WO2018101234A1 - Resistance measurement device and resistance measurement method - Google Patents

Resistance measurement device and resistance measurement method Download PDF

Info

Publication number
WO2018101234A1
WO2018101234A1 PCT/JP2017/042511 JP2017042511W WO2018101234A1 WO 2018101234 A1 WO2018101234 A1 WO 2018101234A1 JP 2017042511 W JP2017042511 W JP 2017042511W WO 2018101234 A1 WO2018101234 A1 WO 2018101234A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
conductive part
new
unit
current
Prior art date
Application number
PCT/JP2017/042511
Other languages
French (fr)
Japanese (ja)
Inventor
大輔 高原
Original Assignee
日本電産リード株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電産リード株式会社 filed Critical 日本電産リード株式会社
Priority to JP2018554147A priority Critical patent/JP6829371B2/en
Priority to CN201780073089.6A priority patent/CN110023768B/en
Priority to KR1020197014672A priority patent/KR102416052B1/en
Publication of WO2018101234A1 publication Critical patent/WO2018101234A1/en

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/08Measuring resistance by measuring both voltage and current
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections

Definitions

  • the present invention relates to a resistance measuring device and a resistance measuring method for measuring the resistance of a substrate.
  • a substrate provided with a conductor that expands in a planar shape (hereinafter referred to as a planar conductor)
  • conductive portions such as pads, bumps, and wiring on the substrate surface and the planar conductor are electrically connected in the thickness direction of the substrate.
  • a substrate with a connected structure There is a substrate with a connected structure.
  • 11 and 12 are conceptual schematic diagrams showing examples of such a substrate.
  • FIG. 11 is a conceptual schematic diagram showing a multilayer substrate WB, which is an example of a substrate having a planar inner layer pattern IP on the substrate inner layer.
  • the multilayer substrate WB shown in FIG. 11 has conductive portions PA and PB such as pads and wiring patterns formed on the substrate surface BS.
  • the conductive portions PA and PB are electrically connected to the inner layer pattern IP by connection portions RA and RB such as vias and wiring patterns.
  • the inner layer pattern IP corresponds to a planar conductor.
  • a substrate manufacturing method a printed metal board is laminated on both sides of a conductive metal plate as a base, and the two printed wirings are peeled off from the base metal plate.
  • the substrate hereinafter referred to as an intermediate substrate
  • the substrate in a state before the substrate is peeled off from the base metal plate has an aspect in which the metal plate is sandwiched between two substrates. .
  • FIG. 12 is a conceptual schematic diagram showing an example of such an intermediate substrate B.
  • the substrate WB1 is formed on one surface of the metal plate MP
  • the substrate WB2 is formed on the other surface of the metal plate MP.
  • Conductive portions PA1, PB1,..., PF1 such as pads and wiring patterns are formed on the substrate surface BS1 of the substrate WB1.
  • Conductive portions PA2, PB2,..., PF2, such as pads and wiring patterns, are formed on the contact surface BS2 of the substrate WB1 with the metal plate MP.
  • the metal plate MP is a conductive metal plate having a thickness of about 1 mm to 10 mm, for example.
  • the conductive portions PA1 to PF1 are electrically connected to the conductive portions PA2 to PF2 through connection portions RA to RF such as vias and wiring patterns. Since the conductive portions PA2 to PF2 are in close contact with and conductive with the metal plate MP, the conductive portions PA1 to PF1 are electrically connected to the metal plate MP through the connection portions RA to RF.
  • the conductive portion PA1 and the connection portion RA are paired, the conductive portion PB1 and the connection portion RB are paired, and the conductive portion and the connection portion are respectively paired. Since the substrate WB2 is configured in the same manner as the substrate WB1, its description is omitted. In the example of the intermediate substrate B, the metal plate MP corresponds to a planar conductor.
  • the resistance values Ra and Rb of the connection portions RA and RB may be measured.
  • FIG. 13 is an explanatory diagram for explaining a measurement method for measuring the resistance values Ra and Rb of the connection portions RA and RB of the intermediate substrate B shown in FIG.
  • a current I for measurement is passed between the conductive part PA1 and the conductive part PB1, and a voltage generated between the conductive part PA1 and the conductive part PB1.
  • V the resistance value calculated by V / I is Ra + Rb.
  • An object of the present invention is to electrically connect a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion to the planar conductor.
  • Another object of the present invention is to provide a resistance measuring device and a resistance measuring method capable of individually measuring the resistance of each connecting portion of a substrate to be measured having a pair with the connecting portion.
  • a resistance measuring device includes a conductive planar conductor that extends in a planar shape, a substrate surface that faces the planar conductor, a conductive portion provided on the substrate surface, and a conductive portion provided on the surface.
  • a resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured which has a pair of connection portions electrically connected to the conductor and has three or more pairs.
  • a current supply section for passing a current through the planar conductor between a first conductive section that is one of the conductive sections and a second conductive section that is a conductive section different from the first conductive section;
  • a first voltage detection unit for detecting a voltage between a third conductive unit and the first conductive unit, which are different from the first and second conductive units, and the current supply unit. Based on the current passed by the first voltage detector and the voltage detected by the first voltage detector.
  • a resistance calculation unit for calculating the resistance value of the connection portions become conductive portion and pair.
  • the resistance measuring method includes a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion.
  • a resistance measurement method for measuring the resistance of the connection portion of the substrate to be measured which has a pair with a connection portion electrically connected to the planar conductor and includes three or more pairs.
  • a current supplying step of passing a current between a first conductive part that is one of the parts and a second conductive part that is a different conductive part from the first conductive part, and the first of the conductive parts A first voltage detecting step for detecting a voltage between the first conductive portion and the third conductive portion, which is a conductive portion different from the first and second conductive portions, and the current passed through the current supply step and the first Based on the voltage detected by the one voltage detecting step. And a resistance calculation step of calculating a resistance value of the connection portion.
  • FIG. 2 is a block diagram illustrating an example of an electrical configuration of a measurement unit illustrated in FIG. 1. It is a flowchart which shows an example of operation
  • FIG. 1 is a schematic diagram conceptually showing the configuration of a resistance measuring apparatus 1 using a resistance measuring method according to an embodiment of the present invention.
  • a resistance measuring apparatus 1 shown in FIG. 1 is an apparatus for measuring the resistance of a measurement target substrate to be measured.
  • the resistance measuring device 1 may be a substrate inspection device that determines the quality of a measured substrate based on the measured resistance value.
  • the substrate to be measured is, for example, an intermediate substrate or a multilayer substrate, a package substrate for a semiconductor package, a film carrier, a printed wiring substrate, a flexible substrate, a ceramic multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, and these substrates. It may be an intermediate substrate in the process of manufacturing.
  • the multilayer substrate WB shown in FIG. 11 and the intermediate substrate B shown in FIG. 12 correspond to an example of a substrate to be measured.
  • FIG. 1 shows an example in which an intermediate substrate B is attached to the resistance measuring apparatus 1 as a substrate to be measured.
  • the resistance measuring device 1 shown in FIG. In the internal space of the housing 112, a substrate fixing device 110, a measurement unit 121, a measurement unit 122, a measurement unit moving mechanism 125, and a control unit 20 are mainly provided.
  • the substrate fixing device 110 is configured to fix the intermediate substrate B to be measured at a predetermined position.
  • the measurement unit 121 is located above the intermediate substrate B fixed to the substrate fixing device 110.
  • the measurement unit 122 is located below the intermediate substrate B fixed to the substrate fixing device 110.
  • the measurement parts 121 and 122 include measurement jigs 4U and 4L for bringing the probe into contact with the conductive part formed on the intermediate substrate B.
  • a plurality of probes Pr are attached to the measurement jigs 4U and 4L.
  • the measuring jigs 4U and 4L arrange and hold a plurality of probes Pr so as to correspond to the arrangement of the conductive parts to be measured formed on the surface of the intermediate substrate B.
  • the measurement unit moving mechanism 125 appropriately moves the measurement units 121 and 122 in the housing 112 in accordance with a control signal from the control unit 20, and the probes Pr of the measurement jigs 4U and 4L are moved to the respective conductive units of the intermediate substrate B. Make contact.
  • the resistance measuring device 1 may include only one of the measurement units 121 and 122. And the resistance measuring apparatus 1 may be made to measure the both surfaces by reversing the substrate to be measured by either one of the measurement units 121 and 122.
  • the control unit 20 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores a predetermined control program. And a storage unit such as an HDD (Hard Disk Drive), and peripheral circuits thereof. And the control part 20 functions as the electroconductive part selection part 21 and the resistance calculation part 22, for example by running the control program memorize
  • a CPU Central Processing Unit
  • RAM Random Access Memory
  • ROM Read Only Memory
  • FIG. 2 is a block diagram showing an example of an electrical configuration of the measurement unit 121 shown in FIG. Note that the measurement unit 122 is configured in the same manner as the measurement unit 121, and thus the description thereof is omitted.
  • the measurement unit 121 illustrated in FIG. 2 includes a scanner unit 31, a current supply unit CS, a voltage detection unit VM1 (first voltage detection unit), a voltage detection unit VM2 (second voltage detection unit), a current detection unit AM, and a plurality of A probe Pr is provided.
  • the current supply unit CS is a constant current circuit that outputs a current I according to a control signal from the control unit 20.
  • the voltage detection units VM ⁇ b> 1 and VM ⁇ b> 2 are voltage detection circuits that measure a voltage and transmit the voltage value to the control unit 20.
  • the current detection unit AM is a current detection circuit that measures the current I and transmits the current value Ic to the control unit 20.
  • the voltage detector VM2 may not be provided.
  • the scanner unit 31 is a switching circuit configured using switching elements such as transistors and relay switches.
  • the scanner unit 31 includes current terminals + F and ⁇ F for supplying a resistance measurement current I to the intermediate substrate B, and a voltage detection terminal for detecting a voltage generated between the conductive portions of the intermediate substrate B by the current I. + S1, -S1, + S2, and -S2.
  • a plurality of probes Pr are electrically connected to the scanner unit 31.
  • the scanner unit 31 switches the connection relationship between the current terminals + F and ⁇ F and the voltage detection terminals + S1, ⁇ S1, + S2, and ⁇ S2 and the plurality of probes Pr according to a control signal from the control unit 20.
  • the current supply part CS has one end of its output terminal connected to the circuit ground and the other end connected to the current terminal + F.
  • the current detection unit AM has one end connected to the current terminal -F and the other end connected to the circuit ground.
  • the voltage detection unit VM1 has one end connected to the voltage detection terminal + S1 and the other end connected to the voltage detection terminal -S1.
  • the voltage detection unit VM2 has one end connected to the voltage detection terminal + S2 and the other end connected to the voltage detection terminal -S2.
  • the scanner unit 31 can connect the current terminals + F and ⁇ F and the voltage detection terminals + S1, ⁇ S1, + S2, and ⁇ S2 to an arbitrary probe Pr in accordance with a control signal from the control unit 20. .
  • the scanner unit 31 causes the current I to flow between any conductors in contact with the probe Pr in accordance with a control signal from the control unit 20, and causes the current detection unit AM to measure the current I.
  • the voltage V generated between the conductor portions can be measured by the voltage detection units VM1 and VM2.
  • the current supply unit CS is not limited to the example in which one end of the current supply unit CS is connected to the circuit ground as long as the current I can flow through the intermediate substrate B via the scanner unit 31.
  • the current loop may be formed by connecting one end of the current supply unit CS and the other end of the current detection unit AM.
  • the current detection unit AM may be disposed on the path through which the current I flows, and is not necessarily limited to the example connected to the current terminal -F.
  • the current detection unit AM may be connected in series with the current supply unit CS and connected to the current terminal + F.
  • control unit 20 outputs a control signal to the scanner unit 31 so that the current supply unit CS causes the current I to flow between the arbitrary probes Pr, and the voltage between the arbitrary probes Pr is detected by the voltage detection unit VM1, VM1. It is possible to be detected by VM2.
  • the conductive part selector 21 selects the first, second, third, and fourth conductive parts from the conductive parts in contact with the probe Pr. Since the resistance calculation unit 22 calculates the resistance value of the connection part paired with the conductive part selected as the first and second conductive parts, the conductive part selection part 21 is a connection part for which the resistance value has not yet been calculated. By sequentially selecting new conductive parts that are paired with each other as the first and second conductive parts, the resistance values of all the connection parts for which the resistance value is finally measured are measured.
  • the conductive part selection unit 21 connects the probe Pr that is in contact with the first conductive part and the current detection unit AM (current terminal -F) by the scanner unit 31 and the probe Pr that is in contact with the second conductive part. And the current supply part CS (current terminal + F) are connected, the probe Pr that is in contact with the third conductive part is connected to one end (voltage detection terminal + S1) of the voltage detection part VM1, and is in contact with the first conductive part
  • the probe Pr in contact with the fourth conductive portion and the other end (voltage detection terminal -S2) of the voltage detection unit VM2 are connected (see FIG. 6).
  • the conductive part selector 21 causes the current supply part CS to pass a current between the first conductive part and the second conductive part via the metal plate MP, and the voltage detection part VM1 causes the first conductive part and the second conductive part to flow.
  • the voltage between the three conductive portions is detected, and the voltage between the second conductive portion and the fourth conductive portion is detected by the voltage detection unit VM2.
  • the resistance calculation unit 22 Based on the current value Ic measured by the current detection unit AM, that is, the current I passed by the current supply unit CS, and the voltage V1 detected by the voltage detection unit VM1, the resistance calculation unit 22 Calculate the resistance value of the pair of connections. Further, the resistance calculation unit 22 calculates the resistance value of the connection part paired with the second conductive part, based on the current value Ic and the voltage V2 detected by the voltage detection part VM2.
  • a resistance measurement method for measuring the resistance of the substrate WB1 using the measurement unit 121 will be described by taking the case where the substrate to be measured is the intermediate substrate B as an example. Since the measurement of the resistance of the substrate WB2 using the measurement unit 122 is the same as the measurement of the resistance of the substrate WB1 using the measurement unit 121, the description thereof is omitted.
  • FIG. 3 to 5 are flowcharts showing an example of the operation of the resistance measuring apparatus 1 using the resistance measuring method according to the embodiment of the present invention.
  • the flowcharts shown in FIG. 3 to FIG. 5 exemplify the case where the intermediate substrate B is measured.
  • 6 to 9 are explanatory diagrams for explaining the operation of the resistance measuring apparatus 1 shown in FIG. 6 to 9, the description of the scanner unit 31 is omitted for the sake of simplicity.
  • control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 to bring the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1).
  • the control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 to bring the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1).
  • the control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 to bring the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1).
  • FIG. 6 a case where resistance is measured by a so-called four-terminal measurement method is illustrated, and two probes Pr are in contact with each of the conductive portions PA1 to PF1.
  • the resistance measuring apparatus 1 is not limited to the example of performing resistance measurement by the four-terminal measurement method, and a configuration in which the probe Pr is brought into contact with each conductive portion one by one and the current supply and the voltage measurement are combined with one probe Pr. It is good.
  • the conductive part selection unit 21 selects an arbitrary conductive part among the conductive parts PA1 to PF1, for example, the conductive part PB1 and the conductive part PC1, the conductive part PB1 as the first conductive part, and the conductive part PC1 as the second.
  • a conductive portion is set (step S2: conductive portion selection step).
  • the conductive part selection unit 21 changes the first condition different from the first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part.
  • the third and fourth conductive parts satisfying the second condition that the shortest conductive path to reach the second condition that does not overlap the current path flowing through the metal plate MP are searched, and the conductive part PA1 that satisfies the first and second conditions is determined as the third conductive part.
  • the conductive part PD1 is selected as the fourth conductive part (step S3: conductive part selection step).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PB1 (first conductive unit) and connect the current supply unit CS to the conductive unit PC1 (second conductive unit).
  • the current I is supplied between the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part) by the current supply part CS (step S4: current supply step), and the current value Ic of the current I is set to Measurement is performed by the current detector AM (step S5) (see FIG. 6).
  • the conductive part selector 21 uses the scanner 31 to connect one terminal of the voltage detector VM1 to the conductive part PB1 (first conductive part) and the other terminal of the voltage detector VM1 to the conductive part PA1 (third conductive part).
  • the voltage detection unit VM1 measures the voltage V1 between the conductive part PB1 (first conductive part) and the conductive part PA1 (third conductive part) (step S6: first voltage detection step) (FIG. 6).
  • the conductive part selector 21 uses the scanner 31 to connect one terminal of the voltage detector VM2 to the conductive part PC1 (second conductive part) and the other terminal of the voltage detector VM2 to the conductive part PD1 (fourth conductive part).
  • the voltage detection unit VM2 measures the voltage V2 between the conductive part PC1 (second conductive part) and the conductive part PD1 (fourth conductive part) (step S7: second voltage detection step) (FIG. 6).
  • the conductive part PA1 (third conductive part) satisfies the first condition because it is different from the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part).
  • the shortest conductive path from the conductive part PA1 (third conductive part) to the conductive part PB1 (first conductive part) is the conductive path X from the conductive part PA1 to the connecting part RA, the metal plate MP, And a path reaching the conductive portion PB1 via the connection portion RB.
  • the current path A flowing through the metal plate MP and the conductive path X do not overlap the current I flowing between the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part). Accordingly, the conductive parts PA1 (third conductive part), PB1 (first conductive part), and PC1 (second conductive part) satisfy the first condition and the second condition.
  • the conductive part PD1 (fourth conductive part) is a conductive part different from the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part), the first condition is satisfied.
  • the shortest conductive path from the conductive part PD1 (fourth conductive part) to the conductive part PC1 (second conductive part) is as shown in FIG. And a path to the conductive part PC1 through the connection part RC.
  • the current path A flowing through the metal plate MP and the conductive path Y do not overlap the current I flowing between the conductive portion PB1 (first conductive portion) and the conductive portion PC1 (second conductive portion). Therefore, the conductive part PB1 (first conductive part), PC1 (second conductive part), and PD1 (fourth conductive part) satisfy the first condition and the second condition.
  • the conductive parts PD1 fourth conductive part
  • PB1 first conductive part
  • PC1 second conductive part
  • the resistance calculation unit 22 calculates the resistance value Rb of the connection part RB and the resistance value Rc of the connection part RC based on the following formulas (1) and (2) (step S8: resistance calculation step). ).
  • Rb V1 / Ic (1)
  • Rc V2 / Ic (2)
  • the current value Ic is not necessarily measured by the current detection unit AM.
  • the current detection unit AM may be omitted, and the current supply unit CS may output a current I having a preset current value Ic.
  • the conductive part selection unit 21 is not limited to the example of selecting the third conductive part and the fourth conductive part so as to satisfy the second condition described above, and the third conductive part and the fourth conductive part that do not satisfy the second condition.
  • a conductive part may be selected. Even when the third conductive portion and the fourth conductive portion that do not satisfy the second condition are selected, the resistance value of each connection portion can be individually measured.
  • FIG. 7 is an explanatory diagram for explaining an example of selecting a third conductive part and a fourth conductive part that do not satisfy the second condition.
  • the conductive portion PA1 is selected as the first conductive portion
  • the conductive portion PD1 is selected as the second conductive portion
  • the conductive portion PB1 is selected as the third conductive portion
  • the conductive portion PC1 is selected as the fourth conductive portion.
  • the third and fourth conductive portions do not satisfy the second condition.
  • the resistance calculation unit 22 can individually calculate the resistance value Ra of the connection part RA and the resistance value Rd of the connection part RD. .
  • the resistance value Ra of the connection portion RA calculated by the resistance calculation unit 22 includes the resistance value Rx of the conductive path X of the metal plate MP.
  • the resistance value Rd of the connection part RD calculated by the resistance calculation part 22 includes the resistance value Ry of the conductive path Y of the metal plate MP.
  • the planar conductors such as the metal plate MP and the inner layer pattern IP have very small resistance values Rx and Ry because the conductor area is wide.
  • the metal plate MP has a large conductor area and a thickness of 1 mm to 10 mm.
  • the resistance values Rx and Ry are extremely small and can be ignored because they are thick and wide in cross section.
  • step S3 by selecting the third and fourth conductive portions that satisfy the second condition, the voltages V1 and V2 do not include the voltage generated by the current I flowing through the metal plate MP. It is more preferable in that the accuracy of calculating the resistance value of the connecting portion can be further improved.
  • the conductive portion selection unit 21 When there is a connection portion for which the resistance value has not yet been calculated, the conductive portion selection unit 21 has a connection different from the connection portions RB and RC whose resistance values have already been calculated in order to calculate the resistance value of the new connection portion.
  • the conductive parts PD1, PE1 paired with the connection parts RD, RE, for example, are selected as new first and second conductive parts (step S11: conductive part selection step) (see FIG. 8).
  • the conductive part selector 21 has a first condition different from the new first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part.
  • the third and fourth conductive parts satisfying the second condition in which the shortest conductive path reaching the part does not overlap with the current path A flowing through the metal plate MP are searched, and the conductive part PC1 satisfying the first and second conditions is newly found.
