WO2008001651A1

WO2008001651A1 - Board inspecting method and board inspecting device

Info

Publication number: WO2008001651A1
Application number: PCT/JP2007/062337
Authority: WO
Inventors: Munehiro Yamashita
Original assignee: Nidec-Read Corporation
Priority date: 2006-06-29
Filing date: 2007-06-19
Publication date: 2008-01-03
Also published as: TW200809227A; JP2008008773A; KR20090031663A

Abstract

[PROBLEMS] A board inspecting method and device for inspecting the electrical connections of the wiring patterns on a board by a reduced number of inspections in a shortened inspection time. [MEANS FOR SOLVING PROBLEMS] Electrical connections of the wiring patterns provided on a board (10) and divided into first to third sets are inspected according to net information stored in a storage section. The first set includes wiring patterns for interconnections between upper terminals (T) on the front side (11). The second set includes wiring patterns for interconnections only between upper terminals (B) on the back side (12). The third set includes wiring patterns for interconnections only between the upper terminal (T) on the front side (11) and the lower terminals (B) on the back side (12). The wiring patterns of the first set and those of the second one are inspected in parallel. One contact (32) has two contact terminals (32a, 32b). Prior to the electrical connection inspection, contact inspection of the contact terminals (32a, 32b) and the terminals (T, B) is performed depending on the electrical connection between the two contact terminals (32a, 32b).

Description

Specification

Substrate inspection method and substrate inspection apparatus

Technical field

The present invention relates to a substrate inspection method and a substrate inspection apparatus for inspecting electrical characteristics of a substrate having a plurality of wiring patterns.

Note that the present invention is not limited to a printed wiring board, but includes, for example, various substrates such as a flexible board, a multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, a package board for a semiconductor package, and a film carrier. The present invention can be applied to inspection of electrical wiring on a semiconductor wafer, and in this specification, these various wiring boards are collectively referred to as “substrate”.

Background art

[0003] In recent years, as electrical components arranged on a substrate have become more complex and have higher functionality, the substrate itself has become multilayered and complicated. For this reason, nets and the like arranged on the substrate are formed more finely, and more nets and the like are formed.

[0004] Since the inspection of the continuity or short circuit of the wiring patterns constituting the net needs to be performed for each wiring pattern, the number of inspections increases and the inspection time increases due to an increase in the number of wiring patterns and the like. Had a problem that increased significantly.

[0005] In order to solve the problem that the inspection time increases as described above, Patent Document 1 relates to an insulation inspection method for inspecting the insulation of wiring patterns arranged side by side in a mutually insulated state. Techniques such as those disclosed in are proposed.

However, the technique disclosed in Patent Document 1 relates to an insulation test, and is not applied to a wiring pattern continuity test.

[0007] In particular, in the wiring pattern continuity inspection, it is necessary to inspect all the wiring patterns in order to improve the inspection accuracy, and how to efficiently perform all the inspections has been a big problem. .

Patent Document 1: Japanese Unexamined Patent Application Publication No. 2006-105795

Disclosure of the invention Problems to be solved by the invention

[0008] The present invention has been made in view of such a situation, and can reduce the number of inspections at the time of continuity inspection of a wiring pattern provided on a substrate and shorten the inspection time and the substrate. Provide inspection equipment.

Means for solving the problem

[0009] In order to solve the above-mentioned problem, in the invention of claim 1, a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals. A substrate inspection method for inspecting electrical characteristics of a substrate, wherein the plurality of wiring patterns are formed on a wiring pattern group connecting the terminals formed on the one surface, and on the other surface. The wiring pattern group connecting the terminals, and the wiring pattern group connecting the terminal formed on the one surface and the terminal formed on the other surface, and formed on the one surface. A first inspection process for inspecting the wiring pattern connecting the terminals, and a second inspection process for inspecting the wiring pattern connecting the terminals formed on the other surface; Said one A third inspection process for inspecting a wiring pattern that connects the terminal formed on the surface and the terminal formed on the other surface is performed.

[0010] Further, in the invention of claim 2, in the substrate inspection method according to the invention of claim 1, the wiring pattern that is the object of the first inspection process is the wiring that is the object of the second inspection process. The pattern belongs to a net different from the pattern, and the first inspection process and the second inspection process are simultaneously performed in parallel.

[0011] Further, in the invention of claim 3, in the substrate inspection method according to claim 1 or claim 2, the third inspection processing is performed on the one surface connected by different nets. A step of simultaneously inspecting electrical characteristics of a wiring pattern connecting the terminals for a plurality of combinations of the terminals and the terminals on the other surface is included.

[0012] Further, in the invention of claim 4, in the substrate inspection method according to any one of claims 1 to 3 and claim 3, the first inspection process, the second inspection process, and the In the third inspection process, two contact terminals provided so as to be able to simultaneously contact one of the terminals are brought into contact with the terminal to be inspected, and one of the two contact terminals is contacted. Electrical characteristics of the wiring pattern for connecting the terminals by supplying a current between the terminals via one of the contact terminals and measuring a voltage between the terminals via the other contact terminal Perform the inspection.

[0013] Further, in the invention of claim 5, in the substrate inspection method according to the invention of claim 4, the two contact terminals in contact with the same terminal prior to the inspection of the electrical characteristics between the terminals. The contact state of the two contact terminals to the terminal is determined based on the conduction state between them.

