JP2019007880A - Substrate inspection device and substrate inspection method - Google Patents

Abstract

To allow an improvement of an inspection accuracy and an improvement of an inspection efficiency to be achieved.SOLUTION: A substrate inspection device executes: a first measurement process in which probes (21a, 21c) brought into contact with first contact points (Pa1, Pa2) connected to through-holes (H1, H2) are allowed to be voltage detection probes, probes (22a, 22c) brought into contact with second contact points (Pb1, Pb2) connected to two through-holes are allowed to be short-circuited, and probes (21b, 22b) brought into contact with the first contact point and the second contact point connected to the through-hole H1 are used as the current supply probe so as to measure a measured amount; and a second measurement process in which probes (21d, 22d) brought into contact with the first contact point and the second contact point connected to the through-hole H2 instead of the current supply probe in the first measurement process are used as the current supply probe to measure the measured amount, and inspects the two through-holes H1, H2 based on each measured amount measured by each measurement process.SELECTED DRAWING: Figure 2

Description

    The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting the quality of internal components on a substrate based on a measured amount measured using a probe brought into contact with the substrate.

  As this type of board inspection apparatus, a circuit board inspection apparatus disclosed by the applicant in Patent Document 1 below is known. The circuit board inspection apparatus includes two probe units (jig-shaped probe units) each having a plurality of probes, a voltage measurement unit, a current supply unit, a first switching unit, a second switching unit, a processing unit, and the like. The internal conductor of the circuit board can be inspected. In this circuit board inspection apparatus, one of the two probes that are in contact with the other end of the inner conductor to be inspected and one of the two probes that are in contact with the other end of the other inner conductor are short-circuited. One of the two probes in contact with one end of the inner conductor to be inspected and one of the two probes in contact with one end of the other inner conductor are used as voltage detection probes. The other of the two probes that are in contact with one end of the inner conductor and the other of the two probes that are in contact with the other end of the inner conductor to be inspected are used as current supply probes. The resistance of the conductor is measured, and the quality of the inner conductor is inspected based on the measured value of the resistance. In this circuit board inspection apparatus, since the voltage detection path is mainly formed on one end side of the internal conductor, the opening area of the voltage detection path can be reduced. For this reason, in this circuit board inspection device, the induced electromotive force generated in the voltage detection path can be weakened. As a result, the resistance of the internal conductor can be measured with high accuracy, and the inspection accuracy of the internal conductor can be sufficiently improved. It has become.

  On the other hand, in order to deal with various circuit board inspections, the applicant has a direction parallel to the upper surface (XY direction) on one surface side (for example, the upper surface side) of the circuit substrate (an XY direction) and an approaching and separating surface. The probe is brought into contact with the contact point by a method of moving the probe in the direction of movement (Z direction) (flying method), and on the other surface side (lower surface side) of the circuit board, the jig-shaped probe unit is moved in the Z direction. Developed a circuit board inspection device (hereinafter, this circuit board inspection device is also referred to as a “single-side flying circuit board inspection device”) that makes the probe contact all the contact points at once by the method of moving to the contact point (collective contact method) doing. Also in this one-side flying circuit board inspection apparatus, since the opening area of the voltage detection path can be reduced by measuring the resistance of the inner conductor to be inspected by the above-described method, the induction generated in the voltage detection path is reduced. As a result of being able to weaken the electric power, it is possible to measure the resistance of the inner conductor with high accuracy and sufficiently improve the inspection accuracy of the inner conductor.

Japanese Patent No. 5057949 (pages 10-15, FIG. 1)

  However, the above-described one-side flying circuit board inspection apparatus has the following problems to be improved. Specifically, in this one-side flying circuit board inspection apparatus, the probe is moved in the XY and Z directions on one surface side of the circuit board to contact the contact point. It is necessary to move the probe each time it is changed (by the number of inner conductors to be inspected). For this reason, this one-side flying circuit board inspection apparatus has a problem that it is difficult to improve inspection efficiency as a result of requiring a lot of time to move the probe.

  The present invention has been made in view of the problems to be improved, and a main object of the present invention is to provide a substrate inspection apparatus and a substrate inspection method capable of realizing improvement in inspection accuracy and improvement in inspection efficiency.

  In order to achieve the above object, the substrate inspection apparatus according to claim 1, a first moving mechanism for bringing a pair of probes into contact with a plurality of first contact points provided on any one surface of the substrate, A second moving mechanism for bringing a pair of probes into contact with a plurality of second contact points provided on the other surface of the substrate; a first processing unit for controlling the moving mechanisms; and a current output unit. And a voltage detection unit based on currents and voltages input / output via the probe in contact with the first contact point and the second contact point connected to the internal components of the substrate. A measuring unit that measures a measured amount of the internal part, an inspection unit that inspects the internal part based on the measured amount measured by the measuring unit, and a connection and disconnection of the probes. A switching unit that switches connection and disconnection between the measurement unit and each probe, and a second processing unit that controls the switching unit, and the first moving mechanism is arranged along the one surface. A moving mechanism of a type in which the pair of probes are moved in a direction and a direction in contact with and away from the one surface to bring the pair of probes into contact with the first contact point, and the second moving mechanism includes: Each of the second contact points is moved by moving a probe unit in which a plurality of the probes are arranged and integrated in correspondence with the arrangement pattern of the plurality of second contact points in a direction in which the probe unit is in contact with or separated from the other surface. A substrate inspection apparatus comprising a moving mechanism of a type in which the probes are brought into contact with each other at a time, wherein the first processing unit controls the first moving mechanism to control one internal part. Before connected to parts A pair of the probes are brought into contact with the first contact point, and the pair of probes are brought into contact with the first contact point connected to the other one internal component excluding the one internal component, The second processing unit controls the second moving mechanism to execute a moving process of bringing the probes of the probe unit into contact with each of the second contact points in pairs, and the second processing unit When the process is executed, the switching unit is controlled so that one of the pair of probes in contact with the first contact point connected to the one internal component and the other one of the internal parts One of the pair of probes that are in contact with the first contact point connected to a component is connected to the voltage detection unit of the measurement unit as a voltage detection probe, and is connected to the one internal component. Said first One of the pair of probes in contact with two contact points and one of the pair of probes in contact with the second contact point connected to the other one internal component The second contact point connected to the other one of the pair of probes that are in contact with the first contact point connected to the one internal component and the one internal component. Instead of the current supply probe in the first switching process, the first switching process of connecting the other of the pair of probes in contact with the current output unit of the measurement unit as a current supply probe, The second contact point connected to the other one of the pair of probes that are in contact with the first contact point connected to the other one internal component and the other one internal component is contacted. The pair of pros And a second switching process for connecting the other of the first and second sensors to the current output unit of the measuring unit as the current supply probe, and the measuring unit performs the first switching process when the first switching process is performed. A first measurement process for measuring the measured amount for one internal part is executed, and a second measured value for the other internal part is measured when a second switching process is executed. 2, and the inspection unit inspects the one internal part based on the measured amounts measured by the first measurement process, and measures the second measurement process. The other one internal part is inspected based on the measured amounts.