  • the third conductive portion is selected, and the conductive portion PF1 is selected as the fourth conductive portion (step S12: conductive portion selection step).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PD1 (first conductive unit) and connect the current supply unit CS to the conductive unit PE1 (second conductive unit).
  • the current I is supplied between the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part) by the current supply part CS (step S13: current supply step), and the current value Ic of the current I is set to Measurement is performed by the current detection unit AM (step S14) (see FIG. 8).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM1 to the conductive unit PD1 (first conductive unit) and the other terminal of the voltage detection unit VM1 to the conductive unit PC1 (third conductive unit).
  • the voltage detection unit VM1 measures the voltage V1 between the conductive part PD1 (first conductive part) and the conductive part PC1 (third conductive part) (step S15: first voltage detection step) (FIG. 8).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM2 to the conductive unit PE1 (second conductive unit) and the other terminal of the voltage detection unit VM2 to the conductive unit PF1 (fourth conductive unit).
  • the voltage detection unit VM2 measures the voltage V2 between the conductive part PE1 (second conductive part) and the conductive part PF1 (fourth conductive part) (step S16: second voltage detection step) (FIG. 8).
  • the conductive part PC1 (third conductive part) satisfies the first condition because it is a different conductive part from the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part).
  • the shortest conductive path from the conductive part PC1 (third conductive part) to the conductive part PD1 (first conductive part) is the conductive path X from the conductive part PC1 to the connection part RC and the metal plate MP, And a path reaching the conductive portion PD1 via the connection portion RD.
  • the current path A and the conductive path X where the current I flowing between the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part) flows through the metal plate MP do not overlap. Accordingly, the conductive part PC1 (third conductive part), PD1 (first conductive part), and PE1 (second conductive part) satisfy the first condition and the second condition.
  • the conductive part PF1 (fourth conductive part) is a conductive part different from the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part), the first condition is satisfied.
  • the shortest conductive path from the conductive part PF1 (fourth conductive part) to the conductive part PE1 (second conductive part) is the conductive part Y from the conductive part PF1, the conductive path Y of the metal plate MP, And a path to the conductive part PE1 via the connection part RE.
  • the voltages V1 and V2 obtained in this way are substantially equal to the voltage generated by the current I flowing through the connection parts RD and RE, as in the case of the connection parts RB and RC described above.
  • the resistance calculation unit 22 calculates the resistance value Rd of the connection part RD and the resistance value Re of the connection part RE based on the following formulas (3) and (4) (step S17: resistance calculation step). ).
  • Rd V1 / Ic (3)
  • Re V2 / Ic (4)
  • connection parts RD and RE can be measured individually.
  • the conductive portion selection unit 21 calculates the resistance value of the new connection portion by connecting the connection portions RB, RC, RD, RE whose resistance values have already been calculated. Select another connection part, for example, the conductive parts PA1 and PF1 paired with the connection parts RA and RF as new first and second conductive parts (step S21: conductive part selection step).
  • the conductive part selector 21 has a first condition different from the new first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part.
  • the third and fourth conductive parts that satisfy the second condition in which the shortest conductive path leading to the part does not overlap with the current path flowing through the metal plate MP are searched.
  • the resistance measuring apparatus 1 includes a conductive portion on the substrate surface BS1 of the substrate WB1 that contacts the probe Pr of the measurement unit 121 and a conductive portion of the substrate surface BS1 of the substrate WB2 that contacts the probe Pr of the measurement unit 122 An example will be described in which a current cannot be passed or the voltage between the conductive parts on both sides cannot be measured.
  • step S22 there is no conductive part that satisfies the first condition and the second condition (step S22).
  • the case where there is no conductive part satisfying the first and second conditions means that the first and second conditions are satisfied and the conductive part is the third conductive part.
  • the conductive part is the fourth conductive part This means that there is no conductive part that can contact the probe Pr and measure the voltage between the first conductive part and the fourth conductive part by the second voltage detection part.
  • the case where there is no conductive part that satisfies the first and second conditions means that the first and second conditions are satisfied and the conductive part is the third conductive part. This means that there is no conductive part that can contact the probe Pr and measure the voltage between the first conductive part and the third conductive part by the first voltage detection part.
  • step S23 when there is only one conductive part that satisfies the first condition and the second condition, the conductive part selector 21 replaces the conductive parts PB1 and PE1 that satisfy the first condition and do not satisfy the second condition with new third and second conditions.
  • the four conductive portions are selected (step S23: conductive portion selection step).
  • step S23 when there is only one conductive part that satisfies the first condition and the second condition, the conductive part selector 21 newly adds a conductive part that satisfies the first condition and the second condition.
  • the conductive part that satisfies the first condition and does not satisfy the second condition may be selected as the other of the new third and fourth conductive parts.
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PA1 (first conductive unit) and connect the current supply unit CS to the conductive unit PF1 (second conductive unit).
  • the current I is supplied between the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part) by the current supply part CS (step S24: current supply process), and the current value Ic of the current I is set to Measurement is performed by the current detector AM (step S25) (see FIG. 9).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM1 to the conductive unit PA1 (first conductive unit) and the other terminal of the voltage detection unit VM1 to the conductive unit PB1 (third conductive unit).
  • the voltage detection unit VM1 measures the voltage V1 between the conductive part PA1 (first conductive part) and the conductive part PB1 (third conductive part) (step S26: first voltage detection step) (FIG. 9).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM2 to the conductive unit PF1 (second conductive unit) and the other terminal of the voltage detection unit VM2 to the conductive unit PE1 (fourth conductive unit).
  • the voltage detection unit VM2 measures the voltage V2 between the conductive unit PF1 (second conductive unit) and the conductive unit PE1 (fourth conductive unit) (step S27: second voltage detection step) (FIG. 9).
  • the first condition is satisfied.
  • the shortest conductive path from the conductive part PB1 (third conductive part) to the conductive part PA1 (first conductive part) is the conductive path X from the conductive part PB1 to the connection part RB, the metal plate MP, And a path reaching the conductive portion PA1 via the connection portion RA.
  • the current path A and the conductive path X where the current I flowing between the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part) flows through the metal plate MP overlap each other. Therefore, the conductive part PB1 (third conductive part), PA1 (first conductive part), and PF1 (second conductive part) do not satisfy the second condition.
  • the conductive part PE1 (fourth conductive part) is a conductive part different from the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part), the first condition is satisfied.
  • the shortest conductive path from the conductive part PE1 (fourth conductive part) to the conductive part PF1 (second conductive part) is the conductive part Y, the conductive part Y of the metal plate MP, the conductive path Y, And a path that reaches the conductive portion PF1 via the connection portion RF.
  • the resistance calculator 22 calculates the resistance value Ra of the connection portion RA and the resistance value Rf of the connection portion RF based on the following formulas (5) and (6) (step S28: resistance calculation step). ).
  • Ra V1 / Ic (5)
  • Rf V2 / Ic (6)
  • the resistance values of the connection portions RA and RF can be individually measured.
  • the voltages V1 and V2 measured in steps S26 and S27 include the voltage generated by the current I flowing through the conductive paths X and Y of the metal plate MP as described above.
  • the resistance values Ra and Rf calculated by the equations (5) and (6) include the resistance values Rx and Ry as errors. However, as described above, the resistance values Rx and Ry are minute and can be substantially ignored.
  • a planar conductor such as a conductive intermediate substrate B spreading in a planar shape, a substrate surface BS1 facing the planar conductor, and a conductive portion PA1 provided on the substrate surface BS1.
  • Resistance values Ra to Rf of the connection portions RA to RF of the substrate to be measured such as the intermediate substrate B having a pair of connection portions RA to RF that electrically connect the conductive portions PA1 to PF1 to the planar conductors Can be measured individually.
  • one conductive part may serve as the third conductive part and the fourth conductive part, that is, the third conductive part and the fourth conductive part may be the same conductive part.
  • the conductive portion selection unit 21 satisfies the first and second conditions for the third conductive portion and satisfies the first and second conditions for the fourth conductive portion. You may select as an electroconductive part which serves as a part.
  • FIG. 10 is an explanatory diagram for explaining the operation of the resistance measuring apparatus when the third conductive portion and the fourth conductive portion are the same conductive portion.
  • the conductive part PA1 serves as the first conductive part
  • the conductive part PC1 serves as the second conductive part
  • the conductive part PB1 serves as the third conductive part and the fourth conductive part. That is, the third conductive portion and the fourth conductive portion are the same conductive portion PB1.
  • the voltage detection unit VM1 measures the voltage between the conductive part PA1 (first conductive part) and the conductive part PB1 (third and fourth conductive parts) as the voltage V1.
  • the voltage detection unit VM2 measures the voltage between the conductive part PB1 (third and fourth conductive parts) and the conductive part PC1 (second conductive part) as the voltage V2.
  • the resistance calculation unit 22 calculates the resistance value Ra of the connection portion RA and the resistance value Rc of the connection portion RC based on the following formulas (7) and (8) (resistance calculation step).
  • Ra V1 / Ic (7)
  • Rc V2 / Ic (8)
  • the resistance calculation unit 22 can individually calculate the resistance value Ra of the connection part RA and the resistance value Rc of the connection part RC.
  • the current supply part CS, the current detection part AM, The voltage detection units VM1 and VM2 may be electrically connected to the conductive unit.
  • the resistance measuring device 1 may not include the voltage detection unit VM2, and the conductive unit selection unit 21 may be configured not to select the fourth conductive unit.
  • the conductive part selection unit 21 may select the first, second, third, and fourth conductive parts regardless of whether or not the second condition is satisfied. In addition, when selecting the new third and fourth conductive parts, the conductive part selection unit 21 may select a conductive part that satisfies the first condition different from the new first and second conductive parts. The same conductive parts as the third and fourth conductive parts may be selected as new third and fourth conductive parts. Moreover, the resistance measuring apparatus 1 does not include the conductive part selection unit 21, and the first, second, third, and fourth conductive parts may be appropriately set.
  • the resistance measuring apparatus includes a conductive planar conductor that extends in a planar shape, a substrate surface that faces the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion.
  • a resistance measuring device for measuring the resistance of the connection part of the substrate to be measured which has a pair of connection parts electrically connected to the planar conductor and has three or more pairs.
  • a current supply section for passing a current through the planar conductor between a first conductive section which is one of the conductive sections and a second conductive section which is a conductive section different from the first conductive section;
  • a first voltage detection unit for detecting a voltage between the third conductive unit and the first conductive unit, which is a conductive unit different from the first and second conductive units among the conductive units, and the current Based on the current passed by the supply unit and the voltage detected by the first voltage detection unit
  • a resistance calculation unit for calculating the resistance value of the connection portion to be the first conductive portion and the pair.
  • the current supply unit causes the connection part that is paired with the third conductive part in the path connecting the third conductive part and the first conductive part to be voltage-measured by the first voltage detection unit. Current does not flow.
  • the voltage measured by the first voltage detection unit includes the voltage drop of the connection part paired with the first conductive part, while the voltage drop of the connection part paired with the third conductive part is included. Absent.
  • the resistance value calculated by the resistance calculation unit based on the current supplied by the current supply unit and the voltage detected by the first voltage detection unit is the resistance value of the connection unit paired with the first conductive unit. Almost equal. Thereby, the resistance value of the connection part which becomes a pair with a 1st electroconductive part can be measured separately.
  • the resistance measuring device detects a voltage between a fourth conductive part and a second conductive part, which are conductive parts different from the first and second conductive parts among the conductive parts.
  • the resistance calculation unit further includes a voltage detection unit, and the resistance calculation unit is further paired with the second conductive unit based on a current passed by the current supply unit and a voltage detected by the second voltage detection unit. It is preferable to calculate the resistance value of the connection portion.
  • the current supply unit passes the connection part paired with the fourth conductive part in the path connecting the fourth conductive part and the second conductive part whose voltage is measured by the second voltage detection part. Current does not flow.
  • the voltage measured by the second voltage detection unit includes the voltage drop of the connection part paired with the second conductive part, while the voltage drop of the connection part paired with the fourth conductive part is included. Absent.
  • the resistance value calculated by the resistance calculation unit based on the current passed by the current supply unit and the voltage detected by the second voltage detection unit is the resistance value of the connection unit paired with the second conductive unit. Almost equal.
  • each connection part which makes a pair with the 1st and 2nd electroconductive part can be measured separately. Since the voltage measurement by the first and second voltage detectors can be performed in parallel and the resistance value of each connection part paired with the first and second conductive parts can be measured individually, the resistance measurement time is reduced. It becomes possible to do.
  • the fourth conductive part is preferably the same conductive part as the third conductive part.
  • one conductive portion serves as both the third conductive portion and the fourth conductive portion.
  • the resistance values of two connecting portions that are paired with two conductive portions (first and second conductive portions) among the three conductive portions that are the first, second, third, and fourth conductive portions are measured. can do. Therefore, in addition to the two conductive parts to be measured for resistance, another conductive part only needs to be secured, so that resistance measurement is facilitated.
  • a conductive part that is paired with a connection part different from the connection part for which the resistance value is calculated is selected as a new first conductive part, and the new conductive part among the conductive parts is selected.
  • a conductive part selection unit that selects a conductive part satisfying a first condition different from the first conductive part as a new second and third conductive part; and the current supply unit further includes the new first conductive part.
  • the resistance calculation unit further includes a resistance value of a connection unit paired with the new first conductive unit based on a current passed by the current supply unit and a voltage detected by the first voltage detection unit. Is preferably calculated.
  • the conductive part selection unit sequentially selects the conductive part paired with the connection part whose resistance value has not yet been measured as the first conductive part, so that each conductive part provided on the measurement target substrate. It is possible to sequentially measure the resistance values of the two.
  • a conductive part paired with a connection part different from the connection part for which the resistance value is calculated is selected as a new first and second conductive part
  • a conductive portion selecting section that selects a conductive portion that satisfies a first condition different from the new first and second conductive portions as a new third and fourth conductive portion
  • the current supply portion further includes: A current is caused to flow between the new first conductive part and the new second conductive part via the planar conductor, and the first voltage detection unit further includes the new third conductive part and the new third conductive part. A voltage between the first conductive part is detected, and the second voltage detection part further detects a voltage between the new fourth conductive part and the new second conductive part, and calculates the resistance.
  • the unit further detects the current passed by the current supply unit and the first and second voltage detection units. Based on the voltage and that, it is preferable to calculate the resistance value of said a new resistance value of the first conductive portion and the paired connection portions become new second conductive portion and the pair connection.
  • the conductive part selection unit is provided on the measured substrate by sequentially selecting the conductive parts that form a pair with the connection part whose resistance value has not been measured as the first and second conductive parts. It is possible to sequentially measure two resistance values of each conductive part.
  • the third conductive portion is a conductive portion different from the first conductive portion and the second conductive portion among the conductive portions, and is the shortest conductive portion from the third conductive portion to the first conductive portion. It is preferable that the path is a conductive part that does not overlap a current path that flows through the planar conductor of a current that is supplied by the current supply part.
  • the fourth conductive portion is a conductive portion different from the first and second conductive portions of the conductive portions, and is the shortest conductive portion from the fourth conductive portion to the second conductive portion. It is preferable that the path is a conductive part that does not overlap a current path that flows through the planar conductor of a current that is supplied by the current supply part.
  • the conductive part selection unit selects, as the first first conductive part, a conductive part paired with a connection part different from the connection part for which the resistance value has been calculated among the conductive parts,
  • the first condition that is different from the new first conductive part among the conductive parts and the shortest conductive path from the new third conductive part to the new first conductive part are caused to The new second conductive portion and the new second conductive portion so as to satisfy a second condition that does not overlap with a current path flowing through the planar conductor of a current flowing between the one conductive portion and the new second conductive portion. It is preferable to select three conductive parts.
  • the conductive part selection unit sequentially selects the conductive part paired with the connection part whose resistance value has not yet been measured as the first conductive part, so that each conductive part provided on the measurement target substrate. It becomes possible to measure the resistance value of each in turn.
  • the measurement accuracy of the voltage generated at the connection unit paired with the new first conductive unit As a result, the resistance calculation accuracy of the connection portion paired with the new first conductive portion by the resistance calculation portion is improved.
  • the conductive part selection unit satisfies the first condition and does not satisfy the second condition. It is preferable to select the third conductive portion.
  • the resistance calculation unit can also calculate the resistance value of the connection part paired with the conductive part that does not satisfy the second condition.
  • the conductive part selection unit selects, as the first and second conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value has been calculated among the conductive parts.
  • the shortest conductive path from the conductive part to the new second conductive part is the shortest conductive path of the current conductor flowing between the new first conductive part and the new second conductive part by the current supply part. It is preferable to select the new third conductive part and the new fourth conductive part so as to satisfy the second condition that does not overlap the flowing current path.
  • the conductive part selection unit is provided on the measured substrate by sequentially selecting the conductive parts that form a pair with the connection part whose resistance value has not been measured as the first and second conductive parts. Two resistance values of each conductive part can be sequentially measured.
  • the connection part paired with the new first and second conductive parts As a result of improving the measurement accuracy of the generated voltage, the calculation accuracy of the resistance value of the connection portion paired with the new first and second conductive portions by the resistance calculation portion is improved.
  • the conductive part selecting unit when there are no two or more conductive parts that satisfy the first and second conditions, the conductive part selecting unit satisfies the first condition and does not satisfy the second condition. It is preferable to select at least one of the second and third conductive parts.
  • the resistance calculation unit can also calculate the resistance value of the connection part paired with the conductive part that does not satisfy the second condition.
  • the resistance measuring method includes a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion.
  • a resistance measurement method for measuring the resistance of the connection portion of the substrate to be measured which has a pair with a connection portion electrically connected to the planar conductor and includes three or more pairs.
  • a current supplying step of passing a current between a first conductive part that is one of the parts and a second conductive part that is a different conductive part from the first conductive part, and the first of the conductive parts A first voltage detecting step for detecting a voltage between the first conductive portion and the third conductive portion, which is a conductive portion different from the first and second conductive portions, and the current passed through the current supply step and the first Based on the voltage detected by the one voltage detecting step. And a resistance calculation step of calculating a resistance value of the connection portion.
  • the current supply step causes the connection portion that is paired with the third conductive portion in the path connecting the third conductive portion and the first conductive portion to be voltage-measured in the first voltage detection step. Current does not flow.
  • the voltage measured by the first voltage detection step includes the voltage drop of the connection part paired with the first conductive part, while the voltage drop of the connection part paired with the third conductive part is included. Absent.
  • the resistance value calculated based on the current passed in the current supply step and the voltage detected in the first voltage detection step is the resistance of the connection portion paired with the first conductive portion. Almost equal to the value. Thereby, the resistance value of the connection part which becomes a pair with a 1st electroconductive part can be measured separately.
  • the resistance measuring device and the resistance measuring method having such a configuration include a conductive planar conductor spreading in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion. It is possible to individually measure the resistance of the connection portion of the substrate to be measured having a pair with a connection portion that is electrically connected to the planar conductor.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

