CN112969925A - Inspection instruction information generating device, substrate inspection system, inspection instruction information generating method, and inspection instruction information generating program - Google Patents

Abstract

The examination instruction information generating apparatus 1 includes: a storage unit 34 that stores conductive structure information D1, the conductive structure information D1 indicating how conductive portions P, wires W, and through holes V of a substrate B having a pair of front and back substrate surfaces F1 and F2 on which a plurality of conductive portions P are provided, a wiring layer L that is a layer stacked between the substrate surfaces F1 and F2, and through holes V that connect the wires of the wiring layer L and the plurality of conductive portions P are electrically connected; and an inspection instruction information generating section 33 that performs an inspection instruction information generating process of combining two of the plurality of conductive sections P in pairs with each other so that the conductive sections P formed on the same substrate surface are paired with each other based on the conductive structure information D1, and generating information indicating the combined pair of conductive sections P as inspection instruction information D2.

Description

Inspection instruction information generating device, substrate inspection system, inspection instruction information generating method, and inspection instruction information generating program

Technical Field

The present invention relates to an inspection instruction information generating device that generates inspection instruction information for instructing an inspection portion when a substrate is inspected, a substrate inspection system that performs an inspection using the inspection instruction information, an inspection instruction information generating method, and an inspection instruction information generating program.

Background

From the past, the following inspection apparatuses have been known: a resistance measurement of a through hole (through hole) provided in a substrate is performed by bringing probes into contact with one end and the other end of the through hole across the front and back of the substrate, respectively (for example, see patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. Hei 09-043295

Disclosure of Invention

However, in order to measure the voltage between the front and back surfaces of the substrate as in the inspection apparatus, it is necessary to pull a wire for connecting the probe to the voltmeter across the front and back surfaces of the substrate. Therefore, a loop of the measurement wiring becomes large, noise is easily picked up, and as a result, resistance measurement accuracy may be lowered. Further, if the probes are brought into contact with the front and back surfaces of the substrate across the front and back surfaces of the substrate, a difference occurs in the influence of external noise between the two surfaces of the substrate, and noise is superimposed on the detection voltage of the probes, which may reduce the resistance measurement accuracy.

The present invention provides an inspection instruction information generating device for generating inspection instruction information indicating an inspection site where resistance measurement accuracy of a through hole is easily improved, a substrate inspection system including the inspection instruction information generating device, an inspection instruction information generating method, and an inspection instruction information generating program.

An inspection instruction information generating device according to an example of the present invention is an inspection instruction information generating device for inspecting a substrate having a pair of front and back substrate surfaces provided with a plurality of conductive portions, a wiring layer which is a layer laminated between the pair of substrate surfaces, and a through hole for connecting a wiring of the wiring layer and the conductive portion, the inspection instruction information generating device including: a storage unit that stores conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are conductively connected; and an inspection instruction information generation unit that performs an inspection instruction information generation process of pairwise combining the conductive portions formed on the same substrate surface with each other based on the conductive structure information, and generates information indicating the combined pair of conductive portions as inspection instruction information.

An inspection instruction information generating method according to an example of the present invention is an inspection instruction information generating method for inspecting a substrate including a front and back pair of substrate surfaces on which a plurality of conductive portions are provided, a wiring layer which is a layer laminated between the pair of substrate surfaces, and a through hole which connects a wiring of the wiring layer and the conductive portion, the inspection instruction information generating method executing an inspection instruction information generating process which combines the conductive portions in pairs with each other in the conductive portions formed on the same substrate surface based on conductive structure information indicating how the conductive portions, the wiring, and the through hole of the substrate are conductively connected, and generates information indicating the pair of conductive portions after the combination as inspection instruction information.

An inspection instruction information generating program according to an example of the present invention is an inspection instruction information generating program for inspecting a substrate including a front and back pair of substrate surfaces provided with a plurality of conductive portions, a wiring layer which is a layer laminated between the pair of substrate surfaces, and a through hole which connects a wiring of the wiring layer and the conductive portion, the inspection instruction information generating program causing a computer to execute an inspection instruction information generating process of combining two conductive portions in pairs with each other at the conductive portions formed on the same substrate surface based on conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are electrically connected, and generating information indicating a pair of conductive portions of the combination as inspection instruction information.

Further, a substrate inspection system of the present invention includes: the inspection instruction information generating means; and a substrate inspection device that performs inspection of the through-hole based on the inspection instruction information generated by the inspection instruction information generation device.

Drawings

Fig. 1 is a schematic view conceptually showing a configuration of a substrate inspection system according to an embodiment of the present invention.

Fig. 2 is a block diagram showing an example of an electrical configuration of the measurement unit shown in fig. 1.

Fig. 3 is a cross-sectional view showing an example of a substrate to be inspected.

Fig. 4 is a plan view showing an example of a substrate to be inspected.

Fig. 5 is a diagram illustrating an example of simplified conductive structure information.

Fig. 6 is a diagram illustrating an example of tree-structured conductive structure information.

Fig. 7 is a flowchart showing an example of the operation of the inspection instruction information generation method and the inspection instruction information generation device.

Fig. 8 is a flowchart showing an example of the operation of the inspection instruction information generation method and the inspection instruction information generation device.

Fig. 9 is an explanatory diagram of the search processing.

Fig. 10 is a modification of fig. 7.

Fig. 11 is a modification of fig. 8.

Fig. 12 is a modification of step S5a in fig. 10.

Fig. 13 is a modification of step S12a in fig. 11.

Fig. 14 is an explanatory diagram of the inspection instruction information.

Fig. 15 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in fig. 1.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals are given to the same components, and the description thereof will be omitted. The substrate inspection system 1 shown in fig. 1 includes an inspection instruction information generation device 3 and a substrate inspection device 2.

The inspection instruction information generation device 3 shown in fig. 1 includes a simplification processing section 31, a tree structure data conversion section 32, an inspection instruction information generation section 33, and a storage section 34. The examination instruction information generating apparatus 3 is configured using a computer such as a personal computer, for example, and includes: a Central Processing Unit (CPU) that executes predetermined arithmetic Processing, a Random Access Memory (RAM) that temporarily stores data, a Hard Disk Drive (HDD) and/or a nonvolatile storage device such as a flash Memory, a communication circuit, and peripheral circuits thereof.

The inspection instruction information generation device 3 functions as the simplification processing unit 31, the tree structure data conversion unit 32, and the inspection instruction information generation unit 33 by executing an inspection instruction information generation program according to an embodiment of the present invention, which is stored in a nonvolatile storage device, for example. The storage unit 34 is configured using the nonvolatile storage device, for example.

The conductive structure information D1 is stored in the storage portion 34. The transmitted conductive structure information D1 may be stored in the storage unit 34 by transmitting the conductive structure information D1 from the outside to the check instruction information generation device 3 via, for example, a communication circuit not shown, or the conductive structure information D1 may be stored in the storage unit 34 by reading the conductive structure information D1 that is already stored in a storage medium such as a Universal Serial Bus (USB) memory by the check instruction information generation device 3, and the conductive structure information D1 may be stored in the storage unit 34 by various methods.

The conductive structure information D1 is information indicating how the conductive portion P of the substrate B, the wiring W or the planar conductor IP of each wiring layer L, and the through hole V are electrically connected, which will be described later. As the conductive structure information D1, for example, so-called guerber data (gerber data) used in the manufacture of the substrate, a netlist (netlist), or the like can be used.

The simplification processing section 31 simplifies the wiring and the via connected in parallel based on the conductive structure information D1, and generates simplified conductive structure information D1'. The simplified conductive structure information D1' corresponds to an example of the conductive structure information.

The tree structure data conversion unit 32 converts the simplified conductive structure information D1' into a tree structure data structure by associating the through hole V with a node, associating the wire W with a branch, and associating the planar conductor IP with a root node, thereby generating tree structure conductive structure information D1 ″. The tree-like structure conductive structure information D1 ″ corresponds to an example of the conductive structure information.