  According to a second aspect of the present invention, there is provided the substrate inspection apparatus, comprising: a first moving mechanism that brings a pair of probes into contact with a plurality of first contact points provided on any one surface of the substrate; A second moving mechanism for bringing a pair of probes into contact with a plurality of second contact points provided on the surface of the substrate, a first processing unit for controlling each moving mechanism, a current output unit, and a voltage detecting unit The internal components based on currents and voltages input / output via the probe in contact with the first contact point and the second contact point connected to the internal component of the substrate. A measuring unit for measuring the measured amount of the sensor, an inspection unit for inspecting the internal component based on the measured amount measured by the measuring unit, connection and disconnection between the probes, and the measuring unit A switching unit that switches between connection and non-connection with each probe, and a second processing unit that controls the switching unit, and each moving mechanism is in a direction along the surface and a direction in contact with and away from the surface Each of the pair of probes is moved to contact the pair of probes with the contact point, and the first processing unit is configured to move the pair of probes to the contact point. And a pair of the probes are brought into contact with the first contact point connected to one of the internal parts, and are connected to one of the other internal parts excluding the one internal part. A pair of the probes are brought into contact with the first contact point, and the second moving mechanism is controlled to bring the pair of probes into contact with the second contact point connected to the one internal component. Let When the movement process is performed, the second processing unit performs a movement process of bringing a pair of probes into contact with the second contact point connected to the other one internal component. The switching unit is controlled to connect one of the pair of probes that are in contact with the first contact point connected to the one internal component and the other one of the internal components. One of the pair of probes that are in contact with one contact point is connected to the voltage detection unit of the measurement unit as a voltage detection probe, and the second contact point is connected to the one internal component One of the pair of probes that are in contact with each other and one of the pair of probes that are in contact with the second contact point connected to the other one internal component are connected to each other and short-circuited, And contact with the one internal part The other of the pair of probes that are in contact with the first contact point that is continued and the other of the pair of probes that are in contact with the second contact point that is connected to the one internal component Is connected to the other one of the internal components instead of the current supply probe in the first switching process. The other of the pair of probes in contact with the first contact point and the other of the pair of probes in contact with the second contact point connected to the other one internal component A second switching process to be connected to the current output unit of the measurement unit as a current supply probe, and the measurement unit performs the above-described one of the internal components when the first switching process is performed. The amount to be measured A first measurement process to be determined, and when a second switching process is executed, a second measurement process for measuring the measured amount of the other internal part is executed, and the inspection is performed. The unit inspects the one internal component based on the measured quantities measured by the first measuring process, and the other based on the measured quantities measured by the second measuring process. Inspect one internal part.

  According to a third aspect of the present invention, there is provided the substrate inspection method, wherein a pair of probes are brought into contact with a plurality of first contact points provided on any one surface of the substrate, respectively, and provided on the other surface of the substrate. A pair of probes are brought into contact with a plurality of second contact points, respectively, and the first contact point connected to the internal component of the substrate and the probe contacted with the second contact point When measuring the measured amount of the internal part based on the input and output current and voltage, and inspecting the internal part based on the measured measured amount, the direction along the one surface and the one The pair of probes are brought into contact with the first contact point by moving the pair of probes in a direction in which the pair of probes are moved toward and away from the surface, and the arrangement pattern of the plurality of second contact points is paired with the first contact point. Then, a substrate unit in which a plurality of the probes are arranged and integrated is moved in a direction in which the probe unit is brought into contact with and separated from the other surface, and the probes are brought into contact with each of the second contact points in pairs. A method is a method in which a pair of the probes is brought into contact with the first contact point connected to one internal component, and is connected to one other internal component excluding the one internal component. A pair of the probes are brought into contact with the first contact point, and a moving process is performed in which the probes of the probe unit are brought into contact with each second contact point at a time. The pair of pros that are in contact with the first contact point that is connected to one of the pair of probes that are in contact with the first contact point that is connected to the other one internal part One of the pair of probes is used as a voltage detection probe and connected to one of the pair of probes in contact with the second contact point connected to the one internal component and the other internal component One of the pair of probes that are in contact with the second contact point that is being connected is short-circuited with each other, and is in contact with the first contact point that is connected to the one internal component Using the other of the pair of probes and the other of the pair of probes in contact with the second contact point connected to the one internal component as the current supply probe, the one internal component A first measurement process for measuring the measured amount of the first and a contact with the first contact point connected to the other internal component instead of the current supply probe in the first measurement process Have The other of the pair of probes and the other of the pair of probes in contact with the second contact point connected to the other one internal component are used as the current supply probe. A second measurement process for measuring the measured amount for one internal part, and inspecting the one internal part based on the measured quantities measured by the first measurement process, The other one internal part is inspected based on the measured amounts measured by the second measurement process.

