JP5191805B2 - Inspection apparatus and inspection method - Google Patents

Description

  The present invention relates to an inspection apparatus and an inspection method for measuring a predetermined physical quantity at each measurement point of an inspection object and determining the quality of the inspection object based on the measured value and a reference value for quality determination.

As this type of inspection apparatus, a substrate inspection apparatus (hereinafter also simply referred to as “inspection apparatus”) disclosed in Japanese Patent Application Laid-Open No. 2001-153909 is known. In this inspection apparatus, a plurality of terminal portions (first terminal portion and second terminal portion) are arranged on both surfaces of the substrate body, and corresponding terminal portions are connected to each other by a wiring net including vias and through holes. The board (circuit board) can be inspected. In this case, in this inspection apparatus, a current for measurement is supplied to the wiring net by the probe element for current application, and the specific electrical resistance value of the wiring net (based on the applied voltage level measured by the probe element for voltage measurement in that state) In the following, the quality of the wiring net is inspected by comparing the measured value with reference information (hereinafter also referred to as “reference value”) predetermined for each wiring net. doing.
JP 2001-153909 A (page 5, FIG. 1)

  However, the conventional inspection apparatus has the following problems. That is, in this inspection apparatus, the quality of the wiring net is inspected by comparing the measured value with the reference value. In this case, for example, when the thickness of the conductor layer constituting the terminal portion of the circuit board to be inspected (for example, the circuit board 100a shown in FIG. 8) is thicker than the reference thickness (the distance between the voltage measuring probe elements is short). As shown in the figure, as compared with the circuit board 100b in which the thickness of the conductor layer is the reference thickness (substantially the reference thickness), each measurement value for each wiring net is reduced as a whole. For this reason, when such a circuit board 100a is inspected, there is a wiring net (No. 64 wiring net shown in the figure) whose resistance value is larger (that is, defective) than other wiring nets. Even so, since the measured value of the wiring net is equal to or less than the reference value for pass / fail judgment (upper limit value: see the same figure), it is discovered that the wiring net is defective, that is, the circuit board 100a is defective. It becomes difficult. Conversely, when the thickness of the conductor layer constituting the terminal portion of the circuit board to be inspected (for example, the circuit board 100c shown in the figure) is thinner than the reference thickness, as shown in the figure, Compared with the substrate 100b, each measurement value for each wiring net increases as a whole. Therefore, when such a circuit board 100c is inspected, the resistance value is not particularly large compared to other wiring nets (that is, not defective). Since the measured value of the net exceeds the reference value for pass / fail judgment, it is determined that the wiring net is defective, that is, the circuit board 100c is defective. Therefore, the conventional inspection apparatus has a problem that the inspection result may be inaccurate.

  The present invention has been made in view of such problems, and provides an inspection apparatus and an inspection method capable of accurately determining pass / fail of an inspection object based on a measurement value of a predetermined physical quantity and a reference value for pass / fail determination. The main purpose.

In order to achieve the above object, the inspection apparatus according to claim 1 is configured to measure a predetermined physical quantity at each measurement point of the inspection object and output a measurement value, and to the inspection object or each measurement point. An inspection apparatus comprising: a storage unit that stores a reference value for pass / fail determination for the physical quantity set in the above; and a processing unit that determines pass / fail of the inspection object based on the measurement value and the reference value for pass / fail determination The storage unit stores a correction reference value for the physical quantity set for one or more predetermined correction points in the inspection object, and the processing unit stores the measurement the physical quantity of the correcting constants calculated on the basis of said measured value and the correction reference value in the correction point prior to measurement at point together to be stored in the storage unit Before performing the pass / fail determination, it is determined whether the correction constant is within a predetermined allowable range, and when the correction constant is not within the allowable range, the inspection is performed without performing the pass / fail determination. The object is determined to be defective, and when the correction constant is within the allowable range, the physical quantity is measured and stored in the storage unit every time the measurement value is output during the measurement. The measurement value is corrected using the correction constant, and the quality determination is performed based on the corrected measurement value .