The inspection instruction information generation section 33 generates inspection instruction information D2 for the substrate inspection apparatus 2 based on the conductive structure information D1(D1', D1 "), the inspection instruction information D2 indicating a pair of conductive parts P into which a current should flow for inspection. The inspection instruction information generating unit 33 may transmit the inspection instruction information D2 to the board inspection apparatus 2 via a communication circuit, which is not shown, for example. Alternatively, the examination instruction information generating unit 33 may write the examination instruction information D2 in the storage medium. The user may cause the board inspection apparatus 2 to read the inspection instruction information D2 from the storage medium. The operation of the inspection instruction information generating unit 33 will be described later in detail.

The substrate inspection apparatus 2 shown in fig. 1 is an apparatus for inspecting a substrate B of an inspected substrate as an inspection object.

The substrate B may be, for example, an intermediate substrate or a multilayer substrate, or may be a printed wiring board, a film carrier (film carrier), a flexible substrate, a ceramic multilayer wiring board, a semiconductor substrate such as a semiconductor chip or a semiconductor wafer, a package substrate for semiconductor packaging, an electrode plate for liquid crystal display or plasma display, an intermediate substrate in a process for producing these substrates, or a so-called carrier substrate.

The substrate inspection apparatus 2 shown in fig. 1 has a frame 112. The substrate fixing device 110, the measuring unit 121, the measuring unit 122, the moving mechanism 125, and the control unit 20 are mainly provided in the internal space of the housing 112. The substrate fixing device 110 is configured to fix the substrate B at a predetermined position.

The measuring part 121 is positioned above the substrate B fixed to the substrate fixing device 110. The measuring part 122 is located below the substrate B fixed to the substrate fixing device 110. The measurement units 121 and 122 include measurement jigs 4U and 4L for bringing probes into contact with a plurality of conductive portions provided on the substrate B.

A plurality of probes Pr are mounted on the measuring jig 4U and the measuring jig 4L. The measurement jig 4U and the measurement jig 4L are arranged and hold a plurality of probes Pr so as to correspond to the arrangement of the conductive portions to be measured provided on the surface of the substrate B. The moving mechanism 125 moves the measurement unit 121 and the measurement unit 122 appropriately within the housing 112 in accordance with a control signal from the control unit 20, and brings the probes Pr of the measurement jig 4U and the measurement jig 4L into contact with the conductive portions of the substrate B.

The substrate inspection apparatus 2 may include only one of the measurement unit 121 and the measurement unit 122, and the substrate B may have a conductive portion on only one surface. The substrate inspection apparatus 2 may be configured to perform measurement of both surfaces of the substrate to be inspected by either of the measurement units by inverting the front and back of the substrate.

The control unit 20 is configured to include, for example, the following components: a cpu (central Processing unit) that executes predetermined arithmetic Processing, a ram (random Access Memory) that temporarily stores data, a non-volatile storage unit 22 such as a Read Only Memory (ROM) that stores a predetermined control program, an hdd (hard Disk drive), and peripheral circuits thereof. The control unit 20 functions as an inspection processing unit 21 by executing a control program stored in the storage unit 22, for example.

The measurement portion 121 shown in fig. 2 includes: a scanner section 13, a plurality of measurement blocks 12, and a plurality of probes Pr. Since the measurement unit 122 is configured similarly to the measurement unit 121, its description will be omitted.

The measurement block 12 includes a power supply section CS, a power supply section CM, and a voltage detection section VM. The power supply section CS and the power supply section CM are constant current circuits that output a current I corresponding to a control signal from the control section 20. The power supply section CS causes the current I to flow in a direction of supply to the scanner section 13, and the power supply section CM causes the current I to flow in a direction of introduction from the scanner section 13. The voltage detection unit VM is a voltage detection circuit that measures a voltage and transmits the voltage value to the control unit 20.

The measurement block 12 does not necessarily need to include both the power supply section CS and the power supply section CM. The measurement block 12 may include only one of the power supply unit CS and the power supply unit CM.

The scanner unit 13 is a switching circuit configured by using a switching element such as a transistor or a relay switch. The scanner unit 13 corresponds to the plurality of measurement blocks 12, and includes a plurality of current terminals + F and-F for supplying a current I for resistance measurement to the substrate B, and a voltage detection terminal + S and a voltage detection terminal-S for detecting a voltage generated between the conductive portions of the substrate B by the current I. In addition, a plurality of probes Pr are electrically connected to the scanner unit 13. The scanner unit 13 switches the connection relationship between the current terminal + F, the current terminal-F, the voltage detection terminal + S, the voltage detection terminal-S, and the plurality of probes Pr in response to a control signal from the control unit 20.

One end of the output terminal of the power supply unit CS is connected to a circuit ground (circuit ground), and the other end is connected to the current terminal + F. One end of the output terminal of the power supply section CM is connected to the circuit ground, and the other end is connected to the current terminal-F. One end of the voltage detection unit VM is connected to the voltage detection terminal + S, and the other end is connected to the voltage detection terminal-S.

The scanner unit 13 is capable of connecting the current terminal + F, the current terminal-F, the voltage detection terminal + S, and the voltage detection terminal-S to any probe Pr in an electrically conductive manner in response to a control signal from the control unit 20. Thus, the scanner unit 13 can cause a current I to flow between any of the conductive portions with which the probe Pr is in contact in response to a control signal from the control unit 20, and can measure a voltage V generated between the conductive portions by the voltage detection unit VM.

Since the plurality of measurement blocks 12 are provided, current supply and voltage measurement can be simultaneously performed between the plurality of conductive portions.

The power supply unit CS and the power supply unit CM are not limited to the example in which one end of the power supply unit CS and the power supply unit CM is connected to the circuit ground, as long as the current I can flow into the substrate B through the scanner unit 13. For example, one end of the power supply section CS may be connected to one end of the power supply section CM to form a current loop (current loop).

Thus, the control unit 20 outputs a control signal to the scanner unit 13, thereby causing the plurality of power supply units CS and CM to flow a current I between the plurality of pairs of probes Pr, and causing the plurality of voltage detection units VM to detect a voltage between the plurality of pairs of probes Pr.

The measurement block 12 is not necessarily limited to the example in which a plurality of blocks are provided. The current supply and the voltage measurement may be performed sequentially between the plurality of conductive parts by one measurement block 12.

Fig. 3 is a cross-sectional view of the substrate B and an explanatory diagram illustrating the conductive structure information D1 of the substrate B. The conductive structure information D1 is not necessarily data represented by an image, but in the following description, the structure represented by the conductive structure information D1 is shown and described with the use of drawings for easy understanding.

The substrate B shown in fig. 3 is a multilayer substrate in which five substrates B1 to B5 are stacked. One surface of the substrate B is a substrate surface F1, and the other surface is a substrate surface F2. A wiring layer L1 is provided between the substrate B1 and the substrate B2, a wiring layer L2 is provided between the substrate B2 and the substrate B3, a wiring layer Lc is provided between the substrate B3 and the substrate B4, and a wiring layer L4 is provided between the substrate B4 and the substrate B5.

Conductive portions P1 to P7 are provided on substrate surface F1, and conductive portions P11 to P17 are provided on substrate surface F2. The conductive portions P1 to P7 and the conductive portions P11 to P17 serve as inspection points against which the probes Pr abut, such as pads, bumps, wirings, and electrodes.

The wiring layer Lc is provided with a planar conductor IP, which is a conductor extending in a planar or mesh shape, as an example of wiring. The wiring layer L1 is provided with a wiring W11 and a wiring W12, the wiring layer L2 is provided with a wiring W21 and a wiring W22, and the wiring layer L4 is provided with a wiring W41, a wiring W42, a wiring W43, a wiring W44 and a wiring W45. The planar conductor IP may be a conductor that is spread into a sheet shape, i.e., a planar shape, or may be a conductor having the following shape: conductor patterns such as wiring are combined into a regular or irregular net shape (mesh shape) and spread in a planar shape as a whole in the same layer.