  According to a fourth aspect of the present invention, there is provided the substrate inspection method, wherein a pair of probes are brought into contact with a plurality of first contact points provided on any one surface of the substrate, respectively, and provided on the other surface of the substrate. A pair of probes are brought into contact with a plurality of second contact points, respectively, and the first contact point connected to the internal component of the substrate and the probe contacted with the second contact point When measuring the measured amount of the internal component based on the input and output currents and voltages, and inspecting the internal component based on the measured measured amount, the direction along the surface and the surface A substrate inspection method in which the pair of probes are brought into contact with the first contact point and the second contact point by moving the pair of probes in a separating direction. A pair of the probes are brought into contact with the first contact point connected to the first contact point, and a pair of the contact points are connected to the first contact point connected to the other one of the internal parts excluding the one internal part. A second contact point that contacts a probe and a pair of the probes that contact the second contact point that is connected to the one internal component and that is connected to the other one internal component A movement process for bringing the pair of probes into contact with each other is performed, and one of the pair of probes in contact with the first contact point connected to the one internal component and the other internal component One of the pair of probes that are in contact with the first contact point that is connected is used as a voltage detection probe, and the second contact point that is connected to the one internal component is in contact with the second contact point. ing One of the pair of probes and one of the pair of probes in contact with the second contact point connected to the other one internal component are connected to each other and short-circuited, and the one internal Of the pair of probes in contact with the other of the pair of probes in contact with the first contact point connected to a component and the second contact point of connection with the one internal component. A first measurement process for measuring the measured amount of the one internal component using the other as a current supply probe, and the other one instead of the current supply probe in the first measurement process. The other of the pair of probes in contact with the first contact point connected to one internal component and the second contact point connected to the other one internal component Of a pair of probes Each of the measured objects measured by the first measuring process, using the other as the current supply probe and performing a second measuring process for measuring the measured quantity of the other one internal component The one internal part is inspected based on the quantity, and the other one internal part is inspected based on each measured quantity measured by the second measurement process.

  According to the substrate inspection apparatus according to claim 1, the substrate inspection apparatus according to claim 2, the substrate inspection method according to claim 3, and the substrate inspection method according to claim 4, each connected to two internal components By using each probe in contact with the first contact point as a voltage detection probe and shorting each probe in contact with each second contact point connected to the two internal components, The path can be a loop with a small opening area. For this reason, according to this board | substrate inspection apparatus and board | substrate inspection method, the magnetic field which passes through the inside of the loop of a voltage path | route can be suppressed enough, and generation | occurrence | production of the induced electromotive force by the magnetic field which passes through the inside of a loop can be suppressed. Therefore, according to the substrate inspection apparatus and the substrate inspection method, the voltage value can be accurately detected while suppressing the influence of the induced electromotive force, so that the quality of the internal components can be inspected with high accuracy. In addition, according to the substrate inspection apparatus and the substrate inspection method, a resistance that uses a probe that is in contact with each of the first contact point and the second contact point connected to one internal component as a current supply probe. A first measurement process for measuring a value, and a first contact point and a second contact point connected to another internal component instead of the current supply probe in the first measurement process, respectively. By executing the second measurement process for measuring the resistance value using the existing probe as the current supply probe, the two internal parts can be inspected by one movement process. For this reason, according to the substrate inspection apparatus and the substrate inspection method, the probe is moved by reducing the number of times of movement of the probe as compared with the conventional configuration in which the probe is moved each time the internal component to be inspected is changed. As a result of shortening the time, the inspection efficiency can be sufficiently improved.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. It is the 1st explanatory view explaining the substrate inspection method using substrate inspection device 1. It is the 2nd explanatory view explaining the substrate inspection method using substrate inspection device 1. 5 is a flowchart of an inspection process 60. It is a block diagram which shows the structure of 1A of board | substrate inspection apparatuses. It is the 1st explanatory view explaining the substrate inspection method using substrate inspection device 1A. It is the 2nd explanatory view explaining the substrate inspection method using substrate inspection device 1A.

  Hereinafter, embodiments of a substrate inspection apparatus and a substrate inspection method will be described with reference to the accompanying drawings.

  Initially, the structure of the board | substrate inspection apparatus 1 shown in FIG. 1 as an example of a board | substrate inspection apparatus is demonstrated. The board inspection apparatus 1 will be described later with regard to the quality of internal parts such as through holes H1 to H4 (hereinafter also referred to as “through holes H” when not distinguished) and vias disposed in the board 100 shown in FIG. It is configured to be executable according to the substrate inspection method. Specifically, as shown in FIG. 1, the substrate inspection apparatus 1 includes a substrate holding unit 11, probing mechanisms 12a and 12b, a vertical movement mechanism 13, a measurement unit 14, scanner units 15a and 15b, a storage unit 16, and a processing unit. 17.

  As shown in FIG. 1, the substrate holding unit 11 is configured to hold the substrate 100 by clamping the outer peripheral portion of the substrate 100.

  The probing mechanism 12a is a flying-type moving mechanism corresponding to the first moving mechanism, and according to the control of the processing unit 17, the upper surface 101a of the substrate 100 held by the substrate holding unit 11 (any one surface: A pair of probes 21a and 21b (see FIGS. 1 and 2) are moved in a direction along the direction (XY direction) along the direction (XY direction) and a direction (Z direction) in contact with and away from the upper surface 101a, and provided on the upper surface 101a. The probe 21a is located at the contact point Pa designated by the processing unit 17 among a plurality (four in this example) of contact points Pa1 to Pa4 (see FIG. 2; hereinafter, also referred to as “contact point Pa” when not distinguished). 21b are brought into contact with each other. The probing mechanism 12b is a flying type moving mechanism corresponding to the first moving mechanism in the same manner as the probing mechanism 12a, and a pair of probes 21c and 21d (FIG. 1, FIG. Reference 2: Hereinafter, the probes 21a to 21d are also referred to as “probes 21” when they are not distinguished, and the probes 21c and 21d are brought into contact with the contact point Pa designated by the processing unit 17. In this case, the contact point Pa corresponds to a first contact point, and is provided, for example, at a conductor portion connected to each end portion on the upper surface 101a side in the through holes H1 to H4. In FIG. 2, the contact points Pa connected to the through holes H1 to H4 are shown as contact points Pa1 to Pa4, respectively.

