WO2018101234A1 - Dispositif de mesure de résistance et procédé de mesure de résistance - Google Patents

Dispositif de mesure de résistance et procédé de mesure de résistance Download PDF

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Publication number
WO2018101234A1
WO2018101234A1 PCT/JP2017/042511 JP2017042511W WO2018101234A1 WO 2018101234 A1 WO2018101234 A1 WO 2018101234A1 JP 2017042511 W JP2017042511 W JP 2017042511W WO 2018101234 A1 WO2018101234 A1 WO 2018101234A1
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WIPO (PCT)
Prior art keywords
conductive
conductive part
new
unit
current
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Application number
PCT/JP2017/042511
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English (en)
Japanese (ja)
Inventor
大輔 高原
Original Assignee
日本電産リード株式会社
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Filing date
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Application filed by 日本電産リード株式会社 filed Critical 日本電産リード株式会社
Priority to JP2018554147A priority Critical patent/JP6829371B2/ja
Priority to CN201780073089.6A priority patent/CN110023768B/zh
Priority to KR1020197014672A priority patent/KR102416052B1/ko
Publication of WO2018101234A1 publication Critical patent/WO2018101234A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/08—Measuring resistance by measuring both voltage and current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections

Definitions

  • the present invention relates to a resistance measuring device and a resistance measuring method for measuring the resistance of a substrate.
  • a substrate provided with a conductor that expands in a planar shape (hereinafter referred to as a planar conductor)
  • conductive portions such as pads, bumps, and wiring on the substrate surface and the planar conductor are electrically connected in the thickness direction of the substrate.
  • a substrate with a connected structure There is a substrate with a connected structure.
  • 11 and 12 are conceptual schematic diagrams showing examples of such a substrate.
  • FIG. 11 is a conceptual schematic diagram showing a multilayer substrate WB, which is an example of a substrate having a planar inner layer pattern IP on the substrate inner layer.
  • the multilayer substrate WB shown in FIG. 11 has conductive portions PA and PB such as pads and wiring patterns formed on the substrate surface BS.
  • the conductive portions PA and PB are electrically connected to the inner layer pattern IP by connection portions RA and RB such as vias and wiring patterns.
  • the inner layer pattern IP corresponds to a planar conductor.
  • a substrate manufacturing method a printed metal board is laminated on both sides of a conductive metal plate as a base, and the two printed wirings are peeled off from the base metal plate.
  • the substrate hereinafter referred to as an intermediate substrate
  • the substrate in a state before the substrate is peeled off from the base metal plate has an aspect in which the metal plate is sandwiched between two substrates. .
  • FIG. 12 is a conceptual schematic diagram showing an example of such an intermediate substrate B.
  • the substrate WB1 is formed on one surface of the metal plate MP
  • the substrate WB2 is formed on the other surface of the metal plate MP.
  • Conductive portions PA1, PB1,..., PF1 such as pads and wiring patterns are formed on the substrate surface BS1 of the substrate WB1.
  • Conductive portions PA2, PB2,..., PF2, such as pads and wiring patterns, are formed on the contact surface BS2 of the substrate WB1 with the metal plate MP.
  • the metal plate MP is a conductive metal plate having a thickness of about 1 mm to 10 mm, for example.
  • the conductive portions PA1 to PF1 are electrically connected to the conductive portions PA2 to PF2 through connection portions RA to RF such as vias and wiring patterns. Since the conductive portions PA2 to PF2 are in close contact with and conductive with the metal plate MP, the conductive portions PA1 to PF1 are electrically connected to the metal plate MP through the connection portions RA to RF.
  • the conductive portion PA1 and the connection portion RA are paired, the conductive portion PB1 and the connection portion RB are paired, and the conductive portion and the connection portion are respectively paired. Since the substrate WB2 is configured in the same manner as the substrate WB1, its description is omitted. In the example of the intermediate substrate B, the metal plate MP corresponds to a planar conductor.
  • the resistance values Ra and Rb of the connection portions RA and RB may be measured.