In fig. 3, the planar conductor IP is shown as extending over substantially the entire area of the substrate B, but the planar conductor IP is not necessarily limited to extending over substantially the entire area of the substrate B. The planar conductor IP may be provided only in a partial region of the substrate B. For example, the wiring W may be provided in a region of the wiring layer Lc where the planar conductor IP of the substrate B is not provided.

The substrate B shown in fig. 4 includes a planar conductor IPa and a planar conductor IPd electrically separated from each other. The planar conductor IPa can be used as an analog ground (analog ground), for example, and the planar conductor IPd can be used as a digital ground (digital ground), for example. As shown in fig. 4, the substrate B may include a plurality of planar conductors IP insulated from each other.

The wires W41, W42, and W43 are one wire in which the wire W41, the wire W42, and the wire W43 of the wiring layer L4 are connected, but for convenience of description, the portions of the one wire W41, W42, and W43 are referred to as the wire W41, the wire W42, and the wire W43. Similarly, the wires W44 and W45 are one wire in which the wire W44 is connected to the wire W45, and the wire W44 and the wire W45 are part of the wires W44 and W45, respectively.

Further, substrate B is provided with through holes V11 to V17 penetrating substrate B1, through holes V21 to V27 penetrating substrate B2, through holes V31 to V36 penetrating substrate B3, through holes V41 to V45 penetrating substrate B4, and through holes V51 to V57 penetrating substrate B5.

The conductive structure information D1 stored in the storage unit 22 includes information indicating how the conductive portions P1 to P7, the conductive portions P11 to P17, the wiring W11, the wiring W12, the wiring W21, the wiring W22, the wiring W41 to W45, the through holes V11 to V17, the through holes V21 to V27, the through holes V31 to V36, the through holes V41 to V45, the through holes V51 to V57, and the planar conductor IP are electrically connected, for example, information indicating the connection relationship illustrated in fig. 3.

Hereinafter, the conductive portions such as the conductive portion P1 to the conductive portion P7, and the conductive portion P11 to the conductive portion P17 are collectively referred to as conductive portions P, the wires such as the wire W11, the wire W12, the wire W21, the wire W22, and the wire W41 to the wire W45 are collectively referred to as wires W, the wires such as the through holes V11 to V17, the through holes V21 to V27, the through holes V31 to V36, the through holes V41 to V45, the through holes V51 to V57 are collectively referred to as through holes V, and the wire layers L1, L2, Lc, and L4 are collectively referred to as wire layers L.

The conductive structure information D1 further includes information indicating the thickness, width, length, and resistivity of each wire W, each through hole V, and each planar conductor IP, and/or information indicating the resistance value of each through hole V and the sheet resistance value of each wire W and each planar conductor IP. Thus, the inspection instruction information generating unit 33 can calculate the resistance value of an arbitrary conductive path based on the conductive structure information D1.

Also, the data form of the conductive structure information D1 can take various forms. The conductive structure information D1 may be, for example, a single data archive, may be constituted by a plurality of data archives, and may be a data structure having no archive form.

Each conductive portion P is conductively connected to the planar conductor IP via the through hole V and the wire W. In this way, the wiring structure in which the conductive portions P are conductively connected to the planar conductor IP is generally used for connection purposes of circuit grounding or power mode. The substrate B may include a wiring or a pad not connected to the circuit ground or the power supply mode.

When the substrate B is mounted on the substrate fixing apparatus 110, the moving mechanism 125 brings the probes Pr of the measuring unit 121 into contact with the conductive portions P1 to P7, and brings the probes Pr of the measuring unit 122 into contact with the conductive portions P11 to P17. Thus, measuring unit 121 and measuring unit 122 can cause current I to flow between any pair of conductive parts P, and can detect the voltage between the pair of conductive parts P.

The measurement units 121 and 122 may have a probe Pr for current supply and a probe Pr for voltage measurement in contact with one conductive part P for resistance measurement by a so-called four-terminal resistance measurement method, or may have a probe Pr for current supply and a probe Pr for voltage measurement in contact with one conductive part P for resistance measurement by a so-called two-terminal resistance measurement method.

The inspection processing unit 21 controls the measurement unit 121 and the measurement unit 122 to supply a current I from the power supply unit CS (see fig. 2) to one of the pair of conductive parts P selected as described later and to extract the current I from the other conductive part P through the power supply unit CM (see fig. 2), thereby supplying the current I between the conductive parts P, detecting a voltage between the conductive parts P, and inspecting the substrate B based on the current and the voltage. The inspection processing unit 21 may measure the resistance by a four-terminal resistance measurement method or a two-terminal resistance measurement method based on the current and the voltage, and inspect the substrate B based on the resistance value.

Hereinafter, the case where the inspection processing unit 21 performs current supply and voltage detection by controlling the measurement unit 121 and the measurement unit 122 will be described only as if the inspection processing unit 21 supplies current and detects voltage. The operation of the inspection processing unit 21 will be described later in detail.

Next, the operation of the inspection instruction information generation device 3 will be described. The case where the inspection instruction information corresponding to the substrate B shown in fig. 3 is generated will be described as an example. The operation of the inspection instruction information generating device 3 that executes the inspection instruction information generating method according to the inspection instruction information generating program according to the embodiment of the present invention will be described below with reference to fig. 5 to 8.

In the following flowcharts, the same steps are assigned to the same processes, and the description thereof will be omitted.

First, the simplification processing section 31 executes, as preprocessing, processing for simplifying the connection structure indicated by the conductive structure information D1. Specifically, when the wires W of the plurality of wiring layers L are connected in parallel, the simplified processing unit 31 generates the simplified conductive structure information D1' by copying and changing the conductive structure information D1 so that one wire W is replaced with the parallel-connected wire W (step S1: simplified processing).

Specifically, in the conductive structure information D1 shown in fig. 3, the plurality of wiring layers L1, the wiring W11 of the wiring layer L2, and the wiring W21 are connected in parallel through the via hole V21 and the via hole V22. In this case, as shown in fig. 5, the two wires W11 and W21 are replaced with, for example, one wire W11 closest to the substrate surface F1 out of the wires W11 and W21, and the simplified conductive structure information D1' is generated with respect to the conductive structure information D1. At this time, one end of the via V22 becomes open, and therefore, it can also be considered that there is no processing of the via V22 in terms of data. This simplifies the wiring structure of the substrate B, and facilitates subsequent processing.

Then, when the line W and the planar conductor IP connect the via V or the row of the vias V in parallel, the simplified processing unit 31 changes the simplified conductive structure information D1 so that the parallel connected via V or the row of the vias V is replaced with one via or one row of vias (step S2: simplified processing).

Specifically, in the conductive structure information D1 shown in fig. 3, the via V24 and the via V33 are connected in series to form a column, and the via V25 and the via V34 are connected in series to form a column. The row of the through holes V24 and V33 and the row of the through holes V25 and V34 are connected in parallel by the wiring W12 and the planar conductor IP. The wiring W22 connects the planar conductor IP to the through hole V32 and the through hole V33 in parallel.

In this case, for example, as shown in fig. 5, for the simplified conductive structure information D1', the column of the via V24, the via V33 and the column of the via V25, the via V34 are replaced with any one column, for example, the column of the via V24, the via V33, and the via V32 and the via V33 are replaced with one via V, for example, the via V32.

In the conductive structure information D1 shown in fig. 3, the through hole V41 and the through hole V42 are connected in parallel by the planar conductor IP and a series connection of the wire W41, the wire W42, and the wire W43. In this case, for example, as shown in fig. 5, in the simplified conductive structure information D1', the via V41, the via V42 are replaced with one via V, for example, with a via V41. In the conductive structure information D1 shown in fig. 3, the via V43, the via V44, and the via V45 are connected in parallel by the wire W44, the wire W45, and the planar conductor IP. In this case, for example, as shown in fig. 5, in the simplified conductive structure information D1', the via V43, the via V44, and the via V45 are replaced with one via V, for example, with a via V44. This simplifies the wiring structure of the substrate B, and facilitates subsequent processing.

