection. It is a figure which shows the procedure of the continuity inspection with respect to the wiring pattern of the board | substrate of FIG. It is a flowchart which shows operation | movement of the substrate processing apparatus of FIG.

Explanation of symbols

  10 substrate, 11 one surface (front surface), 12 other surface (back surface), 20 substrate processing device, 21 storage unit, 22 control unit, 23 output unit, 24 first current supply unit, 25 second current supply unit, 26 One voltage measurement unit, 27 Second voltage measurement unit, 28 First switching unit, 28a switch, 29 Second switching unit, 29a switch, 30 First contact unit, 31 Second contact unit, 32 Contact, 32a, 32b Contact Terminal, 33 Jig, B Lower terminal, N Net, T Upper terminal.

Claims (6)

A substrate inspection method for inspecting electrical characteristics of a substrate on which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals,
The plurality of wiring patterns are formed on the one surface, a wiring pattern group connecting the terminals formed on the one surface, a wiring pattern group connecting the terminals formed on the other surface, and the one surface. Classify into a wiring pattern group connecting the terminals and the terminals formed on the other surface,
A first inspection process for inspecting a wiring pattern connecting the terminals formed on the one surface;
A second inspection process for inspecting a wiring pattern connecting the terminals formed on the other surface;
A third inspection process for inspecting a wiring pattern that connects the terminal formed on the one surface and the terminal formed on the other surface;
A substrate inspection method characterized by: The substrate inspection method according to claim 1,
The wiring pattern that is the target of the first inspection process belongs to a different net from the wiring pattern that is the target of the second inspection process,
The substrate inspection method, wherein the first inspection process and the second inspection process are simultaneously performed in parallel. In the board | substrate inspection method of Claim 1 or Claim 2,
In the third inspection process, for a plurality of combinations of the terminal on the one surface and the terminal on the other surface connected by different nets, an inspection of the electrical characteristics of the wiring pattern connecting the terminals is performed. A method for inspecting a substrate, comprising a step of simultaneously performing the steps. In the board | substrate inspection method in any one of Claim 1 thru | or 3,
In the first inspection process, the second inspection process and the third inspection process, two contact terminals provided so as to be capable of simultaneously contacting one terminal are brought into contact with the terminals to be inspected, respectively. Connect the terminals by measuring the voltage between the terminals through the other contact terminal while supplying current between the terminals through one of the two contact terminals. A circuit board inspection method comprising: inspecting electrical characteristics of the wiring pattern. The substrate inspection method according to claim 4,
Prior to the inspection of the electrical characteristics between the terminals, the contact state of the two contact terminals with the terminal is determined based on a conduction state between the two contact terminals in contact with the same terminal. Substrate inspection method. A board inspection apparatus for inspecting electrical characteristics of a board on which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting between the terminals,
A storage unit for storing net information on the net provided on the substrate;
A plurality of contacts for contacting the terminals to be inspected, and at least two inspection means for inspecting electrical characteristics between the terminals via the contacts;
Based on the net information stored in the storage unit, a control unit that controls the order of the terminals to be inspected by the at least two inspection means;
With
The controller is
A plurality of wiring patterns, a first set that is connected between the terminals formed on the one surface, and a second set that is connected between the terminals formed on the other surface; The terminal formed on the one surface and the terminal formed on the other surface are classified into a third set that should be connected, and the inspection order of the terminals is controlled based on the classification result. A substrate inspection apparatus.

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