CN117597587A

CN117597587A - Scanning device and electrical inspection device

Info

Publication number: CN117597587A
Application number: CN202280045360.6A
Authority: CN
Inventors: 椹木雅也
Original assignee: Nideco Precision Testing Technology Co ltd
Current assignee: Nideco Precision Testing Technology Co ltd
Priority date: 2021-06-29
Filing date: 2022-06-21
Publication date: 2024-02-23
Also published as: WO2023276769A1; KR20240026153A; JPWO2023276769A1; TW202300938A

Abstract

To provide a scanner and an electric inspection device which are not easy to be large-sized. The scanner 3 mounted on an electrical inspection device 1 includes: the first independent substrate 31 is a plate-shaped circuit substrate extending in a first direction; the first common substrate 41 is a plate-shaped circuit substrate and is arranged parallel to the first individual substrate 31; and a second common substrate 42, which is a plate-shaped circuit substrate and electrically connects the first individual substrate 31 and the first common substrate 41, wherein the length of the first common substrate 41 in the X direction is longer than the length of the first individual substrate 31 in the X direction.

Description

Scanning device and electrical inspection device

Technical Field

The present invention relates to a scanner for switching connection relations between a plurality of probes and an inspection processing unit, and an electrical inspection apparatus using the scanner.

Background

Conventionally, there is known a scanning device in which a module board having a selection circuit is held substantially vertically by a connector on a surface opposite to a base body on which contacts are provided, and a microcomputer controls the selection circuit to sequentially select the contacts for inspection (for example, refer to patent document 1).

Prior art literature

Patent literature

Patent document 1: japanese patent publication No. 7-7038

Disclosure of Invention

Problems to be solved by the invention

In recent years, miniaturization of circuit boards, semiconductors, and the like, which are inspection targets, and an increase in circuit scale have been remarkable. Thus, the number of checkpoints to contact the probe increases. If the number of checkpoints increases, the scanning device must select from more checkpoints, and thus the circuit scale of the selection circuit increases. If the circuit scale of the selection circuit increases, the scanner becomes larger.

The invention aims to provide a scanning device and an electric inspection device which are not easy to be large-sized.

Technical means for solving the problems

A scanner device according to an example of the present invention is mounted in an electrical inspection device, and includes: a first independent substrate which is a plate-shaped circuit substrate extending along a first direction; the first shared substrate is a plate-shaped circuit substrate and is arranged in parallel with the first independent substrate; and a second common substrate which is a plate-shaped circuit substrate and electrically connects the first independent substrate and the first common substrate, wherein the length of the first common substrate in the first direction is longer than the length of the first independent substrate in the first direction.

In addition, a scanner according to an example of the present invention is a scanner for switching an electrical connection relation with an inspection processing section for inspecting based on an electrical signal, the scanner including: a plurality of individual substrates arranged in parallel in a second direction orthogonal to a predetermined first direction, wherein the individual substrates are formed in a plate shape extending in the first direction; a first common substrate arranged in parallel with one of the first individual substrates of the individual substrate group; and a plate-shaped second common substrate electrically connected with the end surfaces of the first independent substrates and electrically connected with the plate-shaped surface of the first common substrate.

The electrical inspection device according to an example of the present invention includes the scanning device.

ADVANTAGEOUS EFFECTS OF INVENTION

In the scanner and the electric inspection device with such a structure, the scanner is not easy to be large-sized.

Drawings

Fig. 1 is a schematic diagram conceptually showing the structure of an electrical inspection apparatus using a scanner according to an embodiment of the present invention.

Fig. 2 is a side view schematically showing the structures of the measuring units 2U and 2L shown in fig. 1.

Fig. 3 is a perspective view schematically showing an example of the structure of the scanner 3 shown in fig. 2.

Fig. 4 is a schematic side view of the scanning device 3 shown in fig. 3 viewed from the-Y direction.

Fig. 5 is a schematic side view of the scanning device 3 shown in fig. 3 viewed from the-Z direction.