Note that the simplified processing unit 31 does not necessarily have to be provided, and instead of performing step S1 or step S2, the simplified conductive structure information D1' may be replaced with conductive structure information D1 in the form of data indicating the actual wiring structure of the substrate B shown in fig. 3 in the subsequent processing.

Then, the tree structure data converting section 32 converts the data structure of the simplified conductive structure information D1' into a tree structure (step S3). The simplified conductive structure information D1' that has been converted into a tree structure is referred to as tree structure conductive structure information D1 ". As shown in fig. 6, in the tree-like structure conductive structure information D1 ″, one wire W is expressed by one node N, the planar conductor IP is expressed by the root node NR, and the through hole V is expressed as a branch M connecting the conductive portion P and the node, or a branch M connecting the nodes.

Further, the tree structure data conversion unit 32 is not necessarily required, and the subsequent processing may be executed using the conductive structure information D1 or the simplified conductive structure information D1' in the data format indicating the wiring structure of the substrate B without executing the step S3. In the following description, the processing for the node N is the same as the processing for the wiring W corresponding to the node N, the processing for the root node NR is the same as the processing for the planar conductor IP, and the processing for the branch M is the same as the processing for the wiring W corresponding to the node N.

In the example of the tree-structured conductive structure information D1 ″ of the tree structure shown in fig. 6, the node N11 corresponds to the wiring W11(W21), the node N12 corresponds to the wiring W12, the node N21 corresponds to the wiring W22, the node N41 corresponds to the wiring W41, the wiring W42, and the wiring W43, and the node N42 corresponds to the wiring W44 and the wiring W45. In addition, branch M11 corresponds to through hole V11(V21), branch M12 corresponds to through hole V12(V22), branch M22 corresponds to through hole V22 (V22), branch Mr 22 corresponds to through hole V22 (V22), branch Mr 22 corresponds to through hole V22, branch M22 corresponds to through hole V22, branch M22 corresponds to through hole V22, branch 22 (V36.

Then, the inspection instruction information generating unit 33 calculates the resistance value between the pair of conductive portions P based on the conductive structure information D1 for all combinations in which the conductive portions P on the substrate surface F1, that is, the conductive portions P formed on the same substrate surface are paired (step S4). In step S4, the resistance value between the pair of conductive parts P can be calculated for all combinations of all the conductive parts P of the substrate B, and the calculated value is used in step S11 described later.

In addition, the resistance value between the pair of conductive portions P may not be calculated for all combinations in which the conductive portions P are paired with each other. For example, the resistance value may be calculated for a combination in which the distance between the pair of conductive portions P is equal to or less than a predetermined distance. By reducing the combination of the calculated resistance values, an effect of shortening the processing time is obtained.

Then, the inspection instruction information generating unit 33 selects the pair of conductive portions so that the conductive portions P do not overlap in order from the combination of the small calculated resistance values obtained in step S4, and records the selected pair of conductive portions in the inspection instruction information (step S5: inspection instruction information generating processing). Hereinafter, the resistance between the conductive portion P1 and the conductive portion P2 is referred to as R (P1, P2), and the resistance between the conductive portion P3 and the conductive portion P4 is referred to as R (P3, P4).

For example, in the conductive structure information D1 shown in fig. 3, when the resistance values become larger in the order of R (P1, P2), R (P4, P5), and R (P6, P7), each pair of the conductive portions P1, P2, P4, P5, and P6, P7 is selected and recorded in the inspection instruction information.

Then, when the number of the conductive portions P on the substrate surface F1 is odd, the inspection instruction information generating unit 33 selects a conductive portion pair having the smallest resistance value among the combinations including the conductive portions P remaining last, and additionally records the selected pair in the inspection instruction information (step S6).

In the conductive structure information D1 shown in fig. 3, since the conductive portion P3 remains last, the conductive portion P3 and the conductive portion P4, for example, are selected as the pair of conductive portions having the smallest resistance value among the combinations including the conductive portion P3, and are additionally recorded in the inspection instruction information.

Then, the inspection instruction information generating unit 33 calculates the resistance value between the pair of conductive portions P based on the conductive structure information D1 for all combinations in which the conductive portions P on the substrate surface F2, that is, the conductive portions P formed on the same substrate surface are paired (step S11).

Then, the inspection instruction information generating unit 33 selects the pair of conductive portions so that the conductive portions P do not overlap in order from the combination of the small calculated resistance values obtained in step S11, and records the selected pair of conductive portions in the inspection instruction information (step S12: inspection instruction information generating processing).

For example, in the conductive structure information D1 shown in fig. 3, when the resistance values become larger in the order of R (P11, P12), R (P13, P14), and R (P15, P16), each pair of the conductive portions P11, P12, P13, P14, and P15, P16 is selected and recorded in the inspection instruction information.

Then, when the number of the conductive portions P on the substrate surface F2 is odd, the inspection instruction information generating unit 33 selects a conductive portion pair having the smallest resistance value among the combinations including the conductive portions P remaining last, and additionally records the selected pair in the inspection instruction information (step S13).

In the conductive structure information D1 shown in fig. 3, since the conductive portion P17 remains last, the conductive portion P16 and the conductive portion P17, for example, are selected as the pair of conductive portions having the smallest resistance value among the combinations including the conductive portion P17, and are additionally recorded in the inspection instruction information.

Then, the inspection instruction information generation section 33 searches for a detection leakage via which is not located on the conductive path from one conductive part P to the other conductive part P of each conductive part pair selected in step S5, step S6, step S12, step S13, based on the tree-structured conductive structure information D1 ″ of the tree structure (step S14: search processing).

Referring to fig. 9, conductive paths a1 to a4 from one conductive portion P to the other conductive portion P among conductive portions P1 and P2, conductive portion P4 and P5, conductive portion P6 and P7, and conductive portions P3 and P4, and conductive paths b1 to b4 from one conductive portion P to the other conductive portion P among conductive portions P11 and P12, conductive portion P13 and P14, conductive portion P15 and P16, and conductive portion P16 and P17 are not included in branch Mr1, branch Mr2, branch Mr5, and branch Mr 6.

Therefore, the branch Mr1, the branch Mr2, the branch Mr5, and the branch Mr6, i.e., the through hole V31, the through hole V32, the through hole V41(V42), and the through hole V43(V44, V45) are checked as the detection leak through holes by the inspection instruction information generating section 33.

Then, the inspection instruction information generating unit 33 selects the pair of conductive parts included in the conductive path and detected leakage via searched in step S14 in the order of combination of smaller resistance values, preferentially on the same substrate plane, and records the selected pair of conductive parts in the inspection instruction information (step S15: conductive part addition processing).

Specifically, the inspection instruction information generating unit 33 first searches for a pair of conductive portions including a detection leakage via in a conductive path in the same substrate plane, and if the pair of conductive portions is not found in the same substrate plane, searches across both substrate surfaces, thereby giving priority to the same substrate plane.

For example, in the case of selecting a conductive part pair including the branch Mr1, that is, the through hole V31, in the conductive path, the inspection instruction information generation part 33 first selects the conductive part pair by preferentially selecting the conductive parts P1 to P7 on the substrate face F1, based on the tree structure conductive structure information D1 "shown in fig. 9.

Specifically, a conductive portion pair in which one of the conductive portion P1 and the conductive portion P2 is used and the other of the conductive portion P3 to the conductive portion P7 is used is selected as a candidate of a conductive portion pair including the branch Mr1 in the conductive path. Then, the inspection instruction information generating unit 33 selects a conductive portion pair having the smallest resistance value, for example, the conductive portion P1 and the conductive portion P6, from among the conductive portion pairs selected as candidates, and records the selected conductive portion pair in the inspection instruction information. Similarly, as the pair of conductive portions including the branch Mr2 in the conductive path, for example, the conductive portion P3 and the conductive portion P6 are selected.

Then, as a conductive part pair including branch Mr5 and branch Mr6 in the conductive path, conductive part P11 to conductive part P17 on substrate surface F2 are preferentially selected from conductive parts P14 and conductive parts P15, for example, and recorded in the inspection instruction information.