  • FIG. 13 is an explanatory diagram for explaining a measurement method for measuring the resistance values Ra and Rb of the connection portions RA and RB of the intermediate substrate B shown in FIG.
  • a current I for measurement is passed between the conductive part PA1 and the conductive part PB1, and a voltage generated between the conductive part PA1 and the conductive part PB1.
  • V the resistance value calculated by V / I is Ra + Rb.
  • An object of the present invention is to electrically connect a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion to the planar conductor.
  • Another object of the present invention is to provide a resistance measuring device and a resistance measuring method capable of individually measuring the resistance of each connecting portion of a substrate to be measured having a pair with the connecting portion.
  • a resistance measuring device includes a conductive planar conductor that extends in a planar shape, a substrate surface that faces the planar conductor, a conductive portion provided on the substrate surface, and a conductive portion provided on the surface.
  • a resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured which has a pair of connection portions electrically connected to the conductor and has three or more pairs.
  • a current supply section for passing a current through the planar conductor between a first conductive section that is one of the conductive sections and a second conductive section that is a conductive section different from the first conductive section;
  • a first voltage detection unit for detecting a voltage between a third conductive unit and the first conductive unit, which are different from the first and second conductive units, and the current supply unit. Based on the current passed by the first voltage detector and the voltage detected by the first voltage detector.
  • a resistance calculation unit for calculating the resistance value of the connection portions become conductive portion and pair.
  • the resistance measuring method includes a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion.
  • a resistance measurement method for measuring the resistance of the connection portion of the substrate to be measured which has a pair with a connection portion electrically connected to the planar conductor and includes three or more pairs.
  • a current supplying step of passing a current between a first conductive part that is one of the parts and a second conductive part that is a different conductive part from the first conductive part, and the first of the conductive parts A first voltage detecting step for detecting a voltage between the first conductive portion and the third conductive portion, which is a conductive portion different from the first and second conductive portions, and the current passed through the current supply step and the first Based on the voltage detected by the one voltage detecting step. And a resistance calculation step of calculating a resistance value of the connection portion.
  • FIG. 2 is a block diagram illustrating an example of an electrical configuration of a measurement unit illustrated in FIG. 1. It is a flowchart which shows an example of operation
  • FIG. 1 is a schematic diagram conceptually showing the configuration of a resistance measuring apparatus 1 using a resistance measuring method according to an embodiment of the present invention.
  • a resistance measuring apparatus 1 shown in FIG. 1 is an apparatus for measuring the resistance of a measurement target substrate to be measured.
  • the resistance measuring device 1 may be a substrate inspection device that determines the quality of a measured substrate based on the measured resistance value.
  • the substrate to be measured is, for example, an intermediate substrate or a multilayer substrate, a package substrate for a semiconductor package, a film carrier, a printed wiring substrate, a flexible substrate, a ceramic multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, and these substrates. It may be an intermediate substrate in the process of manufacturing.
  • the multilayer substrate WB shown in FIG. 11 and the intermediate substrate B shown in FIG. 12 correspond to an example of a substrate to be measured.
  • FIG. 1 shows an example in which an intermediate substrate B is attached to the resistance measuring apparatus 1 as a substrate to be measured.
  • the resistance measuring device 1 shown in FIG. In the internal space of the housing 112, a substrate fixing device 110, a measurement unit 121, a measurement unit 122, a measurement unit moving mechanism 125, and a control unit 20 are mainly provided.
  • the substrate fixing device 110 is configured to fix the intermediate substrate B to be measured at a predetermined position.
  • the measurement unit 121 is located above the intermediate substrate B fixed to the substrate fixing device 110.
  • the measurement unit 122 is located below the intermediate substrate B fixed to the substrate fixing device 110.
  • the measurement parts 121 and 122 include measurement jigs 4U and 4L for bringing the probe into contact with the conductive part formed on the intermediate substrate B.
  • a plurality of probes Pr are attached to the measurement jigs 4U and 4L.