In the present invention, an intermediate substrate B comprises: a metal plate MP that is flatly spread out; substrate surfaces BS1 facing the metal plate MP; and pairs of electroconduction sections PA1-PF1 provided to the substrate surfaces BS1 and connection sections RA-RF electrically connecting the electroconduction sections to the metal plate MP, with three or more such pairs being provided. With respect to the intermediate substrate, the following are provided: a current supply unit CS for allowing current to flow via the metal plate MP between the electroconduction section PB1 (first electroconduction section) and the electroconduction section PC1 (second electroconduction section), from among the electroconduction sections PA1-PF1; a voltage detection unit VM1 for detecting a voltage between the electroconduction section PA1 (third electroconduction section) and the electroconduction section PB1 (first electroconduction section); and a resistance calculation unit 22 for calculating a resistance value of the connection section RB that is paired with the electroconduction section PB1 (first electroconduction section) on the basis of a current I passed in by the current supply unit CS and the voltage detected by the voltage detection unit VM1.

Description

抵抗測定装置及び抵抗測定方法Resistance measuring device and resistance measuring method
 本発明は、基板の抵抗を測定する抵抗測定装置、及び抵抗測定方法に関する。 The present invention relates to a resistance measuring device and a resistance measuring method for measuring the resistance of a substrate.
 従来より、回路基板に形成されたビアのように、回路基板の一方の面から他方の面に亘って貫通するものを測定対象とするときに、当該測定対象に測定電流を流し、当該測定対象に生じた電圧を測定することによって、その電流値と電圧値とから当該測定対象の抵抗値を測定する基板検査装置が知られている(例えば、特許文献1参照。)。 Conventionally, when a measurement object that penetrates from one surface of the circuit board to the other surface, such as a via formed in the circuit board, a measurement current is supplied to the measurement object, and the measurement object There is known a substrate inspection apparatus that measures a resistance value of a measurement target from a current value and a voltage value by measuring a voltage generated in (see, for example, Patent Document 1).
特開2012-117991号公報JP 2012-117991 A
 ところで、面状に拡がる導体(以下、面状導体と称する)を内部に備えた基板において、基板表面のパッド、バンプ、配線等の導電部と面状導体とが基板の厚み方向に電気的に接続された構造の基板がある。図11、図12は、このような基板の一例を示す概念的な模式図である。 By the way, in a substrate provided with a conductor that expands in a planar shape (hereinafter referred to as a planar conductor), conductive portions such as pads, bumps, and wiring on the substrate surface and the planar conductor are electrically connected in the thickness direction of the substrate. There is a substrate with a connected structure. 11 and 12 are conceptual schematic diagrams showing examples of such a substrate.
 図11は、基板内層に面状の内層パターンIPを備えた基板の一例である多層基板WBを示す概念的な模式図である。図11に示す多層基板WBは、その基板面BSにパッドや配線パターン等の導電部PA,PBが形成されている。導電部PA,PBは、ビアや配線パターン等の接続部RA,RBによって内層パターンIPと電気的に接続されている。多層基板WBの例では、内層パターンIPが面状導体に相当する。 FIG. 11 is a conceptual schematic diagram showing a multilayer substrate WB, which is an example of a substrate having a planar inner layer pattern IP on the substrate inner layer. The multilayer substrate WB shown in FIG. 11 has conductive portions PA and PB such as pads and wiring patterns formed on the substrate surface BS. The conductive portions PA and PB are electrically connected to the inner layer pattern IP by connection portions RA and RB such as vias and wiring patterns. In the example of the multilayer substrate WB, the inner layer pattern IP corresponds to a planar conductor.
 また、基板の製造方法として、導電性の金属板を土台としてこの金属板の両面にプリント配線基板を積層形成し、形成された基板を土台の金属板から剥離することによって、二枚のプリント配線基板を形成する方法がある。このような基板の製造方法において、土台の金属板から基板を剥離する前の状態の基板(以下、中間基板と称する)は、金属板が二枚の基板に挟まれた態様を有している。 Also, as a substrate manufacturing method, a printed metal board is laminated on both sides of a conductive metal plate as a base, and the two printed wirings are peeled off from the base metal plate. There is a method of forming a substrate. In such a substrate manufacturing method, the substrate (hereinafter referred to as an intermediate substrate) in a state before the substrate is peeled off from the base metal plate has an aspect in which the metal plate is sandwiched between two substrates. .
 図12は、このような中間基板Bの一例を示す概念的な模式図である。図12に示す中間基板Bは、金属板MPの一方の面に基板WB1が形成され、金属板MPの他方の面に基板WB2が形成されている。基板WB1の基板面BS1には、パッドや配線パターン等の導電部PA1,PB1,・・・,PF1が形成されている。基板WB1の金属板MPとの接触面BS2には、パッドや配線パターン等の導電部PA2,PB2,・・・,PF2が形成されている。金属板MPは、例えば厚さが1mm~10mm程度の導電性を有する金属板である。 FIG. 12 is a conceptual schematic diagram showing an example of such an intermediate substrate B. In the intermediate substrate B shown in FIG. 12, the substrate WB1 is formed on one surface of the metal plate MP, and the substrate WB2 is formed on the other surface of the metal plate MP. Conductive portions PA1, PB1,..., PF1 such as pads and wiring patterns are formed on the substrate surface BS1 of the substrate WB1. Conductive portions PA2, PB2,..., PF2, such as pads and wiring patterns, are formed on the contact surface BS2 of the substrate WB1 with the metal plate MP. The metal plate MP is a conductive metal plate having a thickness of about 1 mm to 10 mm, for example.
 導電部PA1~PF1は、ビアや配線パターン等の接続部RA~RFによって導電部PA2~PF2と電気的に接続されている。導電部PA2~PF2は、金属板MPと密着、導通しているので、導電部PA1~PF1は、接続部RA~RFによって金属板MPと電気的に接続されている。導電部PA1と接続部RAとが対になり、導電部PB1と接続部RBとが対になり、それぞれ導電部と接続部とが対になっている。基板WB2は、基板WB1と同様に構成されているのでその説明を省略する。中間基板Bの例では、金属板MPが面状導体に相当する。 The conductive portions PA1 to PF1 are electrically connected to the conductive portions PA2 to PF2 through connection portions RA to RF such as vias and wiring patterns. Since the conductive portions PA2 to PF2 are in close contact with and conductive with the metal plate MP, the conductive portions PA1 to PF1 are electrically connected to the metal plate MP through the connection portions RA to RF. The conductive portion PA1 and the connection portion RA are paired, the conductive portion PB1 and the connection portion RB are paired, and the conductive portion and the connection portion are respectively paired. Since the substrate WB2 is configured in the same manner as the substrate WB1, its description is omitted. In the example of the intermediate substrate B, the metal plate MP corresponds to a planar conductor.
 多層基板WBや中間基板B等の検査として、接続部RA,RBの抵抗値Ra,Rbを測定する場合がある。 As the inspection of the multilayer substrate WB, the intermediate substrate B, etc., the resistance values Ra and Rb of the connection portions RA and RB may be measured.
 図13は、図12に示す中間基板Bの接続部RA,RBの抵抗値Ra,Rbを測定する測定方法を説明するための説明図である。接続部RA,RBの抵抗値Ra,Rbを測定するには、導電部PA1と導電部PB1との間に測定用の電流Iを流し、導電部PA1と導電部PB1との間に生じた電圧Vを測定し、抵抗値をV/Iとして算出することが考えられる。この場合、V/Iによって算出される抵抗値は、Ra+Rbとなる。 FIG. 13 is an explanatory diagram for explaining a measurement method for measuring the resistance values Ra and Rb of the connection portions RA and RB of the intermediate substrate B shown in FIG. In order to measure the resistance values Ra and Rb of the connection parts RA and RB, a current I for measurement is passed between the conductive part PA1 and the conductive part PB1, and a voltage generated between the conductive part PA1 and the conductive part PB1. It is conceivable to measure V and calculate the resistance value as V / I. In this case, the resistance value calculated by V / I is Ra + Rb.
 しかしながら、二カ所の接続部の合計抵抗値ではなく、各接続部の抵抗値を個別に測定したいというニーズがある。 However, there is a need to measure the resistance value of each connection part individually, not the total resistance value of the two connection parts.
 本発明の目的は、面状に拡がる導電性の面状導体と、面状導体と対向する基板面と、基板面に設けられた導電部とその導電部を前記面状導体に電気的に接続する接続部との対とを有する被測定基板の各接続部の抵抗を個別に測定することができる抵抗測定装置、及び抵抗測定方法を提供することである。 An object of the present invention is to electrically connect a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion to the planar conductor. Another object of the present invention is to provide a resistance measuring device and a resistance measuring method capable of individually measuring the resistance of each connecting portion of a substrate to be measured having a pair with the connecting portion.
 本発明の一局面に従う抵抗測定装置は、面状に拡がる導電性の面状導体と、前記面状導体と対向する基板面と、前記基板面に設けられた導電部とその導電部を前記面状導体に電気的に接続する接続部との対とを有すると共に当該対を三つ以上備える被測定基板の前記接続部の抵抗を測定するための抵抗測定装置であって、前記三つ以上の導電部のうちの一つである第一導電部と前記第一導電部とは異なる導電部である第二導電部との間に前記面状導体を介して電流を流す電流供給部と、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部である第三導電部と前記第一導電部との間の電圧を検出する第一電圧検出部と、前記電流供給部によって流された電流と前記第一電圧検出部によって検出された電圧とに基づいて、前記第一導電部と対になる接続部の抵抗値を算出する抵抗算出部とを備える。 A resistance measuring device according to one aspect of the present invention includes a conductive planar conductor that extends in a planar shape, a substrate surface that faces the planar conductor, a conductive portion provided on the substrate surface, and a conductive portion provided on the surface. A resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured, which has a pair of connection portions electrically connected to the conductor and has three or more pairs. A current supply section for passing a current through the planar conductor between a first conductive section that is one of the conductive sections and a second conductive section that is a conductive section different from the first conductive section; A first voltage detection unit for detecting a voltage between a third conductive unit and the first conductive unit, which are different from the first and second conductive units, and the current supply unit. Based on the current passed by the first voltage detector and the voltage detected by the first voltage detector. And a resistance calculation unit for calculating the resistance value of the connection portions become conductive portion and pair.
 また、本発明の一局面に従う抵抗測定方法は、面状に拡がる導電性の面状導体と、前記面状導体と対向する基板面と、前記基板面に設けられた導電部とその導電部を前記面状導体に電気的に接続する接続部との対とを有すると共に当該対を三つ以上備える被測定基板の前記接続部の抵抗を測定するための抵抗測定方法であって、前記各導電部のうちの一つである第一導電部と前記第一導電部とは異なる導電部である第二導電部との間に電流を流す電流供給工程と、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部である第三導電部と前記第一導電部との間の電圧を検出する第一電圧検出工程と、前記電流供給工程によって流された電流と前記第一電圧検出工程によって検出された電圧とに基づいて、前記第一導電部と対になる接続部の抵抗値を算出する抵抗算出工程とを含む。 Moreover, the resistance measuring method according to one aspect of the present invention includes a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion. A resistance measurement method for measuring the resistance of the connection portion of the substrate to be measured, which has a pair with a connection portion electrically connected to the planar conductor and includes three or more pairs. A current supplying step of passing a current between a first conductive part that is one of the parts and a second conductive part that is a different conductive part from the first conductive part, and the first of the conductive parts A first voltage detecting step for detecting a voltage between the first conductive portion and the third conductive portion, which is a conductive portion different from the first and second conductive portions, and the current passed through the current supply step and the first Based on the voltage detected by the one voltage detecting step. And a resistance calculation step of calculating a resistance value of the connection portion.
本発明の一実施形態に係る抵抗測定方法を用いる抵抗測定装置の構成を概念的に示す模式図である。It is a schematic diagram which shows notionally the structure of the resistance measuring apparatus using the resistance measuring method which concerns on one Embodiment of this invention. 図1に示す測定部の電気的構成の一例を示すブロック図である。FIG. 2 is a block diagram illustrating an example of an electrical configuration of a measurement unit illustrated in FIG. 1. 図1に示す抵抗測定装置の動作の一例を示すフローチャートである。It is a flowchart which shows an example of operation | movement of the resistance measuring apparatus shown in FIG. 図1に示す抵抗測定装置の動作の一例を示すフローチャートであるIt is a flowchart which shows an example of operation | movement of the resistance measuring apparatus shown in FIG. 図1に示す抵抗測定装置の動作の一例を示すフローチャートであるIt is a flowchart which shows an example of operation | movement of the resistance measuring apparatus shown in FIG. 図1に示す抵抗測定装置の動作を説明するための説明図である。It is explanatory drawing for demonstrating operation | movement of the resistance measuring apparatus shown in FIG. 図1に示す抵抗測定装置の動作を説明するための説明図である。It is explanatory drawing for demonstrating operation | movement of the resistance measuring apparatus shown in FIG. 図1に示す抵抗測定装置の動作を説明するための説明図である。It is explanatory drawing for demonstrating operation | movement of the resistance measuring apparatus shown in FIG. 図1に示す抵抗測定装置の動作を説明するための説明図である。It is explanatory drawing for demonstrating operation | movement of the resistance measuring apparatus shown in FIG. 第三導電部と第四導電部とを同一の導電部とした場合の抵抗測定装置の動作を説明するための説明図である。It is explanatory drawing for demonstrating operation | movement of a resistance measuring apparatus at the time of making a 3rd electroconductive part and a 4th electroconductive part into the same electroconductive part. 基板内層に面状の内層パターンを備えた基板の一例である多層基板を示す概念的な模式図である。It is a notional schematic diagram showing a multilayer substrate which is an example of a substrate having a planar inner layer pattern on the substrate inner layer. 中間基板の一例を示す概念的な模式図である。It is a notional schematic diagram showing an example of an intermediate substrate. 図12に示す中間基板の抵抗値を測定する測定方法を説明するための説明図である。It is explanatory drawing for demonstrating the measuring method which measures the resistance value of the intermediate | middle board | substrate shown in FIG.
 以下、本発明の一局面に従う実施形態を図面に基づいて説明する。なお、各図において同一の符号を付した構成は、同一の構成であることを示し、その説明を省略する。図1は、本発明の一実施形態に係る抵抗測定方法を用いる抵抗測定装置1の構成を概念的に示す模式図である。図1に示す抵抗測定装置1は、測定対象となる被測定基板の抵抗を測定するための装置である。抵抗測定装置1は、測定された抵抗値に基づき被測定基板の良否を判定する基板検査装置であってもよい。 Hereinafter, an embodiment according to one aspect of the present invention will be described with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted. FIG. 1 is a schematic diagram conceptually showing the configuration of a resistance measuring apparatus 1 using a resistance measuring method according to an embodiment of the present invention. A resistance measuring apparatus 1 shown in FIG. 1 is an apparatus for measuring the resistance of a measurement target substrate to be measured. The resistance measuring device 1 may be a substrate inspection device that determines the quality of a measured substrate based on the measured resistance value.
 被測定基板は、例えば中間基板や多層基板であり、半導体パッケージ用のパッケージ基板、フィルムキャリア、プリント配線基板、フレキシブル基板、セラミック多層配線基板、液晶ディスプレイやプラズマディスプレイ用の電極板、及びこれらの基板を製造する過程の中間基板であってもよい。図11に示す多層基板WB、及び図12に示す中間基板Bは、被測定基板の一例に相当している。図1では、被測定基板として中間基板Bが抵抗測定装置1に取り付けられた例を示している。 The substrate to be measured is, for example, an intermediate substrate or a multilayer substrate, a package substrate for a semiconductor package, a film carrier, a printed wiring substrate, a flexible substrate, a ceramic multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, and these substrates. It may be an intermediate substrate in the process of manufacturing. The multilayer substrate WB shown in FIG. 11 and the intermediate substrate B shown in FIG. 12 correspond to an example of a substrate to be measured. FIG. 1 shows an example in which an intermediate substrate B is attached to the resistance measuring apparatus 1 as a substrate to be measured.
 図1に示す抵抗測定装置1は、筐体112を有している。筐体112の内部空間には、基板固定装置110と、測定部121と、測定部122と、測定部移動機構125と、制御部20とが主に設けられている。基板固定装置110は、測定対象の中間基板Bを所定の位置に固定するように構成されている。 The resistance measuring device 1 shown in FIG. In the internal space of the housing 112, a substrate fixing device 110, a measurement unit 121, a measurement unit 122, a measurement unit moving mechanism 125, and a control unit 20 are mainly provided. The substrate fixing device 110 is configured to fix the intermediate substrate B to be measured at a predetermined position.
 測定部121は、基板固定装置110に固定された中間基板Bの上方に位置する。測定部122は、基板固定装置110に固定された中間基板Bの下方に位置する。測定部121,122は、中間基板Bに形成された導電部にプローブを接触させるための測定治具4U,4Lを備えている。 The measurement unit 121 is located above the intermediate substrate B fixed to the substrate fixing device 110. The measurement unit 122 is located below the intermediate substrate B fixed to the substrate fixing device 110. The measurement parts 121 and 122 include measurement jigs 4U and 4L for bringing the probe into contact with the conductive part formed on the intermediate substrate B.
 測定治具4U,4Lには、複数のプローブPrが取り付けられている。測定治具4U,4Lは、中間基板Bの表面に形成された測定対象の導電部の配置と対応するように複数のプローブPrを配置、保持する。測定部移動機構125は、制御部20からの制御信号に応じて測定部121,122を筐体112内で適宜移動させ、測定治具4U,4LのプローブPrを中間基板Bの各導電部に接触させる。 A plurality of probes Pr are attached to the measurement jigs 4U and 4L. The measuring jigs 4U and 4L arrange and hold a plurality of probes Pr so as to correspond to the arrangement of the conductive parts to be measured formed on the surface of the intermediate substrate B. The measurement unit moving mechanism 125 appropriately moves the measurement units 121 and 122 in the housing 112 in accordance with a control signal from the control unit 20, and the probes Pr of the measurement jigs 4U and 4L are moved to the respective conductive units of the intermediate substrate B. Make contact.