Fig. 6 is an explanatory diagram for explaining the effect of the scanner 3 that is not easily enlarged due to its structure.

Fig. 7 is a schematic perspective view showing a modification of the scanner shown in fig. 3.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals denote the same structures, and a description thereof will be omitted. In order to clarify the direction relationship, XYZ orthogonal coordinate axes are suitably shown in each figure. The X-axis corresponds to the up-down direction. The electrical inspection apparatus 1 shown in fig. 1 is an apparatus for inspecting an inspection object B.

The inspection object B may be, for example, a printed wiring board, a glass epoxy board, a flexible board, a ceramic multilayer wiring board, a package board for semiconductor packaging, a interposer (interposer) board, a film carrier, or the like, or may be an electronic component such as a semiconductor board, a semiconductor chip, a chip size package (Chip Size Package, CSP), a semiconductor element (integrated circuit (Integrated Circuit, IC)), or may be an electrode plate for a display such as a liquid crystal display, an Electroluminescence (EL) display, a touch panel display, or an electrode plate for a touch panel, or may be another electrode plate to be subjected to an electrical inspection.

The electrical inspection apparatus 1 shown in fig. 1 mainly includes a measuring unit 2U, a measuring unit 2L, a fixing device 101, a moving mechanism 102, an inspection processing unit 20, and a housing 103 for housing these components. The fixing device 101 is configured to fix the inspection object B at a predetermined position.

The measuring unit 2U is located above the object B to be inspected fixed to the fixing device 101. The measuring unit 2L is located below the object B to be inspected fixed to the fixing device 101. The measuring units 2U and 2L include measuring jigs 4U and 4L for bringing the probe Pr into contact with a plurality of conductive parts provided on the inspection object B.

A plurality of probes Pr are attached to the measuring jigs 4U and 4L. The measuring jigs 4U and 4L are arranged and hold the plurality of probes Pr so as to correspond to the arrangement of the conductive parts (inspection points) of the measuring object provided on the surface of the inspection object B. The moving mechanism 102 appropriately moves the measuring units 2U and 2L in the housing 103 in response to a control signal from the inspection processing unit 20, and brings the probes Pr of the measuring jigs 4U and 4L into contact with the inspection points of the inspection object B.

The electrical inspection device 1 may include only one of the measuring units 2U and 2L.

The inspection processing unit 20 includes, for example, the following components: a central processing unit (Central Processing Unit, CPU) for executing predetermined arithmetic processing, a random access Memory (Random Access Memory, RAM) for temporarily storing data, a Read Only Memory (ROM) for storing a predetermined control program, a nonvolatile storage unit such as a Hard Disk Drive (HDD), and peripheral circuits thereof. The inspection processing unit 20 inspects the inspection object B by executing a control program stored in the storage unit, for example.

The measuring unit 2U shown in fig. 2 includes two scanning devices 3 and 3, a measuring jig 4U, an aluminum plate 21, and a wiring board 22. The scanner 3 and the scanner 3 are mounted on the upper surface of the aluminum plate 21, and the wiring board 22 is laminated on the lower surface of the aluminum plate 21. A measurement jig 4U is mounted on the lower surface of the wiring board 22.

The rear end portions of the probes Pr of the measuring jig 4U are connected to the wiring board 22, and the scanner 3 are connected to the wiring board 22 via an opening, not shown, formed in the aluminum plate 21. Wiring lines for connecting the probes Pr to the scanner 3 and the scanner 3 are formed on the wiring board 22. Thus, each probe Pr is electrically connected to the scanner 3 and the scanner 3.

The measuring jig 4L is constructed substantially the same as the measuring jig 4U except for the upper (+x) and lower (-X) reversals, and therefore, the description thereof will be omitted. Hereinafter, the measuring unit 2U and the measuring unit 2L are collectively referred to as a measuring unit 2, and the measuring jig 4U and the measuring jig 4L are collectively referred to as a measuring jig 4.