  • the measuring jigs 4U and 4L arrange and hold a plurality of probes Pr so as to correspond to the arrangement of the conductive parts to be measured formed on the surface of the intermediate substrate B.
  • the measurement unit moving mechanism 125 appropriately moves the measurement units 121 and 122 in the housing 112 in accordance with a control signal from the control unit 20, and the probes Pr of the measurement jigs 4U and 4L are moved to the respective conductive units of the intermediate substrate B. Make contact.
  • the resistance measuring device 1 may include only one of the measurement units 121 and 122. And the resistance measuring apparatus 1 may be made to measure the both surfaces by reversing the substrate to be measured by either one of the measurement units 121 and 122.
  • the control unit 20 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores a predetermined control program. And a storage unit such as an HDD (Hard Disk Drive), and peripheral circuits thereof. And the control part 20 functions as the electroconductive part selection part 21 and the resistance calculation part 22, for example by running the control program memorize
  • a CPU Central Processing Unit
  • RAM Random Access Memory
  • ROM Read Only Memory
  • FIG. 2 is a block diagram showing an example of an electrical configuration of the measurement unit 121 shown in FIG. Note that the measurement unit 122 is configured in the same manner as the measurement unit 121, and thus the description thereof is omitted.
  • the measurement unit 121 illustrated in FIG. 2 includes a scanner unit 31, a current supply unit CS, a voltage detection unit VM1 (first voltage detection unit), a voltage detection unit VM2 (second voltage detection unit), a current detection unit AM, and a plurality of A probe Pr is provided.
  • the current supply unit CS is a constant current circuit that outputs a current I according to a control signal from the control unit 20.
  • the voltage detection units VM ⁇ b> 1 and VM ⁇ b> 2 are voltage detection circuits that measure a voltage and transmit the voltage value to the control unit 20.
  • the current detection unit AM is a current detection circuit that measures the current I and transmits the current value Ic to the control unit 20.
  • the voltage detector VM2 may not be provided.
  • the scanner unit 31 is a switching circuit configured using switching elements such as transistors and relay switches.
  • the scanner unit 31 includes current terminals + F and ⁇ F for supplying a resistance measurement current I to the intermediate substrate B, and a voltage detection terminal for detecting a voltage generated between the conductive portions of the intermediate substrate B by the current I. + S1, -S1, + S2, and -S2.
  • a plurality of probes Pr are electrically connected to the scanner unit 31.
  • the scanner unit 31 switches the connection relationship between the current terminals + F and ⁇ F and the voltage detection terminals + S1, ⁇ S1, + S2, and ⁇ S2 and the plurality of probes Pr according to a control signal from the control unit 20.
  • the current supply part CS has one end of its output terminal connected to the circuit ground and the other end connected to the current terminal + F.
  • the current detection unit AM has one end connected to the current terminal -F and the other end connected to the circuit ground.
  • the voltage detection unit VM1 has one end connected to the voltage detection terminal + S1 and the other end connected to the voltage detection terminal -S1.
  • the voltage detection unit VM2 has one end connected to the voltage detection terminal + S2 and the other end connected to the voltage detection terminal -S2.
  • the scanner unit 31 can connect the current terminals + F and ⁇ F and the voltage detection terminals + S1, ⁇ S1, + S2, and ⁇ S2 to an arbitrary probe Pr in accordance with a control signal from the control unit 20. .
  • the scanner unit 31 causes the current I to flow between any conductors in contact with the probe Pr in accordance with a control signal from the control unit 20, and causes the current detection unit AM to measure the current I.
  • the voltage V generated between the conductor portions can be measured by the voltage detection units VM1 and VM2.
  • the current supply unit CS is not limited to the example in which one end of the current supply unit CS is connected to the circuit ground as long as the current I can flow through the intermediate substrate B via the scanner unit 31.
  • the current loop may be formed by connecting one end of the current supply unit CS and the other end of the current detection unit AM.
  • the current detection unit AM may be disposed on the path through which the current I flows, and is not necessarily limited to the example connected to the current terminal -F.
  • the current detection unit AM may be connected in series with the current supply unit CS and connected to the current terminal + F.