Further, the inspection method according to claim 2 is to obtain a measurement value by measuring a predetermined physical quantity at each measurement point of the inspection object, and to determine the physical quantity set for the inspection object or each measurement point. An inspection method for performing pass / fail determination of an inspection object based on a reference value for pass / fail determination and the measured value , wherein the pre-defined 1 in the inspection object is measured prior to measurement of the physical quantity at the measurement point. Alternatively, a correction constant is calculated based on a correction reference value for the physical quantity set for a plurality of correction points and the measured value at the correction point, and is stored in a storage unit, and the pass / fail determination is performed. Before performing, it is determined whether or not the correction constant is within a predetermined allowable range. When the correction constant is not within the allowable range, the pass / fail determination is performed. It is determined that the inspection object is defective without performing the measurement, and when the correction constant is within the allowable range, the measurement of the physical quantity is executed and the measurement value is obtained during the measurement of the physical quantity. The measurement value is corrected using the correction constant stored in the unit, and the quality determination is performed based on the corrected measurement value .

According to the inspection apparatus according to claim 1 and the inspection method according to claim 2, the measured value and the reference value for pass / fail determination using the correction constant calculated based on the measured value at the correction point and the reference value for correction. For example, when performing pass / fail judgment of vias that electrically connect wiring patterns on a circuit board as an inspection object, by performing pass / fail judgment based on the corrected value, Due to the overall decrease or increase in the measurement value associated with the thickness of the conductor layer that makes up the wiring pattern, it is mistakenly determined that a defective via is not defective, or a good via is erroneously determined to be defective. It is possible to reliably prevent a situation in which a determination is made. Therefore, according to this inspection apparatus, the quality determination of the circuit board based on the measured value and the reference value for quality determination can be performed sufficiently accurately.

Further, in this inspection apparatus and inspection査方method, the calculated correction constant stored in the storage unit prior to the measurement of the physical quantity in the measurement point, time (measured to obtain the measurement value during the measurement of the physical quantity is output Each time, the measured value is corrected using the correction constant stored in the storage unit. Therefore, according to the inspection apparatus and the inspection method, for example, when the measurement value is corrected, the quality of the circuit board is determined based on the corrected value and the reference value for quality determination. When a bad via exists in one of many vias on a circuit board, the physical quantity at the measurement point corresponding to the via is measured and the pass / fail judgment is made without measuring the physical quantity at all the measurement points. At this point, the inspection for the circuit board can be completed. For this reason, according to this inspection apparatus and inspection method, since the inspection time for one circuit board can be shortened, the inspection efficiency when inspecting many circuit boards can be sufficiently improved.

Further, according to the inspection apparatus and inspection査方method, by correcting constant is determined to be defective inspection object when out of tolerance, conductivity constituting the wiring pattern of the circuit board as a test subject The body layer can be extremely thick or thin to reliably identify that the circuit board does not conform to the standard.

  Hereinafter, the best mode of an inspection apparatus and an inspection method according to the present invention will be described with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described. A circuit board inspection apparatus 1 shown in FIG. 1 is an example of an inspection apparatus according to the present invention, and an inspection method according to the present invention determines whether a circuit board 100 (see FIG. 2) as an example of an inspection object in the present invention is good or bad. It is configured to be inspectable according to Here, the circuit board 100 is, for example, a bare board on which no electronic component is mounted. As shown in the figure, the board body 101, one surface 101a (upper surface in the figure) and the other surface 101b ( A plurality of wiring patterns 102 formed on a lower surface in the figure, and a plurality of vias (through holes) 103 that electrically connect the wiring patterns 102 are provided.

  On the other hand, as shown in FIG. 1, the circuit board inspection apparatus 1 includes moving mechanisms 11a and 11b (hereinafter also referred to as “moving mechanism 11” when not distinguished), a measuring unit 12, an operating unit 13, a display unit 14, and a storage unit. 15 and a control unit 16. The moving mechanisms 11 a and 11 b move the probing jig 21 in the vertical direction under the control of the control unit 16. Each probing jig 21 includes a plurality of probe pins 21a whose numbers and arrangement patterns are defined in accordance with the contact points Pp (see FIG. 2) on each wiring pattern 102 on the circuit board 100. By being moved by the mechanism 11, each probe pin 21a is brought into contact (probing) with each contact point Pp. In this case, as shown in the figure, as an example, a contactable portion of the probe pin 21a in the pair of wiring patterns 102 respectively connected via the vias 103 is defined as the contact point Pp. A position defined by each contact point Pp (a pair of contact points Pp) in the pair of wiring patterns 102 corresponds to a measurement point (hereinafter also referred to as “measurement point Pm”) in the present invention.