 なお、抵抗測定装置1は、測定部121,122のうちいずれか一方のみを備えてもよい。そして、抵抗測定装置1は、いずれか一方の測定部121,122によって、被測定基板を表裏反転させてその両面の測定を行うようにしてもよい。 The resistance measuring device 1 may include only one of the measurement units 121 and 122. And the resistance measuring apparatus 1 may be made to measure the both surfaces by reversing the substrate to be measured by either one of the measurement units 121 and 122.
 制御部20は、例えば、所定の演算処理を実行するCPU(Central Processing Unit)と、データを一時的に記憶するRAM(Random Access Memory)と、所定の制御プログラムを記憶するROM(Read Only Memory)やHDD(Hard Disk Drive)等の記憶部と、これらの周辺回路等とを備えて構成されている。そして、制御部20は、例えば記憶部に記憶された制御プログラムを実行することにより、導電部選択部21及び抵抗算出部22として機能する。 The control unit 20 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores a predetermined control program. And a storage unit such as an HDD (Hard Disk Drive), and peripheral circuits thereof. And the control part 20 functions as the electroconductive part selection part 21 and the resistance calculation part 22, for example by running the control program memorize | stored in the memory | storage part.
 図2は、図1に示す測定部121の電気的構成の一例を示すブロック図である。なお、測定部122は、測定部121と同様に構成されているのでその説明を省略する。図2に示す測定部121は、スキャナ部31、電流供給部CS、電圧検出部VM1(第一電圧検出部)、電圧検出部VM2(第二電圧検出部)、電流検出部AM、及び複数のプローブPrを備えている。 FIG. 2 is a block diagram showing an example of an electrical configuration of the measurement unit 121 shown in FIG. Note that the measurement unit 122 is configured in the same manner as the measurement unit 121, and thus the description thereof is omitted. The measurement unit 121 illustrated in FIG. 2 includes a scanner unit 31, a current supply unit CS, a voltage detection unit VM1 (first voltage detection unit), a voltage detection unit VM2 (second voltage detection unit), a current detection unit AM, and a plurality of A probe Pr is provided.
 電流供給部CSは、制御部20からの制御信号に応じた電流Iを出力する定電流回路である。電圧検出部VM1,VM2は電圧を測定し、その電圧値を制御部20へ送信する電圧検出回路である。電流検出部AMは、電流Iを測定し、その電流値Icを制御部20へ送信する電流検出回路である。なお、電圧検出部VM2を備えない構成としてもよい。 The current supply unit CS is a constant current circuit that outputs a current I according to a control signal from the control unit 20. The voltage detection units VM <b> 1 and VM <b> 2 are voltage detection circuits that measure a voltage and transmit the voltage value to the control unit 20. The current detection unit AM is a current detection circuit that measures the current I and transmits the current value Ic to the control unit 20. The voltage detector VM2 may not be provided.
 スキャナ部31は、例えばトランジスタやリレースイッチ等のスイッチング素子を用いて構成された切り替え回路である。スキャナ部31は、中間基板Bに抵抗測定用の電流Iを供給するための電流端子+F,-Fと、電流Iによって中間基板Bの導電部間に生じた電圧を検出するための電圧検出端子+S1,-S1,+S2,-S2とを備えている。また、スキャナ部31には、複数のプローブPrが電気的に接続されている。スキャナ部31は、制御部20からの制御信号に応じて電流端子+F,-F及び電圧検出端子+S1,-S1,+S2,-S2と、複数のプローブPrとの間の接続関係を切り替える。 The scanner unit 31 is a switching circuit configured using switching elements such as transistors and relay switches. The scanner unit 31 includes current terminals + F and −F for supplying a resistance measurement current I to the intermediate substrate B, and a voltage detection terminal for detecting a voltage generated between the conductive portions of the intermediate substrate B by the current I. + S1, -S1, + S2, and -S2. A plurality of probes Pr are electrically connected to the scanner unit 31. The scanner unit 31 switches the connection relationship between the current terminals + F and −F and the voltage detection terminals + S1, −S1, + S2, and −S2 and the plurality of probes Pr according to a control signal from the control unit 20.
 電流供給部CSは、その出力端子の一端が回路グラウンドに接続され、他端が電流端子+Fに接続されている。電流検出部AMは、その一端が電流端子-Fに接続され、他端が回路グラウンドに接続されている。電圧検出部VM1は、その一端が電圧検出端子+S1に接続され、他端が電圧検出端子-S1に接続されている。電圧検出部VM2は、その一端が電圧検出端子+S2に接続され、他端が電圧検出端子-S2に接続されている。 The current supply part CS has one end of its output terminal connected to the circuit ground and the other end connected to the current terminal + F. The current detection unit AM has one end connected to the current terminal -F and the other end connected to the circuit ground. The voltage detection unit VM1 has one end connected to the voltage detection terminal + S1 and the other end connected to the voltage detection terminal -S1. The voltage detection unit VM2 has one end connected to the voltage detection terminal + S2 and the other end connected to the voltage detection terminal -S2.
 そして、スキャナ部31は、制御部20からの制御信号に応じて、電流端子+F,-F及び電圧検出端子+S1,-S1,+S2,-S2を任意のプローブPrに導通接続可能にされている。これにより、スキャナ部31は、制御部20からの制御信号に応じて、プローブPrが接触している任意の導体部間に電流Iを流し、その電流Iを電流検出部AMによって測定させ、任意の導体部間に生じた電圧Vを電圧検出部VM1,VM2によって測定させることが可能にされている。 The scanner unit 31 can connect the current terminals + F and −F and the voltage detection terminals + S1, −S1, + S2, and −S2 to an arbitrary probe Pr in accordance with a control signal from the control unit 20. . As a result, the scanner unit 31 causes the current I to flow between any conductors in contact with the probe Pr in accordance with a control signal from the control unit 20, and causes the current detection unit AM to measure the current I. The voltage V generated between the conductor portions can be measured by the voltage detection units VM1 and VM2.
 なお、電流供給部CSは、スキャナ部31を介して中間基板Bに電流Iを流すことができればよく、電流供給部CSの一端が回路グラウンドに接続される例に限らない。例えば、電流供給部CSの一端と電流検出部AMの他端とが接続されて電流ループが形成される構成であってもよい。また、電流検出部AMは、電流Iが流れる経路上に配置されればよく、必ずしも電流端子-Fに接続される例に限らない。例えば、電流検出部AMは、電流供給部CSと直列接続されて、電流端子+Fに接続されてもよい。 The current supply unit CS is not limited to the example in which one end of the current supply unit CS is connected to the circuit ground as long as the current I can flow through the intermediate substrate B via the scanner unit 31. For example, the current loop may be formed by connecting one end of the current supply unit CS and the other end of the current detection unit AM. In addition, the current detection unit AM may be disposed on the path through which the current I flows, and is not necessarily limited to the example connected to the current terminal -F. For example, the current detection unit AM may be connected in series with the current supply unit CS and connected to the current terminal + F.
 これにより、制御部20は、スキャナ部31へ制御信号を出力することで、電流供給部CSにより電流Iを任意のプローブPr間に流させ、任意のプローブPr間の電圧を電圧検出部VM1,VM2によって検出させることが可能にされている。 As a result, the control unit 20 outputs a control signal to the scanner unit 31 so that the current supply unit CS causes the current I to flow between the arbitrary probes Pr, and the voltage between the arbitrary probes Pr is detected by the voltage detection unit VM1, VM1. It is possible to be detected by VM2.
 導電部選択部21は、プローブPrが接触している導電部のうちから、第一、第二、第三、及び第四導電部を選択する。第一及び第二導電部として選択された導電部と対になる接続部の抵抗値が抵抗算出部22によって算出されるので、導電部選択部21は、まだ抵抗値が算出されていない接続部と対になる新たな導電部を第一及び第二導電部として順次、選択することによって、最終的に抵抗値を測定しようとしている全ての接続部の抵抗値を測定するようになっている。 The conductive part selector 21 selects the first, second, third, and fourth conductive parts from the conductive parts in contact with the probe Pr. Since the resistance calculation unit 22 calculates the resistance value of the connection part paired with the conductive part selected as the first and second conductive parts, the conductive part selection part 21 is a connection part for which the resistance value has not yet been calculated. By sequentially selecting new conductive parts that are paired with each other as the first and second conductive parts, the resistance values of all the connection parts for which the resistance value is finally measured are measured.
 導電部選択部21は、スキャナ部31によって、第一導電部に接触しているプローブPrと電流検出部AM(電流端子-F)とを接続させ、第二導電部に接触しているプローブPrと電流供給部CS(電流端子+F)とを接続させ、第三導電部に接触しているプローブPrと電圧検出部VM1の一端(電圧検出端子+S1)とを接続させ、第一導電部に接触しているプローブPrと電圧検出部VM1の他端(電圧検出端子-S1)とを接続させ、第二導電部に接触しているプローブPrと電圧検出部VM2の一端(電圧検出端子+S2)とを接続させ、第四導電部に接触しているプローブPrと電圧検出部VM2の他端(電圧検出端子-S2)とを接続させる(図6参照)。 The conductive part selection unit 21 connects the probe Pr that is in contact with the first conductive part and the current detection unit AM (current terminal -F) by the scanner unit 31 and the probe Pr that is in contact with the second conductive part. And the current supply part CS (current terminal + F) are connected, the probe Pr that is in contact with the third conductive part is connected to one end (voltage detection terminal + S1) of the voltage detection part VM1, and is in contact with the first conductive part The probe Pr and the other end (voltage detection terminal -S1) of the voltage detection unit VM1, and the probe Pr that is in contact with the second conductive unit and one end of the voltage detection unit VM2 (voltage detection terminal + S2) And the probe Pr in contact with the fourth conductive portion and the other end (voltage detection terminal -S2) of the voltage detection unit VM2 are connected (see FIG. 6).
 これによって、導電部選択部21は、電流供給部CSによって第一導電部と第二導電部との間に金属板MPを介して電流を流させ、電圧検出部VM1によって第一導電部と第三導電部との間の電圧を検出させ、電圧検出部VM2によって第二導電部と第四導電部との間の電圧を検出させる。 As a result, the conductive part selector 21 causes the current supply part CS to pass a current between the first conductive part and the second conductive part via the metal plate MP, and the voltage detection part VM1 causes the first conductive part and the second conductive part to flow. The voltage between the three conductive portions is detected, and the voltage between the second conductive portion and the fourth conductive portion is detected by the voltage detection unit VM2.
 抵抗算出部22は、電流検出部AMによって測定された電流値Icすなわち電流供給部CSによって流された電流Iと、電圧検出部VM1によって検出された電圧V1とに基づいて、第一導電部と対になる接続部の抵抗値を算出する。また、抵抗算出部22は、電流値Icと、電圧検出部VM2によって検出された電圧V2とに基づいて、第二導電部と対になる接続部の抵抗値を算出する。 Based on the current value Ic measured by the current detection unit AM, that is, the current I passed by the current supply unit CS, and the voltage V1 detected by the voltage detection unit VM1, the resistance calculation unit 22 Calculate the resistance value of the pair of connections. Further, the resistance calculation unit 22 calculates the resistance value of the connection part paired with the second conductive part, based on the current value Ic and the voltage V2 detected by the voltage detection part VM2.
 次に、上述の抵抗測定装置1の動作について説明する。被測定基板が中間基板Bである場合を例に、測定部121を用いて基板WB1の抵抗測定を行う抵抗測定方法について説明する。測定部122を用いて基板WB2の抵抗測定を行う場合は、測定部121を用いて基板WB1の抵抗測定を行う場合と同様であるのでその説明を省略する。 Next, the operation of the resistance measuring apparatus 1 will be described. A resistance measurement method for measuring the resistance of the substrate WB1 using the measurement unit 121 will be described by taking the case where the substrate to be measured is the intermediate substrate B as an example. Since the measurement of the resistance of the substrate WB2 using the measurement unit 122 is the same as the measurement of the resistance of the substrate WB1 using the measurement unit 121, the description thereof is omitted.
 図3~図5は、本発明の一実施形態に係る抵抗測定方法を用いる抵抗測定装置1の動作の一例を示すフローチャートである。図3~図5に示すフローチャートは、中間基板Bの測定を行う場合について例示している。図6~図9は、図1に示す抵抗測定装置1の動作を説明するための説明図である。図6~図9では、説明を簡単にするためスキャナ部31の記載を省略している。 3 to 5 are flowcharts showing an example of the operation of the resistance measuring apparatus 1 using the resistance measuring method according to the embodiment of the present invention. The flowcharts shown in FIG. 3 to FIG. 5 exemplify the case where the intermediate substrate B is measured. 6 to 9 are explanatory diagrams for explaining the operation of the resistance measuring apparatus 1 shown in FIG. 6 to 9, the description of the scanner unit 31 is omitted for the sake of simplicity.
 まず、制御部20は、測定部移動機構125によって測定部121を移動させ、基板固定装置110に固定された中間基板Bに測定治具4UのプローブPrを接触させる(ステップS1)。図6に示す例では、いわゆる四端子測定法によって抵抗測定する場合を例示しており、導電部PA1~PF1のそれぞれに、プローブPrが二つずつ接触する。 First, the control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 to bring the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1). In the example shown in FIG. 6, a case where resistance is measured by a so-called four-terminal measurement method is illustrated, and two probes Pr are in contact with each of the conductive portions PA1 to PF1.
 なお、抵抗測定装置1は、四端子測定法によって抵抗測定を行う例に限られず、各導電部にプローブPrを一つずつ接触させ、一つのプローブPrで電流供給と電圧測定とを兼用する構成としてもよい。 The resistance measuring apparatus 1 is not limited to the example of performing resistance measurement by the four-terminal measurement method, and a configuration in which the probe Pr is brought into contact with each conductive portion one by one and the current supply and the voltage measurement are combined with one probe Pr. It is good.
 次に、導電部選択部21は、導電部PA1~PF1のうち任意の導電部、例えば導電部PB1と導電部PC1とを選択し、導電部PB1を第一導電部、導電部PC1を第二導電部とする(ステップS2:導電部選択工程)。 Next, the conductive part selection unit 21 selects an arbitrary conductive part among the conductive parts PA1 to PF1, for example, the conductive part PB1 and the conductive part PC1, the conductive part PB1 as the first conductive part, and the conductive part PC1 as the second. A conductive portion is set (step S2: conductive portion selection step).
 次に、導電部選択部21は、第一及び第二導電部と異なる第一条件と、第三導電部から第一導電部に至る最短の導電経路及び第四導電部から第二導電部に至る最短の導電経路が、金属板MPを流れる電流経路と重ならない第二条件とを満たす第三及び第四導電部を検索し、第一及び第二条件を満たす導電部PA1を第三導電部とし、導電部PD1を第四導電部として選択する(ステップS3:導電部選択工程)。 Next, the conductive part selection unit 21 changes the first condition different from the first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part. The third and fourth conductive parts satisfying the second condition that the shortest conductive path to reach the second condition that does not overlap the current path flowing through the metal plate MP are searched, and the conductive part PA1 that satisfies the first and second conditions is determined as the third conductive part. Then, the conductive part PD1 is selected as the fourth conductive part (step S3: conductive part selection step).
 次に、導電部選択部21は、スキャナ部31によって、電流検出部AMを導電部PB1(第一導電部)に接続させ電流供給部CSを導電部PC1(第二導電部)に接続させて、電流供給部CSによって導電部PB1(第一導電部)と導電部PC1(第二導電部)との間に電流Iを供給させ(ステップS4:電流供給工程)、電流Iの電流値Icを電流検出部AMによって測定させる(ステップS5)(図6参照)。 Next, the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PB1 (first conductive unit) and connect the current supply unit CS to the conductive unit PC1 (second conductive unit). The current I is supplied between the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part) by the current supply part CS (step S4: current supply step), and the current value Ic of the current I is set to Measurement is performed by the current detector AM (step S5) (see FIG. 6).
 次に、導電部選択部21は、スキャナ部31によって電圧検出部VM1の一方端子を導電部PB1(第一導電部)に、電圧検出部VM1の他方端子を導電部PA1(第三導電部)に接続させて、電圧検出部VM1によって導電部PB1(第一導電部)と導電部PA1(第三導電部)との間の電圧V1を測定させる(ステップS6:第一電圧検出工程)(図6参照)。 Next, the conductive part selector 21 uses the scanner 31 to connect one terminal of the voltage detector VM1 to the conductive part PB1 (first conductive part) and the other terminal of the voltage detector VM1 to the conductive part PA1 (third conductive part). And the voltage detection unit VM1 measures the voltage V1 between the conductive part PB1 (first conductive part) and the conductive part PA1 (third conductive part) (step S6: first voltage detection step) (FIG. 6).
 次に、導電部選択部21は、スキャナ部31によって電圧検出部VM2の一方端子を導電部PC1(第二導電部)に、電圧検出部VM2の他方端子を導電部PD1(第四導電部)に接続させて、電圧検出部VM2によって導電部PC1(第二導電部)と導電部PD1(第四導電部)との間の電圧V2を測定させる(ステップS7:第二電圧検出工程)(図6参照)。 Next, the conductive part selector 21 uses the scanner 31 to connect one terminal of the voltage detector VM2 to the conductive part PC1 (second conductive part) and the other terminal of the voltage detector VM2 to the conductive part PD1 (fourth conductive part). And the voltage detection unit VM2 measures the voltage V2 between the conductive part PC1 (second conductive part) and the conductive part PD1 (fourth conductive part) (step S7: second voltage detection step) (FIG. 6).
 導電部PA1(第三導電部)は、導電部PB1(第一導電部)及び導電部PC1(第二導電部)と異なる導電部であるから第一条件を満たしている。導電部PA1(第三導電部)から導電部PB1(第一導電部)に至る最短の導電経路は、図6に示すように、導電部PA1から接続部RA、金属板MPの導電経路X、及び接続部RBを介して導電部PB1に至る経路である。導電部PB1(第一導電部)と導電部PC1(第二導電部)の間に流れる電流Iが金属板MPを流れる電流経路Aと導電経路Xとは重ならない。従って、導電部PA1(第三導電部),PB1(第一導電部),PC1(第二導電部)は、第一条件及び第二条件を満たしている。 The conductive part PA1 (third conductive part) satisfies the first condition because it is different from the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part). As shown in FIG. 6, the shortest conductive path from the conductive part PA1 (third conductive part) to the conductive part PB1 (first conductive part) is the conductive path X from the conductive part PA1 to the connecting part RA, the metal plate MP, And a path reaching the conductive portion PB1 via the connection portion RB. The current path A flowing through the metal plate MP and the conductive path X do not overlap the current I flowing between the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part). Accordingly, the conductive parts PA1 (third conductive part), PB1 (first conductive part), and PC1 (second conductive part) satisfy the first condition and the second condition.