  • control unit 20 outputs a control signal to the scanner unit 31 so that the current supply unit CS causes the current I to flow between the arbitrary probes Pr, and the voltage between the arbitrary probes Pr is detected by the voltage detection unit VM1, VM1. It is possible to be detected by VM2.
  • the conductive part selector 21 selects the first, second, third, and fourth conductive parts from the conductive parts in contact with the probe Pr. Since the resistance calculation unit 22 calculates the resistance value of the connection part paired with the conductive part selected as the first and second conductive parts, the conductive part selection part 21 is a connection part for which the resistance value has not yet been calculated. By sequentially selecting new conductive parts that are paired with each other as the first and second conductive parts, the resistance values of all the connection parts for which the resistance value is finally measured are measured.
  • the conductive part selection unit 21 connects the probe Pr that is in contact with the first conductive part and the current detection unit AM (current terminal -F) by the scanner unit 31 and the probe Pr that is in contact with the second conductive part. And the current supply part CS (current terminal + F) are connected, the probe Pr that is in contact with the third conductive part is connected to one end (voltage detection terminal + S1) of the voltage detection part VM1, and is in contact with the first conductive part
  • the probe Pr in contact with the fourth conductive portion and the other end (voltage detection terminal -S2) of the voltage detection unit VM2 are connected (see FIG. 6).
  • the conductive part selector 21 causes the current supply part CS to pass a current between the first conductive part and the second conductive part via the metal plate MP, and the voltage detection part VM1 causes the first conductive part and the second conductive part to flow.
  • the voltage between the three conductive portions is detected, and the voltage between the second conductive portion and the fourth conductive portion is detected by the voltage detection unit VM2.
  • the resistance calculation unit 22 Based on the current value Ic measured by the current detection unit AM, that is, the current I passed by the current supply unit CS, and the voltage V1 detected by the voltage detection unit VM1, the resistance calculation unit 22 Calculate the resistance value of the pair of connections. Further, the resistance calculation unit 22 calculates the resistance value of the connection part paired with the second conductive part, based on the current value Ic and the voltage V2 detected by the voltage detection part VM2.
  • a resistance measurement method for measuring the resistance of the substrate WB1 using the measurement unit 121 will be described by taking the case where the substrate to be measured is the intermediate substrate B as an example. Since the measurement of the resistance of the substrate WB2 using the measurement unit 122 is the same as the measurement of the resistance of the substrate WB1 using the measurement unit 121, the description thereof is omitted.
  • FIG. 3 to 5 are flowcharts showing an example of the operation of the resistance measuring apparatus 1 using the resistance measuring method according to the embodiment of the present invention.
  • the flowcharts shown in FIG. 3 to FIG. 5 exemplify the case where the intermediate substrate B is measured.
  • 6 to 9 are explanatory diagrams for explaining the operation of the resistance measuring apparatus 1 shown in FIG. 6 to 9, the description of the scanner unit 31 is omitted for the sake of simplicity.
  • control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 to bring the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1).
  • the control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 to bring the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1).
  • the control unit 20 moves the measurement unit 121 by the measurement unit moving mechanism 125 to bring the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1).
  • FIG. 6 a case where resistance is measured by a so-called four-terminal measurement method is illustrated, and two probes Pr are in contact with each of the conductive portions PA1 to PF1.
  • the resistance measuring apparatus 1 is not limited to the example of performing resistance measurement by the four-terminal measurement method, and a configuration in which the probe Pr is brought into contact with each conductive portion one by one and the current supply and the voltage measurement are combined with one probe Pr. It is good.
  • the conductive part selection unit 21 selects an arbitrary conductive part among the conductive parts PA1 to PF1, for example, the conductive part PB1 and the conductive part PC1, the conductive part PB1 as the first conductive part, and the conductive part PC1 as the second.
  • a conductive portion is set (step S2: conductive portion selection step).
  • the conductive part selection unit 21 changes the first condition different from the first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part.
