JP4998791B2 - Semiconductor test equipment - Google Patents

Description

  The present invention relates to a semiconductor test apparatus in which a test head is mounted on a prober, and more particularly, to a semiconductor test apparatus having a test head that can be mounted on a prober without being restricted by external dimensions even when the test head is enlarged.

  In general, a semiconductor test apparatus determines the quality of a DUT based on the output of the DUT obtained by giving a test signal to an IC, LSI, or the like, which is an object to be tested (hereinafter also referred to as a DUT) mounted on a prober. Is. Prior art documents related to such a semiconductor test apparatus include the following.

JP 2005-321238 A

By the way, the semiconductor test apparatus includes a control station (tester body) and a test head. Among these, the test head is mounted on a prober (docking), and measurement is performed by contacting the DUT via a performance board or a probe card. Therefore, in the following description, a schematic structure of the test head will be described, and how the test head is docked with respect to the prober will be described.

FIG. 4 is a perspective view of a test head of the semiconductor inspection apparatus. The test head 1 is a rectangular parallelepiped, and a measurement module (not shown) is mounted inside. The performance board 2 is attached to the upper surface of the test head 1.

FIG. 5 is an internal sectional view of a test head of a semiconductor test apparatus according to the prior art when viewed from the back. The contact probe 3 is electrically connected to the performance board 2 with a rigid mechanical structure. The cable 4 has one end connected to the contact probe 3 and the other end connected to a connector 5 described later.

The connector 5 is connected to the cable 4 and is mounted on the end of the measurement module substrate 6 . In addition to the connector 5, electrical components necessary for testing the DUT are mounted on the measurement module substrate 6 . As a signal flow, the signal output from the measurement module board 6 is transmitted in the order of the connector 5, the cable 4, the contact probe 3, and the performance board 2, and is output to a DUT (not shown).

Further, in the test head 1 of FIG. 5, the center of the test head (TH center) and the center of the DUT (DUT center) are exactly the same, and the distances to both ends of the test head are A, respectively.

FIG. 6 is an explanatory diagram of a state in which a test head of a semiconductor test apparatus according to the prior art is mounted on a prober. In FIG. 6, the test head 1 is the same as the test head 1 of FIGS. 4 and 5, but since the test head 1 is swiveling around a test head turning shaft 21 described later, the performance board 2 is tested. The prober 30 is mounted in such a positional relationship as to come to the lower surface of the head 1.

The positioning mechanism 20 turns the test head 1 with the test head turning shaft 21 as a fulcrum, and docks the test head 1 to the prober 30. A DUT (not shown) is placed on the prober 30. A wafer cassette 31 is provided at the upper right end of the prober. Although the swiveled test head 1 is docked with the prober 30, there is a space for taking in and out the DUT.

As described above, in the test head of the conventional semiconductor test apparatus, the center of the test head and the center of the DUT have the same axis, and the width of the test head is substantially equal to the width of the prober body 30.

However, as the number of pins of the DUT increases in recent years, it is necessary to increase the number of pins in the semiconductor test apparatus, and it is necessary to increase the size of the test head 1. Further, since the test head 1 is used by being normally docked to the prober 30 as shown in FIG. 6, the size that can be designed is naturally determined.

In particular, the distance from the “DUT center” of the prober to the wafer cassette 31 located at the upper right end when viewed from the front of the prober (the distance of N in FIG. 6) is an outer shape limitation when the test head 1 is mounted on the prober 30. ing.

Therefore, if the test head whose width is increased from A to A ′ due to the increase in the number of pins is to be mounted on the prober 30 as it is, it cannot be mounted on the wafer cassette 31 as shown in FIG.

  The present invention has been made in view of these problems, and an object thereof is to provide a semiconductor test apparatus including a test head that can be mounted on a prober even if the test head is enlarged.

In order to achieve such a problem, the invention described in claim 1
In a semiconductor test apparatus for testing a DUT, comprising a test head that is pivoted and docked on an upper surface of a prober provided with a wafer cassette.
A measurement module board is mounted inside the test head, and a cover and a performance board are slidably mounted on the upper surface.
The cover and the performance board are slid in a predetermined direction so that the center of the cover and the performance board coincides with the center of the DUT when the test head is swung so as to be docked with the prober. To do.

According to a second aspect of the present invention, in the semiconductor test apparatus according to the first aspect, the cover and the performance board are screw-fastened to the test head in a state where the center of the cover and the performance board coincides with the center of the DUT. To do.

According to a third aspect of the present invention, in the semiconductor test apparatus according to the first or second aspect, the measurement module substrate and the contact probe are connected by a cable.

  The present invention has the following effects. Since the position of the cover and performance board mounted on the test head is slid in accordance with the center of the DUT, it can be mounted on the prober even if the test head is enlarged.