  The vertical movement mechanism 13 is a collective contact type movement mechanism corresponding to the second movement mechanism, and is provided on the lower surface 101 b (the other surface: see FIG. 1) of the substrate 100 under the control of the processing unit 17. A plurality (in this example, 8) of contact points Pb1 to Pb4 (see FIG. 2; hereinafter referred to as “contact point Pb” when not distinguished) are arranged in a plurality (in this example, 8). A direction (Z direction) in which probes 22a to 22h (see FIGS. 1 and 2; hereinafter, also referred to as “probe 22” when not distinguished) are arranged on the support portion 31a and are integrated with the lower surface 101b. The probe 22 is brought into contact with each contact point Pb at a time. In this case, each contact point Pb corresponds to a second contact point, and is provided, for example, at a conductor portion connected to each end portion on the lower surface 101b side in the through holes H1 to H4. In FIG. 2, the contact points Pb connected to the through holes H1 to H4 are illustrated as contact points Pb1 to Pb4.

  As shown in FIG. 2, the measurement unit 14 includes a current output unit 41 that outputs a measurement current and a voltage detection unit 42 that detects a voltage generated by supplying the measurement current. According to the control, based on the current value of the measurement current and the voltage value of the voltage detected by the voltage detector 42 (current and voltage input / output via the probes 21 and 22 in contact with the contact points Pa and Pb). Then, the resistance values of the through holes H1 and H2 as an example of the amount to be measured for the internal parts are measured.

  The scanner unit 15a constitutes a switching unit together with the scanner unit 15b, and as shown in FIG. 2, a plurality of (in this example, four) switches 51a to 51d (hereinafter also referred to as "switch 51" when not distinguished). In accordance with the control of the processing unit 17, the connection between the measurement unit 14 (current output unit 41 or voltage detection unit 42) and each probe 21 is switched. As shown in the figure, the scanner unit 15b includes a plurality of (eight in this example) switches 52a to 52h (hereinafter also referred to as “switches 52” when not distinguished from each other). In accordance with the control, the connection (short circuit) and non-connection between the probes 22 and the connection and non-connection between the measurement unit 14 (current output unit 41) and each probe 22 are switched.

  The storage unit 16 stores substrate data Db used in the inspection processing 60 executed by the processing unit 17. In this case, the board data Db includes, for example, information that can identify the through holes H of the board 100 (number of each through hole H), information that indicates the position of each through hole H, and the like. Further, the storage unit 16 stores a reference value for the resistance value of the through-hole H used when checking the quality of the through-hole H. In addition, the storage unit 16 stores the result of the inspection executed by the processing unit 17.

  The processing unit 17 functions as a first processing unit and controls the probing mechanisms 12a and 12b and the vertical movement mechanism 13. The processing unit 17 functions as a second processing unit and controls the scanner units 15a and 15b. The processing unit 17 functions as an inspection unit, and inspects the quality of the through holes H1 and H2 based on the resistance values of the through holes H1 and H2 as the measured amounts measured by the measurement unit 14.

  Next, a substrate inspection method for inspecting the quality of each through hole H in the substrate 100 shown in FIG. 2 using the substrate inspection apparatus 1 will be described with reference to the drawings. In the initial state, the switches 51 and 52 of the scanner units 15a and 15b are assumed to be in an off state.

  First, as shown in FIG. 1, a substrate 100 to be inspected is held by a substrate holder 11. Next, an inspection start operation is performed using an operation unit (not shown). In response to this, the processing unit 17 executes the inspection process 60 shown in FIG. In the inspection process 60, the processing unit 17 reads the substrate data Db for the substrate 100 from the storage unit 16 (step 61). Subsequently, the processing unit 17 acquires information about the through hole H provided in the substrate 100 (number for identifying the through hole H and the position of the through hole H) based on the substrate data Db (step 62). .

  Next, the processing unit 17 selects one through hole H (for example, the through hole H1) from each through hole H that has not been inspected (step 63), and specifies the position of the through hole H1. Subsequently, the processing unit 17 selects one through hole H (for example, the through hole H2) other than the through hole H1 from each through hole H that has not been inspected (step 64), and the through hole is selected. The position of H2 is specified.

  Next, the processing unit 17 executes a movement process (step 65). In this moving process, the processing unit 17 controls the probing mechanism 12a to move the pair of probes 21a and 21b, and as shown in FIG. 2, the probe 21a and 21b are moved to the contact point Pa1 connected to the through hole H1. Contact. Further, the processing unit 17 controls the probing mechanism 12b to move the pair of probes 21c and 21d, and brings the probes 21c and 21d into contact with the contact point Pa2 connected to the through hole H2, as shown in FIG. (Flying contact). In addition, the processing unit 17 controls the vertical movement mechanism 13 to move the probe unit 31 to place the probes 22a to 22h of the probe unit 31 at the contact points Pb1 to Pb4 connected to the through holes H1 to H4, respectively. Contact one by one at a time (contact by a batch method).

  Subsequently, the processing unit 17 executes a first switching process (step 66). In the first switching process, as shown in FIG. 2, the processing unit 17 controls the scanner unit 15a to switch the switches 51a and 51c to the on state, thereby the contact point connected to the through hole H1. The probe 21a as one of the probes 21a and 21b in contact with Pa1 and the probe 21c as one of the probes 21c and 21d in contact with the contact point Pa2 connected to the through hole H2 are used as voltage detection probes. The voltage detection unit 42 of the measurement unit 14 is connected.

  Further, as shown in FIG. 2, the processing unit 17 controls the scanner unit 15b to turn on the switches 52a and 52c, thereby contacting the contact point Pb1 connected to the through hole H1. The probe 22a as one of the probes 22a and 22b and the probe 22c as one of the probes 22c and 22d in contact with the contact point Pb2 connected to the through hole H2 are connected to each other and short-circuited.

  Further, as shown in FIG. 2, the processing unit 17 controls the scanner unit 15a to switch the switch 51b to the on state, and also controls the scanner unit 15b to switch the switch 52b to the on state. As the other of the probes 21a and 21b that are in contact with the contact point Pa1 connected to the hole H1, and the other of the probes 22a and 22b that are in contact with the contact point Pb1 that is connected to the through hole H1. The probe 22b is connected to the current output unit 41 of the measurement unit 14 as a current supply probe.