  • the third and fourth conductive parts satisfying the second condition that the shortest conductive path to reach the second condition that does not overlap the current path flowing through the metal plate MP are searched, and the conductive part PA1 that satisfies the first and second conditions is determined as the third conductive part.
  • the conductive part PD1 is selected as the fourth conductive part (step S3: conductive part selection step).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PB1 (first conductive unit) and connect the current supply unit CS to the conductive unit PC1 (second conductive unit).
  • the current I is supplied between the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part) by the current supply part CS (step S4: current supply step), and the current value Ic of the current I is set to Measurement is performed by the current detector AM (step S5) (see FIG. 6).
  • the conductive part selector 21 uses the scanner 31 to connect one terminal of the voltage detector VM1 to the conductive part PB1 (first conductive part) and the other terminal of the voltage detector VM1 to the conductive part PA1 (third conductive part).
  • the voltage detection unit VM1 measures the voltage V1 between the conductive part PB1 (first conductive part) and the conductive part PA1 (third conductive part) (step S6: first voltage detection step) (FIG. 6).
  • the conductive part selector 21 uses the scanner 31 to connect one terminal of the voltage detector VM2 to the conductive part PC1 (second conductive part) and the other terminal of the voltage detector VM2 to the conductive part PD1 (fourth conductive part).
  • the voltage detection unit VM2 measures the voltage V2 between the conductive part PC1 (second conductive part) and the conductive part PD1 (fourth conductive part) (step S7: second voltage detection step) (FIG. 6).
  • the conductive part PA1 (third conductive part) satisfies the first condition because it is different from the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part).
  • the shortest conductive path from the conductive part PA1 (third conductive part) to the conductive part PB1 (first conductive part) is the conductive path X from the conductive part PA1 to the connecting part RA, the metal plate MP, And a path reaching the conductive portion PB1 via the connection portion RB.
  • the current path A flowing through the metal plate MP and the conductive path X do not overlap the current I flowing between the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part). Accordingly, the conductive parts PA1 (third conductive part), PB1 (first conductive part), and PC1 (second conductive part) satisfy the first condition and the second condition.
  • the conductive part PD1 (fourth conductive part) is a conductive part different from the conductive part PB1 (first conductive part) and the conductive part PC1 (second conductive part), the first condition is satisfied.
  • the shortest conductive path from the conductive part PD1 (fourth conductive part) to the conductive part PC1 (second conductive part) is as shown in FIG. And a path to the conductive part PC1 through the connection part RC.
  • the current path A flowing through the metal plate MP and the conductive path Y do not overlap the current I flowing between the conductive portion PB1 (first conductive portion) and the conductive portion PC1 (second conductive portion). Therefore, the conductive part PB1 (first conductive part), PC1 (second conductive part), and PD1 (fourth conductive part) satisfy the first condition and the second condition.
  • the conductive parts PD1 fourth conductive part
  • PB1 first conductive part
  • PC1 second conductive part
  • the resistance calculation unit 22 calculates the resistance value Rb of the connection part RB and the resistance value Rc of the connection part RC based on the following formulas (1) and (2) (step S8: resistance calculation step). ).
  • Rb V1 / Ic (1)
  • Rc V2 / Ic (2)
  • the current value Ic is not necessarily measured by the current detection unit AM.
  • the current detection unit AM may be omitted, and the current supply unit CS may output a current I having a preset current value Ic.
  • the conductive part selection unit 21 is not limited to the example of selecting the third conductive part and the fourth conductive part so as to satisfy the second condition described above, and the third conductive part and the fourth conductive part that do not satisfy the second condition.
  • a conductive part may be selected. Even when the third conductive portion and the fourth conductive portion that do not satisfy the second condition are selected, the resistance value of each connection portion can be individually measured.
  • FIG. 7 is an explanatory diagram for explaining an example of selecting a third conductive part and a fourth conductive part that do not satisfy the second condition.
  • the conductive portion PA1 is selected as the first conductive portion
  • the conductive portion PD1 is selected as the second conductive portion
  • the conductive portion PB1 is selected as the third conductive portion
  • the conductive portion PC1 is selected as the fourth conductive portion.