[0014] Further, in the invention of claim 6, there is provided a substrate in which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals. A board inspection apparatus for inspecting electrical characteristics, comprising a storage unit for storing net information relating to the net provided on the board, and a plurality of contacts for contacting the terminals to be inspected. The at least two inspection means for inspecting electrical characteristics between the terminals via a contact and the terminals to be inspected by the at least two inspection means based on net information stored in the storage unit And a control unit that controls the order of the first and second wiring patterns formed on the other surface and the first set of wiring patterns that connect the terminals formed on the one surface. The terminal to be Are classified into a second group consisting of those that connect the terminals, and a third group that consists of the forces that connect the terminals formed on the one surface and the terminals formed on the other surface, and the classification. Based on the result, the order of inspection of the terminals is controlled.

The invention's effect

[0015] According to the invention of claim 1, the inspection of the plurality of wiring patterns formed on the substrate is performed on the wiring pattern connecting the terminals formed on one surface, and the other surface. A wiring pattern that connects terminals formed in a single line! / Inspection at the time of continuity inspection of the wiring pattern provided on the board, because it is performed separately for the inspection of the wiring pattern that connects the terminal formed on one surface and the terminal formed on the other surface. The number of times can be reduced and the inspection time can be shortened.

[0016] According to the invention of claim 2, the wiring pattern connecting the terminals formed on one surface and the wiring pattern connecting the terminals formed on the other surface are used. The inspection time can be further shortened because the inspection is performed in parallel.

[0017] According to the invention described in claim 3, the third inspection processing is performed between the terminals for a plurality of combinations of the terminals on the one surface and the terminals on the other surface connected by different nets. The inspection time can be further shortened because it includes a step of simultaneously inspecting the electrical characteristics of the wiring pattern connecting the wires.

[0018] According to the invention of claim 4, since the contact terminal for current supply and the contact terminal for voltage measurement are provided, the contact resistance between the contact terminal and the terminal at the time of voltage measurement is provided. The voltage applied across the terminals can be accurately measured. As a result, electrical characteristics such as resistance between terminals can be accurately measured, and the reliability of the continuity test can be improved.

[0019] According to the invention of claim 5, prior to the inspection of the electrical characteristics between the terminals, the two contact terminals are connected based on the conduction state between the two contact terminals in contact with the same terminal. Since the contact state between the terminals is determined, it is possible to prevent an error in the conduction test between the terminals due to poor contact between the contact terminals.

[0020] According to the invention of claim 6, the inspection of the plurality of wiring patterns formed on the substrate, the inspection of the wiring patterns connecting the terminals formed on one surface, and the other surface A wiring pattern that connects terminals formed in a single line! / Inspection at the time of continuity inspection of the wiring pattern provided on the board, because it is performed separately for the inspection of the wiring pattern that connects the terminal formed on one surface and the terminal formed on the other surface. The number of times can be reduced and the inspection time can be shortened.

BEST MODE FOR CARRYING OUT THE INVENTION

A substrate inspection method and a substrate inspection apparatus used therefor according to an embodiment of the present invention will be described.

[0022] The substrate inspection method according to the present embodiment is an electrical circuit for a substrate in which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals. Applies to property inspection.

FIG. 1 is a diagram schematically showing an example of a substrate to which the substrate inspection method according to the present embodiment is applied. A substrate 10 shown in FIG. 1 is a substrate to be inspected by a substrate inspection apparatus, for example, a package substrate used in a BGA (Ball Grid Array) package. This figure 1 Board

One surface 11 (surface 11) of 10 is an element arrangement surface to which a semiconductor chip is attached. For example, an upper terminal T (terminal) that is a conductor portion for connecting the semiconductor chip by flip chip bonding or wire bonding Τ1 · · · Τ13)

[0024] The other surface 12 (back surface 12) of the substrate 10 is provided with, for example, lower terminal pins (terminals B1... -B13) that are pads for soldering terminals of solder balls.

[0025] The upper terminal 端子, the lower terminal Β, the upper terminal Τ, and the lower terminal are connected to internal wiring and internal wiring patterns (hereinafter referred to as internal via patterns) provided on the inside or the surface of the substrate 10, respectively. The wiring pattern is electrically connected to the bottom.

In addition, in the substrate 10 shown in FIG. 1, since the upper terminal Τ provided on the surface であ is the side on which the semiconductor chip is attached, the pitch at which each upper terminal T is provided is different from the lower terminal B. The interval is smaller than that. Further, although there are shown 13 upper terminals T and 13 lower terminals B on the substrate 10 in FIG. 1, this is for the convenience of explanation and is not particularly limited.

In the substrate 10 of FIG. 1, the upper terminal T1 is connected to the lower terminals Bl and B4, the upper terminal T2 is connected to the upper terminal T3, the upper terminal T4 is connected to the upper terminal T5, and the lower terminals Β5 and Β6. , Upper terminal Τ6 is connected to upper terminal Τ9, lower terminals Β7, 、 8, upper terminal T10 is connected to lower terminals Β9, B10, upper terminal T11 is connected to upper terminal T12, upper terminal T13 is connected to lower terminal B13 Connected, lower terminal Β2 is connected to lower terminal Β3, and lower terminal B11 is connected to lower terminal B12.