Hereinafter, a configuration example of the semiconductor test apparatus of the present invention will be described. FIG. 1 is an internal cross-sectional view of a test head according to the present invention when viewed from the back. In FIG. 1, since the performance board 2 and the cover 7 are moved to the right by a distance Y as the test head 11 becomes larger, the center of the test head (TH center) and the center of the performance board 2 (DUT center) are distances. Y apart.

That is, since the measurement module substrate 6 and the contact probe 3 are connected by the cable 4, the relative position of the measurement module substrate 6 and the performance board 2 can be slid in the direction of the arrow in the figure. In addition, when the distance from the DUT center to the right end surface of the test head at this time is X,

  Distance A = distance X <distance (X + Y) in FIG.

Therefore, even if the test head 11 is enlarged, the distance from the center of the DUT to the right end surface of the test head can be made the same as the conventional one.

In addition, by increasing the size of the test head 11, it is possible to cope with the increase in the number of pins of the DUT, and design flexibility is created as shown in the following a to c.

(B) Widen the intervals between multiple measurement module boards 6 and mount large components. (B) Increase the number of measurement module boards 6 connected to the performance board 2. (c) Other prints that are not directly connected to the performance boat 2. Mounting the board

Here, in order to simplify the story, there is no change in the interval and the number of the measurement modules 6 (that is, the above-mentioned A and B), and the printed circuit board (which is not electrically connected directly to the performance board 2 described in C) ( It is assumed that the test head 11 is increased in size by mounting (not shown). Therefore, the performance board 2, the contact probe 3, the cable 4, the connector 5, and the measurement module 6 are assumed to be the same as those in FIG.

FIG. 2 is an explanatory diagram showing a state in which a test head of a semiconductor test apparatus according to the present invention is mounted on a prober. Since FIG. 2 is a front view, the position of the performance board is seen opposite to FIG. 1 which is an internal cross-sectional view when viewed from the back. That is, in FIG. 2, the position of the performance board 2 is seen from the center of the test head 11 to the left, but both are the same. In FIG. 2, the distance B is the distance between the center of the DUT placed on the prober 30 and the turning shaft 21 of the test head.

  The positioning mechanism 20 uses the test head rotating shaft 21 to turn the test head 11 in the direction of the arrow, and docks the test head 11 to the prober 30. Then, as shown in FIG. 1, even if the test head 11 is a test head having a size such that the width of the test head 11 is in contact with the wafer cassette 31 at the distance X + Y, the distance between the center of the DUT and the end of the test head on the wafer cassette 31 side. Since the distance can be kept unchanged, both can be docked in the same way as in the past.

FIG. 3 is a diagram for explaining that the test head can be mounted on a prober even if the test head is further enlarged. FIG. 3 differs from FIG. 2 in that B ′> B. Even in this case, if the distance to be slid is increased and the distance from the center of the DUT to the end of the test head is suppressed to X, both can be docked.

If it is not necessary to slide frequently within the movable range of the cover, for example, the cover 7 may be screwed to the test head 11 with the cover and the center of the performance board aligned with the center of the DUT. good.

As described above, since the positions of the cover 7 and the performance board 2 mounted on the test head 11 are slid in accordance with the center of the DUT, it can be mounted on the prober even if the test head is enlarged.

It is an internal sectional view when the test head according to the present invention is viewed from the back. It is explanatory drawing of the state by which the test head of the semiconductor testing apparatus by this invention is mounted in the prober. It is drawing explaining that a test head can be mounted on a prober even if the test head is further enlarged. It is a perspective view of the test head of the semiconductor testing apparatus by a prior art. It is internal sectional drawing when the test head of the semiconductor testing apparatus by a prior art is seen from the back surface. It is explanatory drawing of the state by which the test head of the semiconductor testing apparatus by a prior art is mounted in the prober. It is explanatory drawing of the problem when a test head enlarges.

Explanation of symbols

2 Performance board 7 Cover 11 Test head

Claims (3)

In a semiconductor test apparatus for testing a DUT, comprising a test head that is pivoted and docked on an upper surface of a prober provided with a wafer cassette.
A measurement module board is mounted inside the test head, and a cover and a performance board are slidably mounted on the upper surface.
The cover and the performance board are slid in a predetermined direction so that the center of the cover and the performance board coincides with the center of the DUT when the test head is swung so as to be docked with the prober. Semiconductor testing equipment. 2. The semiconductor test apparatus according to claim 1, wherein the cover and the performance board are screw-fastened to the test head in a state where the center of the cover and the performance board coincides with the center of the DUT . The semiconductor test apparatus according to claim 1, wherein the measurement module substrate and the contact probe are connected by a cable.

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