The measuring jig 4 is fixed to the scanner 3 and the scanner 3 by an aluminum plate 21. The moving mechanism 102 moves the entire measuring unit 2 supported by the aluminum plate 21 when positioning the probe Pr at the inspection point of the inspection object B. The measurement jig 4U and the measurement jig 4L each include about 1000 to 20000 probes Pr.

The scanner 3 switches the electrical connection relation with the inspection processing unit 20 that performs inspection based on the electrical signal. The scanner 3 includes a power supply circuit, a voltmeter, a ammeter, and the like for inspecting the inspection object B. The scanner 3 includes a switching circuit for switching connection relations between the probes Pr included in the measuring jig 4 and the power supply circuits, the voltmeter, the ammeter, and the like, in response to a control signal from the inspection processing unit 20. Therefore, thousands of, for example, 4096 probes Pr are electrically connected to one scanning device 3 via the wiring board 22.

The scanner 3 and the inspection processing unit 20 are connected by a cable or the like, not shown, and can transmit and receive signals between each unit in the scanner 3 and the inspection processing unit 20. In this way, the measurement result measured by the measurement circuit such as a voltmeter or a ammeter is sent to the inspection processing section 20 based on the signal obtained from the probe Pr selected by the switching circuit. That is, the scanner 3 switches the probe Pr for inspection among the plurality of probes Pr between the plurality of probes Pr and the inspection processing unit 20.

The scanner 3 shown in fig. 3 and 4 includes: the individual substrates 33, the second individual substrate 32, the first common substrate 41, the second common substrate 42, the third common substrate 43, and the parallel substrate 51. The individual substrate group 33 includes four first individual substrates 31. The number of the first individual substrates 31 included in the individual substrate group 33 is not limited to four. In fig. 3, for simplicity of explanation, the number of the first individual substrates 31 included in the individual substrate group 33 is four, but actually, the number of about 32 individual substrates is assumed.

The first individual substrate 31 is a circuit substrate having a substantially rectangular plate shape extending in the X direction (first direction). The plurality of first individual substrates 31 are arranged in parallel and opposite to each other in the Y direction (second direction) orthogonal to the X direction. the-X side end portion of the first common substrate 41 is connected to the wiring substrate 22 via a connector or the like, not shown. Thus, the wiring provided at the-X side end portion of the first common substrate 41 is electrically connected to the probe Pr via the wiring substrate 22.

For example, if 4096 probes Pr are connected to one scanning device 3, and 32 first individual substrates 31 included in the individual substrate group 33 are connected to one first individual substrate 31, 128 probes Pr are electrically connected. A switching circuit, so-called a multiplexer (multiplexer), for selecting the probe Pr according to a control signal from the inspection processing unit 20 is mounted on the first independent board 31.

When, for example, 128 probes Pr are connected to one first independent board 31, it is necessary to select any one of the 128 probes Pr, and the larger the number of probes Pr connected to the first independent board 31 is, the larger the circuit scale of the switching circuit mounted on the first independent board 31 is.

The first common substrate 41 is a circuit substrate having a substantially rectangular plate shape extending in the X direction. The first common substrate 41 is disposed in parallel with one of the plurality of first individual substrates 31, for example, the first individual substrate 31 located on the +y side. The length L41 in the X direction of the first common substrate 41 is longer than the length L31X in the X direction of the first individual substrate 31. Thus, the first common substrate 41 protrudes toward the +x side of the individual substrate group 33.

At least one of the power supply circuit, the voltmeter, and the ammeter is mounted on the first common substrate 41. The power supply circuit supplies a voltage and a current used for conducting, disconnecting, measuring resistance, and the like of the inspection object B via the probe Pr, or supplies a power supply voltage for operating the semiconductor circuit included in the inspection object B via the probe Pr. The voltmeter and the ammeter measure the voltage and the current obtained from the detection object B by the probe Pr. The measurement result of the voltage, current, or the like measured by the first common substrate 41 is sent to the inspection processing unit 20.