  Next, the processing unit 17 controls the measurement unit 14 to execute the first measurement process (step 67). In the first measurement process, the measurement unit 14 causes the current output unit 41 to output a measurement current Im (for example, a DC constant current). At this time, as shown in FIG. 2, the measurement current Im is supplied through the current output unit 41, the switch 51b, the probe 21b, the contact point Pa1, the through hole H1, the contact point Pb1, the probe 22b, and the switch 52b. It flows through a current path Ci (path indicated by a one-dot chain line in the figure) returning to the output unit 41.

  Further, as shown in FIG. 2, a voltage Vm is generated between both ends of the through hole H1 due to the flow of the measurement current Im, and a contact point Pa1 connected to the end portion on the upper surface 101a side of the through hole H1; This voltage Vm is also connected to the contact point Pb1, the probe 22a, the switch 52a, the switch 52c, the probe 22c, and the contact point Pa2 connected to the end portion on the lower surface 101b side of the through hole H1 through the through hole H2. Occur. As shown in the figure, the voltage detection unit 42 of the measurement unit 14 inputs the voltage Vm via the probes 21a and 21c as voltage detection probes, and detects the voltage value. Subsequently, the measurement unit 14 determines the resistance value (covered value) of the through hole H1 based on the current value of the measurement current Im output from the current output unit 41 and the voltage value of the voltage Vm detected by the voltage detection unit 42. (Measurement amount) is measured (calculated).

  Next, the processing unit 17 inspects the quality of the through hole H1 (one through hole H) (step 68). In this inspection, the processing unit 17 reads the reference value of the resistance value of the through hole H1 from the storage unit 16, and subsequently obtains the resistance value (measured value) of the through hole H1 measured by the measuring unit 14 and the reference value. Compare. In this case, the processing unit 17 determines that the through hole H1 is good when the measured value is equal to or less than the reference value, and determines that the through hole H1 is defective when the measured value exceeds the reference value. Next, the processing unit 17 stores the inspection result in the storage unit 16.

  Here, a magnetic field is generated in the current path Ci when the measurement current Im flows through the current path Ci indicated by a one-dot chain line in FIG. In this case, an induced electromotive force is generated when the magnetic field passes through the loop of the voltage path Cv (path indicated by a broken line in the figure), and the accuracy of detection of the voltage Vm by the current output unit 41 may be reduced. In the substrate inspection apparatus 1 and the substrate inspection method, by performing the first switching process described above, the portion on the lower surface 101b side of the substrate 100 in the voltage path Cv is configured with a short path connecting the probe 22 and the scanner unit 15b. Has been. For this reason, in the substrate inspection apparatus 1 and the substrate inspection method, as shown in the figure, the voltage path Cv is mainly composed of a path connecting the scanner unit 15a and the voltage detection unit 42 on the upper surface 101a side of the substrate 100. Therefore, a path (for example, in the same figure) that loops around the substrate 100 and has a large opening area that connects the scanner unit 15b on the lower surface 101b side of the substrate 100 and the voltage detection unit 42 on the upper surface 101a side of the substrate 100. Unlike the current path Ci shown), the voltage path Cv can be a loop having a small opening area. For this reason, in this substrate inspection apparatus 1 and the substrate inspection method, it is possible to sufficiently suppress the magnetic field passing through the loop of the voltage path Cv and to reduce the generation of induced electromotive force due to the magnetic field passing through the loop. It has become. Therefore, in this board inspection apparatus 1 and the board inspection method, the influence of the induced electromotive force can be suppressed and the voltage value of the voltage Vm can be accurately detected. As a result, the quality of the through hole H can be inspected with high accuracy. It has become.

  Subsequently, the processing unit 17 executes a second switching process (step 69). In the second switching process, as shown in FIG. 3, the processing unit 17 controls the scanner unit 15a to switch the switch 51b to the off state and switches the switch 51d to the on state to control the scanner unit 15b. Then, the switch 52b is switched to the off state and the switch 52d is switched to the on state. As a result, the probe 21d as the other of the probes 21c and 21d in contact with the contact point Pa2 connected to the through hole H2, and the probe 22c in contact with the contact point Pb2 connected to the through hole H2 The probe 22d as the other of 22d is connected to the current output unit 41 of the measurement unit 14 as a new current supply probe instead of the probes 21b and 22b used as current supply probes in the first switching process described above.

  Next, the processing unit 17 controls the measurement unit 14 to execute the second measurement process (step 70). In the second measurement process, the measurement unit 14 causes the current output unit 41 to output the measurement current Im. At this time, as shown in FIG. 3, the measurement current Im is supplied through the current output unit 41, the switch 51d, the probe 21d, the contact point Pa2, the through hole H2, the contact point Pb2, the probe 22d, and the switch 52d. It flows through a current path Ci (path indicated by a one-dot chain line in the figure) returning to the output unit 41.

  Further, as shown in FIG. 3, a voltage Vm is generated between both ends of the through-hole H2 due to the flow of the measurement current Im, and the contact point Pa2 connected to the end on the upper surface 101a side of the through-hole H2, This voltage Vm is also present between the contact point Pb2, the probe 22c, the switch 52c, the switch 52a, the probe 22a, and the contact point Pa1 connected to the end portion of the through hole H2 on the lower surface 101b side. Occur. The voltage detection unit 42 of the measurement unit 14 inputs the voltage Vm via the probes 21a and 21c as voltage detection probes, and detects the voltage value. Subsequently, the measurement unit 14 determines the resistance value (covered) of the through hole H2 based on the current value of the measurement current Im output from the current output unit 41 and the voltage value of the voltage Vm detected by the voltage detection unit 42. (Measurement amount) is measured (calculated).

  Next, the processing unit 17 inspects the quality of the through hole H2 (the other one through hole H) (step 71). In this inspection, the processing unit 17 reads the reference value of the resistance value of the through hole H2 from the storage unit 16, and subsequently obtains the resistance value (measured value) and the reference value of the through hole H2 measured by the measuring unit 14. Compare. In this case, the processing unit 17 determines that the through hole H2 is good when the measured value is equal to or less than the reference value, and determines that the through hole H2 is defective when the measured value exceeds the reference value. Next, the processing unit 17 stores the inspection result in the storage unit 16.