 導電部PD1(第四導電部)は、導電部PB1(第一導電部)及び導電部PC1(第二導電部)と異なる導電部であるから第一条件を満たしている。導電部PD1(第四導電部)から導電部PC1(第二導電部)に至る最短の導電経路は、図6に示すように、導電部PD1から接続部RD、金属板MPの導電経路Y、及び接続部RCを介して導電部PC1に至る経路である。導電部PB1(第一導電部)と導電部PC1(第二導電部)の間に流れる電流Iが金属板MPを流れる電流経路Aと導電経路Yとは重ならない。従って、導電部PB1(第一導電部),PC1(第二導電部),PD1(第四導電部)は、第一条件及び第二条件を満たしている。 Since the conductive part PD1 (fourth conductive part) is a conductive part different from the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part), the first condition is satisfied. As shown in FIG. 6, the shortest conductive path from the conductive part PD1 (fourth conductive part) to the conductive part PC1 (second conductive part) is as shown in FIG. And a path to the conductive part PC1 through the connection part RC. The current path A flowing through the metal plate MP and the conductive path Y do not overlap the current I flowing between the conductive portion PB1 (first conductive portion) and the conductive portion PC1 (second conductive portion). Therefore, the conductive part PB1 (first conductive part), PC1 (second conductive part), and PD1 (fourth conductive part) satisfy the first condition and the second condition.
 上述のようにして選択された導電部PA1(第三導電部),PB1(第一導電部),PC1(第二導電部)によれば、導電経路X及び接続部RAには電流が流れず、従ってこの箇所では電圧が生じないから、電圧検出部VM1によって測定された電圧V1には、導電経路X及び接続部RAで生じた電圧が含まれることがない。従って、電圧V1は、接続部RBに電流Iが流れることによって生じた電圧に略等しい。 According to the conductive parts PA1 (third conductive part), PB1 (first conductive part), and PC1 (second conductive part) selected as described above, no current flows through the conductive path X and the connection part RA. Therefore, since no voltage is generated at this point, the voltage V1 measured by the voltage detection unit VM1 does not include the voltage generated at the conductive path X and the connection unit RA. Therefore, the voltage V1 is substantially equal to the voltage generated by the current I flowing through the connection portion RB.
 また、上述のようにして選択された導電部PD1(第四導電部),PB1(第一導電部),PC1(第二導電部)によれば、導電経路Y及び接続部RDには電流が流れず、従ってこの箇所では電圧が生じないから、電圧検出部VM2によって測定された電圧V2には、導電経路Y及び接続部RDで生じた電圧が含まれることがない。従って、電圧V2は、接続部RCに電流Iが流れることによって生じた電圧に略等しい In addition, according to the conductive parts PD1 (fourth conductive part), PB1 (first conductive part), and PC1 (second conductive part) selected as described above, current flows in the conductive path Y and the connection part RD. Since the voltage does not flow and therefore no voltage is generated at this point, the voltage V2 measured by the voltage detection unit VM2 does not include the voltage generated at the conductive path Y and the connection unit RD. Therefore, the voltage V2 is substantially equal to the voltage generated by the current I flowing through the connection portion RC.
 次に、抵抗算出部22によって、下記の式(1),(2)に基づいて、接続部RBの抵抗値Rbと接続部RCの抵抗値Rcとが算出される(ステップS8:抵抗算出工程)。
Rb=V1/Ic ・・・(1)
Rc=V2/Ic ・・・(2)
Next, the resistance calculation unit 22 calculates the resistance value Rb of the connection part RB and the resistance value Rc of the connection part RC based on the following formulas (1) and (2) (step S8: resistance calculation step). ).
Rb = V1 / Ic (1)
Rc = V2 / Ic (2)
 これにより、接続部RB,RCの抵抗値を、個別に測定することができる。なお、必ずしも電流検出部AMによって電流値Icを測定する例に限らない。電流検出部AMを備えず、電流供給部CSが、予め設定された電流値Icの電流Iを出力する構成であってもよい。 Thereby, the resistance values of the connection parts RB and RC can be measured individually. The current value Ic is not necessarily measured by the current detection unit AM. The current detection unit AM may be omitted, and the current supply unit CS may output a current I having a preset current value Ic.
 なお、導電部選択部21は、必ずしも上述の第二条件を満たすように第三導電部と第四導電部とを選択する例に限らず、第二条件を満たさない第三導電部と第四導電部とを選択してもよい。第二条件を満たさない第三導電部と第四導電部とを選択した場合であっても、各接続部の抵抗値を、個別に測定することができる。 The conductive part selection unit 21 is not limited to the example of selecting the third conductive part and the fourth conductive part so as to satisfy the second condition described above, and the third conductive part and the fourth conductive part that do not satisfy the second condition. A conductive part may be selected. Even when the third conductive portion and the fourth conductive portion that do not satisfy the second condition are selected, the resistance value of each connection portion can be individually measured.
 図7は、第二条件を満たさない第三導電部と第四導電部とを選択する例を説明するための説明図である。図7に示す例では、導電部PA1が第一導電部、導電部PD1が第二導電部、導電部PB1が第三導電部、導電部PC1が第四導電部としてそれぞれ選択されている。この場合、電流Iが金属板MPを流れる電流経路Aと導電経路X,Yとが重なっているから、第三及び第四導電部は、第二条件を満たさない。 FIG. 7 is an explanatory diagram for explaining an example of selecting a third conductive part and a fourth conductive part that do not satisfy the second condition. In the example shown in FIG. 7, the conductive portion PA1 is selected as the first conductive portion, the conductive portion PD1 is selected as the second conductive portion, the conductive portion PB1 is selected as the third conductive portion, and the conductive portion PC1 is selected as the fourth conductive portion. In this case, since the current path A through which the current I flows through the metal plate MP overlaps the conductive paths X and Y, the third and fourth conductive portions do not satisfy the second condition.
 この場合であっても、電流Iは接続部RB,RCを流れないから、抵抗算出部22は、接続部RAの抵抗値Raと接続部RDの抵抗値Rdとを個別に算出することができる。 Even in this case, since the current I does not flow through the connection parts RB and RC, the resistance calculation unit 22 can individually calculate the resistance value Ra of the connection part RA and the resistance value Rd of the connection part RD. .
 しかしながら、導電経路X,Yでは電流Iが流れることによる電圧降下が生じるから、抵抗算出部22によって算出される接続部RAの抵抗値Raには金属板MPの導電経路Xの抵抗値Rxが含まれ、抵抗算出部22によって算出される接続部RDの抵抗値Rdには金属板MPの導電経路Yの抵抗値Ryが含まれる。しかしながら、金属板MPや内層パターンIPなどの面状導体は、その導体面積が広いため抵抗値Rx,Ryは微小であり、特に金属板MPは、その導体面積が広く、かつ厚さも1mm~10mm程度と厚く断面積が広いので、抵抗値Rx,Ryは極めて小さく無視することができる。 However, since a voltage drop occurs due to the current I flowing in the conductive paths X and Y, the resistance value Ra of the connection portion RA calculated by the resistance calculation unit 22 includes the resistance value Rx of the conductive path X of the metal plate MP. Thus, the resistance value Rd of the connection part RD calculated by the resistance calculation part 22 includes the resistance value Ry of the conductive path Y of the metal plate MP. However, the planar conductors such as the metal plate MP and the inner layer pattern IP have very small resistance values Rx and Ry because the conductor area is wide. In particular, the metal plate MP has a large conductor area and a thickness of 1 mm to 10 mm. The resistance values Rx and Ry are extremely small and can be ignored because they are thick and wide in cross section.
 しかしながら、ステップS3に示すように、第二条件を満たす第三及び第四導電部を選択することによって、電圧V1,V2には金属板MPに電流Iが流れることで生じる電圧が含まれなくなるので、接続部の抵抗値算出精度をより向上することができる点でより好ましい。 However, as shown in step S3, by selecting the third and fourth conductive portions that satisfy the second condition, the voltages V1 and V2 do not include the voltage generated by the current I flowing through the metal plate MP. It is more preferable in that the accuracy of calculating the resistance value of the connecting portion can be further improved.
 導電部選択部21は、まだ抵抗値が算出されていない接続部がある場合、新たな接続部の抵抗値を算出するべく、抵抗値が既に算出済の接続部RB,RCとは別の接続部、例えば接続部RD,REと対になる導電部PD1,PE1を新たな第一及び第二導電部として選択する(ステップS11:導電部選択工程)(図8参照)。 When there is a connection portion for which the resistance value has not yet been calculated, the conductive portion selection unit 21 has a connection different from the connection portions RB and RC whose resistance values have already been calculated in order to calculate the resistance value of the new connection portion. The conductive parts PD1, PE1 paired with the connection parts RD, RE, for example, are selected as new first and second conductive parts (step S11: conductive part selection step) (see FIG. 8).
 次に、導電部選択部21は、新たな第一及び第二導電部と異なる第一条件と、第三導電部から第一導電部に至る最短の導電経路及び第四導電部から第二導電部に至る最短の導電経路が、金属板MPを流れる電流経路Aと重ならない第二条件とを満たす第三及び第四導電部を検索し、第一及び第二条件を満たす導電部PC1を新たな第三導電部とし、導電部PF1を第四導電部として選択する(ステップS12:導電部選択工程)。 Next, the conductive part selector 21 has a first condition different from the new first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part. The third and fourth conductive parts satisfying the second condition in which the shortest conductive path reaching the part does not overlap with the current path A flowing through the metal plate MP are searched, and the conductive part PC1 satisfying the first and second conditions is newly found. The third conductive portion is selected, and the conductive portion PF1 is selected as the fourth conductive portion (step S12: conductive portion selection step).
 次に、導電部選択部21は、スキャナ部31によって、電流検出部AMを導電部PD1(第一導電部)に接続させ電流供給部CSを導電部PE1(第二導電部)に接続させて、電流供給部CSによって導電部PD1(第一導電部)と導電部PE1(第二導電部)との間に電流Iを供給させ(ステップS13:電流供給工程)、電流Iの電流値Icを電流検出部AMによって測定させる(ステップS14)(図8参照)。 Next, the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PD1 (first conductive unit) and connect the current supply unit CS to the conductive unit PE1 (second conductive unit). The current I is supplied between the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part) by the current supply part CS (step S13: current supply step), and the current value Ic of the current I is set to Measurement is performed by the current detection unit AM (step S14) (see FIG. 8).
 次に、導電部選択部21は、スキャナ部31によって電圧検出部VM1の一方端子を導電部PD1(第一導電部)に、電圧検出部VM1の他方端子を導電部PC1(第三導電部)に接続させて、電圧検出部VM1によって導電部PD1(第一導電部)と導電部PC1(第三導電部)との間の電圧V1を測定させる(ステップS15:第一電圧検出工程)(図8参照)。 Next, the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM1 to the conductive unit PD1 (first conductive unit) and the other terminal of the voltage detection unit VM1 to the conductive unit PC1 (third conductive unit). And the voltage detection unit VM1 measures the voltage V1 between the conductive part PD1 (first conductive part) and the conductive part PC1 (third conductive part) (step S15: first voltage detection step) (FIG. 8).
 次に、導電部選択部21は、スキャナ部31によって電圧検出部VM2の一方端子を導電部PE1(第二導電部)に、電圧検出部VM2の他方端子を導電部PF1(第四導電部)に接続させて、電圧検出部VM2によって導電部PE1(第二導電部)と導電部PF1(第四導電部)との間の電圧V2を測定させる(ステップS16:第二電圧検出工程)(図8参照)。 Next, the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM2 to the conductive unit PE1 (second conductive unit) and the other terminal of the voltage detection unit VM2 to the conductive unit PF1 (fourth conductive unit). And the voltage detection unit VM2 measures the voltage V2 between the conductive part PE1 (second conductive part) and the conductive part PF1 (fourth conductive part) (step S16: second voltage detection step) (FIG. 8).
 導電部PC1(第三導電部)は、導電部PD1(第一導電部)及び導電部PE1(第二導電部)と異なる導電部であるから第一条件を満たしている。導電部PC1(第三導電部)から導電部PD1(第一導電部)に至る最短の導電経路は、図8に示すように、導電部PC1から接続部RC、金属板MPの導電経路X、及び接続部RDを介して導電部PD1に至る経路である。導電部PD1(第一導電部)と導電部PE1(第二導電部)の間に流れる電流Iが金属板MPを流れる電流経路Aと導電経路Xは重ならない。従って、導電部PC1(第三導電部),PD1(第一導電部),PE1(第二導電部)は、第一条件及び第二条件を満たしている。 The conductive part PC1 (third conductive part) satisfies the first condition because it is a different conductive part from the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part). As shown in FIG. 8, the shortest conductive path from the conductive part PC1 (third conductive part) to the conductive part PD1 (first conductive part) is the conductive path X from the conductive part PC1 to the connection part RC and the metal plate MP, And a path reaching the conductive portion PD1 via the connection portion RD. The current path A and the conductive path X where the current I flowing between the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part) flows through the metal plate MP do not overlap. Accordingly, the conductive part PC1 (third conductive part), PD1 (first conductive part), and PE1 (second conductive part) satisfy the first condition and the second condition.
 導電部PF1(第四導電部)は、導電部PD1(第一導電部)及び導電部PE1(第二導電部)と異なる導電部であるから第一条件を満たしている。導電部PF1(第四導電部)から導電部PE1(第二導電部)に至る最短の導電経路は、図8に示すように、導電部PF1から接続部RF、金属板MPの導電経路Y、及び接続部REを介して導電部PE1に至る経路である。導電部PD1(第一導電部)と導電部PE1(第二導電部)の間に流れる電流Iが金属板MPを流れる電流経路Aと導電経路Yは重ならない。従って、導電部PD1(第一導電部),PE1(第二導電部),PF1(第四導電部)は、第一条件及び第二条件を満たしている。 Since the conductive part PF1 (fourth conductive part) is a conductive part different from the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part), the first condition is satisfied. As shown in FIG. 8, the shortest conductive path from the conductive part PF1 (fourth conductive part) to the conductive part PE1 (second conductive part) is the conductive part Y from the conductive part PF1, the conductive path Y of the metal plate MP, And a path to the conductive part PE1 via the connection part RE. The current path A through which the current I flowing between the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part) flows through the metal plate MP and the conductive path Y do not overlap. Therefore, the conductive part PD1 (first conductive part), PE1 (second conductive part), and PF1 (fourth conductive part) satisfy the first condition and the second condition.
 このようにして得られた電圧V1,V2は、上述の接続部RB,RCの場合と同様、接続部RD,REに電流Iが流れることによって生じた電圧に略等しい。 The voltages V1 and V2 obtained in this way are substantially equal to the voltage generated by the current I flowing through the connection parts RD and RE, as in the case of the connection parts RB and RC described above.
 次に、抵抗算出部22によって、下記の式(3),(4)に基づいて、接続部RDの抵抗値Rdと接続部REの抵抗値Reとが算出される(ステップS17:抵抗算出工程)。
Rd=V1/Ic ・・・(3)
Re=V2/Ic ・・・(4)
Next, the resistance calculation unit 22 calculates the resistance value Rd of the connection part RD and the resistance value Re of the connection part RE based on the following formulas (3) and (4) (step S17: resistance calculation step). ).
Rd = V1 / Ic (3)
Re = V2 / Ic (4)
 これにより、接続部RD,REの抵抗値を、個別に測定することができる。 Thereby, the resistance values of the connection parts RD and RE can be measured individually.
 導電部選択部21は、まだ抵抗値が算出されていない接続部がある場合、新たな接続部の抵抗値を算出するべく、抵抗値が既に算出済の接続部RB,RC,RD,REとは別の接続部、例えば接続部RA,RFと対になる導電部PA1,PF1を新たな第一及び第二導電部として選択する(ステップS21:導電部選択工程)。 When there is a connection portion for which the resistance value has not yet been calculated, the conductive portion selection unit 21 calculates the resistance value of the new connection portion by connecting the connection portions RB, RC, RD, RE whose resistance values have already been calculated. Select another connection part, for example, the conductive parts PA1 and PF1 paired with the connection parts RA and RF as new first and second conductive parts (step S21: conductive part selection step).
 次に、導電部選択部21は、新たな第一及び第二導電部と異なる第一条件と、第三導電部から第一導電部に至る最短の導電経路及び第四導電部から第二導電部に至る最短の導電経路が、金属板MPを流れる電流経路と重ならない第二条件とを満たす第三及び第四導電部を検索する。 Next, the conductive part selector 21 has a first condition different from the new first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part. The third and fourth conductive parts that satisfy the second condition in which the shortest conductive path leading to the part does not overlap with the current path flowing through the metal plate MP are searched.
 ここで、説明を簡素化するために、基板WB1の基板面BS1には、導電部PA1~PF1が一列に形成され、導電部PA1~PF1以外にプローブPrが接触する導電部が存在していない場合を例に説明する。また、抵抗測定装置1は、測定部121のプローブPrが接触する基板WB1の基板面BS1の導電部と、測定部122のプローブPrが接触する基板WB2の基板面BS1の導電部との間に電流を流したり、当該両面の導電部間の電圧を測定したりすることはできない場合を例に説明する。 Here, in order to simplify the description, conductive portions PA1 to PF1 are formed in a row on the substrate surface BS1 of the substrate WB1, and there is no conductive portion that the probe Pr contacts other than the conductive portions PA1 to PF1. A case will be described as an example. In addition, the resistance measuring apparatus 1 includes a conductive portion on the substrate surface BS1 of the substrate WB1 that contacts the probe Pr of the measurement unit 121 and a conductive portion of the substrate surface BS1 of the substrate WB2 that contacts the probe Pr of the measurement unit 122 An example will be described in which a current cannot be passed or the voltage between the conductive parts on both sides cannot be measured.
 この場合、第一条件と第二条件とを満たす導電部は存在しないことになる(ステップS22)。電圧検出部VM1,VM2を備える構成において、第一及び第二条件を満たす導電部が存在しない場合とは、第一及び第二条件を満たし、かつその導電部を第三導電部とした場合にプローブPrを接触させて第一電圧検出部により第一導電部と第三導電部との間の電圧を測定可能な導電部が存在せず、かつその導電部を第四導電部とした場合にプローブPrを接触させて第二電圧検出部により第一導電部と第四導電部との間の電圧を測定可能な導電部が存在しないことを意味する。電圧検出部VM2を備えない構成においては、第一及び第二条件を満たす導電部が存在しない場合とは、第一及び第二条件を満たし、かつその導電部を第三導電部とした場合にプローブPrを接触させて第一電圧検出部により第一導電部と第三導電部との間の電圧を測定可能な導電部が存在しないことを意味する。 In this case, there is no conductive part that satisfies the first condition and the second condition (step S22). In the configuration including the voltage detection parts VM1 and VM2, the case where there is no conductive part satisfying the first and second conditions means that the first and second conditions are satisfied and the conductive part is the third conductive part. When there is no conductive part that can contact the probe Pr and measure the voltage between the first conductive part and the third conductive part by the first voltage detection part, and the conductive part is the fourth conductive part This means that there is no conductive part that can contact the probe Pr and measure the voltage between the first conductive part and the fourth conductive part by the second voltage detection part. In the configuration without the voltage detection unit VM2, the case where there is no conductive part that satisfies the first and second conditions means that the first and second conditions are satisfied and the conductive part is the third conductive part. This means that there is no conductive part that can contact the probe Pr and measure the voltage between the first conductive part and the third conductive part by the first voltage detection part.