The second common substrate 42 is a circuit substrate having a substantially rectangular plate shape extending in the Y direction. The plane direction of the second common substrate 42 is along the XY plane. the-X side end of the second common substrate 42 is electrically connected to the +x side end of all the first individual substrates 31 of the individual substrate group 33 by, for example, a connector or the like, which is not shown.

The +y side end of the second common substrate 42 is electrically connected to the-Y side substrate surface (plate-like surface) of the first common substrate 41 by, for example, a connector or the like, which is not shown. Thus, the first common substrate 41 is electrically connected to each of the first individual substrates 31 via the second common substrate 42.

As shown in fig. 3, the length L41 of the first common substrate 41 is longer than the length L31X of the first individual substrate 31, and the first common substrate 41 protrudes toward the +x side of the individual substrate group 33, whereby it is easy to electrically connect the +y side end of the second common substrate 42 to the plate-like surface of the-Y side of the first common substrate 41.

The second common substrate 42 is provided with a switching circuit, so-called a multiplexer, for switching the connection relationship between the power supply circuit, the voltmeter, and the ammeter of the first common substrate 41 and the signal wiring connected to the switching circuit of each first individual substrate 31 in response to the control signal from the inspection processing unit 20.

That is, the switching circuits for switching the connection relationship between the power supply circuit, the voltmeter, and the ammeter of the first common substrate 41 and the probes Pr in response to the control signal from the inspection processing unit 20 are arranged in a distributed manner on the plurality of first individual substrates 31 and the plurality of second common substrates 42.

The second common substrate 42 may be one, for example, as shown in fig. 4, or a plurality of second common substrates 42 may be disposed in parallel. By providing a plurality of second common substrates 42, it is easy to increase the circuit scale of the switching circuit that can be mounted on the second common substrate 42.

As shown in fig. 3, the first common substrate 41 is arranged to face the first individual substrates 31, and the first common substrate 41 is electrically connected to each of the first individual substrates 31 via the second common substrate 42, whereby the scanner 3 is not easily enlarged.

If the circuit obtained by combining the first common substrate 41 and the second common substrate 42 is mounted on one substrate 400 without using the configuration of the scanner 3 shown in fig. 3, the circuit is shown in fig. 6.

That is, as is clear from comparison with fig. 3, the length in the X direction, in which the second common substrate region 42' and the first individual substrate 31, which are necessary for mounting the circuit corresponding to the second common substrate 42 on the substrate 400, are combined, is the length L41. Further, since it is necessary to mount a circuit equivalent to the first common substrate 41 on the substrate 400, the first common substrate region 41' required for mounting a circuit equivalent to the first common substrate 41 becomes the length L41, assuming that the length L31Z in the Z direction of the first individual substrate 31 is equal to the length L400 in the Y direction of the substrate 400. Therefore, the length in the X direction of the scanner device having the structure shown in fig. 6 is twice as long as L41.

On the other hand, since the length in the X direction of the scanner 3 shown in fig. 3 is L41, the scanner 3 is not easily enlarged because the length in the X direction is half of the length of the scanner having the structure shown in fig. 6.

Since the scanner 3 is not easily enlarged, the scanner 3 is easily moved together with the measuring jig 4 by the moving mechanism 102. If the scanner is enlarged, it is difficult to move the scanner by the moving mechanism 102. In this case, it is conceivable that a power supply circuit, a voltmeter, a ammeter, and the like mounted on the first common substrate 41 are disposed outside the scanner, and are connected to the probes Pr by cables. However, when the signal line is extended by the cable, the signal obtained from the probe Pr is affected by the resistance or impedance of the cable, and the measurement accuracy is lowered.

On the other hand, according to the scanner 3 which is not easily enlarged, it is easy to move the scanner 3 together with the measuring jig 4 without extending the signal line through the cable. As a result, it becomes easy to improve the measurement accuracy of the scanning device 3 with respect to the inspection object B.