  The measurement unit 12 includes a power supply unit, a measurement circuit, and a switch circuit (all not shown). In this case, the power supply unit outputs an inspection signal Sm (for example, a constant current). In addition, the measurement circuit is based on an electrical signal Se (for example, voltage) input through the probe pin 21a of the probing jig 21, and a resistance value (an example of a physical quantity in the present invention) at each measurement point Pm of the circuit board 100, specifically Specifically, the resistance value of the wiring pattern 102 and the via 103 between the pair of contact points Pp is measured to obtain the measured value Rm, and the measured value Rm (data indicating the measured value Rm) is output. The switch circuit connects / disconnects each probe pin 21a and the power supply unit and connects / disconnects each probe pin 21a and the measurement circuit. The operation unit 13 includes various switches and keys, and outputs an operation signal So when these are operated. The display unit 14 displays an inspection result, a setting screen, and the like according to the control of the control unit 16.

  The storage unit 15 includes a pass / fail determination reference value Rs1, a correction reference value Rs2 and an allowable range Rp that are used in an inspection process 30 to be described later executed by the control unit 16, the measurement value Rm output by the measurement unit 12, and the inspection. The correction constant Rc calculated in the process 30 is stored. Here, the pass / fail judgment reference value Rs1 is a reference value of the resistance value for judging pass / fail of the via 103 (circuit board 100), and as an example, each measurement point Pm (each via 103) on the circuit board 100. It is set for each. In this embodiment, the thickness of the conductor layer constituting each wiring pattern 102 of the circuit board 100 is the reference thickness, and each of the non-defective circuit boards 100 in which defects such as disconnection do not exist in each via 103. The resistance value at each measurement point Pm specified by a predetermined method using the measured value of the resistance value at the measurement point Pm, design data, or the like (as an example, the method disclosed in Japanese Patent Application Laid-Open No. 2007-48957), A resistance value to which a predetermined allowable value is added is set as a pass / fail judgment reference value Rs1.

  The correction reference value Rs2 is a resistance reference value for calculating a correction constant Rc used when correcting the measurement value Rm (or the pass / fail determination reference value Rs1) in the inspection process 30. As an example, it is set with respect to one or a plurality of correction points Pc (one in this embodiment) selected (defined) in advance from each measurement point Pm. In this embodiment, the resistance value at the correction point Pc when the thickness of the conductor layer described above is the reference thickness and there is no defect such as disconnection in each via 103 is set as the correction reference value Rs2. ing. Further, the allowable range Rp is an allowable range used for the pass / fail determination of the circuit board 100 performed separately from the pass / fail determination based on the pass / fail determination reference value Rs1 in the inspection process 30, and is set for the correction point Pc. Has been. In this embodiment, the thickness of the conductor layer is smaller than the resistance value at the correction point Pc when the thickness of the conductor layer is the reference thickness and there is no defect such as disconnection in each via 103. An allowable range (range defined by the upper and lower limit values) of the increase / decrease (variation) in resistance value caused by the above is set as the allowable range Rp.

  The control unit 16 controls each unit constituting the circuit board inspection apparatus 1 according to the operation signal So output from the operation unit 13. Moreover, the control part 16 functions as a process part in this invention, and performs the test | inspection process 30 shown in FIG. 3, based on the measured value Rm output by the measurement part 12, and the reference value Rs1 for quality determination. The quality of the circuit board 100 is determined.

  Next, a method for inspecting the quality of the circuit board 100 according to the inspection method according to the present invention using the circuit board inspection apparatus 1 and the operation of the circuit board inspection apparatus 1 at that time will be described with reference to the drawings.

