KR20240026153A - Scanner device and electrical inspection device - Google Patents

Abstract

[Summary] A scanner device that is difficult to enlarge and an electrical inspection device are provided. [Solution] A scanner device 3 mounted on an electrical inspection device 1, including a first independent board 31, which is a plate-shaped circuit board extending in a first direction, and a first independent board 31, which is a plate-shaped circuit board and A first common board 41 arranged in parallel with (31) and a second common board 42, which is a plate-shaped circuit board and electrically connects the first independent board 31 and the first common board 41. A scanner device comprising: a scanner device, wherein the length of the first common substrate (41) in the X direction is longer than the length of the first independent substrate (31) in the X direction.

Description

Scanner device and electrical inspection device

The present invention relates to a scanner device that switches the connection relationship between a plurality of probes and an inspection processing unit, and an electrical inspection device using the same.

Conventionally, a module board having a selection circuit is held almost vertically by a connector on the side opposite to the body where the contact points are provided, and a microcomputer controls the selection circuit to sequentially select inspection contact points. So-called scanner devices are known (see, for example, Patent Document 1).

Japanese Patent Publication No. 7-7038

However, in recent years, the miniaturization and increase in circuit scale of circuit boards and semiconductors that are subject to inspection have been remarkable. For this reason, the number of inspection points that the probe touches is increasing. As the number of test points increases, the scanner device must select from more test points, thus increasing the circuit size of the selection circuit. As the circuit scale of the selection circuit increases, the scanner device becomes larger.

An object of the present invention is to provide a scanner device and an electrical inspection device that are difficult to enlarge.

A scanner device according to an example of the present invention is a scanner device mounted on an electrical inspection device, and includes a first independent board, which is a plate-shaped circuit board extending in a first direction, and a plate-shaped circuit board, and is parallel to the first independent board. It has a first common board disposed in such a way that it has a second common board, which is a plate-shaped circuit board and electrically connects the first independent board and the first common board, and The length is longer than the length of the first independent substrate in the first direction.

In addition, the scanner device according to one example of the present invention is a scanner device that switches the electrical connection relationship with an inspection processing unit that performs inspection based on an electric signal, and has a first independent device formed in a plate shape extending in a predetermined first direction. A group of independent substrates arranged in parallel in a second direction perpendicular to the first direction, a first common substrate arranged in parallel with one of the first independent substrates of the independent substrate group, and the plurality of first independent substrates and a second plate-shaped common substrate electrically connected to each end surface of the substrate and electrically connected to the plate-shaped surface of the first common substrate.

Additionally, the electrical inspection device according to one example of the present invention includes the scanner device described above.

For a scanner device and an electrical inspection device with such a configuration, it becomes difficult for the scanner device to be enlarged.

1 is a schematic diagram conceptually showing the configuration of an electrical inspection device using a scanner device according to an embodiment of the present invention.
FIG. 2 is a side view schematically showing the structure of the measurement units 2U and 2L shown in FIG. 1.
FIG. 3 is a perspective view schematically showing an example of the configuration of the scanner device 3 shown in FIG. 2.
FIG. 4 is a schematic side view of the scanner device 3 shown in FIG. 3 as seen from the -Y direction.
FIG. 5 is a schematic side view of the scanner device 3 shown in FIG. 3 as seen from the -Z direction.
Figure 6 is an explanatory diagram to explain the effect of making it difficult to enlarge the scanner device 3 due to its configuration.
FIG. 7 is a schematic perspective view showing a modified example of the scanner device shown in FIG. 3.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment concerning this invention will be described based on the drawings. In addition, the components given the same reference numerals in each drawing indicate the same configuration and their description is omitted. In each drawing, the XYZ orthogonal coordinate axes are appropriately indicated to clarify the direction relationship. The X-axis corresponds to the vertical direction. The electrical inspection device 1 shown in FIG. 1 is an device for inspecting inspection object B.

The inspection object B may be, for example, a printed wiring board, a glass epoxy board, a flexible board, a ceramic multilayer wiring board, a package board for a semiconductor package, an interposer board, or a film carrier, or may be a semiconductor board, a semiconductor chip, or a CSP. (Chip Size Package), semiconductor elements (IC: Integrated Circuit), etc. may be electronic components, electrode plates for displays such as liquid crystal displays, EL (Electro-Luminescence) displays, and touch panel displays, or electrodes for touch panels, etc. It may be a plate or anything else that is subject to electrical inspection.