  As described above, in the substrate inspection apparatus 1 and the substrate inspection method, the two through holes H1 and H2 can be inspected by one movement process. For this reason, in this board | substrate inspection apparatus 1 and a board | substrate inspection method, the frequency | count of the movement of the probe 21 by the probing mechanism 12a, 12b is less compared with the conventional structure which moves the probe 21 whenever the through-hole H to be inspected is changed. Can be (half the conventional). Therefore, in the substrate inspection apparatus 1 and the substrate inspection method, the time for moving the probe 21 can be shortened, so that the inspection efficiency can be improved accordingly.

  Subsequently, the processing unit 17 determines whether or not all the through holes H have been inspected (step 72). In this case, since the inspection of all the through holes H is not completed, the processing unit 17 determines that, and then executes the above-described steps 63 to 71 to inspect the through holes H3 and H4. Do. Subsequently, when the processing unit 17 determines in step 72 that all the through holes H have been inspected, the processing unit 17 ends the inspection processing 60.

  Thus, according to this board | substrate inspection apparatus 1 and the board | substrate inspection method, while using each probe 21 which is contacting each contact point Pa connected to the two through holes H as a voltage detection probe, By short-circuiting each probe 22 in contact with each contact point Pb connected to the through hole H, the voltage path Cv can be made a loop having a small opening area. For this reason, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, the magnetic field which passes the inside of the loop of the voltage path | route Cv is suppressed enough, and generation | occurrence | production of the induced electromotive force by the magnetic field which passes the inside of a loop is suppressed. it can. Therefore, according to the substrate inspection apparatus 1 and the substrate inspection method, the voltage value can be accurately detected while suppressing the influence of the induced electromotive force, so that the quality of the through hole H can be inspected with high accuracy. Moreover, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, the resistance value is used using the probes 21 and 22 which are contacting the contact points Pa and Pb respectively connected to one through hole H as a current supply probe. And the probes 21 and 22 respectively contacting the contact points Pa and Pb connected to the other one through hole H instead of the current supply probe in the first measurement process. By performing the second measurement process of measuring the resistance value using the current supply probe, the two through holes H1 and H2 can be inspected by one movement process. For this reason, according to this board | substrate inspection apparatus 1 and a board | substrate inspection method, compared with the conventional structure which moves the probe 21 whenever the through-hole H of a test object is changed, the frequency | count of the movement of the probe 21 is decreased. As a result of shortening the time for moving the probe 21, the inspection efficiency can be sufficiently improved.

  In addition, this invention is not limited to said structure and said method. For example, the example in which the flying type probing mechanisms 12a and 12b are used on the upper surface 101a side of the substrate 100 and the collective contact type vertical movement mechanism 13 is used on the lower surface 101b side of the substrate 100 has been described above. It is also possible to adopt a configuration in which the collective contact type vertical movement mechanism 13 is used on the upper surface 101a side of the 100 and the flying type probing mechanisms 12a and 12b are used on the lower surface 101b side of the substrate 100.

  Moreover, the board | substrate inspection apparatus 1A shown in FIG. 5 is also employable. In the following description, the same components as those in the substrate inspection apparatus 1 described above are denoted by the same reference numerals, and redundant description is omitted. As shown in the figure, the substrate inspection apparatus 1A includes probing mechanisms 12c and 12d instead of the vertical movement mechanism 13 of the substrate inspection apparatus 1, and a scanner unit instead of the scanner unit 15b of the substrate inspection apparatus 1. 15c is comprised.

  The probing mechanism 12c is a flying type moving mechanism corresponding to the second moving mechanism, and moves a pair of probes 23a and 23b (see FIGS. 5 and 6) in the XY and Z directions under the control of the processing unit 17. The probes 23a and 23b are brought into contact with the contact point Pb designated by the processing unit 17 among the contact points Pb provided on the lower surface 101b. The probing mechanism 12d is a flying type moving mechanism corresponding to the second moving mechanism in the same manner as the probing mechanism 12c, and a pair of probes 23c, 23d in the XY and Z directions according to the control of the processing unit 17 (FIG. 5). , 6: Hereinafter, when the probes 23a to 23d are not distinguished from each other, the probe 23c is also moved, and the probes 23c and 23d are brought into contact with the contact point Pb designated by the processing unit 17.

  The scanner unit 15c constitutes a switching unit together with the scanner unit 15a, and as shown in FIG. 6, a plurality of (in this example, four) switches 53a to 53d (hereinafter also referred to as “switch 53” when not distinguished). In accordance with the control of the processing unit 17, the connection (short circuit) and non-connection between the probes 23 and the connection and non-connection between the measurement unit 14 (current output unit 41) and each probe 23 are switched.

  In the substrate inspection apparatus 1A, the processing unit 17 controls the probing mechanisms 12a and 12b and moves the probes 21a and 21b to the contact point Pa1, as shown in FIG. 6, in the movement process (step 65) of the inspection process 60 described above. , The probes 21c and 21d are brought into contact with the contact point Pa2, the probe 23a and 23b are brought into contact with the contact point Pb1 by controlling the probing mechanism 12c, and the probe 23c and the probe 23c are brought into contact with the contact point Pb2. 23d is brought into contact.

  In the substrate inspection apparatus 1A, the processing unit 17 controls the scanner unit 15a and switches the switches 51a and 51c as shown in FIG. 6 in the first switching process (step 66) of the inspection process 60 described above. Voltage detection is performed on the probe 21a that is in contact with the contact point Pa1 connected to the through hole H1 and the probe 21c that is in contact with the contact point Pa2 connected to the through hole H2. The probe is connected to the voltage detection unit 42 of the measurement unit 14. In addition, the processing unit 17 controls the scanner unit 15c to switch the switches 53a and 53c to the on state, thereby as one of the probes 23a and 23b in contact with the contact point Pb1 connected to the through hole H1. The probe 23a and the probe 23c as one of the probes 23c and 23d in contact with the contact point Pb2 connected to the through hole H2 are connected to each other and short-circuited.

  Further, as shown in FIG. 6, the processing unit 17 controls the scanner unit 15a to switch the switch 51b to the on state, and also controls the scanner unit 15c to switch the switch 53b to the on state, thereby causing the through As the other of the probe 21b that is in contact with the contact point Pa1 that is connected to the hole H1 and the other of the probe 23a and 23b that is in contact with the contact point Pb1 that is connected to the through hole H1. Are connected to the current output unit 41 of the measurement unit 14 as a current supply probe.