  • the third and fourth conductive portions do not satisfy the second condition.
  • the resistance calculation unit 22 can individually calculate the resistance value Ra of the connection part RA and the resistance value Rd of the connection part RD. .
  • the resistance value Ra of the connection portion RA calculated by the resistance calculation unit 22 includes the resistance value Rx of the conductive path X of the metal plate MP.
  • the resistance value Rd of the connection part RD calculated by the resistance calculation part 22 includes the resistance value Ry of the conductive path Y of the metal plate MP.
  • the planar conductors such as the metal plate MP and the inner layer pattern IP have very small resistance values Rx and Ry because the conductor area is wide.
  • the metal plate MP has a large conductor area and a thickness of 1 mm to 10 mm.
  • the resistance values Rx and Ry are extremely small and can be ignored because they are thick and wide in cross section.
  • step S3 by selecting the third and fourth conductive portions that satisfy the second condition, the voltages V1 and V2 do not include the voltage generated by the current I flowing through the metal plate MP. It is more preferable in that the accuracy of calculating the resistance value of the connecting portion can be further improved.
  • the conductive portion selection unit 21 When there is a connection portion for which the resistance value has not yet been calculated, the conductive portion selection unit 21 has a connection different from the connection portions RB and RC whose resistance values have already been calculated in order to calculate the resistance value of the new connection portion.
  • the conductive parts PD1, PE1 paired with the connection parts RD, RE, for example, are selected as new first and second conductive parts (step S11: conductive part selection step) (see FIG. 8).
  • the conductive part selector 21 has a first condition different from the new first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part.
  • the third and fourth conductive parts satisfying the second condition in which the shortest conductive path reaching the part does not overlap with the current path A flowing through the metal plate MP are searched, and the conductive part PC1 satisfying the first and second conditions is newly found.
  • the third conductive portion is selected, and the conductive portion PF1 is selected as the fourth conductive portion (step S12: conductive portion selection step).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PD1 (first conductive unit) and connect the current supply unit CS to the conductive unit PE1 (second conductive unit).
  • the current I is supplied between the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part) by the current supply part CS (step S13: current supply step), and the current value Ic of the current I is set to Measurement is performed by the current detection unit AM (step S14) (see FIG. 8).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM1 to the conductive unit PD1 (first conductive unit) and the other terminal of the voltage detection unit VM1 to the conductive unit PC1 (third conductive unit).
  • the voltage detection unit VM1 measures the voltage V1 between the conductive part PD1 (first conductive part) and the conductive part PC1 (third conductive part) (step S15: first voltage detection step) (FIG. 8).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM2 to the conductive unit PE1 (second conductive unit) and the other terminal of the voltage detection unit VM2 to the conductive unit PF1 (fourth conductive unit).
  • the voltage detection unit VM2 measures the voltage V2 between the conductive part PE1 (second conductive part) and the conductive part PF1 (fourth conductive part) (step S16: second voltage detection step) (FIG. 8).
  • the conductive part PC1 (third conductive part) satisfies the first condition because it is a different conductive part from the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part).
  • the shortest conductive path from the conductive part PC1 (third conductive part) to the conductive part PD1 (first conductive part) is the conductive path X from the conductive part PC1 to the connection part RC and the metal plate MP, And a path reaching the conductive portion PD1 via the connection portion RD.
  • the current path A and the conductive path X where the current I flowing between the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part) flows through the metal plate MP do not overlap. Accordingly, the conductive part PC1 (third conductive part), PD1 (first conductive part), and PE1 (second conductive part) satisfy the first condition and the second condition.
  • the conductive part PF1 (fourth conductive part) is a conductive part different from the conductive part PD1 (first conductive part) and the conductive part PE1 (second conductive part), the first condition is satisfied.
  • the shortest conductive path from the conductive part PF1 (fourth conductive part) to the conductive part PE1 (second conductive part) is the conductive part Y from the conductive part PF1, the conductive path Y of the metal plate MP, And a path to the conductive part PE1 via the connection part RE.