 第一条件と第二条件とを満たす導電部が存在しない場合にのみ、導電部選択部21は、第一条件を満たし、第二条件を満たさない導電部PB1,PE1を新たな第三,第四導電部として選択する(ステップS23:導電部選択工程)。なお、ステップS23において、第一条件と第二条件とを満たす導電部が一つだけ存在する場合には、導電部選択部21は、その第一条件と第二条件とを満たす導電部を新たな第三,第四導電部のいずれか一方として選択し、第一条件を満たし、第二条件を満たさない導電部を新たな第三,第四導電部のうち他方として選択してもよい。 Only when there is no conductive part that satisfies the first condition and the second condition, the conductive part selector 21 replaces the conductive parts PB1 and PE1 that satisfy the first condition and do not satisfy the second condition with new third and second conditions. The four conductive portions are selected (step S23: conductive portion selection step). In step S23, when there is only one conductive part that satisfies the first condition and the second condition, the conductive part selector 21 newly adds a conductive part that satisfies the first condition and the second condition. The conductive part that satisfies the first condition and does not satisfy the second condition may be selected as the other of the new third and fourth conductive parts.
 次に、導電部選択部21は、スキャナ部31によって、電流検出部AMを導電部PA1(第一導電部)に接続させ電流供給部CSを導電部PF1(第二導電部)に接続させて、電流供給部CSによって導電部PA1(第一導電部)と導電部PF1(第二導電部)との間に電流Iを供給させ(ステップS24:電流供給工程)、電流Iの電流値Icを電流検出部AMによって測定させる(ステップS25)(図9参照)。 Next, the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PA1 (first conductive unit) and connect the current supply unit CS to the conductive unit PF1 (second conductive unit). The current I is supplied between the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part) by the current supply part CS (step S24: current supply process), and the current value Ic of the current I is set to Measurement is performed by the current detector AM (step S25) (see FIG. 9).
 次に、導電部選択部21は、スキャナ部31によって電圧検出部VM1の一方端子を導電部PA1(第一導電部)に、電圧検出部VM1の他方端子を導電部PB1(第三導電部)に接続させて、電圧検出部VM1によって導電部PA1(第一導電部)と導電部PB1(第三導電部)との間の電圧V1を測定させる(ステップS26:第一電圧検出工程)(図9参照)。 Next, the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM1 to the conductive unit PA1 (first conductive unit) and the other terminal of the voltage detection unit VM1 to the conductive unit PB1 (third conductive unit). And the voltage detection unit VM1 measures the voltage V1 between the conductive part PA1 (first conductive part) and the conductive part PB1 (third conductive part) (step S26: first voltage detection step) (FIG. 9).
 次に、導電部選択部21は、スキャナ部31によって電圧検出部VM2の一方端子を導電部PF1(第二導電部)に、電圧検出部VM2の他方端子を導電部PE1(第四導電部)に接続させて、電圧検出部VM2によって導電部PF1(第二導電部)と導電部PE1(第四導電部)との間の電圧V2を測定させる(ステップS27:第二電圧検出工程)(図9参照)。 Next, the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM2 to the conductive unit PF1 (second conductive unit) and the other terminal of the voltage detection unit VM2 to the conductive unit PE1 (fourth conductive unit). And the voltage detection unit VM2 measures the voltage V2 between the conductive unit PF1 (second conductive unit) and the conductive unit PE1 (fourth conductive unit) (step S27: second voltage detection step) (FIG. 9).
 導電部PB1(第三導電部)は、導電部PA1(第一導電部)及び導電部PF1(第二導電部)と異なる導電部であるから第一条件を満たしている。導電部PB1(第三導電部)から導電部PA1(第一導電部)に至る最短の導電経路は、図9に示すように、導電部PB1から接続部RB、金属板MPの導電経路X、及び接続部RAを介して導電部PA1に至る経路である。導電部PA1(第一導電部)と導電部PF1(第二導電部)の間に流れる電流Iが金属板MPを流れる電流経路Aと導電経路Xとは重なっている。従って、導電部PB1(第三導電部),PA1(第一導電部),PF1(第二導電部)は、第二条件を満たしていない。 Since the conductive part PB1 (third conductive part) is a conductive part different from the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part), the first condition is satisfied. As shown in FIG. 9, the shortest conductive path from the conductive part PB1 (third conductive part) to the conductive part PA1 (first conductive part) is the conductive path X from the conductive part PB1 to the connection part RB, the metal plate MP, And a path reaching the conductive portion PA1 via the connection portion RA. The current path A and the conductive path X where the current I flowing between the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part) flows through the metal plate MP overlap each other. Therefore, the conductive part PB1 (third conductive part), PA1 (first conductive part), and PF1 (second conductive part) do not satisfy the second condition.
 導電部PE1(第四導電部)は、導電部PA1(第一導電部)及び導電部PF1(第二導電部)と異なる導電部であるから第一条件を満たしている。導電部PE1(第四導電部)から導電部PF1(第二導電部)に至る最短の導電経路は、図9に示すように、導電部PE1から接続部RE、金属板MPの導電経路Y、及び接続部RFを介して導電部PF1に至る経路である。導電部PA1(第一導電部)と導電部PF1(第二導電部)の間に流れる電流Iが金属板MPを流れる電流経路Aと導電経路Yとは重なっている。従って、導電部PA1(第一導電部),PF1(第二導電部),PE1(第四導電部)は、第二条件を満たしていない。 Since the conductive part PE1 (fourth conductive part) is a conductive part different from the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part), the first condition is satisfied. As shown in FIG. 9, the shortest conductive path from the conductive part PE1 (fourth conductive part) to the conductive part PF1 (second conductive part) is the conductive part Y, the conductive part Y of the metal plate MP, the conductive path Y, And a path that reaches the conductive portion PF1 via the connection portion RF. The current path A and the conductive path Y through which the current I flowing between the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part) flows through the metal plate MP overlap each other. Therefore, the conductive part PA1 (first conductive part), PF1 (second conductive part), and PE1 (fourth conductive part) do not satisfy the second condition.
 次に、抵抗算出部22によって、下記の式(5),(6)に基づいて、接続部RAの抵抗値Raと接続部RFの抵抗値Rfとが算出される(ステップS28:抵抗算出工程)。
Ra=V1/Ic ・・・(5)
Rf=V2/Ic ・・・(6)
Next, the resistance calculator 22 calculates the resistance value Ra of the connection portion RA and the resistance value Rf of the connection portion RF based on the following formulas (5) and (6) (step S28: resistance calculation step). ).
Ra = V1 / Ic (5)
Rf = V2 / Ic (6)
 これにより、接続部RA,RFの抵抗値を、個別に測定することができる。第二条件を満たさない場合、ステップS26,S27で測定された電圧V1,V2には、上述したように金属板MPの導電経路X,Yに電流Iが流れることで生じる電圧が含まれるから、式(5),(6)で算出される抵抗値Ra,Rfには、抵抗値Rx,Ryが誤差として含まれる。しかしながら、上述したように、抵抗値Rx,Ryは微小であるから実質的に無視できる。 Thereby, the resistance values of the connection portions RA and RF can be individually measured. When the second condition is not satisfied, the voltages V1 and V2 measured in steps S26 and S27 include the voltage generated by the current I flowing through the conductive paths X and Y of the metal plate MP as described above. The resistance values Ra and Rf calculated by the equations (5) and (6) include the resistance values Rx and Ry as errors. However, as described above, the resistance values Rx and Ry are minute and can be substantially ignored.
 以上、ステップS1~S28の処理によれば、面状に拡がる導電性の中間基板Bなどの面状導体と、面状導体と対向する基板面BS1と、基板面BS1に設けられた導電部PA1~PF1とその導電部PA1~PF1を面状導体に電気的に接続する接続部RA~RFとの対とを有する中間基板Bなどの被測定基板の接続部RA~RFの抵抗値Ra~Rfを個別に測定することができる。 As described above, according to the processing in steps S1 to S28, a planar conductor such as a conductive intermediate substrate B spreading in a planar shape, a substrate surface BS1 facing the planar conductor, and a conductive portion PA1 provided on the substrate surface BS1. Resistance values Ra to Rf of the connection portions RA to RF of the substrate to be measured such as the intermediate substrate B having a pair of connection portions RA to RF that electrically connect the conductive portions PA1 to PF1 to the planar conductors Can be measured individually.
 なお、一つの導電部が第三導電部と第四導電部とを兼ね、すなわち第三導電部と第四導電部とが同一の導電部であってもよい。導電部選択部21は、第三導電部についての第一及び第二条件を満たし、かつ第四導電部についての第一及び第二条件とを満たす導電部を、第三導電部と第四導電部とを兼ねる導電部として選択してもよい。 Note that one conductive part may serve as the third conductive part and the fourth conductive part, that is, the third conductive part and the fourth conductive part may be the same conductive part. The conductive portion selection unit 21 satisfies the first and second conditions for the third conductive portion and satisfies the first and second conditions for the fourth conductive portion. You may select as an electroconductive part which serves as a part.
 図10は、第三導電部と第四導電部とを同一の導電部とした場合の抵抗測定装置の動作を説明するための説明図である。図10に示す例では、導電部PA1が第一導電部、導電部PC1が第二導電部、導電部PB1が第三導電部と第四導電部を兼ねている。すなわち、第三導電部と第四導電部とが同一の導電部PB1となっている。 FIG. 10 is an explanatory diagram for explaining the operation of the resistance measuring apparatus when the third conductive portion and the fourth conductive portion are the same conductive portion. In the example shown in FIG. 10, the conductive part PA1 serves as the first conductive part, the conductive part PC1 serves as the second conductive part, and the conductive part PB1 serves as the third conductive part and the fourth conductive part. That is, the third conductive portion and the fourth conductive portion are the same conductive portion PB1.
 この場合、電圧検出部VM1は、導電部PA1(第一導電部)と導電部PB1(第三、第四導電部)との間の電圧を電圧V1として測定する。電圧検出部VM2は、導電部PB1(第三、第四導電部)と導電部PC1(第二導電部)との間の電圧を電圧V2として測定する。 In this case, the voltage detection unit VM1 measures the voltage between the conductive part PA1 (first conductive part) and the conductive part PB1 (third and fourth conductive parts) as the voltage V1. The voltage detection unit VM2 measures the voltage between the conductive part PB1 (third and fourth conductive parts) and the conductive part PC1 (second conductive part) as the voltage V2.
 抵抗算出部22は、下記の式(7),(8)に基づいて、接続部RAの抵抗値Raと接続部RCの抵抗値Rcとを算出する(抵抗算出工程)。
Ra=V1/Ic ・・・(7)
Rc=V2/Ic ・・・(8)
The resistance calculation unit 22 calculates the resistance value Ra of the connection portion RA and the resistance value Rc of the connection portion RC based on the following formulas (7) and (8) (resistance calculation step).
Ra = V1 / Ic (7)
Rc = V2 / Ic (8)
 この場合であっても、電流Iは接続部RBを流れないから、抵抗算出部22は、接続部RAの抵抗値Raと接続部RCの抵抗値Rcとを個別に算出することができる。 Even in this case, since the current I does not flow through the connection part RB, the resistance calculation unit 22 can individually calculate the resistance value Ra of the connection part RA and the resistance value Rc of the connection part RC.
 また、複数のプローブPrが、被検査基板の導電部の配置と対応するように配置されている例を示したが、移動式の、いわゆるフライングプローブによって、電流供給部CS、電流検出部AM、及び電圧検出部VM1,VM2が導電部と電気的に接続される構成としてもよい。また、抵抗測定装置1は電圧検出部VM2を備えず、導電部選択部21は第四導電部を選択しない構成としてもよい。 Moreover, although the example in which the plurality of probes Pr are arranged so as to correspond to the arrangement of the conductive parts of the substrate to be inspected is shown, the current supply part CS, the current detection part AM, The voltage detection units VM1 and VM2 may be electrically connected to the conductive unit. The resistance measuring device 1 may not include the voltage detection unit VM2, and the conductive unit selection unit 21 may be configured not to select the fourth conductive unit.
 また、導電部選択部21は、第二条件を満たすか否かとは無関係に、第一,第二,第三、第四導電部を選択してもよい。また、導電部選択部21は、新たな第三、第四導電部を選択する際に、新たな第一及び第二導電部と異なる第一条件を満たす導電部を選択すればよく、現在の第三、第四導電部と同じ導電部を新たな第三、第四導電部として選択してもよい。また、抵抗測定装置1は導電部選択部21を備えず、適宜第一,第二,第三、第四導電部が設定されていてもよい。 Also, the conductive part selection unit 21 may select the first, second, third, and fourth conductive parts regardless of whether or not the second condition is satisfied. In addition, when selecting the new third and fourth conductive parts, the conductive part selection unit 21 may select a conductive part that satisfies the first condition different from the new first and second conductive parts. The same conductive parts as the third and fourth conductive parts may be selected as new third and fourth conductive parts. Moreover, the resistance measuring apparatus 1 does not include the conductive part selection unit 21, and the first, second, third, and fourth conductive parts may be appropriately set.
 すなわち、本発明の一局面に従う抵抗測定装置は、面状に拡がる導電性の面状導体と、前記面状導体と対向する基板面と、前記基板面に設けられた導電部とその導電部を前記面状導体に電気的に接続する接続部との対とを有すると共に当該対を三つ以上備える被測定基板の前記接続部の抵抗を測定するための抵抗測定装置であって、前記三つ以上の導電部のうちの一つである第一導電部と前記第一導電部とは異なる導電部である第二導電部との間に前記面状導体を介して電流を流す電流供給部と、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部である第三導電部と前記第一導電部との間の電圧を検出する第一電圧検出部と、前記電流供給部によって流された電流と前記第一電圧検出部によって検出された電圧とに基づいて、前記第一導電部と対になる接続部の抵抗値を算出する抵抗算出部とを備える。 That is, the resistance measuring apparatus according to one aspect of the present invention includes a conductive planar conductor that extends in a planar shape, a substrate surface that faces the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion. A resistance measuring device for measuring the resistance of the connection part of the substrate to be measured, which has a pair of connection parts electrically connected to the planar conductor and has three or more pairs. A current supply section for passing a current through the planar conductor between a first conductive section which is one of the conductive sections and a second conductive section which is a conductive section different from the first conductive section; A first voltage detection unit for detecting a voltage between the third conductive unit and the first conductive unit, which is a conductive unit different from the first and second conductive units among the conductive units, and the current Based on the current passed by the supply unit and the voltage detected by the first voltage detection unit And a resistance calculation unit for calculating the resistance value of the connection portion to be the first conductive portion and the pair.
 この構成によれば、第一電圧検出部によって電圧測定される第三導電部と第一導電部とを結ぶ経路中の第三導電部と対になる接続部には、電流供給部によって流された電流が流れない。その結果、第一電圧検出部によって測定される電圧には、第一導電部と対になる接続部の電圧降下が含まれる一方、第三導電部と対になる接続部の電圧降下は含まれない。その結果、抵抗算出部が電流供給部によって流された電流と第一電圧検出部によって検出された電圧とに基づいて算出する抵抗値は、第一導電部と対になる接続部の抵抗値と略等しくなる。これにより、第一導電部と対になる接続部の抵抗値を個別に測定することができる。 According to this configuration, the current supply unit causes the connection part that is paired with the third conductive part in the path connecting the third conductive part and the first conductive part to be voltage-measured by the first voltage detection unit. Current does not flow. As a result, the voltage measured by the first voltage detection unit includes the voltage drop of the connection part paired with the first conductive part, while the voltage drop of the connection part paired with the third conductive part is included. Absent. As a result, the resistance value calculated by the resistance calculation unit based on the current supplied by the current supply unit and the voltage detected by the first voltage detection unit is the resistance value of the connection unit paired with the first conductive unit. Almost equal. Thereby, the resistance value of the connection part which becomes a pair with a 1st electroconductive part can be measured separately.
 また、前記抵抗測定装置は、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部である第四導電部と前記第二導電部との間の電圧を検出する第二電圧検出部をさらに備え、前記抵抗算出部は、さらに、前記電流供給部によって流された電流と前記第二電圧検出部によって検出された電圧とに基づいて、前記第二導電部と対になる接続部の抵抗値を算出することが好ましい。 The resistance measuring device detects a voltage between a fourth conductive part and a second conductive part, which are conductive parts different from the first and second conductive parts among the conductive parts. The resistance calculation unit further includes a voltage detection unit, and the resistance calculation unit is further paired with the second conductive unit based on a current passed by the current supply unit and a voltage detected by the second voltage detection unit. It is preferable to calculate the resistance value of the connection portion.
 この構成によれば、第二電圧検出部によって電圧測定される第四導電部と第二導電部とを結ぶ経路中の第四導電部と対になる接続部には、電流供給部によって流された電流が流れない。その結果、第二電圧検出部によって測定される電圧には、第二導電部と対になる接続部の電圧降下が含まれる一方、第四導電部と対になる接続部の電圧降下は含まれない。その結果、抵抗算出部が電流供給部によって流された電流と第二電圧検出部によって検出された電圧とに基づいて算出する抵抗値は、第二導電部と対になる接続部の抵抗値と略等しくなる。これにより、第一及び第二導電部と対になる各接続部の抵抗値を個別に測定することができる。第一及び第二電圧検出部による電圧測定を並行して実行し、第一及び第二導電部と対になる各接続部の抵抗値を個別に測定することができるので、抵抗測定時間を短縮することが可能となる。 According to this configuration, the current supply unit passes the connection part paired with the fourth conductive part in the path connecting the fourth conductive part and the second conductive part whose voltage is measured by the second voltage detection part. Current does not flow. As a result, the voltage measured by the second voltage detection unit includes the voltage drop of the connection part paired with the second conductive part, while the voltage drop of the connection part paired with the fourth conductive part is included. Absent. As a result, the resistance value calculated by the resistance calculation unit based on the current passed by the current supply unit and the voltage detected by the second voltage detection unit is the resistance value of the connection unit paired with the second conductive unit. Almost equal. Thereby, the resistance value of each connection part which makes a pair with the 1st and 2nd electroconductive part can be measured separately. Since the voltage measurement by the first and second voltage detectors can be performed in parallel and the resistance value of each connection part paired with the first and second conductive parts can be measured individually, the resistance measurement time is reduced. It becomes possible to do.
 また、前記第四導電部は、前記第三導電部と同一の前記導電部であることが好ましい。 The fourth conductive part is preferably the same conductive part as the third conductive part.