In the substrate 10 of FIG. 1, a plurality of nets (nets 1... -N10) are formed by an upper terminal Τ, a lower terminal Β, and a wiring pattern that electrically connects these terminals.

In FIG. 1, the number of force nets on which ten nets are formed is not particularly limited.

In the substrate inspection method according to the present embodiment, a continuity inspection is performed to inspect whether there is a problem in the electrical connection of the wiring pattern of the net provided on the substrate 10. For this reason, an inspection for confirming electrical connection between two terminals (upper terminals, lower terminals, or upper and lower terminals) at both ends of the wiring pattern is performed. In the continuity test between terminals, the current state between the terminals (resistance value, etc.) is inspected by measuring the voltage between the terminals with current flowing between the terminals! /, The Next, the configuration of the substrate inspection apparatus 20 used for the substrate inspection method according to the present embodiment will be described. FIG. 2 is a block diagram of the substrate inspection apparatus 1. As shown in FIG. 2, the board inspection apparatus 20 includes a storage unit 21, a control unit 22, an output unit 23, first and second current supply units 24 and 25, and first and second voltage measurement units. 26, 27, first and second switching portions 28, 29, and first and second contact portions 30, 31. The inspection means according to the present invention includes first and second current supply units 24, 25, first and second voltage measurement units 26, 27, first and second switching units 28, 29, and first And the second contact portions 30, 31 correspond.

[0032] The storage unit 21 stores rewritable net information relating to terminal positions of the substrate 10, wiring pattern arrangement, and the like. The net information stored in the storage unit 21 is appropriately updated as the type of the board to be inspected 10 is changed. The output unit 23 is used for outputting inspection results and the like, and is configured by a display device or the like.

As shown in FIG. 3, the first and second contact portions 30 and 31 are configured to include a plurality of contacts 32 (see FIG. 4) and a jig 33 that holds the contacts 32. ing. The contact 32 is provided such that its tip end protrudes from the substrate facing surface 33 a facing the substrate 10 of the jig 33. Further, the arrangement position of the contact 32 is set so as to correspond to the arrangement positions of the terminals Τ and B provided on the front surface 11 and the back surface 12 of the substrate 10. As a result, as the substrate facing surface 33a of the jig 30 is brought close to the substrate 10, each contact 32 comes into contact (contact) with the corresponding terminal Τ, B. In the example shown in FIG. 3, the contact 32 is moved by bringing the jig 32 closer to the vertical force as shown by arrows Al and A2 with respect to the substrate 10 set at a predetermined position in the apparatus 1. For example, one of the jigs 33 (for example, the lower jig 33) is fixed, and the board 10 is set at a predetermined position. As a result, the contact 32 provided on the fixed jig 33 may come into contact with the terminals Τ and B of the board 10.

[0034] Further, as shown in FIG. 4, each contact 32 provided in the first and second contact portions 30, 31 has two contact terminals 32a, 32b that simultaneously contact one terminal Τ, B. Is provided. For example, one of the two contact terminals 32a and 32b is used for current supply, and the other is used for voltage measurement. In FIG. 4, the jig 33 is omitted for simplification of the drawing, and only some of the contacts 32 are shown, and the other contacts 32 are connected. Are omitted (the same applies to Figs. 5 and 7).

[0035] In this way, by disposing the two contact terminals 32a and 32b on the terminals Τ and B, respectively, the influence of the contact resistance generated between the terminals Τ and B and the contact terminals 32a and 32b is neglected. It is possible to measure the electrical characteristics of non-turns (a four-terminal measurement method can be implemented).

[0036] Each contact terminal 32a, 32b provided in the first contact portion 30 is connected to a switch 28a in the first switching portion 28 via a wiring, and the first and second current supply is performed by the switch 28a. The connection relationship between the units 24 and 25 and the first and second voltage measuring units 26 and 27 can be switched. Similarly, each contact terminal 32a, 32b provided in the second contact portion 31 is connected to a switch 29a in the second switching portion 29 via a wiring, and the first and second current supply are provided by the switch 29a. The connection relationship between the units 24 and 25 and the first and second voltage measuring units 26 and 27 can be switched.

[0037] The first and second current supply units 24 and 25 include, for example, a power supply circuit (for example, a power supply circuit capable of adjusting the output voltage) and a current control circuit that controls the current value of the output current. The current supply operation is performed under the control of the control unit 22. For example, the current supply units 24 and 25 output a predetermined constant current by the action of the current control circuit.

[0038] In the first current supply unit 24, the first and second switching units 28 and 29 form a circuit with any two contact terminals 32a and 32b in the first and second contact units 30 and 31. Thus, the current supplied by the first current supply unit 24 is supplied to the corresponding terminals Τ and B of the substrate 10 through the contact terminals 32a and 32b. Similarly, any two contact terminals 32a, 32b in the first and second contact portions 30, 31 are connected by the first and second switching portions 28, 29 so as to form a circuit. The current supplied by the two-current supply unit 25 is supplied to the corresponding terminals Τ and B of the substrate 10 through the contact terminals 32a and 32b.