The electrical inspection device 1 shown in FIG. 1 includes measurement units 2U, 2L, a fixing device 101, a moving mechanism 102, an inspection processing unit 20, and a housing 103 that accommodates them. It is mainly equipped with . The fixing device 101 is configured to fix the inspection object B at a predetermined position.

The measurement unit 2U is located above the inspection object B fixed to the fixing device 101. The measurement unit 2L is located below the inspection object B fixed to the fixing device 101. The measurement units 2U, 2L are equipped with measurement jigs 4U, 4L for bringing the probe Pr into contact with a plurality of conductive parts provided on the inspection object B.

A plurality of probes Pr are installed in the measurement jigs 4U and 4L. The measurement jig 4U, 4L arranges and holds a plurality of probes Pr so as to correspond to the arrangement of the conductive portion (inspection point) of the measurement target provided on the surface of the inspection object B. The moving mechanism 102 moves the measuring units 2U, 2L appropriately within the housing 103 in accordance with the control signal from the inspection processing unit 20, and moves the probe Pr of the measuring jig 4U, 4L to the inspection object B. Contact each inspection point.

In addition, the electrical inspection device 1 may be configured to include only one of the measurement units 2U and 2L.

The inspection processing unit 20 includes, for example, a CPU (Central Processing Unit) that executes a predetermined calculation process, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only) that stores a predetermined control program. It is composed of non-volatile memory units such as Memory) and HDD (Hard Disk Drive), and their peripheral circuits. Then, the inspection processing unit 20 inspects the inspection object B, for example, by executing the control program stored in the storage unit.

The measurement unit 2U shown in FIG. 2 is equipped with two scanner devices 3, 3, a measurement jig 4U, an aluminum plate 21, and a wiring board 22. A scanner device 3, 3 is installed on the upper surface of the aluminum plate 21, and a wiring board 22 is laminated on the lower surface of the aluminum plate 21. A measurement jig 4U is installed on the lower surface of the wiring board 22.

The rear end of each probe Pr of the measurement jig 4U is connected to the wiring board 22, and the scanner devices 3, 3 are connected to the wiring board 22 through an opening (not shown) formed in the aluminum plate 21. It is done. On the wiring board 22, wiring connecting each probe Pr and the scanner devices 3, 3 is formed. As a result, each probe Pr and the scanner devices 3, 3 are electrically connected.

Since the measurement jig 4L is configured in substantially the same way as the measurement jig 4U except that the upper (+X) and lower (-X) directions are reversed, its description is omitted. Hereinafter, the measurement units 2U and 2L are collectively referred to as the measurement unit 2, and the measurement jigs 4U and 4L are collectively referred to as the measurement jig 4.

The measurement jig 4 and the scanner device 3, 3 are fixed by an aluminum plate 21. The moving mechanism 102 moves the entire measuring part 2 supported by the aluminum plate 21 when positioning the probe Pr to the inspection point of the inspection object B. The measurement jigs 4U and 4L are each equipped with approximately 1000 to 20000 probes Pr.

The scanner device 3 switches the electrical connection relationship with the inspection processing unit 20, which performs inspection based on electrical signals. The scanner device 3 is equipped with a power supply circuit, a voltmeter, an ammeter, etc. for inspecting the inspection object B. In addition, the scanner device 3 switches the connection relationship between each probe Pr provided in the measurement jig 4 and these power circuits, voltmeters, ammeters, etc. in accordance with a control signal from the inspection processing unit 20. It has a circuit. Therefore, for one scanner device 3, thousands of probes, for example 4096 probes Pr, are electrically connected via the wiring board 22.

The scanner device 3 and the inspection processing unit 20 are connected by a cable (not shown), and signals can be transmitted and received between each unit in the scanner device 3 and the inspection processing unit 20. Accordingly, the measurement result measured by a measurement circuit such as a voltmeter or an ammeter based on the signal obtained from the probe Pr selected by the switching circuit is transmitted to the inspection processing unit 20. That is, the scanner device 3 switches the probe Pr used for inspection among the plurality of probes Pr and the inspection processing unit 20 .