Thus, since the branch Mr1 is included in the conductive path c1 between the conductive portion P1 and the conductive portion P6, the branch Mr2 is included in the conductive path c2 between the conductive portion P3 and the conductive portion P6, and the branch Mr5 and the branch Mr6 are included in the conductive path d1 between the conductive portion P14 and the conductive portion P15, the board inspection apparatus 2 described later performs inspection based on the inspection instruction information thus obtained, and thus all the through holes V can be inspected.

In step S15, when there is no pair of conductive portions including the detection leakage via in the same substrate plane, the inspection instruction information generation unit 33 selects a pair of conductive portions having the smallest resistance value from a pair of conductive portions including the conductive portion P of the substrate plane F1 and the conductive portion P of the substrate plane F2, that is, a pair of conductive portions including the detection leakage via. The above steps S1 to S15 complete the check instruction information D2 shown in fig. 14, and the process ends.

According to steps S5, S6, S12, and S13, the pair of conductive parts is selected by combining the conductive parts P on the same substrate surface with each other. In step S15, the pair of conductive portions in the same substrate surface is preferably selected. As a result, when the resistance between the pair of conductive portions indicated by the inspection instruction information thus obtained is measured to inspect the through hole, the resistance measurement accuracy is improved as described below.

That is, when the resistance is measured between the conductive portions on the same plane of the substrate B, as shown in fig. 1, the measurement can be performed only by the probe Pr provided on any one of the measuring jig 4U and the measuring jig 4L, and therefore, the supply of the measuring current and the voltage detection can be performed only by any one of the measuring unit 121 and the measuring unit 122.

On the other hand, when measuring the resistance between the pair of conductive parts across both surfaces of the substrate B, it is necessary to supply a measuring current and detect a voltage across the measuring part 121 and the measuring part 122 using the probe Pr of the measuring jig 4U and the probe Pr of the measuring jig 4L. In this case, a circuit formed by the current supply wiring and the voltage detection wiring of the measurement unit 121 and the measurement unit 122 becomes larger than that in the case where the resistance measurement is performed between the conductive portions in the same plane of the substrate B. When the wiring circuit is large, electromagnetic noise passing through the inside of the wiring circuit increases, and the impedance of the wiring circuit increases.

In addition, when a voltage between a pair of conductive parts P of the substrate B is detected by flowing a current between the pair of conductive parts P, and a resistance value is measured from the current and the measurement voltage according to ohm's law, an external electromagnetic field overlaps with the detection voltage as noise. Since the external electromagnetic field is applied in substantially the same manner in one surface of the substrate B, the noise voltage due to the external electromagnetic field becomes substantially constant in one surface side of the substrate B. Therefore, when the voltage between the pair of conductive parts P in one surface of the substrate B is measured, noise superimposed on the measurement voltage becomes a common mode (common mode), and as a result, the influence of the noise on the measurement voltage is reduced.

On the other hand, a difference occurs in the intensity of the electromagnetic field applied to the front and back of the substrate B between the two surfaces of the substrate B, and a difference occurs in the noise voltage due to the external electromagnetic field between the one surface and the other surface of the substrate B. Therefore, in the case where the voltage between the pair of conductive portions P is measured across both surfaces of the substrate B, noise superimposed on the measurement voltage becomes a normal mode (normal mode), and as a result, the noise voltage is directly superimposed on the measurement voltage. As a result, the influence of noise when measuring the voltage between the pair of conductive portions P across both surfaces of the substrate B becomes larger than in the case of measuring the voltage between the pair of conductive portions P within one surface of the substrate B.

Therefore, when the inspection of the through hole is performed by measuring the resistance between the pair of conductive portions indicated by the inspection instruction information thus obtained by selecting the pair of conductive portions in combination with each other from the conductive portions P on the same substrate surface in step S5, step S6, step S12, and step S13 and preferentially selecting the pair of conductive portions on the same substrate surface in step S15, the resistance measurement accuracy is improved.

Further, according to step S5, step S6, step S12, step S13, and step S15, the combinations of the pairs of conductive portions are selected in order from the combination in which the theoretical value of the resistance value between the pairs of conductive portions is small. As a result, when the resistance between the pair of conductive portions indicated by the inspection instruction information thus obtained is measured to inspect the through hole V, the inspection accuracy is improved.

That is, when the inspection of the through hole V is performed, it is desirable to measure the resistance value of the through hole V itself. However, as shown in fig. 3, since both ends of the through-hole V are not exposed to the surface of the substrate B, the resistance value of the through-hole V itself cannot be directly measured. Therefore, the via hole V is inspected by selecting a pair of conductive portions connected to each other on a conductive path including the via hole V, and measuring the resistance value of the entire conductive path.

In such inspection, the smaller the resistance value of the entire conductive path, the higher the probability that the ratio of the resistance value of the through hole V to the resistance value of the entire conductive path increases, and the smaller the influence of the wiring resistance other than the through hole V. Therefore, in steps S5, S6, S12, S13, and S15, the inspection accuracy is improved when the inspection of the through-hole V is performed by measuring the resistance between the pairs of conductive portions indicated by the inspection instruction information thus obtained by selecting the combination of the pairs of conductive portions so that the smaller the resistance value between the pairs of conductive portions, the higher the priority.

In step S5, step S6, step S12, and step S13, the conductive portion pair is not necessarily selected by the combination of the conductive portions P on the same substrate surface. However, from the viewpoint that inspection instruction information that facilitates improvement of the inspection accuracy of the through-hole V can be generated, it is more preferable that the conductive part pair be selected by a combination of the conductive parts P on the same substrate surface in step S5, step S6, step S12, and step S13.

In step S15, the conductive part pair in the same substrate surface is not limited to the example of preferential selection. However, it is more preferable to preferentially select the pair of conductive portions on the same substrate surface in step S15, because inspection instruction information that can easily improve the inspection accuracy of the through hole V can be generated.

However, when inspecting through holes of a substrate including, for example, four through holes and conductive portions X1 to X4 connected to the through holes, there is a method of: one of the pair of conductive portions to which the inspection object is fixed is inspected by three times of resistance measurement as in the conductive portion X1-conductive portion X2, conductive portion X1-conductive portion X3, and conductive portion X1-conductive portion X4.

However, according to step S5 and step S12, the plurality of conductive parts P are combined so as not to be repeated two by two, and inspection instruction information indicating a pair of conductive parts as an inspection site is generated. As a result, when the through hole is inspected based on the inspection instruction information thus obtained, the number of inspections is reduced as compared with the above-described method. Therefore, the inspection time of the through hole is easily shortened.

That is, it is found that when a plurality of conductive portions P are combined so as not to overlap each other, the conductive portions X1 to X4 are two sets of the conductive portion X1 — conductive portion X2 and conductive portion X3 — conductive portion X4, and four through holes can be inspected by two resistance measurements, and therefore, the number of inspections is reduced compared to the above method, and the inspection time for through holes is shortened.

In addition, the search process of step S14 and the conductive part addition process of step S15 may be performed based on the conductive structure information D1 or the simplified conductive structure information D1', not based on the tree-structured conductive structure information D1 ″ of the tree structure, without performing step S3. However, if the step S3 is executed and the steps S14 and S15 are executed based on the tree-structured conductive structure information D1 ″ of the tree structure, it is more preferable in that the processes of the steps S14 and S15 can be simplified.

In addition, step S1 may not be executed, or step S2 may not be executed. Also, in step S3, the conductive structure information D1 may be converted into tree-structured conductive structure information D1 ″ of a tree structure. However, by executing the simplification processing of step S1 and step S2, the conversion processing to the tree-structured conductive structure information D1 ″ of the tree structure of step S3 is simplified, and the tree-structured conductive structure information D1 ″ is also simplified. As a result, it is more preferable in terms of simplifying the processing of step S14 and step S15 based on the tree structure conductive structure information D1 ″.