  In addition, after executing the first switching process, the processing unit 17 executes step 67 (first measurement process) and step 68 of the above-described inspection process 60 to measure the resistance value of the through-hole H1, and to perform through. A pass / fail inspection of the hole H1 is executed.

  In the substrate inspection apparatus 1A, the processing unit 17 controls the scanner unit 15a to turn off the switch 51b in the second switching process (step 69) of the inspection process 60 described above, as shown in FIG. And the switch 51d is switched to the on state, the scanner unit 15c is controlled to switch the switch 53b to the off state, and the switch 53d is switched to the on state. Accordingly, the probe 21d as the other of the probes 21c and 21d that are in contact with the contact point Pa2 connected to the through hole H2, and the probe 23c that is in contact with the contact point Pb2 connected to the through hole H2 The probe 23d as the other of 23d is connected to the current output unit 41 of the measurement unit 14 as a new current supply probe instead of the probes 21b and 23b used as the current supply probes in the first switching process described above.

  In addition, after executing the second switching process, the processing unit 17 executes the step 70 (second measurement process) and the step 71 of the inspection process 60 described above to measure the resistance value of the through hole H2, and the through A pass / fail inspection of hole H2 is executed.

  Also in this board inspection apparatus 1A and the board inspection method, each probe 21 in contact with each contact point Pa connected to two through holes H is used as a voltage detection probe and connected to two through holes H. By short-circuiting each probe 22 that is in contact with each contact point Pb, the quality of the through hole H can be inspected with high accuracy in the same manner as the substrate inspection apparatus 1. Also in the substrate inspection apparatus 1A and the substrate inspection method, the first measurement process and the second measurement process are performed when one movement process is performed, so that two through processes are performed by one movement process. Since the inspection of the holes H1 and H2 can be performed, the number of times of movement of the probe 21 can be reduced and the time for moving the probe 21 can be shortened. As a result, the inspection efficiency can be sufficiently improved.

  In addition, the example applied when the through hole H as an internal component is an inspection target has been described above. However, when various internal components such as a resistor and a capacitor disposed inside the substrate 100 are an inspection target. Can be applied.

DESCRIPTION OF SYMBOLS 1,1A Board | substrate inspection apparatus 12a-12d Probing mechanism 13 Vertical movement mechanism 14 Measuring part 15a-15c Scanner part 17 Processing part 21a-21d, 22a-22h, 23a-23d Probe 41 Current output part 42 Voltage detection part 51a-51d, 52a to 52h, 53a to 53d Switch 100 Substrate 101a Upper surface 101b Lower surface H1 to H4 Through hole Pa1, Pa2, Pb1 to Pb4 Contact point

Claims (4)