The scanner device 3 shown in FIGS. 3 and 4 includes a group of independent substrates 33, a second independent substrate 32, a first common substrate 41, a second common substrate 42, and a third common substrate. (43), and a parallel substrate (51). The independent substrate group 33 includes four first independent substrates 31 . Additionally, the number of first independent substrates 31 included in the independent substrate group 33 may be plural and is not limited to four. In FIG. 3, to simplify the explanation, the number of first independent substrates 31 included in the independent substrate group 33 is 4, but in reality, the number of first independent substrates 31 is assumed to be about 32.

The first independent substrate 31 is a circuit board having a substantially rectangular plate shape extending in the X direction (first direction). The plurality of first independent substrates 31 are opposed to each other in the Y direction (second direction) orthogonal to the X direction and are arranged in parallel. The -X side end of the first common board 41 is connected to the wiring board 22 by a connector, etc., not shown. As a result, the wiring provided at the -X side end of the first common board 41 is electrically connected to the probe Pr through the wiring board 22.

For example, if there are 4096 probes Pr connected to one scanner device 3 and the number of first independent substrates 31 included in the independent substrate group 33 is 32, then one first independent substrate 31 ), 128 probes Pr are electrically connected. A switching circuit, a so-called multiplexer, that selects the probe Pr according to a control signal from the inspection processing unit 20 is mounted on the first independent board 31.

For example, when 128 probes Pr are connected to one first independent board 31, it is necessary to select an arbitrary probe Pr among the 128 probes Pr, and the probe connected to the first independent board 31 As the number of Pr increases, the circuit scale of the switching circuit mounted on the first independent board 31 increases.

The first common substrate 41 is a circuit board having a substantially rectangular plate shape extending in the X direction. The first common substrate 41 is arranged in parallel and opposite to one of the plurality of first independent substrates 31, for example, the first independent substrate 31 located furthest on the +Y side. The length L41 of the first common substrate 41 in the X direction is longer than the length L31x of the first independent substrate 31 in the X direction. As a result, the first common substrate 41 protrudes toward the +X side of the independent substrate group 33.

At least one of the above-described power supply circuit, voltmeter, and ammeter is mounted on the first common board 41. The power circuit supplies the voltage and current used to measure continuity, disconnection, or electrical resistance of object B through probe Pr, or supplies the power supply voltage for operation of the semiconductor circuit included in object B through probe Pr. do. The voltmeter and ammeter measure the voltage and current obtained from the inspection object B by the probe Pr. Measurement results such as voltage or current measured on the first common substrate 41 are transmitted to the inspection processing unit 20.

The second common substrate 42 is a circuit board having a substantially rectangular plate shape extending in the Y direction. The surface direction of the second common substrate 42 follows the XY plane. The -X end of the second common board 42 is electrically connected to the + .

Additionally, the +Y side end of the second common substrate 42 is electrically connected to the -Y side substrate surface (plate-shaped surface) of the first common substrate 41 by, for example, a connector not shown. As a result, the first common substrate 41 is electrically connected to each first independent substrate 31 through the second common substrate 42.

As shown in FIG. 3, the length L41 of the first common substrate 41 is longer than the length L31x of the first independent substrate 31, so that the first common substrate 41 is located on the +X side of the independent substrate group 33. By protruding, it becomes easy to electrically connect the +Y side end of the second common substrate 42 to the -Y side plate-shaped surface of the first common substrate 41.

On the second common board 42, a connection relationship between the power circuit, voltmeter, and ammeter of the first common board 41 and the signal wires connected to the switching circuits of each first independent board 31 is provided by an inspection processing unit. A switching circuit, a so-called multiplexer, that switches according to the control signal from (20) is mounted.

That is, the switching circuit that switches the connection relationship between the power supply circuit, voltmeter, and ammeter of the first common board 41 and each probe Pr in accordance with the control signal from the inspection processing unit 20 is a plurality of first independent It is distributedly arranged on the substrate 31 and the second common substrate 42.

The number of second common substrates 42 may be one, or, for example, as shown in FIG. 4, a plurality of second common substrates 42 may be provided in parallel. By using a plurality of second common boards 42, it becomes easy to increase the circuit scale of the switching circuit that can be mounted on the second common board 42.

As shown in FIG. 3, the first common substrate 41 is disposed to face the first independent substrate 31, and the first common substrate 41 is connected to each first common substrate 42 through the second common substrate 42. By making it electrically connected to the independent substrate 31, it becomes difficult for the scanner device 3 to be enlarged.

If the configuration of the scanner device 3 shown in FIG. 3 is not adopted and a circuit combining the first common board 41 and the second common board 42 is mounted on one board 400, It becomes as shown in FIG. 6.