  First, the circuit board 100 to be inspected is placed on a mounting table (not shown), and then the operation unit 13 is operated to instruct the start of inspection. At this time, the control unit 16 executes the inspection process 30 shown in FIG. 3 according to the operation signal So output from the operation unit 13. In this inspection process 30, the control unit 16 controls the moving mechanism 11 (step 31) and, as shown in FIG. 2, each probing jig 21 has a contact point Pp on each wiring pattern 102 on the circuit board 100. The probe pins 21a are brought into contact with each other. Subsequently, the control unit 16 controls the switch unit of the measurement unit 12 (step 32) to connect the predetermined probe pin 21a and the power supply unit, thereby correcting in advance selected from each measurement point Pm. The inspection signal Sm is supplied to the point Pc (see the same figure).

  At this time, the measurement circuit of the measurement unit 12 inputs the electric signal Se generated at the correction point Pc through the probe pin 21a. Next, the control unit 16 controls the measurement unit 12 to measure the resistance value at the correction point Pc based on the electric signal Se (step 33). Subsequently, the control unit 16 reads the correction reference value Rs2 from the storage unit 15, and calculates a correction constant Rc based on the measurement value Rm and the correction reference value Rs2 output by the measurement unit 12 (step 34) The correction constant Rc is stored in the storage unit 15. In this case, as an example, the control unit 16 calculates a value obtained by subtracting the measurement value Rm from the correction reference value Rs2 (a difference value obtained by subtracting the measurement value Rm from the correction reference value Rs2) as the correction constant Rc. Next, the control unit 16 reads the allowable range Rp and the correction constant Rc from the storage unit 15, and determines whether or not the correction constant Rc is within the allowable range Rp (step 35). In this case, when the correction constant Rc is not within the permissible range Rp (when the correction constant Rc is outside the permissible range Rp), the conductor layer constituting the wiring pattern 102 is extremely thick or thin. May not be suitable. Therefore, the control unit 16 determines that the circuit board 100 is defective when the correction constant Rc is not within the allowable range Rp (step 36).

  On the other hand, when the correction constant Rc is within the allowable range Rp, the control unit 16 determines that in step 35 and then controls the switch unit of the measurement unit 12 (step 37) in advance. The inspection signal Sm is supplied to the first measurement point Pm according to the determined order. Next, the control unit 16 controls the measurement unit 12 to perform measurement of the resistance value at the first measurement point Pm and output of the measurement value Rm (step 38). Subsequently, the control unit 16 corrects the measurement value Rm output by the measurement unit 12 using the correction constant Rc described above, and uses the corrected measurement value Rm (hereinafter also referred to as “correction value Rr”). It records in the memory | storage part 15 (step 39). In this case, as an example, the control unit 16 adds the correction constant Rc to the measurement value Rm to calculate the correction value Rr.

  Next, the control unit 16 reads out the pass / fail determination reference value Rs1 corresponding to the measurement point Pm from the storage unit 15, and determines whether or not the correction value Rr corrected in step 39 is less than or equal to the pass / fail determination reference value Rs1. Is discriminated (step 40). In this case, when the correction value Rr is equal to or less than the reference value Rs1 for pass / fail determination, the control unit 16 determines whether or not the measurement of the resistance at all the measurement points Pm is completed (step 41). In this case, when the measurement at all the measurement points Pm is not completed, the control unit 16 executes the above steps 37 to 41. That is, as long as the correction value Rr at each measurement point Pm is equal to or less than the reference value Rs1 for pass / fail determination, the control unit 16 repeats steps 37 to 41 to execute the correction constant Rc each time the measurement value Rm is output. Is used to correct the measurement value Rm, and when the correction value Rr at all the measurement points Pm is equal to or less than the reference value Rs1 for quality determination, the circuit board 100 is determined to be good (step 42). On the other hand, when the correction value Rr exceeds the pass / fail judgment reference value Rs1 (not less than the pass / fail judgment reference value Rs1) in step 40 described above, the circuit board 100 is determined to be defective (step 36).

  Here, for example, when the thickness of the conductor layer constituting the wiring pattern 102 in the circuit board 100 to be inspected is thicker than the reference thickness, the resistance value of the wiring pattern 102 decreases, and therefore the measured value Rm at each measurement point Pm. Decreases as a whole. In this case, as shown in FIG. 4, the correction constant Rc, which is a difference value obtained by subtracting the measurement value Rm from the correction reference value Rs2 at the correction point Pc, corresponds to this decrease. By performing correction by adding the correction constant Rc to the value Rm, the resistance value (correction value Rr) at each measurement point Pm when the thickness of the conductor layer is assumed to be the reference thickness can be obtained. For this reason, the measurement value Rm before the correction is equal to or less than the reference value Rs1 for pass / fail judgment, and it is difficult to find the defect as a via 103 (positioned at the measurement point Pm of No. 64 shown in the figure). Even if there is a via 103), it is possible to reliably determine that the via 103 is defective by correcting the measured value Rm.