[0039] The first voltage measuring unit 26 is connected to any two contact terminals 32a, 32b in the first and second contact units 30, 31 via the first and second switching units 28, 29, and Measure the voltage between terminals Τ and B of board 10 with which contact terminals 32a and 32b are in contact. To give. Similarly, the second voltage measuring unit 27 is connected to any two contact terminals 32a, 32b in the first and second contact units 30, 31 via the first and second switching units 28, 29. Then, the voltage between the terminals の and B of the substrate 10 in contact with the contact terminals 32a and 32b is measured, and the measurement result is given to the control unit 22.

The first switching unit 28 includes a plurality of switches 28 a such as semiconductor switching elements that operate independently under the control of the control unit 22, and a plurality of switches provided in the first contact unit 30. The connection relationship between the contact terminals 32a and 32b, the first and second current supply units 24 and 25, and the first and second voltage measurement units 26 and 27 is switched. Similarly, the second switching unit 29 includes a plurality of switches 29a including semiconductor switching elements that operate independently under the control of the control unit 22, and a plurality of switches provided in the second contact unit 31. The connection relationship between the contact terminals 32a and 32b, the first and second current supply units 24 and 25, and the first and second voltage measurement units 26 and 27 is switched.

The control unit 22 determines an inspection procedure for the wiring pattern provided on the substrate 10 based on the net information stored in the storage unit 21 (this inspection procedure will be described in detail later). According to the procedure, the switches 28a and 29b of the first and second switching units 28 and 29 are operated, and the first and second current supply units 24 and 25 and the first and second voltage measuring units 26 and 27 are operated. The contact terminals 32a and 32b in the first and second contact portions 30 and 31 connected to are sequentially switched. In synchronism with this switching operation, the control unit 22 supplies current to the first and second current supply units 24 and 25 via the contact terminals 32a and 32b between the terminals of the substrate 10 corresponding to the inspection procedure. The voltage between the terminals is supplied to the first and second voltage measuring units 26, 27 and the contact terminals 3 2a, 3

Measurement is performed via 2b, and the quality of each wiring pattern is determined based on the measurement result.

The quality determination is performed based on, for example, the current value supplied by the current supply units 24 and 25 and the voltage value measured by the voltage measurement units 26 and 27. More specifically, for example, the resistance value of the wiring pattern is calculated based on the current value and the voltage value, and whether or not the resistance value is within a predetermined allowable range or the resistance value. A pass / fail judgment is made based on the magnitude relationship between the value and the predetermined threshold. [0043] For example, as shown in FIG. 4, when a conduction inspection is performed on a wiring pattern connecting the upper terminals T4 and T5, one of the contact terminals 32A of the contact 32A corresponding to the upper terminal T4 , 32b (for example, terminal 32a) and one contact terminal 32a, 32b (for example, terminal 32b) of the contact 32B corresponding to the upper terminal T5 are connected to the positive / negative current of the first current supply unit 24 by the first switching unit 28. Each is connected to the output unit. At the same time, the other contact terminals 32a, 32b (for example, terminal 32b) of the contact 32A and the other contact terminals 32a, 32b (for example, terminal 32a) of the contact 32B are connected to the first voltage by the first switching unit 28. Connected to the positive and negative voltage input sections of the measurement section 24, respectively. Then, in the state where the current is supplied between the upper terminals T4 and T5 by the first current supply unit 24, the voltage between the upper terminals T4 and T5 is measured by the first voltage measuring unit 26.

In addition, the control unit 22 performs a continuity test on the wiring pattern of the substrate 10 when the contact terminals 32a and 32b of the first and second contact portions 30 and 31 are in contact with the terminals Τ and B of the substrate 10. Prior to this, contact detection is performed to confirm whether the contact terminals 32a and 32b are in contact with terminals Τ and B.

In this contact inspection, for example, an inspection for the upper terminal T on the front surface 11 side of the substrate 10 and an inspection for the lower terminal B on the rear surface 12 side are performed in parallel. More specifically, for the one surface 11, an order is given to a plurality of terminals T with which the contacts 32 are contacted, and according to the order, the contact terminals 32 a and 32 b that are in contact with the terminals T are the first switching unit. 28 is connected to the first current supply unit 24, and current is supplied between the contact terminals 32 a and 32 b via the terminal T. Then, for example, by determining whether or not a current flows between the contact terminals 32a and 32b, it is possible to determine whether or not the contact force of the contact terminals 32a and 32b is in contact with the terminal T. ing. Similarly, for the terminal B on the other surface 12 side of the substrate 10, the order is given to the plurality of terminals B with which the contact 32 is contacted, and the contact terminals 32a and 32b that are in contact with each terminal B are arranged in accordance with the order. The second switching unit 29 is connected to the second current supply unit 25, and it is determined whether or not a current flows between the contact terminals 32a and 32b via the terminal B! /.

For example, as shown in FIG. 5, when the contact inspection of the contact 32A with respect to the upper terminal T4 is performed, the contact terminals 32a and 32b of the contact 32A corresponding to the upper terminal T4 are the first switching unit 2 8 is connected to the positive and negative current output sections of the first current supply section 24, respectively. And second The inspection is performed by determining whether or not the current flowing through the upper terminal T4 between the contact terminals 32a and 32b of the contact 32A is determined by one current supply unit 24. In this way, the contact inspection for the lower terminal B is performed in parallel with the contact inspection for the upper terminal T! /.