As shown in fig. 4 and 5, the second individual substrate 32 is a circuit substrate having a substantially rectangular plate shape with the same plane direction as the first individual substrate 31. The second individual substrates 32 are each provided one for each of the first individual substrates 31. Further, a single second independent substrate 32 may be provided for each of the two first independent substrates 31, and the two first independent substrates 31 may be connected to the single second independent substrate 32. In this way, for example, 16 second individual substrates 32 may be provided for 32 first individual substrates 31, and thus the number of substrates of the second individual substrates 32 can be reduced.

The length L32 in the Z direction of the second individual substrate 32 is shorter than the length L31Z in the Z direction of the first individual substrate 31. the-X side end portion of the second individual substrate 32 is connected to a portion of the +x side end portion of the first individual substrate 31 that is not connected to the second common substrate 42, for example, by a connector or the like, which is not shown.

Further, the second individual substrate 32 is not necessarily limited to an example of being connected to all the first individual substrates 31, as long as it is connected to at least one of the first individual substrates 31. Alternatively, the scanning device 3 may not include the second independent substrate 32.

The third common substrate 43 is a circuit substrate having a substantially rectangular plate shape with a planar direction along the YZ plane. The third common substrate 43 is connected to the +x side end portions of one or more second individual substrates 32 by, for example, a connector or the like, which is not shown. The third common substrate 43 is connected to the outside of the scanner 3 via a cable, not shown, for example.

In the case of measuring the object B, the signal to be measured is not necessarily limited to the signal to be measured requiring high accuracy. The signal to be measured is, for example, a signal having a high voltage, a low frequency, or no problem even if it is affected by the resistance or impedance of the cable. Therefore, the second individual board 32 can extract a signal which is free from problems even when it is influenced by the cable resistance or impedance from the first individual board 31, and can be connected to a measurement circuit disposed outside the scanner 3 via the third common board 43 and a cable which is not shown.

In this way, by providing the second individual substrate 32 and the third common substrate 43 in the scanner 3, it is possible to extract a signal which is free from problems even if it is affected by the resistance or impedance of the cable, and to perform measurement outside the scanner 3. As a result, it is not necessary to provide a measurement circuit for processing a signal which is free from problems even if it is influenced by the resistance or impedance of the cable in the scanner 3, and thus it is easy to make the scanner 3 difficult to be large-sized.

The third common substrate 43 may be not provided, but may be connected directly from the second independent substrate 32 to a measurement circuit provided outside the scanner 3 via a cable or the like. The second individual substrate 32 and the third common substrate 43 may not be included.

The parallel substrate 51 shown in fig. 4 and 5 has, for example, a substantially rectangular plate shape, and is disposed in parallel with and opposite to the second common substrate. the-X side end of the parallel substrate 51 is electrically connected to the +x side end of all the first individual substrates 31 of the individual substrate group 33 by, for example, a connector or the like, which is not shown. The +x side end of the parallel substrate 51 is connected to the outside of the scanner 3 via a cable, not shown, for example.

Further, the parallel substrate 51 is not necessarily limited to an example of being connected to all the first individual substrates 31, as long as it is connected to at least one of the first individual substrates 31. Alternatively, the scanning device 3 may not include the parallel substrate 51.

The scanning device 3a shown in fig. 7 is different from the scanning device 3 shown in fig. 3 in that it includes a second common substrate 42a instead of the second common substrate 42. In other respects, since the scanner 3 is configured in the same way, the description thereof will be omitted, and the characteristic points of the scanner 3a will be described below.

The second common substrate 42a is a circuit substrate having a substantially rectangular plate shape extending in the Y direction. The plane direction of the second common substrate 42a is along the YZ plane. the-X side substrate surface of the second common substrate 42a is electrically connected to the +x side end portions of all the first individual substrates 31 of the individual substrate group 33 by, for example, connectors or the like, which are not shown.