That is, the length of the board 400 in the is the length L41, as becomes clear by contrast with Fig. 3. In addition, since it is necessary to mount a circuit equivalent to that of the first common board 41 on the board 400, the length L31z in the Z direction of the first independent board 31 and the length L400 in the Y direction of the board 400 are If this is assumed to be equal, the first common substrate area 41' required to mount a circuit corresponding to the first common substrate 41 has a length L41. Accordingly, in the scanner device employing the configuration shown in Fig. 6, the length in the X direction is twice that of L41.

On the other hand, since the length in the X direction of the scanner device 3 shown in FIG. 3 is L41, the length in the It gets difficult.

As the scanner device 3 becomes difficult to enlarge, it becomes easier to move the scanner device 3 together with the measurement jig 4 using the moving mechanism 102. When the scanner device becomes large, it is difficult to move it using the moving mechanism 102. In that case, it is conceivable to arrange the power circuit, voltmeter, ammeter, etc. mounted on the first common board 41 outside the scanner device and connect them to each probe Pr with a cable. However, if the signal line is extended with a cable, the signal obtained from the probe Pr is affected by the resistance or impedance of the cable, and measurement accuracy deteriorates.

On the other hand, according to the scanner device 3, which is difficult to enlarge, it is easy to move the scanner device 3 together with the measurement jig 4 without stretching the signal line with a cable. As a result, it becomes easy to improve the measurement precision of the inspection object B by the scanner device 3.

As shown in FIGS. 4 and 5, the second independent substrate 32 is a circuit board having a substantially rectangular plate shape with the same surface direction as the first independent substrate 31. One second independent substrate 32 is provided for each first independent substrate 31 . In addition, one second independent substrate 32 is provided for every two first independent substrates 31, and two first independent substrates 31 are connected to one second independent substrate 32. You can do this. In this way, for example, 16 second independent substrates 32 need to be provided for 32 first independent substrates 31, so the number of substrates for the second independent substrate 32 can be reduced. .

The length L32 of the second independent substrate 32 in the Z direction is shorter than the length L31z of the first independent substrate 31 in the Z direction. The -X side end of the second independent substrate 32 is located at a portion not connected to the second common substrate 42 at the + They are connected by connectors, etc.

In addition, the second independent substrate 32 is not necessarily connected to all of the first independent substrates 31, and may be connected to at least one of the first independent substrates 31. Alternatively, the scanner device 3 does not need to be provided with the second independent board 32.

The third common substrate 43 is a circuit board having a substantially rectangular plate shape whose surface direction follows the YZ plane. The third common board 43 is connected to the +X side end of one or more second independent boards 32 by, for example, a connector not shown. Additionally, the third common board 43 is connected to the outside of the scanner device 3 by, for example, a cable not shown.

When measuring inspection object B, the signal of the measurement target is not necessarily limited to those requiring high-precision measurement. Among the signals to be measured, for example, some may be high voltage, low frequency, or may be affected by cable resistance or impedance. Therefore, the second independent board 32 extracts a signal without problems even if it is affected by the resistance or impedance of the cable from the first independent board 31, and transmits the signal through the third common board 43 and a cable (not shown). It enables connection to a measurement circuit arranged outside the scanner device 3.

In this way, by providing the second independent board 32 and the third common board 43 in the scanner device 3, a signal without problems can be drawn even if affected by the resistance or impedance of the cable, and the scanner device 3 It becomes easier to measure from outside. As a result, there is no need to provide in the scanner device 3 a measurement circuit for processing signals without problems even if affected by the resistance or impedance of the cable, making it easier to make it difficult to enlarge the scanner device 3.

Alternatively, the third common board 43 may not be provided, and the second independent board 32 may be directly connected to a measurement circuit provided outside the scanner device 3 using a cable or the like. Additionally, it is not necessary to provide the second independent substrate 32 and the third common substrate 43.

The parallel substrate 51 shown in FIGS. 4 and 5 has a substantially rectangular plate shape, for example, and is arranged to face and parallel to the second common substrate. The - The +X side end of the parallel substrate 51 is connected to the outside of the scanner device 3 by, for example, a cable not shown.

In addition, the parallel substrate 51 is not necessarily limited to being connected to all of the first independent substrates 31, and may be connected to at least one of the first independent substrates 31. Alternatively, the scanner device 3 does not need to be provided with the parallel substrate 51.