  On the other hand, for example, when the thickness of the conductor layer constituting the wiring pattern 102 in the circuit board 100 to be inspected is thinner than the reference thickness, the resistance value of the wiring pattern 102 increases, so that the measured value Rm at each measurement point Pm is Increases overall. In this case, as shown in FIG. 5, the correction constant Rc, which is a difference value obtained by subtracting the measurement value Rm from the correction reference value Rs2 at the correction point Pc, corresponds to this increase. In step 39, correction is performed by adding the correction constant Rc to the measurement value Rm (in this case, the measurement value Rm is larger than the correction reference value Rs2 and the correction constant Rc is a negative value, so the measurement value Rm Thus, the resistance value at each measurement point Pm when it is assumed that the thickness of the conductor layer is the reference thickness can be obtained. For this reason, although the resistance value is not particularly large (that is, not defective) compared to the other vias 103 due to the increase in the measured value Rm as a whole, before the correction, , It is assumed that there is a via 103 (via 103 located at the measurement point Pm of No. 40 shown in the figure) that may cause the measurement value Rm to exceed the reference value Rs1 for pass / fail determination and be determined to be defective. However, by correcting the measurement value Rm, it is possible to reliably prevent a situation where the via 103 is erroneously determined to be defective.

  As described above, according to the circuit board inspection apparatus 1 and the inspection method, the control unit 16 uses the correction constant Rc calculated based on the measurement value Rm and the correction reference value Rs2 at the correction point Pc. By correcting the value Rm and determining the quality of the circuit board 100 based on the corrected measured value Rm (corrected value Rr), the entire measured value Rm associated with the thickness of the conductor layer constituting the wiring pattern 102 is determined. It is reliably prevented that a bad via 103 is erroneously determined not to be bad or a good (non-defective) via 103 is erroneously determined to be bad due to a decrease or increase can do. Therefore, according to the circuit board inspection apparatus 1 and the inspection method, the pass / fail judgment of the via 103 (circuit board 100) based on the measured value Rm and the pass / fail judgment reference value Rs1 can be performed sufficiently accurately.

  In the circuit board inspection apparatus 1 and the inspection method, the control unit 16 stores the correction constant Rc in the storage unit 15 prior to the measurement of the resistance value at the measurement point Pm, and the measured value during the measurement of the resistance value. Each time Rm is output, the measured value Rm is corrected using the correction constant Rc stored in the storage unit 15, and at that time, the circuit board is based on the corrected correction value Rr and the reference value Rs1 for pass / fail determination. 100 pass / fail is determined. Therefore, according to the circuit board inspection apparatus 1 and the inspection method, for example, when a defective via 103 is present in one of many vias 103, the resistance value is not measured at all the measurement points Pm. When the resistance value at the measurement point Pm corresponding to the via 103 is measured to determine pass / fail, the inspection of the circuit board 100 can be finished. Therefore, according to the circuit board inspection apparatus 1 and the inspection method, the inspection time for one circuit board 100 can be shortened, so that the inspection efficiency when inspecting many circuit boards 100 can be sufficiently improved. Can do.

  Further, according to the circuit board inspection apparatus 1 and the inspection method, the control unit 16 determines that the circuit board 100 is defective when the correction constant Rc is outside the allowable range Rp, whereby the conductive material constituting the wiring pattern 102 is determined. The circuit board 100 that does not conform to the standard due to the extremely thick or thin body layer can be reliably identified.