The +y side end of the second common substrate 42a is electrically connected to the-Y side substrate surface of the first common substrate 41 by a connector or the like, which is not shown. Thus, the first common substrate 41 is electrically connected to each of the first individual substrates 31 via the second common substrate 42a.

As shown in fig. 7, the length L41 of the first common substrate 41 is longer than the length L31X of the first individual substrate 31, and the first common substrate 41 protrudes toward the +x side of the individual substrate group 33, whereby it is easy to electrically connect the +y side end of the second common substrate 42a to the plate-like surface of the-Y side of the first common substrate 41.

The second common substrate 42a is provided with a switching circuit, so-called a multiplexer, for switching the connection relationship between the power supply circuit, the voltmeter, and the ammeter of the first common substrate 41 and the signal wiring connected to the switching circuit of each first individual substrate 31 in response to the control signal from the inspection processing unit 20, in the same manner as the second common substrate 42.

The second common substrate 42a may be one, for example, as shown in fig. 7, or a plurality of second common substrates 42a may be disposed in parallel. By providing a plurality of second common substrates 42a, it is easy to increase the circuit scale of the switching circuit that can be mounted on the second common substrate 42a.

As shown in fig. 7, the first common substrate 41 is arranged so as to face the first individual substrates 31, and the first common substrate 41 is electrically connected to each of the first individual substrates 31 via the second common substrate 42a, whereby the scanner 3a is not easily enlarged.

In the scanner 3a, the planar direction of the second common substrate 42a is along the YZ plane, and the X direction is the plate thickness direction of the second common substrate 42a. As a result, the scanner 3a is less likely to be enlarged than the scanner 3 in which the surface direction of the second common substrate 42 extends in the X direction.

That is, a scanner according to an example of the present invention is mounted on an electrical inspection apparatus, and includes: a first independent substrate which is a plate-shaped circuit substrate extending along a first direction; the first shared substrate is a plate-shaped circuit substrate and is arranged in parallel with the first independent substrate; and a second common substrate which is a plate-shaped circuit substrate and electrically connects the first independent substrate and the first common substrate, wherein the length of the first common substrate in the first direction is longer than the length of the first independent substrate in the first direction.

According to the above configuration, since the first independent substrate and the first common substrate are arranged in parallel, the scanner is less likely to be enlarged than when the first independent substrate and the first common substrate are arranged on a straight line.

According to the above configuration, since the plurality of first individual substrates are arranged in parallel, if the probes are connected to the first individual substrates, it becomes easy to increase the number of probes by increasing the number of first individual substrates. Further, since the first individual substrate is arranged in parallel with one of the plurality of individual substrate groups arranged in parallel, and the second common substrate is electrically connected to the respective end faces of the plurality of first individual substrates and to the plate-like surface of the first common substrate, it is easy to arrange the first common substrate and the second common substrate in such a manner as to be bent in an L shape along the edge portion of the individual substrate groups. Therefore, the circuits mounted on the first common substrate and the second common substrate can be compactly arranged, and thus the scanner is not easily enlarged.

In addition, it is preferable that the planar direction of the second common substrate is along a second direction and the first direction which are the separation directions of the first individual substrate and the first common substrate.

According to the above configuration, since the space for connecting the first individual substrate to the second common substrate can be small in the one end portion of the first individual substrate, it becomes easy to connect other circuit substrates or the like in the space for not connecting the first individual substrate to the second common substrate in the one end portion of the first individual substrate.

Further, it is preferable that the second common substrate includes a plurality of the second common substrates. According to the above configuration, it becomes easy to increase the circuit scale that can be mounted on the second common substrate. As a result, it becomes easy to cope with an increase in the number of probes.

Further, the substrate may further include a parallel substrate disposed parallel to the second common substrate. According to the above configuration, since the circuit mounting space is increased by the parallel substrates, it becomes easy to increase the circuit scale of the scanner.