The scanner device 3a shown in FIG. 7 differs from the scanner device 3 shown in FIG. 3 in that it includes a second common substrate 42a instead of the second common substrate 42. In other respects, since it is configured similarly to the scanner device 3, description thereof will be omitted, and the characteristic points of the scanner device 3a will be described below.

The second common substrate 42a is a circuit board having a substantially rectangular plate shape extending in the Y direction. The surface direction of the second common substrate 42a follows the YZ plane. The -X side substrate surface of the second common board 42a is electrically connected to the + there is.

Additionally, the +Y side end of the second common board 42a is electrically connected to the -Y side board surface of the first common board 41 by, for example, a connector not shown. As a result, the first common substrate 41 is electrically connected to each first independent substrate 31 through the second common substrate 42a.

As shown in FIG. 7, the length L41 of the first common substrate 41 is longer than the length L31x of the first independent substrate 31, so that the first common substrate 41 is located on the +X side of the independent substrate group 33. By protruding, it becomes easy to electrically connect the +Y side end of the second common substrate 42a to the -Y side plate-shaped surface of the first common substrate 41.

The second common board 42a, like the second common board 42, is connected to the power circuit, voltmeter, and ammeter of the first common board 41 and the switching circuit of each first independent board 31. A switching circuit, a so-called multiplexer, that switches the connection relationship between signal wires in accordance with a control signal from the inspection processing unit 20 is mounted.

The number of second common substrates 42a may be one, or, for example, as shown in FIG. 7, a plurality of second common substrates 42a may be provided in parallel. By using a plurality of second common boards 42a, it becomes easy to increase the circuit scale of the switching circuit that can be mounted on the second common board 42a.

As shown in FIG. 7, the first common substrate 41 is disposed to face the first independent substrate 31, and the first common substrate 41 is connected to each first common substrate 42a through the second common substrate 42a. By making it electrically connected to the independent substrate 31, it becomes easy to make it difficult to enlarge the scanner device 3a.

Additionally, in the scanner device 3a, the surface direction of the second common substrate 42a follows the YZ plane, and the X direction is the thickness direction of the second common substrate 42a. As a result, it becomes more difficult to enlarge the scanner device 3a than the scanner device 3 in which the surface direction of the second common substrate 42 extends in the X direction.

That is, the scanner device according to an example of the present invention is a scanner device mounted on an electrical inspection device, and includes a first independent substrate that is a plate-shaped circuit board extending in a first direction, and a plate-shaped circuit board, and the first independent substrate and a first common substrate disposed in parallel with a second common substrate, which is a plate-shaped circuit board and electrically connects the first independent substrate and the first common substrate, and the second common substrate of the first common substrate is provided. The length in one direction is longer than the length of the first independent substrate in the first direction.

According to this configuration, since the first independent substrate and the first common substrate are arranged in parallel, it is difficult to enlarge the scanner device than if the first independent substrate and the first common substrate are arranged in a straight line.

In addition, the scanner device according to one example of the present invention is a scanner device that switches the electrical connection relationship with an inspection processing unit that performs inspection based on an electric signal, and has a first independent device formed in a plate shape extending in a predetermined first direction. A group of independent substrates arranged in parallel in a second direction perpendicular to the first direction, a first common substrate arranged in parallel with one of the first independent substrates of the independent substrate group, and the plurality of first independent substrates and a second plate-shaped common substrate electrically connected to each end surface of the substrate and electrically connected to the plate-shaped surface of the first common substrate.

According to this configuration, since a plurality of first independent substrates are arranged in parallel, it becomes easy to increase the number of probes by increasing the number of first independent substrates by connecting probes to the first independent substrates. In addition, the first independent substrate is arranged in parallel with one of a plurality of independent substrate groups arranged in parallel, and the second common substrate is electrically connected to each end surface of the plurality of first independent substrates, and the second common substrate is electrically connected to the end surface of each of the plurality of first independent substrates. Since they are electrically connected to the plate-shaped surface, it becomes easy to arrange the first common substrate and the second common substrate as if bent into an L shape along the edge of the independent substrate group. Accordingly, the circuits mounted on the first common board and the second common board can be arranged compactly, making it easy to make it difficult to enlarge the scanner device.

Additionally, it is preferable that the surface direction of the second common substrate follows the first direction and the second direction, which is the direction of separation between the first independent substrate and the first common substrate.