In addition , although it described above about the example which determines the quality of the circuit board 100 by comparing the correction value Rr with the reference value Rs1 for quality determination every time the correction value Rr of the measurement value Rm at one measurement point Pm is calculated, After the process of calculating the correction value Rr of the measurement value Rm at the measurement point Pm is completed, the pass / fail determination reference value Rs1 corresponding to each measurement point Pm is compared with the correction value Rr to determine the pass / fail of the circuit board 100. It is also possible to adopt a configuration and an inspection method for performing the processing. In addition, after the measurement of the resistance values at all the measurement points Pm is completed, the correction value Rr is calculated by collectively correcting the measurement values Rm at all the measurement points Pm using the correction constant Rc, It is also possible to employ a configuration and an inspection method for performing a process of determining the quality of the circuit board 100 by comparing the quality determination reference value Rs1 corresponding to each measurement point Pm with the correction value Rr. In these configurations, when there are a plurality of defective vias 103, all of them can be specified. Therefore, when inspecting many circuit boards 100 of the same type, which via 103 is likely to have a defect. Can be statistically grasped.

  Further, in the above configuration example, the measurement value Rm is corrected using the correction constant Rc. However, instead of this configuration and the inspection method, the pass / fail determination reference value Rs1 is corrected using the correction constant Rc. Configurations and inspection methods can also be employed. In this configuration and the inspection method, as shown in FIG. 6, the control unit 16 converts the measurement value Rm and the correction reference value Rs2 at one or more correction points Pc (one correction point Pc in the figure). Based on (specifically, the measurement value Rm is subtracted from the correction reference value Rs2), the correction constant Rc is calculated, and correction is performed to increase or decrease the pass / fail judgment reference value Rs1 by the correction constant Rc. . In addition, the control unit 16 determines the quality of the circuit board 100 based on the corrected quality determination reference value Rs1.

  In this case, for example, as shown in FIG. 6, when the correction reference value Rs2 is larger than the measurement value Rm, the control unit 16 reduces the pass / fail judgment reference value Rs1 by the correction constant Rc, As shown in FIG. 7, when the measured value Rm is larger than the correction reference value Rs2, the pass / fail judgment reference value Rs1 is increased by the correction constant Rc. Also in this configuration and the inspection method, the correction constant Rc calculated based on the correction reference value Rs2 and the measurement value Rm at the correction point Pc (that is, calculated by subtracting the measurement value Rm from the correction reference value Rs2). Is used to correct the pass / fail judgment reference value Rs1 and inspect the pass / fail of the circuit board 100 on the basis of the corrected pass / fail judgment reference value Rs1, thereby measuring the thickness of the conductor layer constituting the wiring pattern 102. A situation in which a bad via 103 is erroneously determined not to be defective or a good (non-defective) via 103 is erroneously determined to be defective due to an overall decrease or increase in the value Rm. Can be reliably prevented. Therefore, also in this circuit board inspection apparatus 1, the pass / fail judgment of the via 103 (circuit board 100) based on the measured value Rm and the pass / fail judgment reference value Rs1 can be performed sufficiently accurately.

  Furthermore, a configuration and an inspection method in which the control unit 16 corrects both the measured value Rm and the pass / fail judgment reference value Rs1 using the correction constant Rc may be employed. Specifically, when the correction reference value Rs2 at the correction point Pc is larger than the measurement value Rm, 1 / N (the correction constant Rc calculated by subtracting the measurement value Rm from the correction reference value Rs2). N is an integer, for example, a value of N = 2: the same applies hereinafter) is added to the measurement value Rm at each measurement point Pm to calculate the correction value Rr, and the value of 1 / N of the correction constant Rc is calculated. Thus, the quality determination reference value Rs1 is lowered (corrected). Further, when the measured value Rm is larger than the correction reference value Rs2, for example, the value of 1 / N of the absolute value of the correction constant Rc calculated by subtracting the measurement value Rm from the correction reference value Rs2 is set. The correction value Rr is calculated by subtracting the measurement value Rm at the measurement point Pm, and the pass / fail judgment reference value Rs1 is increased (corrected) by 1 / N of the absolute value of the correction constant Rc. Next, pass / fail determination is performed based on the correction value Rr and the corrected pass / fail reference value Rs1.