Next, a specific procedure of the continuity test for the wiring pattern of the substrate 10 will be described. First, the control unit 22 classifies the wiring patterns provided on the substrate 10 into first to third groups based on the net information stored in the storage unit 21.

[0048] In the first group, wiring patterns that connect only the upper terminals T on the surface 11 side are classified.

Figure 1

In the example shown in Fig. 6, as shown in the table in Fig. 6, the wiring pattern connecting the upper terminal T2 and the upper terminal T3, the wiring pattern connecting the upper terminal T4 and the upper terminal T5, and the wiring pattern connecting the upper terminal T6 and the upper terminal T9. The wiring pattern connecting the upper terminal T7 and the upper terminal T8, and the wiring pattern connecting the upper terminal T11 and the upper terminal T12 are classified into the first group.

[0049] In the second group, wiring patterns that connect only the upper terminals B on the back surface 12 side are classified.

In the example shown in Fig. 1, as shown in the table in Fig. 6, the wiring pattern connecting the lower terminal B1 and the lower terminal B4, the wiring pattern connecting the lower terminal B2 and the lower terminal B3, and connecting the lower terminal B5 and the lower terminal B6. Wiring patterns, wiring patterns connecting lower terminal B7 and lower terminal B8, wiring patterns connecting lower terminal B9 and lower terminal B10, and wiring patterns connecting lower terminal B11 and lower terminal B12 are classified.

[0050] In the third group, the wiring pattern connecting the upper terminal T on the front surface 11 side and the lower terminal B on the rear surface 12 side is classified. However, if there are multiple upper terminal strips classified into this third group in one net, one of these terminals T (here, the smallest of the symbols “符号 1...” Terminal Τ) is representatively classified as the third group for inspection! As for the lower terminal Β, when there are a plurality of lower terminals に classified in this third group in one net, one of these terminals Β (here, the symbol `` Β1 "Smallest!", Terminal Β) is representatively classified as the third group for inspection! In other words, if there are multiple wiring patterns that connect the upper terminal Τ and the lower terminal 内 in one net, the continuity test is performed for only one of the wiring patterns. Thus, the inspection efficiency is improved. [0051] To explain based on a specific example, in the example shown in FIG. 1, the upper terminal T1 and the lower terminal B1 or the lower terminal B4 in the net N1 are used as a wiring pattern for connecting the upper terminal T and the lower terminal B. Wiring pattern connecting the upper terminal T4 or upper terminal T5 and lower terminal B5 or lower terminal B6 in net N3, wiring pattern connecting upper terminal T6 or upper terminal T9 and lower terminal B 7 or lower terminal B8 in net N4 The wiring pattern connecting the upper terminal T10 and the lower terminal B9 or the lower terminal B10 in the net N6 and the wiring pattern connecting the upper terminal T13 and the lower terminal B13 in the net N8 are applicable. However, by sorting as described above, what is finally classified into the third group is the wiring pattern connecting the upper terminal T1 and the lower terminal B1 of the net N1, and the upper terminal T4 of the net N3. Wiring pattern connecting lower terminal B5, wiring pattern connecting net N4 upper terminal T6 and lower terminal B7, wiring pattern connecting net N6 upper terminal T10 and lower terminal B9, and net N8 upper terminal T13 and lower terminal A wiring pattern connecting B13.

[0052] Next, an actual continuity test will be described. First, the continuity test of the wiring patterns classified into the first group and the second group will be described.

[0053] The continuity test of the wiring pattern classified as the first set is performed using the two upper terminals T connected to the first set of wiring patterns, and the wiring pattern classified as the second set. The continuity test is performed using the two lower terminals B to which the second set of wiring patterns are connected. The continuity test for the first set of wiring patterns and the continuity test for the second set of wiring patterns are performed in parallel by performing tests on the wiring patterns belonging to the mutually independent nets. It ’s like that.

For example, in the case of the substrate 10 having the wiring pattern shown in FIG. 1, as shown in FIG. 4, the continuity test of the wiring pattern connecting the upper terminal T4 and the upper terminal T5 classified as the first set is performed at the same time. In the second group, the wiring pattern that does not belong to the network N3 to which the wiring pattern that connects the upper terminal T4 and the upper terminal T5 belongs, for example, the wiring pattern that connects the lower terminal B1 and the lower terminal B4, the lower terminal B9 The continuity test of the wiring pattern connecting the lower terminal B10 (or the wiring pattern connecting the lower terminal B7 and the lower terminal B8) is started.

In this way, at least one wiring pattern (upper terminal T or lower terminal B) that does not belong to the same net N can be selected from the first group and the second group, and the continuity test can be performed at the same time. . For this reason, it becomes possible to shorten the time of a normal continuity test. [0056] Specific examples of the continuity test for the wiring pattern belonging to the first group and the continuity test for the wiring pattern belonging to the second group include those shown in FIG. In the inspection process shown in FIG. 4, the continuity test for the wiring pattern connecting the upper terminals T4 and T5 and the continuity test for the wiring pattern connecting the lower terminals B9 and B10 are simultaneously performed.