According to this configuration, the space connected to the second common board among one ends of the first independent board is minimal, so another circuit board, etc. can be connected to the space among one end of the first independent board that is not connected to the second common board. It becomes easier to do.

Additionally, it is preferable to have a plurality of second common substrates. According to this configuration, it becomes easy to increase the scale of circuits that can be mounted on the second common board. As a result, it becomes easier to cope with an increase in the number of probes.

In addition, it is preferable to further include a parallel substrate disposed in parallel with the second common substrate. According to this configuration, the circuit mounting space is increased by the parallel substrate, making it easy to increase the circuit scale of the scanner device.

In addition, it is preferable to further include a second independent board, which is a plate-shaped circuit board having the same surface direction as the first independent board, and is connected to one end of the first independent board in the first direction. According to this configuration, it becomes easy to process signals obtained from the first independent substrate that do not need to be processed by the first common substrate by using the second independent substrate.

In addition, it further includes a third common substrate that is a plate-shaped circuit board whose surface direction is perpendicular to the first direction, wherein the second independent substrate is disposed between the third common substrate and the first independent substrate, The third common substrate is preferably connected to the second independent substrate. According to this configuration, it becomes easy to process signals obtained from the second independent substrate by the third common substrate.

Additionally, it is preferable that the surface direction of the second common substrate is perpendicular to the first direction. According to this configuration, it becomes easy to arrange the second common substrate so as to cover the edge portion of the first independent substrate.

Additionally, it is preferable to have a plurality of second common substrates. According to this configuration, it becomes easy to increase the scale of circuits that can be mounted on the second common board.

Additionally, the electrical inspection device according to one example of the present invention includes the scanner device described above. For an electrical inspection device with such a configuration, it becomes difficult for the scanner device to be enlarged.

1: Electrical inspection device
2, 2U, 2L: Measuring section
3, 3a: scanner device
4, 4U, 4L: Measuring jig
20: Inspection processing department
21: aluminum plate
22: wiring board
31: first independent substrate
32: second independent board
33: Independent board group
41: first common substrate
41': first common substrate area
42, 42a: second common substrate
42': second common substrate region
43: third common substrate
51: parallel substrate
101: Fixing device
102: Moving mechanism
103: housing
400: substrate
B: Inspection object
L31x, L31z, L32, L400, L41: Length
Pr: Probe

Claims (10)

It is a scanner device mounted on an electrical inspection device,
A first independent board, which is a plate-shaped circuit board extending in a first direction,
a first common board, which is a plate-shaped circuit board and is arranged parallel to the first independent board;
It is a plate-shaped circuit board, and has a first independent board and a second common board electrically connecting the first common board,
A scanner device wherein the length of the first common substrate in the first direction is longer than the length of the first independent substrate in the first direction. It is a scanner device that switches the electrical connection relationship with an inspection processing unit that performs inspection based on electrical signals,
a group of independent substrates in which a plurality of first independent substrates formed in a plate shape extending in a predetermined first direction are arranged in parallel in a second direction perpendicular to the first direction;
a first common substrate disposed in parallel with one of the first independent substrates of the independent substrate group;
A scanner device comprising a plate-shaped second common substrate electrically connected to each end surface of the plurality of first independent substrates and electrically connected to a plate-shaped surface of the first common substrate. According to claim 1 or 2,
The surface direction of the second common substrate is along the first direction and a second direction that is a separation direction between the first independent substrate and the first common substrate. According to paragraph 3,
A scanner device comprising a plurality of second common substrates. According to clause 3 or 4,
A scanner device further comprising a parallel substrate disposed parallel to the second common substrate. According to any one of claims 3 to 5,
The scanner device is a plate-shaped circuit board having the same surface direction as the first independent board, and further includes a second independent board connected to one end of the first independent board in the first direction. According to clause 6,
Further comprising a third common board, which is a plate-shaped circuit board whose surface direction is perpendicular to the first direction,
The second independent substrate is disposed between the third common substrate and the first independent substrate,
The scanner device wherein the third common substrate is connected to the second independent substrate. According to claim 1 or 2,
A scanner device wherein a surface direction of the second common substrate is perpendicular to the first direction. According to clause 8,
A scanner device comprising a plurality of second common substrates. An electrical inspection device comprising the scanner device according to any one of claims 1 to 9.

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