 この構成によれば、一つの導電部が、第三導電部と第四導電部とを兼ねる。この場合、第一、第二、第三、第四導電部となる三つの導電部のうち二つの導電部(第一、第二導電部)と対になる二つの接続部の抵抗値を測定することができる。従って、抵抗測定対象となる二箇所の導電部の他に、もう一箇所導電部を確保すればよいので、抵抗測定が容易となる。 According to this configuration, one conductive portion serves as both the third conductive portion and the fourth conductive portion. In this case, the resistance values of two connecting portions that are paired with two conductive portions (first and second conductive portions) among the three conductive portions that are the first, second, third, and fourth conductive portions are measured. can do. Therefore, in addition to the two conductive parts to be measured for resistance, another conductive part only needs to be secured, so that resistance measurement is facilitated.
 また、前記各導電部のうち、前記抵抗値が算出された接続部とは別の接続部と対になる導電部を新たな第一導電部として選択し、前記各導電部のうち前記新たな第一導電部とは異なる第一条件を満たす導電部を新たな第二及び第三導電部として選択する導電部選択部をさらに備え、前記電流供給部は、さらに、前記新たな第一導電部と前記新たな第二導電部との間に電流を流し、前記第一電圧検出部は、さらに、前記新たな第三導電部と前記新たな第一導電部との間の電圧を検出し、前記抵抗算出部は、さらに、前記電流供給部によって流された電流と前記第一電圧検出部によって検出された電圧とに基づいて、前記新たな第一導電部と対になる接続部の抵抗値を算出することが好ましい。 Further, among the conductive parts, a conductive part that is paired with a connection part different from the connection part for which the resistance value is calculated is selected as a new first conductive part, and the new conductive part among the conductive parts is selected. A conductive part selection unit that selects a conductive part satisfying a first condition different from the first conductive part as a new second and third conductive part; and the current supply unit further includes the new first conductive part. And a current is passed between the new second conductive part, and the first voltage detector further detects a voltage between the new third conductive part and the new first conductive part, The resistance calculation unit further includes a resistance value of a connection unit paired with the new first conductive unit based on a current passed by the current supply unit and a voltage detected by the first voltage detection unit. Is preferably calculated.
 この構成によれば、導電部選択部が、まだ抵抗値が測定されていない接続部と対になる導電部を順次第一導電部として選択することによって、被測定基板に設けられた各導電部の抵抗値を順次測定することが可能となる。 According to this configuration, the conductive part selection unit sequentially selects the conductive part paired with the connection part whose resistance value has not yet been measured as the first conductive part, so that each conductive part provided on the measurement target substrate. It is possible to sequentially measure the resistance values of the two.
 また、前記各導電部のうち、前記抵抗値が算出された接続部とは別の接続部と対になる導電部を新たな第一及び第二導電部として選択し、前記各導電部のうち前記新たな第一及び第二導電部とは異なる第一条件を満たす導電部を新たな第三及び第四導電部として選択する導電部選択部をさらに備え、前記電流供給部は、さらに、前記新たな第一導電部と前記新たな第二導電部との間に前記面状導体を介して電流を流し、前記第一電圧検出部は、さらに、前記新たな第三導電部と前記新たな第一導電部との間の電圧を検出し、前記第二電圧検出部は、さらに、前記新たな第四導電部と前記新たな第二導電部との間の電圧を検出し、前記抵抗算出部は、さらに、前記電流供給部によって流された電流と前記第一及び第二電圧検出部によって検出された電圧とに基づいて、前記新たな第一導電部と対になる接続部の抵抗値と前記新たな第二導電部と対になる接続部の抵抗値とを算出することが好ましい。 In addition, among the conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value is calculated is selected as a new first and second conductive part, A conductive portion selecting section that selects a conductive portion that satisfies a first condition different from the new first and second conductive portions as a new third and fourth conductive portion; and the current supply portion further includes: A current is caused to flow between the new first conductive part and the new second conductive part via the planar conductor, and the first voltage detection unit further includes the new third conductive part and the new third conductive part. A voltage between the first conductive part is detected, and the second voltage detection part further detects a voltage between the new fourth conductive part and the new second conductive part, and calculates the resistance. The unit further detects the current passed by the current supply unit and the first and second voltage detection units. Based on the voltage and that, it is preferable to calculate the resistance value of said a new resistance value of the first conductive portion and the paired connection portions become new second conductive portion and the pair connection.
 この構成によれば、導電部選択部が、まだ抵抗値が測定されていない接続部と対になる導電部を順次第一及び第二導電部として選択することによって、被測定基板に設けられた各導電部の抵抗値を二つずつ順次測定することが可能となる。 According to this configuration, the conductive part selection unit is provided on the measured substrate by sequentially selecting the conductive parts that form a pair with the connection part whose resistance value has not been measured as the first and second conductive parts. It is possible to sequentially measure two resistance values of each conductive part.
 また、前記第三導電部は、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部であって、かつ当該第三導電部から前記第一導電部に至る最短の導電経路が、前記電流供給部により流される電流の前記面状導体を流れる電流経路と重ならない導電部であることが好ましい。 The third conductive portion is a conductive portion different from the first conductive portion and the second conductive portion among the conductive portions, and is the shortest conductive portion from the third conductive portion to the first conductive portion. It is preferable that the path is a conductive part that does not overlap a current path that flows through the planar conductor of a current that is supplied by the current supply part.
 この構成によれば、第一電圧検出部によって検出される電圧に、面状導体に電流が流れることによって生じる電圧が含まれないので、第一導電部と対になる接続部で生じる電圧の測定精度が向上する結果、抵抗算出部による第一導電部と対になる接続部の抵抗値の算出精度が向上する。 According to this configuration, since the voltage detected by the current flowing through the planar conductor is not included in the voltage detected by the first voltage detection unit, measurement of the voltage generated at the connection unit paired with the first conductive unit is performed. As a result of improving the accuracy, the resistance calculation accuracy of the connection portion paired with the first conductive portion by the resistance calculation portion is improved.
 また、前記第四導電部は、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部であって、かつ当該第四導電部から前記第二導電部に至る最短の導電経路が、前記電流供給部により流される電流の前記面状導体を流れる電流経路と重ならない導電部であることが好ましい。 The fourth conductive portion is a conductive portion different from the first and second conductive portions of the conductive portions, and is the shortest conductive portion from the fourth conductive portion to the second conductive portion. It is preferable that the path is a conductive part that does not overlap a current path that flows through the planar conductor of a current that is supplied by the current supply part.
 この構成によれば、第二電圧検出部によって検出される電圧に、面状導体に電流が流れることによって生じる電圧が含まれないので、第二導電部と対になる接続部で生じる電圧の測定精度が向上する結果、抵抗算出部による第二導電部と対になる接続部の抵抗値の算出精度が向上する。 According to this configuration, since the voltage detected by the current flowing through the planar conductor is not included in the voltage detected by the second voltage detection unit, the voltage generated at the connection portion paired with the second conductive portion is measured. As a result of improving the accuracy, the calculation accuracy of the resistance value of the connection portion paired with the second conductive portion by the resistance calculation portion is improved.
 また、前記導電部選択部は、前記各導電部のうち、前記抵抗値が算出された接続部とは別の接続部と対になる導電部を新たな第一導電部として選択し、前記各導電部のうち前記新たな第一導電部とは異なる第一条件と、新たな第三導電部から前記新たな第一導電部に至る最短の導電経路が、前記電流供給部により前記新たな第一導電部と新たな第二導電部との間に流される電流の前記面状導体を流れる電流経路と重ならない第二条件とを満たすように、前記新たな第二導電部及び前記新たな第三導電部を選択することが好ましい。 In addition, the conductive part selection unit selects, as the first first conductive part, a conductive part paired with a connection part different from the connection part for which the resistance value has been calculated among the conductive parts, The first condition that is different from the new first conductive part among the conductive parts and the shortest conductive path from the new third conductive part to the new first conductive part are caused to The new second conductive portion and the new second conductive portion so as to satisfy a second condition that does not overlap with a current path flowing through the planar conductor of a current flowing between the one conductive portion and the new second conductive portion. It is preferable to select three conductive parts.
 この構成によれば、導電部選択部が、まだ抵抗値が測定されていない接続部と対になる導電部を順次第一導電部として選択することによって、被測定基板に設けられた各導電部の抵抗値を順次測定可能になる。また、第一電圧検出部によって検出される電圧には、面状導体に電流が流れることによって生じる電圧が含まれないので、新たな第一導電部と対になる接続部で生じる電圧の測定精度が向上する結果、抵抗算出部による新たな第一導電部と対になる接続部の抵抗値の算出精度が向上する。 According to this configuration, the conductive part selection unit sequentially selects the conductive part paired with the connection part whose resistance value has not yet been measured as the first conductive part, so that each conductive part provided on the measurement target substrate. It becomes possible to measure the resistance value of each in turn. In addition, since the voltage detected by the current flowing through the planar conductor is not included in the voltage detected by the first voltage detection unit, the measurement accuracy of the voltage generated at the connection unit paired with the new first conductive unit As a result, the resistance calculation accuracy of the connection portion paired with the new first conductive portion by the resistance calculation portion is improved.
 また、前記導電部選択部は、前記第一及び第二条件を満たす前記導電部が存在しない場合、前記第一条件を満たし、かつ前記第二条件を満たさない導電部を前記新たな第二及び第三導電部として選択することが好ましい。 In addition, when the conductive part that satisfies the first and second conditions does not exist, the conductive part selection unit satisfies the first condition and does not satisfy the second condition. It is preferable to select the third conductive portion.
 この構成によれば、第二条件を満たさない導電部と対になる接続部の抵抗値についても、抵抗算出部により算出することが可能となる。 According to this configuration, the resistance calculation unit can also calculate the resistance value of the connection part paired with the conductive part that does not satisfy the second condition.
 また、前記導電部選択部は、前記各導電部のうち、前記抵抗値が算出された接続部とは別の接続部と対になる導電部を新たな第一及び第二導電部として選択し、前記各導電部のうち前記新たな第一及び第二導電部とは異なる第一条件と、新たな第三導電部から前記新たな第一導電部に至る最短の導電経路及び新たな第四導電部から前記新たな第二導電部に至る最短の導電経路が、前記電流供給部により前記新たな第一導電部と新たな第二導電部との間に流される電流の前記面状導体を流れる電流経路と重ならない第二条件とを満たすように、前記新たな第三導電部及び前記新たな第四導電部を選択することが好ましい。 In addition, the conductive part selection unit selects, as the first and second conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value has been calculated among the conductive parts. The first condition different from the new first and second conductive parts among the conductive parts, the shortest conductive path from the new third conductive part to the new first conductive part, and the new fourth The shortest conductive path from the conductive part to the new second conductive part is the shortest conductive path of the current conductor flowing between the new first conductive part and the new second conductive part by the current supply part. It is preferable to select the new third conductive part and the new fourth conductive part so as to satisfy the second condition that does not overlap the flowing current path.
 この構成によれば、導電部選択部が、まだ抵抗値が測定されていない接続部と対になる導電部を順次第一及び第二導電部として選択することによって、被測定基板に設けられた各導電部の抵抗値を二つずつ順次測定可能になる。また、第一及び第二電圧検出部によって検出される電圧に、面状導体に電流が流れることによって生じる電圧が含まれないので、新たな第一及び第二導電部と対になる接続部で生じる電圧の測定精度が向上する結果、抵抗算出部による新たな第一及び第二導電部と対になる接続部の抵抗値の算出精度が向上する。 According to this configuration, the conductive part selection unit is provided on the measured substrate by sequentially selecting the conductive parts that form a pair with the connection part whose resistance value has not been measured as the first and second conductive parts. Two resistance values of each conductive part can be sequentially measured. In addition, since the voltage detected by the current flowing through the planar conductor is not included in the voltage detected by the first and second voltage detectors, the connection part paired with the new first and second conductive parts As a result of improving the measurement accuracy of the generated voltage, the calculation accuracy of the resistance value of the connection portion paired with the new first and second conductive portions by the resistance calculation portion is improved.
 また、前記導電部選択部は、前記第一及び第二条件を満たす前記導電部が二つ以上存在しない場合、前記第一条件を満たし、かつ前記第二条件を満たさない導電部を前記新たな第二及び第三導電部のうち少なくとも一つとして選択することが好ましい。 In addition, when there are no two or more conductive parts that satisfy the first and second conditions, the conductive part selecting unit satisfies the first condition and does not satisfy the second condition. It is preferable to select at least one of the second and third conductive parts.
 この構成によれば、第二条件を満たさない導電部と対になる接続部の抵抗値についても、抵抗算出部により算出することが可能となる。 According to this configuration, the resistance calculation unit can also calculate the resistance value of the connection part paired with the conductive part that does not satisfy the second condition.
 また、本発明の一局面に従う抵抗測定方法は、面状に拡がる導電性の面状導体と、前記面状導体と対向する基板面と、前記基板面に設けられた導電部とその導電部を前記面状導体に電気的に接続する接続部との対とを有すると共に当該対を三つ以上備える被測定基板の前記接続部の抵抗を測定するための抵抗測定方法であって、前記各導電部のうちの一つである第一導電部と前記第一導電部とは異なる導電部である第二導電部との間に電流を流す電流供給工程と、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部である第三導電部と前記第一導電部との間の電圧を検出する第一電圧検出工程と、前記電流供給工程によって流された電流と前記第一電圧検出工程によって検出された電圧とに基づいて、前記第一導電部と対になる接続部の抵抗値を算出する抵抗算出工程とを含む。 Moreover, the resistance measuring method according to one aspect of the present invention includes a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion. A resistance measurement method for measuring the resistance of the connection portion of the substrate to be measured, which has a pair with a connection portion electrically connected to the planar conductor and includes three or more pairs. A current supplying step of passing a current between a first conductive part that is one of the parts and a second conductive part that is a different conductive part from the first conductive part, and the first of the conductive parts A first voltage detecting step for detecting a voltage between the first conductive portion and the third conductive portion, which is a conductive portion different from the first and second conductive portions, and the current passed through the current supply step and the first Based on the voltage detected by the one voltage detecting step. And a resistance calculation step of calculating a resistance value of the connection portion.
 この構成によれば、第一電圧検出工程によって電圧測定される第三導電部と第一導電部とを結ぶ経路中の第三導電部と対になる接続部には、電流供給工程によって流された電流が流れない。その結果、第一電圧検出工程によって測定される電圧には、第一導電部と対になる接続部の電圧降下が含まれる一方、第三導電部と対になる接続部の電圧降下は含まれない。その結果、抵抗算出工程において、電流供給工程によって流された電流と第一電圧検出工程によって検出された電圧とに基づいて算出される抵抗値は、第一導電部と対になる接続部の抵抗値と略等しくなる。これにより、第一導電部と対になる接続部の抵抗値を個別に測定することができる。 According to this configuration, the current supply step causes the connection portion that is paired with the third conductive portion in the path connecting the third conductive portion and the first conductive portion to be voltage-measured in the first voltage detection step. Current does not flow. As a result, the voltage measured by the first voltage detection step includes the voltage drop of the connection part paired with the first conductive part, while the voltage drop of the connection part paired with the third conductive part is included. Absent. As a result, in the resistance calculation step, the resistance value calculated based on the current passed in the current supply step and the voltage detected in the first voltage detection step is the resistance of the connection portion paired with the first conductive portion. Almost equal to the value. Thereby, the resistance value of the connection part which becomes a pair with a 1st electroconductive part can be measured separately.
 このような構成の抵抗測定装置及び抵抗測定方法は、面状に拡がる導電性の面状導体と、前記面状導体と対向する基板面と、前記基板面に設けられた導電部とその導電部を前記面状導体に電気的に接続する接続部との対とを有する被測定基板の前記接続部の抵抗を個別に測定することができる。 The resistance measuring device and the resistance measuring method having such a configuration include a conductive planar conductor spreading in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion. It is possible to individually measure the resistance of the connection portion of the substrate to be measured having a pair with a connection portion that is electrically connected to the planar conductor.
 この出願は、2016年12月1日に出願された日本国特許出願特願2016-233893を基礎とするものであり、その内容は、本願に含まれるものである。なお、発明を実施するための形態の項においてなされた具体的な実施態様又は実施例は、あくまでも、本発明の技術内容を明らかにするものであって、本発明は、そのような具体例にのみ限定して狭義に解釈されるべきものではない。 This application is based on Japanese Patent Application No. 2016-233893 filed on December 1, 2016, the contents of which are included in this application. It should be noted that the specific embodiments or examples made in the section for carrying out the invention are merely to clarify the technical contents of the present invention, and the present invention is not limited to such specific examples. It should not be interpreted in a narrow sense only as a limitation.
1    抵抗測定装置
4U,4L  測定治具
20  制御部
21  導電部選択部
22  抵抗算出部
31  スキャナ部
110      基板固定装置
112      筐体
121,122    測定部
AM  電流検出部
B    中間基板(被測定基板)
BS,BS1      基板面
BS2      接触面
CS  電流供給部
I    電流
Ic  電流値
IP  内層パターン(面状導体)
MP  金属板(面状導体)
PA,PB  導電部
PA1~PF1    導電部
Pr  プローブ
RA~RF  接続部
Ra~Rf,Rx,Ry  抵抗値
V1,V2  電圧
VM1      電圧検出部(第一電圧検出部)
VM2      電圧検出部(第二電圧検出部)
WB  多層基板(被測定基板)
WB1,WB2    基板
A,X,Y  導電経路
 