More specifically, one contact terminal 32a of the contact 32A corresponding to the upper terminal T4 and one contact terminal 32b of the contact 32B corresponding to the upper terminal T 5 are connected to each other by the first switching unit 28. The current supply unit 24 is connected to the positive and negative current output units, respectively. At the same time, the other contact terminal 32b of the contact 32A and the other contact terminal 32a of the contact 32B are connected to the positive and negative voltage input sections of the first voltage measuring section 26 by the first switching section 28, respectively. Then, in a state where a current is supplied between the upper terminals T4 and T5 by the first current supply unit 24, the voltage between the upper terminals T4 and T5 is measured by the first voltage measurement unit 26.

At the same time, one contact terminal 32a of the contact 32C corresponding to the lower terminal B9 and one contact terminal 32b of the contact 32D corresponding to the lower terminal B10 are connected by the second switching unit 29 to the second. The current supply unit 25 is connected to the positive and negative current output units. At the same time, the other contact terminal 32b of the contact 32D and the other contact terminal 32a of the contact 32D are connected to the positive and negative voltage input sections of the second voltage measurement section 27 by the second switching section 29, respectively. Then, in the state where the current is supplied between the lower terminals B9 and B10 by the second current supply unit 25, the voltage between the lower terminals B9 and B10 is measured by the second voltage measuring unit 27.

[0059] Then, when the continuity inspection for the wiring pattern belonging to the first set for one step (one set for the upper and lower portions) and the continuity inspection for the wiring pattern belonging to the second set are completed, the first and second switching units 28, The combination of contact terminals 32a and 32b corresponding to terminals Τ and B to which the next wiring pattern to be inspected is connected is changed to the first and second current supply units 24, 25, and 29 It is connected to the first and second voltage measuring units 26 and 27.

Next, the continuity test for the third set of wiring patterns will be described. The wiring patterns classified into the third group are all wiring patterns belonging to different nets N. Therefore, even if a plurality of wiring patterns are arbitrarily selected, the selected wiring patterns can be inspected at the same time. I'm getting ready.

A specific example of the continuity test for the wiring patterns belonging to the third group is shown in FIG. 7, for example. In the inspection process shown in FIG. 7, the continuity test for the wiring pattern connecting the terminals T6 and B7 and the continuity test for the wiring pattern connecting the terminals TIO and B10 are simultaneously performed.

More specifically, one contact terminal 32b of the contact 32E corresponding to the upper terminal T6 and one contact terminal 32b of the contact 32F corresponding to the lower terminal B 7 are connected to the first and second switching units 28. , 29 are connected to the positive and negative current output sections of the first current supply section 24, respectively. At the same time, the other contact terminal 32a of the contact 32E and the other contact terminal 32a of the contact 32F are connected to the positive and negative voltage input sections of the first voltage measuring section 26 by the first and second switching sections 28 and 29. Each is connected. Then, with the current supplied between the terminals T6 and B7 by the first current supply unit 24, the voltage between the terminals T6 and B7 is measured by the first voltage measurement unit 26.

At the same time, one contact terminal 32b of the contact 32B corresponding to the upper and lower terminals T10 and one contact terminal 32b of the contact 32D corresponding to the lower terminal B10 are connected to the first and second switching sections 28. , 29 are connected to the positive and negative current output sections of the second current supply section 25, respectively. At the same time, the other contact terminal 32a of the contact 32B and the other contact terminal 32a of the contact 32D are connected to the positive and negative voltage input parts of the second voltage measuring part 27 by the first and second switching parts 28, 29. And connected respectively. Then, in the state where the current is supplied between the terminals TIO and B10 by the second current supply unit 25, the voltage between the terminals TIO and B10 is measured by the second voltage measurement unit 27.

[0064] When the continuity inspection for the wiring pattern belonging to the third set of one process (two nets) is completed, the connection state of the first and second switching units 28 and 29 is switched, and the next inspection target The combination of the contact terminals 32a and 32b corresponding to the terminals Τ and B to which the wiring pattern to be connected is the first and second current supply units 24 and 25, and the first and second voltage measurement units 26 and 27. To be connected.

FIG. 8 is a diagram (table) showing the procedure of continuity inspection for the wiring pattern of the substrate 10 of FIG. Prior to this continuity test, a contact test for confirming the contact state between the contact terminals 32a, 32b of the first and second contact portions 30, 31, and the terminals Τ, B is performed. ing.

[0066] In the first continuity test, a wiring pattern connecting the upper terminal T4 and the upper terminal T5 and a wiring pattern connecting the lower end B9 and the lower terminal B10 are simultaneously tested. In the second continuity test, the wiring pattern connecting the upper terminal T6 and the upper terminal T9 and the wiring pattern connecting the lower terminal B1 and the lower terminal B4 are simultaneously tested.

[0067] In the third continuity test, the wiring pattern due to the lower terminal B remains. Since there is no wiring pattern due to the upper terminal T, the wiring pattern connecting the lower terminal B7 and the lower terminal B8 belonging to different nets N And the inspection of the wiring pattern connecting the lower terminal B5 and the lower terminal B6 are performed at the same time. The above is the inspection for the wiring patterns belonging to the first group and the second group.

Next, inspection for wiring patterns belonging to the third group will be described. Since all of the third set of wiring patterns belong to the independent net N, for example, the first current supply unit 24 and the first voltage are provided for each of the two wiring patterns in the order of identification given to the upper terminals. The set of the measurement unit 26 and the set of the second current supply unit 25 and the second voltage measurement unit 27 are assigned. In the table of FIG. 8, the assignment is performed according to the order of the codes of the upper terminals T, and the inspection of all the wiring patterns is completed at the sixth time.