  Further, the example in which one or a plurality of correction points Pc selected from the measurement points Pm are defined as the correction points in the present invention has been described above, but a correction point Pc different from the measurement points Pm is used for correction. It can also be set as a point. Further, the example in which the difference value obtained by subtracting the measurement value Rm from the correction reference value Rs2 is used as the correction constant Rc is described above. However, the ratio between the correction reference value Rs2 and the correction point Pc is used as the correction constant Rc. For example, a configuration and an inspection method in which the correction value Rr is calculated by multiplying the measurement value Rm by the correction constant Rc (or dividing the measurement value Rm by the correction constant Rc) may be employed. Further, a value obtained by subtracting the measurement value Rm from the correction reference value Rs2 may be calculated for a plurality of correction points Pc, and the average value thereof may be used as the correction constant Rc. Further, the correction constant Rc can be calculated by, for example, the least square method based on the measurement value Rm and the correction reference value Rs2 at the plurality of correction points Pc.

  In addition, the configuration example in which the storage unit 15 stores all of the pass / fail determination reference value Rs1, the correction reference value Rs2, the allowable range Rp, the measurement value Rm, and the correction constant Rc has been described. However, the storage unit 15 includes a plurality of storage units. It is possible to adopt a configuration in which these values, ranges, and constants are stored separately in each storage unit, or a configuration that includes a plurality of storage units that store each of these values, ranges, and constants exclusively. You can also. Further, the configuration and the inspection method in which the different pass / fail judgment reference value Rs1 is set for each measurement point Pm have been described above, but one (that is, the measurement point Pm) for one circuit board 100 as the inspection target. Regardless of this, it is also possible to adopt a configuration and inspection method in which a common quality reference value Rs1 is set.

1 is a block diagram showing a configuration of a circuit board inspection device 1. FIG. 1 is a configuration diagram showing a configuration of a circuit board 100. FIG. 3 is a flowchart of an inspection process 30. FIG. 6 is a first explanatory diagram for explaining the processing content of an inspection process 30; FIG. 10 is a second explanatory diagram for explaining the processing content of the inspection processing 30. It is the 3rd explanatory view for explaining the processing contents of other inspection processing. It is the 4th explanatory view for explaining the processing contents of other inspection processing. It is explanatory drawing for demonstrating the content of the conventional process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 12 Measurement part 15 Memory | storage part 16 Control part 30 Inspection process 100 Circuit board Pc Correction point Pm Measurement point Pp Contact point Rc Correction constant Rp Permissible range Rs1 Pass / fail judgment reference value Rs2 Correction reference value

Claims (2)

Stores a measurement unit that measures a predetermined physical quantity at each measurement point of the inspection object and outputs a measurement value, and a reference value for pass / fail judgment for the physical quantity set for the inspection object or each measurement point An inspection apparatus including a storage unit, and a processing unit that performs pass / fail determination of the inspection object based on the measurement value and the reference value for pass / fail determination,
The storage unit stores a correction reference value for the physical quantity set for one or more predetermined correction points in the inspection object,
The processing unit stores, in the storage unit, a correction constant calculated based on the measurement value and the correction reference value at the correction point prior to the measurement of the physical quantity at the measurement point, and the pass / fail Before performing the determination, it is determined whether or not the correction constant is within a predetermined allowable range, and when the correction constant is not within the allowable range, the inspection object is determined without performing the pass / fail determination. Is determined to be defective, and when the correction constant is within the allowable range, the physical quantity is measured and the correction value stored in the storage unit each time the measurement value is output during the measurement. An inspection apparatus that corrects the measurement value using a constant for use, and performs the pass / fail determination based on the corrected measurement value . A measurement value is obtained by measuring a predetermined physical quantity at each measurement point of the inspection object, and a pass / fail judgment reference value and the measurement value for the physical quantity set for the inspection object or each measurement point are obtained. An inspection method for determining pass / fail of the inspection object based on:
Prior to measurement of the physical quantity at the measurement point, a correction reference value for the physical quantity set for one or more correction points defined in advance in the inspection object and the measurement at the correction point. A correction constant is calculated based on the value and stored in a storage unit, and before the pass / fail judgment, it is determined whether the correction constant is within a predetermined allowable range, and the correction constant is determined. When the constant is not within the allowable range, it is determined that the inspection object is defective without performing the pass / fail determination, and when the correction constant is within the allowable range, the physical quantity is measured and the measurement is performed. wherein using the correction constant stored in the storage unit corrects the measured value every time obtaining a measured value at medium, the quality determination on the basis of the measured value after the correction Cormorant inspection method.

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