As shown in fig. 10 and 11, step S4 and step S11 may not be executed, and in step S5a and step S12a, the conductive part pairs may be selected in a combination order in which the distance between the conductive part pairs on the substrate surface is short, instead of the combination order in which the resistance values are small. In addition, steps S5b and S12b shown in fig. 12 and 13 may be performed instead of steps S5a and S12a, and the pair of conductive portions may be selected so that the conductive portions P do not overlap from the pair of conductive portions on the same substrate surface regardless of the order of combination. In step S6a and step S13a, the pair of conductive portions whose distance between the pair of conductive portions on the substrate surface is shortest may be selected instead of the pair of conductive portions whose resistance value is smallest.

In this case, the calculation processing of the resistance values in step S4 and step S11 is not necessary, and therefore the data processing amount of the check instruction information generation processing can be reduced. Further, the shorter the distance between the pair of conductor portions on the substrate surface, the higher the possibility that the length of the conductive path between the pair of conductor portions is short, and therefore the higher the possibility that the resistance value is low.

Therefore, in step S6a and step S13a, the conductive part pairs can be selected in order of priority of the combination order in which the approximate resistance value is small, by setting the combination order in which the distance between the conductive part pairs on the substrate surface is short instead of the combination order in which the resistance value is small in step S6 and step S13, without executing step S4 and step S11.

Further, the smaller the total of the number of through holes and the number of wires included in the conductive path between the conductive portions of the pair of conductive portions, the higher the possibility that the length of the conductive path between the pair of conductive portions is short, and therefore the higher the possibility that the resistance value is low. The number of wirings corresponds to the number of nodes N (between the via V and the via V) in the tree-structured conductive structure information D1 ″.

Therefore, in step S15a, instead of the combination of small resistance values in step S15, the combination of small total of the number of through holes and the number of wires included in the conductive paths between the conductive portions in the conductive portion pair is prioritized, and thus the conductive portion pair can be selected in order of priority similar to the order of combination of small resistance values without performing steps S4 and S11.

After steps S1 to S14 shown in fig. 7 and 8 are executed, step S15a may be executed instead of step S15. In addition, after performing steps S1 to S14 shown in fig. 10 and 11, step S15 may be performed instead of step S15 a.

In step S15a, instead of the combination of the small total of the number of through holes and the number of wires included in the conductive paths between the conductive portions in the conductive portion pairs, the conductive portion pairs may be selected in the order of the combination of short distances between the conductive portion pairs on the substrate surface, as in steps S5a and S12 a.

However, the leak-detecting through holes are likely to be through holes between wiring layers far from the surface layer in the multilayer substrate. The length of the conductive path including the through hole between the wiring layers distant from the surface layer is less dependent on the distance between the pair of conductors on the substrate surface than the length of the through hole between the layers close to the surface layer.

Therefore, when selecting the pair of conductive portions including the leak detection through hole in the conductive path, it is preferable to select the pair of conductive portions in a combination order in which the total of the number of through holes and the number of wires included in the conductive path between the conductive portions in the pair of conductive portions is small, as compared with a combination order in which the distance between the pair of conductive portions on the substrate surface is short, because it is possible to increase the possibility that the pair of conductive portions having a small resistance value between the pairs can be selected.

In step S5a and step S12a, the total of the number of through holes and the number of wires included in the conductive paths between the conductive portions of the conductive portion pairs may be reduced, similarly to step S15a, without depending on the order of combination in which the distance between the conductive portion pairs on the substrate surface is short. However, it is more preferable to select the conductive part pairs in the order of combination of the short distance between the conductive part pairs on the substrate surface in step S5a and step S12a, from the viewpoint that the process of searching for the conductive path between the conductive part pairs is not necessary.

In step S6a and step S13a, a conductive part pair with the smallest total of the number of through holes and the number of wires included in the conductive paths between the conductive parts of the conductive part pair may be selected, instead of selecting the conductive part pair with the shortest distance between the conductive part pairs on the substrate surface. However, from the viewpoint that the process of searching for a conductive path between the conductor part pairs is not necessary, it is more preferable to select the conductor part pair having the shortest distance between the conductor part pairs on the substrate surface in step S6a and step S13 a.

Fig. 14 is an explanatory diagram in a table format showing an example of the examination instruction information D2 recorded as described above. The inspection instruction information D2 thus obtained can be transmitted to the board inspection apparatus 2 by a communication circuit, not shown, for example, or the inspection instruction information D2 can be stored in a storage medium such as a USB memory, and the board inspection apparatus 2 can read the storage medium to store it in the storage unit 22.

Next, the operation of the substrate inspection apparatus 2 will be described with reference to fig. 15. Hereinafter, a case will be described as an example in which the storage unit 22 stores the inspection instruction information D2 shown in fig. 14.

First, the inspection processing unit 21 reads out information indicating the conductive part pair from the inspection instruction information D2 in a pair-by-pair manner (step S21). Next, the inspection processing unit 21 measures the voltage V between the pair of conductive parts while supplying a measurement current having a current value I between the pair of conductive parts thus read (step S22). Next, the inspection processing unit 21 calculates the resistance R between the pair of conductive portions to be inspected so that R becomes V/I based on the current value I and the voltage V (step S23).

For example, the inspection processing unit 21 reads the first pair of conductive parts P1 and P2 from the inspection instruction information D2 shown in fig. 14, and calculates the resistance R between the pair of conductive parts P1 and P2 by flowing the measurement current into the conductive path a1 between the pair of conductive parts P1 and P2 (step S21 to step S23).

Next, the inspection processing unit 21 inspects whether or not the resistance R is within a predetermined range of the determination criterion (step S24). The determination criterion may be, for example, a range of-10% to + 10% of the calculated resistance value between the pair of conductive portions to be inspected.

If the resistance R is within the range of the determination criterion (YES in step S24), the inspection processing unit 21 determines that the through hole V between the conductive part pair to be inspected is normal (step S25), and proceeds to step S27. For example, if the conductive part pair P1, P2 is the inspection target, the inspection processing part 21 determines that the through holes V11, V21, V12, V22 corresponding to the branch M11, M12 on the conductive path a1 are normal. Further, the through hole V does not necessarily need to be determined, and it is sufficient to determine that the conductive part pair to be inspected is normal.

On the other hand, if the resistance R is out of the range of the determination criterion (NO in step S24), the inspection processing unit 21 determines that the conductive path between the conductive part pair to be inspected is defective (step S26), and proceeds to step S27. For example, if the conductive part pair P1, P2 is the inspection target, the inspection processing unit 21 determines that the conductive path a1 is defective.

In step S27, the check processing section 21 checks whether all conductive section pairs of the check instruction information D2 have completed the check (step S27). If there are any electrically conductive part pairs that have not been checked (no in step S27), the check processing unit 21 reads out a new electrically conductive part pair from the check instruction information D2 (step S28), and repeats steps S22 to S27 again.

The above-described steps are repeated, and if all the conductive part pairs of the inspection instruction information D2 have been inspected (yes in step S27), the inspection processing unit 21 ends the inspection processing.

According to the processing of step S21 to step S28, the resistance values R of the conductive paths a1 to a4, the conductive paths b1 to b4, the conductive paths c1, the conductive paths c2, and the conductive paths d1 corresponding to all the conductive portion pairs shown in fig. 14 are measured, and the through holes V included in the conductive paths a1 to a4, the conductive paths b1 to b4, the conductive paths c1, the conductive paths c2, and the conductive paths d1 can be checked based on the resistance values R.

That is, an inspection instruction information generating device according to an example of the present invention is an inspection instruction information generating device for inspecting a substrate having a pair of front and back substrate surfaces on which a plurality of conductive portions are provided, a wiring layer which is a layer laminated between the pair of substrate surfaces, and a through hole for connecting a wiring of the wiring layer and the conductive portion, the inspection instruction information generating device including: a storage unit that stores conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are conductively connected; and an inspection instruction information generation unit that performs an inspection instruction information generation process of pairwise combining the conductive portions formed on the same substrate surface with each other based on the conductive structure information, and generates information indicating the combined pair of conductive portions as inspection instruction information.