[0069] FIG. 7 shows the state of the fifth continuity test in FIG. 10, and the inspection of the wiring pattern connecting the upper terminal T6 and the lower terminal B 7, and the upper terminal T10 and the lower terminal B10 are connected. The wiring pattern to be connected is inspected at the same time.

FIG. 9 is a flowchart showing the operation of the substrate inspection apparatus 20. First, the storage unit 21 stores the net information of the board 10 to be inspected.

When the information is stored in the substrate 10 to be inspected, the information in the storage unit 21 is read out by the control unit 22 in order to perform a continuity inspection of the substrate 10 to be inspected (Sl).

[0072] The first and second contact portions 30, 31 having a multi-needle contact 32 so that the substrate to be inspected 10 is actually set in the substrate inspection apparatus 1 and the continuity inspection can be performed, It is pressed against the substrate to be inspected 10 and is brought into contact with the terminals Τ and B. Do not have multi-needle contacts.

When using an inspection tool such as a flying probe, The operation is controlled so that the contact of the ing probe contacts.

[0073] Next, the confirmation inspection of the contact state between the terminals の, B of the set board 10 to be inspected and the contact terminals 32a, 32b of the first and second contact portions 30, 31 is performed as described above. Performed (S2). At this time, if there is a contact failure in any one of the contacts 32, the first and second contact portions 30, 31 are pressed again against the substrate 10 to be inspected, and the contact failure via the output portion 23 is poor. Processing such as display output indicating the presence of a message is performed (S3).

If there is no contact failure as a result of the contact inspection, the control unit 22 classifies the wiring patterns into the first group, the second group, and the third group based on the information stored in the storage unit 21 ( S4). Then, the control unit 22 sets a wiring pattern inspection process for conducting a continuity test in accordance with the classified wiring pattern set. At this time, as described above, at least one wiring pattern of each set is inspected for the first set and the second set of wiring patterns. For this reason, the inspection time can be shortened by the substrate inspection apparatus 1.

[0075] Subsequently, the continuity inspection of the first and second sets of wiring patterns is performed, and if a defect is found, the output unit 23 displays that there is a defect (S8). If no defect is found, A third set of wiring patterns will be inspected (S6).

When the continuity test for the first and second sets of wiring patterns is completed, the continuity test for the third set of wiring patterns is performed (S6). At this time, one third wiring pattern is set for each net, but when the first and second wiring patterns are confirmed to be conductive, this third wiring pattern is used. A net continuity test can be performed simply by performing a continuity test.

[0077] The first and second switching units 28 and 29, the first current supply unit 24, the first voltage measurement unit 26, the second current supply unit 25, and the second voltage included in the substrate inspection apparatus 1 are also provided. Since the measurement unit 27 can be used without separation between the front surface and the back surface of the substrate 10, the inspection time for the continuity inspection of the substrate 10 can be shortened, and the current supply units 24 and 25 and the voltage measurement unit 26 , 27 can be used efficiently for inspection.

[0078] If a defect is found as a result of the continuity test on the third set of wiring patterns, the output unit 23 displays that there is a defect (S8). If no defect is found, the inspected substrate 10 has a poor continuity. If so, it is determined (displayed) as the substrate 10 (S7). As described above, according to the present embodiment, the inspection for the plurality of wiring patterns formed on the substrate 10 is performed on the wiring pattern for connecting the terminals T formed on the surface 11. And an inspection of the wiring pattern connecting the terminals B formed on the back surface 12, and an inspection of the wiring pattern connecting the terminal T formed on the front surface 11 and the terminal B formed on the back surface 12. Therefore, the number of inspections during the continuity inspection of the wiring pattern provided on the substrate 10 can be reduced, and the inspection time can be shortened.

In addition, the inspection for the wiring pattern connecting the terminals T formed on the front surface 11 and the inspection for the wiring pattern connecting the terminals B formed on the back surface 12 are performed in parallel. The inspection time can be further shortened.

[0081] Also, a wiring pattern that connects between the terminals T on the front surface 11 connected by the nets N independent of each other and a wiring pattern that connects between the terminals B on the back surface 12 are selected, and at least the selected wiring pattern is selected. Since the electrical characteristics of two wiring patterns are inspected at the same time,

The interval can be shortened effectively.

[0082] For the wiring patterns belonging to the third group, the continuity test is performed at the same time for every two wiring patterns, so that the test time can be further reduced.

[0083] Further, since the contact 32 that is in contact with one terminal Τ, B is provided with two contact terminals 32a, 32b, one of the contact terminals 32a, 32b is used for current supply, Either one of the contact terminals 32a and 32b can be used for voltage measurement, which effectively affects the effect of contact resistance between contact terminals 32a and 32b and terminals Τ and B during voltage measurement. The voltage applied between terminals 端子 and B can be accurately measured. As a result, electrical characteristics such as the resistance value between terminals 等 and B can be accurately measured, and the reliability of the continuity test can be improved.

[0084] Prior to the continuity test between the terminals Τ and B, the two contact terminals 32a and 32b are connected to each other based on the continuity between the two contact terminals 32a and 32b in contact with the same terminal Τ and B. Since the contact state with the terminals T and B is determined, it is possible to prevent an error in the continuity test between the terminals Τ and B due to poor contact between the contact terminals 32a and 32b and the terminals Τ and B.