DESCRIPTION OF SYMBOLS 1 Resistance measuring apparatus 4U, 4L Measuring jig 20 Control part 21 Conductive part selection part 22 Resistance calculation part 31 Scanner part 110 Board | substrate fixing device 112 Case 121,122 Measuring part AM Current detection part B Intermediate board (measuring board)
BS, BS1 Substrate surface BS2 Contact surface CS Current supply part I Current Ic Current value IP Inner layer pattern (planar conductor)
MP metal plate (planar conductor)
PA, PB Conductive part PA1 to PF1 Conductive part Pr Probe RA to RF Connection part Ra to Rf, Rx, Ry Resistance value V1, V2 Voltage VM1 Voltage detection part (first voltage detection part)
VM2 voltage detector (second voltage detector)
WB multi-layer substrate (substrate to be measured)
WB1, WB2 Substrate A, X, Y Conductive path

Claims (12)

  1.  面状に拡がる導電性の面状導体と、前記面状導体と対向する基板面と、前記基板面に設けられた導電部とその導電部を前記面状導体に電気的に接続する接続部との対とを有すると共に当該対を三つ以上備える被測定基板の前記接続部の抵抗を測定するための抵抗測定装置であって、
     前記三つ以上の導電部のうちの一つである第一導電部と前記第一導電部とは異なる導電部である第二導電部との間に前記面状導体を介して電流を流す電流供給部と、
     前記各導電部のうちの前記第一及び第二導電部とは異なる導電部である第三導電部と前記第一導電部との間の電圧を検出する第一電圧検出部と、
     前記電流供給部によって流された電流と前記第一電圧検出部によって検出された電圧とに基づいて、前記第一導電部と対になる接続部の抵抗値を算出する抵抗算出部とを備える抵抗測定装置。
    A conductive planar conductor extending in a planar shape; a substrate surface facing the planar conductor; a conductive portion provided on the substrate surface; and a connecting portion for electrically connecting the conductive portion to the planar conductor. A resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured that includes three or more pairs.
    A current that flows current through the planar conductor between a first conductive part that is one of the three or more conductive parts and a second conductive part that is a conductive part different from the first conductive part. A supply section;
    A first voltage detection unit that detects a voltage between the first conductive unit and a third conductive unit that is a conductive unit different from the first and second conductive units among the conductive units;
    A resistance comprising a resistance calculation unit that calculates a resistance value of a connection unit that is paired with the first conductive unit based on a current passed by the current supply unit and a voltage detected by the first voltage detection unit measuring device.
  2.  前記抵抗測定装置は、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部である第四導電部と前記第二導電部との間の電圧を検出する第二電圧検出部をさらに備え、
     前記抵抗算出部は、さらに、前記電流供給部によって流された電流と前記第二電圧検出部によって検出された電圧とに基づいて、前記第二導電部と対になる接続部の抵抗値を算出する請求項1記載の抵抗測定装置。
    The resistance measuring device detects a voltage between a fourth conductive portion and a second conductive portion which are different conductive portions from the first and second conductive portions of the conductive portions. Further comprising
    The resistance calculation unit further calculates a resistance value of the connection part paired with the second conductive part based on the current passed by the current supply part and the voltage detected by the second voltage detection part. The resistance measuring device according to claim 1.
  3.  前記第四導電部は、前記第三導電部と同一の前記導電部である請求項2記載の抵抗測定装置。 3. The resistance measuring apparatus according to claim 2, wherein the fourth conductive part is the same conductive part as the third conductive part.
  4.  前記各導電部のうち、前記抵抗値が算出された接続部とは別の接続部と対になる導電部を新たな第一導電部として選択し、前記各導電部のうち前記新たな第一導電部とは異なる第一条件を満たす導電部を新たな第二及び第三導電部として選択する導電部選択部をさらに備え、
     前記電流供給部は、さらに、前記新たな第一導電部と前記新たな第二導電部との間に電流を流し、
     前記第一電圧検出部は、さらに、前記新たな第三導電部と前記新たな第一導電部との間の電圧を検出し、
     前記抵抗算出部は、さらに、前記電流供給部によって流された電流と前記第一電圧検出部によって検出された電圧とに基づいて、前記新たな第一導電部と対になる接続部の抵抗値を算出する請求項1記載の抵抗測定装置。
    Among the conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value has been calculated is selected as a new first conductive part, and the new first conductive part is selected from the conductive parts. A conductive part selecting part for selecting a conductive part satisfying a first condition different from the conductive part as a new second and third conductive part;
    The current supply unit further causes a current to flow between the new first conductive unit and the new second conductive unit,
    The first voltage detector further detects a voltage between the new third conductive part and the new first conductive part,
    The resistance calculation unit further includes a resistance value of a connection unit paired with the new first conductive unit based on a current passed by the current supply unit and a voltage detected by the first voltage detection unit. The resistance measuring device according to claim 1, wherein the resistance is calculated.
  5.  前記各導電部のうち、前記抵抗値が算出された接続部とは別の接続部と対になる導電部を新たな第一及び第二導電部として選択し、前記各導電部のうち前記新たな第一及び第二導電部とは異なる第一条件を満たす導電部を新たな第三及び第四導電部として選択する導電部選択部をさらに備え、
     前記電流供給部は、さらに、前記新たな第一導電部と前記新たな第二導電部との間に前記面状導体を介して電流を流し、
     前記第一電圧検出部は、さらに、前記新たな第三導電部と前記新たな第一導電部との間の電圧を検出し、
     前記第二電圧検出部は、さらに、前記新たな第四導電部と前記新たな第二導電部との間の電圧を検出し、
     前記抵抗算出部は、さらに、前記電流供給部によって流された電流と前記第一及び第二電圧検出部によって検出された電圧とに基づいて、前記新たな第一導電部と対になる接続部の抵抗値と前記新たな第二導電部と対になる接続部の抵抗値とを算出する請求項2又は3に記載の抵抗測定装置。
    Among the conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value is calculated is selected as new first and second conductive parts, and the new conductive part among the conductive parts is selected. A conductive part selection unit that selects a conductive part satisfying a first condition different from the first and second conductive parts as a new third and fourth conductive part,
    The current supply unit further passes a current through the planar conductor between the new first conductive unit and the new second conductive unit,
    The first voltage detector further detects a voltage between the new third conductive part and the new first conductive part,
    The second voltage detector further detects a voltage between the new fourth conductive part and the new second conductive part,
    The resistance calculation unit further includes a connection unit paired with the new first conductive unit based on the current passed by the current supply unit and the voltage detected by the first and second voltage detection units. The resistance measuring device according to claim 2 or 3, wherein a resistance value of the connecting portion that is paired with the new second conductive portion is calculated.
  6.  前記第三導電部は、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部であって、かつ当該第三導電部から前記第一導電部に至る最短の導電経路が、前記電流供給部により流される電流の前記面状導体を流れる電流経路と重ならない導電部である請求項1~5のいずれか1項に記載の抵抗測定装置。 The third conductive part is a conductive part different from the first and second conductive parts of the conductive parts, and the shortest conductive path from the third conductive part to the first conductive part is 6. The resistance measuring device according to claim 1, wherein the resistance measuring device is a conductive portion that does not overlap a current path of the current flowing through the planar conductor.
  7.  前記第四導電部は、前記各導電部のうちの前記第一及び第二導電部とは異なる導電部であって、かつ当該第四導電部から前記第二導電部に至る最短の導電経路が、前記電流供給部により流される電流の前記面状導体を流れる電流経路と重ならない導電部である請求項2、3、及び5のいずれか1項に記載の抵抗測定装置。 The fourth conductive portion is a conductive portion different from the first and second conductive portions of the conductive portions, and the shortest conductive path from the fourth conductive portion to the second conductive portion is The resistance measuring device according to claim 2, wherein the resistance measuring device is a conductive portion that does not overlap a current path flowing through the planar conductor of a current flowing by the current supply portion.
  8.  前記導電部選択部は、
     前記各導電部のうち、前記抵抗値が算出された接続部とは別の接続部と対になる導電部を新たな第一導電部として選択し、前記各導電部のうち前記新たな第一導電部とは異なる第一条件と、新たな第三導電部から前記新たな第一導電部に至る最短の導電経路が、前記電流供給部により前記新たな第一導電部と新たな第二導電部との間に流される電流の前記面状導体を流れる電流経路と重ならない第二条件とを満たすように、前記新たな第二導電部及び前記新たな第三導電部を選択する請求項4記載の抵抗測定装置。
    The conductive part selector is
    Among the conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value has been calculated is selected as a new first conductive part, and the new first conductive part is selected from the conductive parts. The first condition different from the conductive part and the shortest conductive path from the new third conductive part to the new first conductive part are connected to the new first conductive part and the new second conductive part by the current supply part. 5. The new second conductive portion and the new third conductive portion are selected so as to satisfy a second condition that does not overlap with a current path flowing through the planar conductor of a current flowing between the two portions. The resistance measuring apparatus as described.
  9.  前記導電部選択部は、
     前記第一及び第二条件を満たす前記導電部が存在しない場合、前記第一条件を満たし、かつ前記第二条件を満たさない導電部を前記新たな第二及び第三導電部として選択する請求項8記載の抵抗測定装置。
    The conductive part selector is
    The conductive part that satisfies the first condition and does not satisfy the second condition is selected as the new second and third conductive parts when the conductive part that satisfies the first and second conditions does not exist. 8. The resistance measuring device according to 8.
  10.  前記導電部選択部は、
     前記各導電部のうち、前記抵抗値が算出された接続部とは別の接続部と対になる導電部を新たな第一及び第二導電部として選択し、前記各導電部のうち前記新たな第一及び第二導電部とは異なる第一条件と、新たな第三導電部から前記新たな第一導電部に至る最短の導電経路及び新たな第四導電部から前記新たな第二導電部に至る最短の導電経路が、前記電流供給部により前記新たな第一導電部と新たな第二導電部との間に流される電流の前記面状導体を流れる電流経路と重ならない第二条件とを満たすように、前記新たな第三導電部及び前記新たな第四導電部を選択する請求項5記載の抵抗測定装置。
    The conductive part selector is
    Among the conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value is calculated is selected as new first and second conductive parts, and the new conductive part among the conductive parts is selected. A first condition different from the first and second conductive parts, a shortest conductive path from the new third conductive part to the new first conductive part, and a new fourth conductive part from the new fourth conductive part. A second condition in which the shortest conductive path leading to the part does not overlap with the current path flowing through the planar conductor of the current flowing between the new first conductive part and the new second conductive part by the current supply part The resistance measurement apparatus according to claim 5, wherein the new third conductive part and the new fourth conductive part are selected so as to satisfy the above.
  11.  前記導電部選択部は、
     前記第一及び第二条件を満たす前記導電部が二つ以上存在しない場合、前記第一条件を満たし、かつ前記第二条件を満たさない導電部を前記新たな第二及び第三導電部のうち少なくとも一つとして選択する請求項10記載の抵抗測定装置。
    The conductive part selector is
    When two or more conductive parts satisfying the first and second conditions do not exist, a conductive part that satisfies the first condition and does not satisfy the second condition is selected from the new second and third conductive parts. The resistance measuring device according to claim 10, wherein at least one is selected.
  12.  面状に拡がる導電性の面状導体と、前記面状導体と対向する基板面と、前記基板面に設けられた導電部とその導電部を前記面状導体に電気的に接続する接続部との対とを有すると共に当該対を三つ以上備える被測定基板の前記接続部の抵抗を測定するための抵抗測定方法であって、
     前記各導電部のうちの一つである第一導電部と前記第一導電部とは異なる導電部である第二導電部との間に電流を流す電流供給工程と、
     前記各導電部のうちの前記第一及び第二導電部とは異なる導電部である第三導電部と前記第一導電部との間の電圧を検出する第一電圧検出工程と、
     前記電流供給工程によって流された電流と前記第一電圧検出工程によって検出された電圧とに基づいて、前記第一導電部と対になる接続部の抵抗値を算出する抵抗算出工程とを含む抵抗測定方法。
    A conductive planar conductor extending in a planar shape; a substrate surface facing the planar conductor; a conductive portion provided on the substrate surface; and a connecting portion for electrically connecting the conductive portion to the planar conductor. A resistance measuring method for measuring the resistance of the connection portion of the substrate to be measured having three or more pairs.
    A current supplying step of passing a current between a first conductive part that is one of the conductive parts and a second conductive part that is a conductive part different from the first conductive part;
    A first voltage detecting step of detecting a voltage between the third conductive portion and the first conductive portion which is a conductive portion different from the first and second conductive portions of the conductive portions;
    A resistance calculation step of calculating a resistance value of a connection portion paired with the first conductive portion based on the current passed through the current supply step and the voltage detected by the first voltage detection step Measuring method.
PCT/JP2017/042511 2016-12-01 2017-11-28 Resistance measurement device and resistance measurement method WO2018101234A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018554147A JP6829371B2 (en) 2016-12-01 2017-11-28 Resistance measuring device and resistance measuring method
CN201780073089.6A CN110023768B (en) 2016-12-01 2017-11-28 Resistance measuring device and resistance measuring method
KR1020197014672A KR102416052B1 (en) 2016-12-01 2017-11-28 Resistance measuring devices and methods of measuring resistance

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-233893 2016-12-01
JP2016233893 2016-12-01

Publications (1)

Publication Number Publication Date
WO2018101234A1 true WO2018101234A1 (en) 2018-06-07

Family

ID=62242132

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/042511 WO2018101234A1 (en) 2016-12-01 2017-11-28 Resistance measurement device and resistance measurement method

Country Status (5)

Country Link
JP (1) JP6829371B2 (en)
KR (1) KR102416052B1 (en)
CN (1) CN110023768B (en)
TW (2) TWI788314B (en)
WO (1) WO2018101234A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095810A1 (en) * 2018-11-09 2020-05-14 日本電産リード株式会社 Inspection instructions information generation device, board inspection system, inspection instructions information generation method, and inspection instructions information generation program
TWI834728B (en) 2018-11-09 2024-03-11 日商日本電產理德股份有限公司 Inspection instruction information generation device, substrate inspection system, inspection instruction information generation method and inspection instruction information generation program

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112763802B (en) * 2019-11-04 2023-04-25 航天科工惯性技术有限公司 Resistance detection device and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013051355A (en) * 2011-08-31 2013-03-14 Fujikura Ltd Penetration wiring inspection method and penetration wiring board manufacturing method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771083B1 (en) * 2002-03-19 2004-08-03 Sandia Corporation Poole-frenkel piezoconductive element and sensor
JP2004101453A (en) * 2002-09-12 2004-04-02 Ngk Spark Plug Co Ltd Characteristics measuring method and system
JP2006047172A (en) * 2004-08-06 2006-02-16 Nidec-Read Corp Apparatus, method and program for inspecting substrate
JP2007178318A (en) * 2005-12-28 2007-07-12 Nidec-Read Corp Substrate inspection device and method
US20100045311A1 (en) * 2008-08-20 2010-02-25 Jaycee Howard Chung Dual Electrical Current Sourcing-piezoresistive Material Self-Sensing (DEC-PMSS) System
JP2011185702A (en) * 2010-03-08 2011-09-22 Yamaha Fine Technologies Co Ltd Electric inspection method and electric inspection device of circuit board
TW201142310A (en) * 2010-05-21 2011-12-01 Yageo Corp Method for measuring the resistance of a chip resistor having a low resistance
KR101849248B1 (en) * 2010-07-20 2018-04-16 히오끼 덴끼 가부시끼가이샤 Circuit board inspection device
JP5507430B2 (en) * 2010-12-03 2014-05-28 日置電機株式会社 Circuit board inspection equipment
KR20120090490A (en) * 2011-02-08 2012-08-17 주식회사 지.엠 Circuit board testing apparatus
CN102645586B (en) * 2011-06-09 2014-07-09 北京京东方光电科技有限公司 Glass base plate, through hole resistance measuring method and metal wire resistance measuring method
JP6311223B2 (en) * 2013-06-07 2018-04-18 日本電産リード株式会社 Inspection device, calibration method of inspection device, and inspection method
JP6229876B2 (en) * 2013-08-27 2017-11-15 日本電産リード株式会社 Inspection device
JP6375661B2 (en) * 2014-03-26 2018-08-22 日本電産リード株式会社 Resistance measuring device, substrate inspection device, inspection method, and maintenance method for inspection jig
JP6592885B2 (en) * 2014-10-08 2019-10-23 日本電産リード株式会社 Substrate inspection method and substrate inspection apparatus
US10302677B2 (en) * 2015-04-29 2019-05-28 Kla-Tencor Corporation Multiple pin probes with support for performing parallel measurements

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013051355A (en) * 2011-08-31 2013-03-14 Fujikura Ltd Penetration wiring inspection method and penetration wiring board manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095810A1 (en) * 2018-11-09 2020-05-14 日本電産リード株式会社 Inspection instructions information generation device, board inspection system, inspection instructions information generation method, and inspection instructions information generation program
CN112969925A (en) * 2018-11-09 2021-06-15 日本电产理德股份有限公司 Inspection instruction information generating device, substrate inspection system, inspection instruction information generating method, and inspection instruction information generating program
JP7384169B2 (en) 2018-11-09 2023-11-21 ニデックアドバンステクノロジー株式会社 Inspection instruction information generation device, board inspection system, inspection instruction information generation method, and inspection instruction information generation program
TWI834728B (en) 2018-11-09 2024-03-11 日商日本電產理德股份有限公司 Inspection instruction information generation device, substrate inspection system, inspection instruction information generation method and inspection instruction information generation program

Also Published As

Publication number Publication date
KR102416052B1 (en) 2022-07-04
TWI788314B (en) 2023-01-01
KR20190089873A (en) 2019-07-31
JP6829371B2 (en) 2021-02-10
CN110023768A (en) 2019-07-16
TW201821811A (en) 2018-06-16
TW202234077A (en) 2022-09-01
JPWO2018101234A1 (en) 2019-10-24
CN110023768B (en) 2021-11-23
TWI809813B (en) 2023-07-21

Similar Documents

Publication Publication Date Title
JP6592885B2 (en) Substrate inspection method and substrate inspection apparatus
JP2001041994A (en) Device and method for inspecting wire of substrate
WO2013168729A1 (en) Insulation inspection method and insulation inspection device
WO2018101234A1 (en) Resistance measurement device and resistance measurement method
JP2017053744A (en) Measurement device and inspection device
JP2007333598A (en) Substrate inspecting means
JP6885612B2 (en) Resistance measuring device and resistance measuring method
JP4949947B2 (en) Circuit board inspection method and circuit board inspection apparatus
JP7352840B2 (en) Inspection instruction information generation device, board inspection system, inspection instruction information generation method, and inspection instruction information generation program
JP2007322127A (en) Method for inspecting substrate and substrate inspection system
WO2008001651A1 (en) Board inspecting method and board inspecting device
JP5991034B2 (en) Electrical property detection method and detection apparatus
JP6446791B2 (en) Substrate inspection method, substrate inspection apparatus, inspection jig, and inspection jig set
JP2006234642A (en) Device and method for inspecting substrate
JP2020128881A (en) Short circuit inspection system, and short circuit inspection method
JP2014181977A (en) Insulation inspection method and insulation inspection device
JP2005337979A (en) Electrostatic capacity measuring method, circuit board inspection method, electrostatic capacity measuring instrument, and circuit board inspection device
JP6696523B2 (en) Resistance measuring method, resistance measuring device, and board inspection device
JP2006071567A (en) Method for determining contact state of probe, and method and apparatus for inspecting circuit board
JP2009115719A (en) Substrate inspection device and substrate inspection method
JP6255833B2 (en) Substrate inspection method and substrate inspection apparatus
JP2001349920A (en) Device and method for inspecting wiring
JP2019086459A (en) Inspection apparatus and inspection method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17876977

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2018554147

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20197014672

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17876977

Country of ref document: EP

Kind code of ref document: A1