An inspection instruction information generating method according to an example of the present invention is an inspection instruction information generating method for inspecting a substrate including a front and back pair of substrate surfaces on which a plurality of conductive portions are provided, a wiring layer which is a layer laminated between the pair of substrate surfaces, and a through hole which connects a wiring of the wiring layer and the conductive portion, the inspection instruction information generating method executing an inspection instruction information generating process which combines the conductive portions in pairs with each other in the conductive portions formed on the same substrate surface based on conductive structure information indicating how the conductive portions, the wiring, and the through hole of the substrate are conductively connected, and generates information indicating the pair of conductive portions after the combination as inspection instruction information.

An inspection instruction information generating program according to an example of the present invention is an inspection instruction information generating program for inspecting a substrate including a front and back pair of substrate surfaces provided with a plurality of conductive portions, a wiring layer which is a layer laminated between the pair of substrate surfaces, and a through hole which connects a wiring of the wiring layer and the conductive portion, the inspection instruction information generating program causing a computer to execute an inspection instruction information generating process of combining two conductive portions in pairs with each other at the conductive portions formed on the same substrate surface based on conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are electrically connected, and generating information indicating the combined pair of conductive portions as inspection instruction information.

According to the apparatus, method, and program, inspection instruction information indicating an inspection site in which the accuracy of measuring the resistance of a through hole can be improved more easily than the method described in the background art can be generated by inspection in the same substrate plane.

Preferably, the inspection instruction information generation processing is processing in which: when the plurality of conductive portions are combined into two, the inspection instruction information is generated by sequentially combining pairs having small calculated resistance values between the combined pair of conductive portions.

The smaller the resistance value between the pair of conductive portions serving as the inspection portion, the higher the probability that the ratio of the resistance value of the through hole to the resistance value between the conductive portions increases, and the smaller the influence of the wiring resistance other than the through hole. Therefore, the combination of the conductive portion pairs is selected so that the smaller the resistance value between the conductive portion pairs, the more priority, and thus the inspection accuracy is improved when the through-hole is inspected by measuring the resistance between the conductive portion pairs indicated by the inspection instruction information thus obtained.

Preferably, the inspection instruction information generation processing is processing in which: when the plurality of conductive parts are combined in two, the inspection instruction information is generated by sequentially combining pairs having a short distance on the substrate surface between the combined pair of conductive parts.

The shorter the distance between the pair of conductive portions on the substrate surface, the higher the possibility that the length of the conductive path between the pair of conductive portions is short, and therefore the higher the possibility that the resistance value is low. In addition, in the process of sequentially combining the conductive portions from the pair having a short distance on the substrate surface, it is not necessary to calculate the resistance value of the conductive path between the pair of conductive portions, and therefore the amount of processing can be reduced. Therefore, according to the above configuration, the conductive part pair can be selected in the order of priority of the combination order in which the approximate resistance value is small while reducing the processing amount.

Preferably, the inspection instruction information generation processing is processing in which: when the plurality of conductive portions are combined, the inspection instruction information is generated by sequentially combining pairs in which the total of the number of through holes and the number of wires included in the conductive paths between the pair of conductive portions of the combination is small.

The smaller the total of the number of through holes and the number of wires included in the conductive path between the conductive portions in the pair of conductive portions, the higher the possibility that the length of the conductive path between the pair of conductive portions is short, and therefore the higher the possibility that the resistance value is low. In addition, the process of counting the sum of the number of through holes and the number of wires included in the conductive path between the conductive portions does not require calculation of the resistance value of the conductive path between the pair of conductive portions, and therefore the amount of processing can be reduced. Therefore, according to the above configuration, the conductive part pair can be selected in the order of priority of the combination order in which the approximate resistance value is small while reducing the processing amount.

Preferably, the inspection instruction information generating unit further executes: a search process of searching for a through hole that is not located on a conductive path from one conductive part to another conductive part of each pair combined in the inspection instruction information generation process, based on the conductive structure information; and a conductive part addition process of, when a through hole not located on the conductive path is found in the search process, selecting a pair of conductive parts located at both ends of the conductive path including the found through hole based on the conductive structure information, and adding information indicating the pair of conductive parts to the inspection instruction information.

According to the configuration, the possibility of generating an unchecked through hole is reduced in the inspection based on the inspection instruction information.

Preferably, the conductive portion addition processing is processing in which: a pair of conductive portions is selected from a pair of conductive portions located at both ends, the pair of conductive portions satisfying a condition that a calculated resistance value between the pair of conductive portions is minimum.

According to the above configuration, since the pair of conductive portions to be added by the conductive portion addition processing is selected as well as the pair of conductive portions having a small calculated resistance value between the pair of conductive portions, the inspection accuracy is improved when the through-hole is inspected by measuring the resistance between the pair of conductive portions indicated by the inspection instruction information.

Preferably, the conductive portion addition processing is processing in which: the pair of conductive portions satisfying the condition that the distance on the substrate surface is shortest is selected from the pair of conductive portions located at both ends.

According to the above configuration, since the pair of conductive portions to be added by the conductive portion addition processing is also selected approximately as the pair of conductive portions having a small calculated resistance value between the pair of conductive portions, the inspection accuracy is improved when the through-hole is inspected by measuring the resistance between the pair of conductive portions indicated by the inspection instruction information.

Preferably, the conductive portion addition processing is processing in which: and selecting a pair of conductive portions from the pair of conductive portions located at both ends, the pair of conductive portions satisfying a condition that a total of the number of through holes and the number of wires included in the conductive path between the conductive portions is minimized.

According to the above configuration, since the pair of conductive portions to be added by the conductive portion addition processing is also selected approximately as the pair of conductive portions having a small calculated resistance value between the pair of conductive portions, the inspection accuracy is improved when the through-hole is inspected by measuring the resistance between the pair of conductive portions indicated by the inspection instruction information.

Preferably, the conductive portion addition processing is processing in which: among the pair of conductive portions located at both ends, the pair of conductive portions that satisfy the above condition is preferentially selected from the pair of conductive portions that are formed on the same substrate surface.

Performing resistance measurement in one plane of the substrate is less susceptible to noise than performing resistance measurement across both sides of the substrate, and therefore the accuracy of resistance measurement is improved. According to the above configuration, since the pair of conductive portions formed on the same substrate surface is preferentially selected, the accuracy of the inspection based on the inspection instruction information obtained in this manner can be easily improved.

In addition, it is preferable that: the substrate further includes a plurality of wiring layers and a plurality of through holes connecting the wiring layers, the inspection instruction information generation device further includes a simplification processing unit that executes simplification processing for changing the conductive structure information so that the plurality of parallel-connected wires are replaced with one wire when the wires of the wiring layers are connected in parallel, and the inspection instruction information generation unit executes the search processing based on the conductive structure information that has executed the simplification processing.

According to the configuration, since the conductive structure information is simplified and the search processing is performed based on the simplified conductive structure information, the search processing becomes easy.

Preferably, the simplified processing further includes: in the case where the through holes or the rows of through holes are connected in parallel by the wirings of the plurality of wiring layers, the conductive structure information is changed so that the through holes or the rows of through holes connected in parallel are replaced with one through hole or one row of through holes.

According to the configuration, since the conductive structure information is simplified and the search processing is performed based on the simplified conductive structure information, the search processing becomes easy.

Preferably, the inspection instruction information generating device further includes a tree structure information converting unit that converts the conductive structure information on which the simplification processing has been performed into a data structure of a tree structure by associating the through hole with a node, associating the wiring with a branch, and associating the planar conductor with a root node, and the inspection instruction information generating unit executes the search processing based on the conductive structure information converted into the data structure of the tree structure.

According to the configuration, the conductive structure information is converted into the tree structure data to be simplified, and the search processing is performed based on the simplified conductive structure information, so that the search processing becomes easy.