In the above-described embodiment, two sets of current supply units 24 and 25 and voltage measurement units 26 and 27 are connected to the contact units 30 and 31 via the switching units 28 and 29. More than set power The flow supply unit and the voltage measurement unit may be connected to the contact units 30 and 31 via the switching units 28 and 29.

[0086] Further, in the above-described embodiment, the force using the contact portions 30, 31 having the multi-needle contact 32 is movable in the X, y, and z directions, and can be rotated about the z axis. A plurality of (for example, two) probes may be provided on the front surface 11 side and the back surface 12 side of the substrate 10.

[0087] Further, in the above-described embodiment, the contact 32 that is in contact with each of the terminals Τ and B may be configured to include two contact terminals 32a and 32b. The contactor 32 may include a single contact terminal. Good. In this case, the current supply unit and the voltage measurement unit are commonly connected to one contact terminal for each of the positive electrode side and the negative electrode side.

Brief Description of Drawings

FIG. 1 is a diagram schematically showing an example of a substrate to which a substrate inspection method according to an embodiment of the present invention is applied.

FIG. 2 is a block diagram of a substrate inspection apparatus used in a substrate inspection method according to an embodiment of the present invention.

3 is a diagram showing a configuration of first and second substrate contact portions and the like of the substrate inspection apparatus of FIG.

FIG. 4 is an explanatory diagram relating to a continuity test.

FIG. 5 is an explanatory diagram regarding contact inspection.

FIG. 6 is a diagram showing a result of classifying the wiring pattern of the substrate of FIG.

FIG. 7 is an explanatory diagram relating to a continuity test.

FIG. 8 is a diagram showing a procedure of continuity inspection for the wiring pattern of the substrate in FIG. 1.

FIG. 9 is a flowchart showing the operation of the substrate processing apparatus of FIG.

Explanation of symbols

[0089] 10 substrate, 11 one surface (front surface), 12 other surface (back surface), 20 substrate processing device, 21 storage unit, 22 control unit, 23 output unit, 24 first current supply unit, 25 second current supply unit 2 6 1st voltage measuring part, 27 2nd voltage measuring part, 28 1st switching part, 28a switch, 29 2nd switching part, 29a switch, 30 1st contact part, 31 2nd contact part,

32 contact, 32a, 32b contact terminal, 33 jig, B lower terminal, N net, T upper terminal.

Claims

The scope of the claims

[1] A board inspection method for inspecting electrical characteristics of a board on which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals. There,

The plurality of wiring patterns are formed on the one surface, a wiring pattern group connecting the terminals formed on the one surface, a wiring pattern group connecting the terminals formed on the other surface, and the one surface. The wiring pattern group connecting the terminal and the terminal formed on the other surface,

A first inspection process for inspecting a wiring pattern connecting the terminals formed on the one surface;

A second inspection process for inspecting a wiring pattern connecting the terminals formed on the other surface;

A third inspection process for inspecting a wiring pattern for connecting the terminal formed on the one surface and the terminal formed on the other surface;

A substrate inspection method characterized by:

[2] In the substrate inspection method according to claim 1,

The wiring pattern that is the target of the first inspection process belongs to a different net from the wiring pattern that is the target of the second inspection process.

A substrate inspection method, wherein the first inspection process and the second inspection process are performed in parallel.

[3] In the substrate inspection method according to claim 1 or claim 2,

In the third inspection process, a plurality of combinations of the terminal on the one surface and the terminal on the other surface connected by different nets are electrically connected to the wiring pattern connecting the terminals. A substrate inspection method characterized by including a step of simultaneously inspecting characteristics.

[4] The method for inspecting a substrate according to any one of claims 1 and 3 and claim 3!

In the first inspection process, the second inspection process and the third inspection process, two contact terminals provided so as to be able to contact one terminal at the same time are to be inspected. Measuring the voltage between the terminals through the other contact terminal while contacting each of the terminals and supplying a current between the terminals through one of the two contact terminals. A substrate inspection method comprising: inspecting electrical characteristics of the wiring patterns connecting the terminals.

[5] In the substrate inspection method according to claim 4,

Prior to the inspection of the electrical characteristics between the terminals, the contact state of the two contact terminals with the terminal is determined based on the conduction state between the two contact terminals in contact with the same terminal. Substrate inspection method.

[6] A board inspection apparatus for inspecting electrical characteristics of a board on which a plurality of nets are formed by a plurality of terminals formed on one surface and the other surface and a plurality of wiring patterns connecting the terminals. There,

A storage unit for storing net information related to the net provided on the substrate, and a plurality of contacts to be brought into contact with the terminals to be inspected, and inspecting electrical characteristics between the terminals via the contacts At least two inspection means;

A control unit for controlling the order of the terminals to be inspected by the at least two inspection units based on the net information stored in the storage unit;

With

The controller is

A plurality of wiring patterns, a first set for connecting the terminals formed on the one surface, and a second set for connecting the terminals formed on the other surface; The terminal formed on the one surface and the terminal formed on the other surface are classified into a third set that should be connected, and the order of inspection of the terminals is determined based on the classification result. A substrate inspection apparatus characterized by controlling.