A first movement mechanism for bringing a pair of probes into contact with a plurality of first contact points provided on any one surface of the substrate; and a plurality of second mechanisms provided on the other surface of the substrate. A second moving mechanism for bringing the pair of probes into contact with the contact points, a first processing unit for controlling each moving mechanism, a current output unit, and a voltage detecting unit are connected to the internal components of the substrate. A measuring unit that measures a measured amount of the internal component based on current and voltage input and output through the probe that is in contact with the first contact point and the second contact point, and An inspection unit for inspecting the internal component based on the measured amount measured by the measurement unit, connection and non-connection between the probes, and connection and non-connection between the measurement unit and the probes Comprising a switching unit for switching, a second processing unit for controlling the switching unit,
The first moving mechanism is configured to move the pair of probes in a direction along the one surface and in a direction in contact with and away from the one surface to bring the pair of probes into contact with the first contact point. Consisting of a moving mechanism
The second moving mechanism moves a probe unit in which a plurality of the probes are arranged and integrated corresponding to the arrangement pattern of the plurality of second contact points in a direction in which the probe unit comes in contact with and separates from the other surface. A substrate inspection apparatus configured by a moving mechanism of a method in which the probes are brought into contact with each second contact point at a time.
The first processing unit controls the first moving mechanism to bring the pair of probes into contact with the first contact point connected to one internal component, and the one internal component A pair of the probes is brought into contact with the first contact point connected to the other one of the internal components except for the control unit, and the second moving mechanism is controlled so that the second contact point is moved to the second contact point. Execute the moving process of bringing the probes of the probe unit into contact with each other in a batch,
The second processing unit controls the switching unit when the movement process is executed, and the pair of the two processing units that are in contact with the first contact point connected to the one internal component. One of the probes and one of the pair of probes in contact with the first contact point connected to the other one internal component are connected to the voltage detection unit of the measurement unit as a voltage detection probe. And one of the pair of probes in contact with the second contact point connected to the one internal component and the second contact point connected to the other one internal component. One of the pair of probes connected to each other is short-circuited, and the other of the pair of probes in contact with the first contact point connected to the one internal component and the one Connected to internal components A first switching process in which the other of the pair of probes in contact with the second contact point is connected to the current output unit of the measurement unit as a current supply probe, and the current in the first switching process Instead of the supply probe, the other of the pair of probes contacting the first contact point connected to the other one internal component and the first connected to the other internal component. A second switching process for connecting the other of the pair of probes in contact with the two contact points to the current output unit of the measurement unit as the current supply probe;
The measurement unit executes a first measurement process for measuring the measured amount for the one internal part when the first switching process is executed, and the second switching process is executed. Sometimes performing a second measurement process for measuring the measured quantity for the other one internal part,
The inspection unit inspects the one internal component based on the measured quantities measured by the first measurement process, and based on the measured quantities measured by the second measurement process. A board measuring apparatus for inspecting the other one internal component. A first movement mechanism for bringing a pair of probes into contact with a plurality of first contact points provided on any one surface of the substrate; and a plurality of second mechanisms provided on the other surface of the substrate. A second moving mechanism for bringing the pair of probes into contact with the contact points, a first processing unit for controlling each moving mechanism, a current output unit, and a voltage detecting unit are connected to the internal components of the substrate. A measuring unit that measures a measured amount of the internal component based on current and voltage input and output through the probe that is in contact with the first contact point and the second contact point, and An inspection unit for inspecting the internal component based on the measured amount measured by the measurement unit, connection and non-connection between the probes, and connection and non-connection between the measurement unit and the probes Comprising a switching unit for switching, a second processing unit for controlling the switching unit,
Each of the moving mechanisms is configured by a moving mechanism of a type in which the pair of probes are moved in a direction along the surface and in a direction in contact with and away from the surface to bring the pair of probes into contact with the contact point. An inspection device,
The first processing unit controls the first moving mechanism to bring the pair of probes into contact with the first contact point connected to one internal component, and the one internal component A pair of the probes are brought into contact with the first contact point connected to the one other internal component except for the control unit, and the second moving mechanism is controlled to be connected to the one internal component. Performing a moving process in which a pair of the probes are brought into contact with the second contact point and the pair of probes is brought into contact with the second contact point connected to the other one internal component;
The second processing unit controls the switching unit when the movement process is executed, and the pair of the two processing units that are in contact with the first contact point connected to the one internal component. One of the probes and one of the pair of probes in contact with the first contact point connected to the other one internal component are connected to the voltage detection unit of the measurement unit as a voltage detection probe. And one of the pair of probes in contact with the second contact point connected to the one internal component and the second contact point connected to the other one internal component. One of the pair of probes connected to each other is short-circuited, and the other of the pair of probes in contact with the first contact point connected to the one internal component and the one Connected to internal components A first switching process in which the other of the pair of probes in contact with the second contact point is connected to the current output unit of the measurement unit as a current supply probe, and the current in the first switching process Instead of the supply probe, the other of the pair of probes contacting the first contact point connected to the other one internal component and the first connected to the other internal component. A second switching process for connecting the other of the pair of probes in contact with the two contact points to the current output unit of the measurement unit as the current supply probe;
The measurement unit executes a first measurement process for measuring the measured amount for the one internal part when the first switching process is executed, and the second switching process is executed. Sometimes performing a second measurement process for measuring the measured quantity for the other one internal part,
The inspection unit inspects the one internal component based on the measured quantities measured by the first measurement process, and based on the measured quantities measured by the second measurement process. A board measuring apparatus for inspecting the other one internal component. A pair of probes is brought into contact with a plurality of first contact points provided on any one surface of the substrate, and a pair of probes is provided with a plurality of second contact points provided on the other surface of the substrate. The internal components based on currents and voltages input / output through the probe that are in contact with the first contact point and the second contact point connected to the internal components of the substrate. When measuring the amount to be measured and inspecting the internal part based on the measured amount to be measured, the pair of probes in a direction along the one surface and a direction in contact with and away from the one surface The pair of probes are brought into contact with the first contact point by a method of moving the plurality of probes, and a plurality of the probes are arranged corresponding to the arrangement pattern of the plurality of second contact points. A conjugated to a substrate inspection method of the probe unit is moved toward or away from the other surface contacting collectively the probe to the respective second contact point in pairs,
A pair of the probes are brought into contact with the first contact point connected to one internal component, and the first contact is connected to one other internal component excluding the one internal component. A pair of the probes is brought into contact with a point, and a movement process is performed in which the probes of the probe unit are brought into contact with each second contact point in a batch.
In contact with one of the pair of probes in contact with the first contact point connected to the one internal component and the first contact point connected to the other internal component; One of the pair of probes is used as a voltage detection probe, and one of the pair of probes in contact with the second contact point connected to the one internal component and the other one One of the pair of probes that are in contact with the second contact point that is connected to an internal component is connected to each other to short-circuit, and the first contact point that is connected to the one internal component The other of the pair of probes that are in contact with each other and the other of the pair of probes that are in contact with the second contact point connected to the one internal component are used as the current supply probe. Internal parts A first measurement process for measuring the measured amount with respect to the first contact point connected to the other one internal component instead of the current supply probe in the first measurement process; Using the other of the pair of probes in contact and the other of the pair of probes in contact with the second contact point connected to the other one internal component as the current supply probe Performing a second measurement process for measuring the measured amount of the other one internal component;
The one internal part is inspected based on each measured quantity measured by the first measuring process, and the other one internal part is measured based on each measured quantity measured by the second measuring process PCB board inspection method for inspecting. A pair of probes is brought into contact with a plurality of first contact points provided on any one surface of the substrate, and a pair of probes is provided with a plurality of second contact points provided on the other surface of the substrate. The internal components based on currents and voltages input / output through the probe that are in contact with the first contact point and the second contact point connected to the internal components of the substrate. A method of measuring a measured amount of the probe and moving the pair of probes in a direction along the surface and a direction contacting and separating from the surface when inspecting the internal component based on the measured measured amount In the substrate inspection method of contacting the pair of probes with the first contact point and the second contact point,
A pair of the probes are brought into contact with the first contact point connected to one internal component, and the first contact is connected to one other internal component excluding the one internal component. A pair of probes in contact with a point, a pair of probes in contact with the second contact point connected to the one internal component, and connected to the other internal component Performing a movement process for bringing the pair of probes into contact with the second contact point;
In contact with one of the pair of probes in contact with the first contact point connected to the one internal component and the first contact point connected to the other internal component; One of the pair of probes is used as a voltage detection probe, and one of the pair of probes in contact with the second contact point connected to the one internal component and the other one One of the pair of probes that are in contact with the second contact point that is connected to an internal component is connected to each other to short-circuit, and the first contact point that is connected to the one internal component The other of the pair of probes that are in contact with each other and the other of the pair of probes that are in contact with the second contact point connected to the one internal component are used as the current supply probe. Internal parts A first measurement process for measuring the measured amount with respect to the first contact point connected to the other one internal component instead of the current supply probe in the first measurement process; Using the other of the pair of probes in contact and the other of the pair of probes in contact with the second contact point connected to the other one internal component as the current supply probe Performing a second measurement process for measuring the measured amount of the other one internal component;
The one internal part is inspected based on each measured quantity measured by the first measuring process, and the other one internal part is measured based on each measured quantity measured by the second measuring process PCB board inspection method for inspecting.

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