Preferably, the circuit board further includes a second independent board which is a plate-like circuit board having the same plane direction as the first independent board, and is connected to one end of the first independent board in the first direction. According to the above configuration, it becomes easy to process, by the second independent substrate, signals which do not need to be processed by the first common substrate among signals obtained from the first independent substrate.

Further, the present invention is preferably configured such that the first substrate is a circuit board, the second substrate is a circuit board, the circuit board is a circuit board, the first substrate is a circuit board, the second substrate is a circuit board, the third substrate is a circuit board, the first substrate is a circuit board, the third substrate is a circuit board, the surface direction of the circuit board is orthogonal to the first direction, the third substrate is a circuit board, and the third substrate is a circuit board. According to the above structure, it becomes easy to further process the signal obtained from the second individual substrate through the third common substrate.

In addition, the surface direction of the second common substrate is preferably orthogonal to the first direction. According to the above configuration, it is easy to dispose the second common substrate so as to cover the edge portion of the first individual substrate.

Further, it is preferable that the second common substrate includes a plurality of the second common substrates. According to the above configuration, it becomes easy to increase the circuit scale mountable to the second common substrate.

The electrical inspection device according to an example of the present invention includes the scanning device. In the electric inspection device with such a structure, the scanner is not easily enlarged.

Description of symbols

1: electrical inspection device

2. 2U, 2L: measuring unit

3. 3a: scanning device

4. 4U, 4L: measuring clamp

20: inspection processing unit

21: aluminum plate

22: wiring board

31: first independent substrate

32: second independent substrate

33: independent substrate group

41: first common substrate

41': first common substrate region

42. 42a: second common substrate

42': second common substrate region

43: third common substrate

51: parallel substrate

101: fixing device

102: moving mechanism

103: frame body

400: substrate board

B: object to be inspected

L31x, L31z, L32, L400, L41: length of

Pr: probe with a probe tip

Claims

1. A scanner device mounted on an electrical inspection device, the scanner device comprising: a first independent substrate which is a plate-shaped circuit substrate extending along a first direction; the first shared substrate is a plate-shaped circuit substrate and is arranged in parallel with the first independent substrate; and a second common substrate which is a plate-shaped circuit substrate and electrically connects the first independent substrate and the first common substrate, wherein the length of the first common substrate in the first direction is longer than the length of the first independent substrate in the first direction.

2. A scanning device that switches an electrical connection relationship with an inspection processing section that performs inspection based on an electrical signal, the scanning device comprising: a plurality of individual substrates arranged in parallel in a second direction orthogonal to a predetermined first direction, wherein the individual substrates are formed in a plate shape extending in the first direction; a first common substrate arranged in parallel with one of the first individual substrates of the individual substrate group; and a plate-shaped second common substrate electrically connected with the end surfaces of the first independent substrates and electrically connected with the plate-shaped surface of the first common substrate.

3. The scanning device according to claim 1 or 2, wherein a plane direction of the second common substrate is along a second direction and the first direction which are separate directions of the first individual substrate and the first common substrate.

4. A scanning device according to claim 3, comprising a plurality of said second common substrates.

5. The scanning device according to claim 3 or 4, further comprising a parallel substrate arranged parallel to the second common substrate.

6. The scanning device according to any one of claims 3 to 5, further comprising a second independent substrate that is a plate-like circuit substrate having the same plane direction as the first independent substrate, and that is connected to an end portion of the first independent substrate in the first direction.

7. The scanning device according to claim 6, further comprising a third common substrate which is a plate-shaped circuit substrate and has a surface direction orthogonal to the first direction, wherein the second independent substrate is arranged between the third common substrate and the first independent substrate, and wherein the third common substrate is connected to the second independent substrate.

8. A scanning device according to claim 1 or 2, wherein the planar direction of the second common substrate is orthogonal to the first direction.

9. The scanning device of claim 8, comprising a plurality of the second common substrates.

10. An electrical inspection device comprising a scanning device as claimed in any one of claims 1 to 9.