Further, a substrate inspection system of the present invention includes: the above-mentioned inspection instruction information generating device; and a substrate inspection device that performs inspection of the through-hole based on the inspection instruction information generated by the inspection instruction information generation device.

According to the above configuration, the inspection of the through hole is performed based on the inspection instruction information indicating the inspection site which is easier to improve the accuracy of the resistance measurement of the through hole than the method described in the background art, and therefore, the accuracy of the resistance measurement of the through hole is easier to improve.

The inspection instruction information generating device, the inspection instruction information generating method, and the inspection instruction information generating program configured as described above can generate the inspection instruction information indicating the inspection portion in which the resistance measurement accuracy of the through hole is easily improved. In addition, the substrate inspection system having such a configuration can easily improve the accuracy of measuring the resistance of the through hole.

The present application is based on Japanese patent application laid-open at 11/9/2018, Japanese patent application laid-open at 2018-211079, the contents of which are incorporated herein. In addition, the technical contents of the present invention will be made clear by the specific embodiments or examples carried out in the description of the embodiment, and the present invention should not be construed narrowly limited to such specific examples.

Description of the symbols

1: substrate inspection system

2: substrate inspection device

3: inspection instruction information generating apparatus

4U, 4L: measuring tool

12: measuring block

13: scanner unit

20: control unit

21: inspection processing unit

22: storage unit

31: simplified processing unit

32: tree structured data conversion section

33: inspection instruction information generating unit

34: storage unit

110: substrate fixing device

112: frame body

121. 122: measuring part

125: moving mechanism

a 1-a 4, b 1-b 4, c1, c2, d 1: conductive path

B. B1-B5: substrate

CS, CM: power supply unit

D1: conductive structure information

D1': simplifying conductive structure information

D1': conductive structure information of tree structure

D2: checking indication information

F1, F2: substrate surface

I: current value

IP, IPA, IPd: planar conductor

L, L1, L2, Lc, L4: wiring layer

M, M11-M14, M22, M41-M47, Mr1, Mr2, Mr5, Mr 6: branch of

N, N11, N12, N21, N41, N42: node point

NR: root node

P, P1-P7, P11-P17: conductive part

Pr: probe needle

V, V11-V17, V21-V27, V31-V36, V41-V45, V51-V57: through hole

VM: voltage detection unit

W, W11, W12, W21, W22, W41 to W45: wiring harness

Claims (15)

1. An inspection instruction information generating apparatus for inspecting a substrate, the substrate comprising: the inspection instruction information generating apparatus includes a front substrate surface and a back substrate surface, a wiring layer laminated between the pair of substrate surfaces, and a through hole connecting a wiring of the wiring layer and the conductive portion, the substrate surface having a pair of front and back conductive portions provided thereon, the inspection instruction information generating apparatus including:

a storage unit that stores conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are conductively connected; and

an inspection instruction information generation unit that executes an inspection instruction information generation process including: the conductive portions are combined in pairs with each other at the conductive portions formed on the same substrate surface based on the conductive structure information, and information indicating the combined pair of conductive portions is generated as inspection instruction information.

2. The examination instruction information generating apparatus according to claim 1, wherein the examination instruction information generating process is a process of: when the plurality of conductive portions are combined in two, the inspection instruction information is generated by sequentially combining pairs having small calculated resistance values between the combined pair of conductive portions.

3. The examination instruction information generating apparatus according to claim 1, wherein the examination instruction information generating process is a process of: when the plurality of conductive parts are combined in two, the inspection instruction information is generated by sequentially combining pairs having a short distance on the substrate surface between the combined pair of conductive parts.

4. The examination instruction information generating apparatus according to claim 1, wherein the examination instruction information generating process is a process of: when the plurality of conductive portions are combined, the inspection instruction information is generated by sequentially combining pairs in which the total of the number of through holes and the number of wires included in the conductive path between the combined pair of conductive portions is small.

5. The inspection instruction information generation device according to any one of claims 1 to 4, wherein the inspection instruction information generation section further performs:

and (3) search processing: searching for a through hole that is not located on a conductive path from one conductive part to another conductive part of each pair combined in the inspection instruction information generation process, based on the conductive structure information; and

a conductive section addition process of, when a through hole not located on the conductive path is found in the search process, selecting a pair of conductive sections located at both ends of the conductive path including the found through hole based on the conductive structure information, and adding information indicating the pair of conductive sections to the inspection instruction information.

6. The inspection instruction information generation apparatus according to claim 5, wherein the conductive part addition processing is processing of: a pair of conductive portions satisfying a condition that a calculated resistance value between the pair of conductive portions is the smallest is selected from a pair of conductive portions located at both ends.

7. The inspection instruction information generation apparatus according to claim 5, wherein the conductive part addition processing is processing of: and selecting a pair of conductive portions satisfying a condition that a distance on the substrate surface is shortest from the pair of conductive portions located at both ends.

8. The inspection instruction information generation apparatus according to claim 5, wherein the conductive part addition processing is processing of: and selecting a pair of conductive portions from the pair of conductive portions located at both ends, the pair of conductive portions satisfying a condition that a total of the number of through holes and the number of wires included in the conductive path between the conductive portions is minimized.

9. The inspection instruction information generation apparatus according to any one of claims 6 to 8, wherein the conductive section addition processing is processing of: among the pair of conductive portions located at both ends, the pair of conductive portions that satisfy the above condition is preferentially selected as the pair of conductive portions that are formed on the same substrate surface.

10. The inspection instruction information generating apparatus according to any one of claims 5 to 9, wherein the substrate further includes: a plurality of wiring layers and a plurality of via holes connecting the wiring layers,

the inspection instruction information generation device further includes a simplification processing unit that executes simplification processing of changing the conductive structure information so as to replace a plurality of wires connected in parallel with one wire when the wires of the plurality of wiring layers are connected in parallel,

the inspection instruction information generation section performs the search process based on the conductive structure information on which the simplification process is performed.

11. The examination indication information generating apparatus according to claim 10, wherein the simplified processing further comprises processing of: in the case where the through holes or the rows of through holes are connected in parallel by the wirings of the plurality of wiring layers, the conductive structure information is changed so that the through holes or the rows of through holes connected in parallel are replaced with one through hole or one row of through holes.

12. The examination instruction information generating apparatus according to claim 10 or 11, further comprising:

a tree structure data converting section for converting the conductive structure information on which the simplification processing is performed into a tree structure data structure by making the through hole correspond to a node, making the wiring correspond to a branch, and making the planar conductor correspond to a root node,

the inspection instruction information generation section executes the search processing based on the conductive structure information converted into the data structure of the tree structure.

13. A substrate inspection system comprising:

the examination indication information generating apparatus according to any one of claims 1 to 12; and

a substrate inspection device that performs inspection of the through-hole based on the inspection instruction information generated by the inspection instruction information generation device.

14. An inspection instruction information generation method for inspecting a substrate, the substrate comprising: a front-back pair of substrate surfaces provided with a plurality of conductive portions, a wiring layer which is a layer laminated between the pair of substrate surfaces, and a through hole which connects a wiring of the wiring layer with the conductive portion, wherein the inspection instruction information generation method executes an inspection instruction information generation process,

the inspection instruction information generation processing is based on conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are conductively connected,

the conductive parts are combined in pairs so that the conductive parts formed on the same substrate surface are paired with each other, and information indicating the combined pair of conductive parts is generated as inspection instruction information.

15. An inspection instruction information generation program for inspecting a substrate including a front and a back pair of substrate surfaces provided with a plurality of conductive portions, a wiring layer which is a layer laminated between the pair of substrate surfaces, and a through hole which connects a wiring of the wiring layer and the conductive portion, the inspection instruction information generation program causing a computer to execute an inspection instruction information generation process,

the inspection instruction information generation processing is based on conductive structure information indicating how the conductive portion, the wiring, and the through hole of the substrate are conductively connected,

the conductive parts are combined in pairs so that the conductive parts formed on the same substrate surface are paired with each other, and information indicating the combined pair of conductive parts is generated as inspection instruction information.

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