  • the voltages V1 and V2 obtained in this way are substantially equal to the voltage generated by the current I flowing through the connection parts RD and RE, as in the case of the connection parts RB and RC described above.
  • the resistance calculation unit 22 calculates the resistance value Rd of the connection part RD and the resistance value Re of the connection part RE based on the following formulas (3) and (4) (step S17: resistance calculation step). ).
  • Rd V1 / Ic (3)
  • Re V2 / Ic (4)
  • connection parts RD and RE can be measured individually.
  • the conductive portion selection unit 21 calculates the resistance value of the new connection portion by connecting the connection portions RB, RC, RD, RE whose resistance values have already been calculated. Select another connection part, for example, the conductive parts PA1 and PF1 paired with the connection parts RA and RF as new first and second conductive parts (step S21: conductive part selection step).
  • the conductive part selector 21 has a first condition different from the new first and second conductive parts, the shortest conductive path from the third conductive part to the first conductive part, and the fourth conductive part to the second conductive part.
  • the third and fourth conductive parts that satisfy the second condition in which the shortest conductive path leading to the part does not overlap with the current path flowing through the metal plate MP are searched.
  • the resistance measuring apparatus 1 includes a conductive portion on the substrate surface BS1 of the substrate WB1 that contacts the probe Pr of the measurement unit 121 and a conductive portion of the substrate surface BS1 of the substrate WB2 that contacts the probe Pr of the measurement unit 122 An example will be described in which a current cannot be passed or the voltage between the conductive parts on both sides cannot be measured.
  • step S22 there is no conductive part that satisfies the first condition and the second condition (step S22).
  • the case where there is no conductive part satisfying the first and second conditions means that the first and second conditions are satisfied and the conductive part is the third conductive part.
  • the conductive part is the fourth conductive part This means that there is no conductive part that can contact the probe Pr and measure the voltage between the first conductive part and the fourth conductive part by the second voltage detection part.
  • the case where there is no conductive part that satisfies the first and second conditions means that the first and second conditions are satisfied and the conductive part is the third conductive part. This means that there is no conductive part that can contact the probe Pr and measure the voltage between the first conductive part and the third conductive part by the first voltage detection part.
  • step S23 when there is only one conductive part that satisfies the first condition and the second condition, the conductive part selector 21 replaces the conductive parts PB1 and PE1 that satisfy the first condition and do not satisfy the second condition with new third and second conditions.
  • the four conductive portions are selected (step S23: conductive portion selection step).
  • step S23 when there is only one conductive part that satisfies the first condition and the second condition, the conductive part selector 21 newly adds a conductive part that satisfies the first condition and the second condition.
  • the conductive part that satisfies the first condition and does not satisfy the second condition may be selected as the other of the new third and fourth conductive parts.
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect the current detection unit AM to the conductive unit PA1 (first conductive unit) and connect the current supply unit CS to the conductive unit PF1 (second conductive unit).
  • the current I is supplied between the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part) by the current supply part CS (step S24: current supply process), and the current value Ic of the current I is set to Measurement is performed by the current detector AM (step S25) (see FIG. 9).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM1 to the conductive unit PA1 (first conductive unit) and the other terminal of the voltage detection unit VM1 to the conductive unit PB1 (third conductive unit).
  • the voltage detection unit VM1 measures the voltage V1 between the conductive part PA1 (first conductive part) and the conductive part PB1 (third conductive part) (step S26: first voltage detection step) (FIG. 9).
  • the conductive portion selection unit 21 causes the scanner unit 31 to connect one terminal of the voltage detection unit VM2 to the conductive unit PF1 (second conductive unit) and the other terminal of the voltage detection unit VM2 to the conductive unit PE1 (fourth conductive unit).
  • the voltage detection unit VM2 measures the voltage V2 between the conductive unit PF1 (second conductive unit) and the conductive unit PE1 (fourth conductive unit) (step S27: second voltage detection step) (FIG. 9).
  • the first condition is satisfied.
  • the shortest conductive path from the conductive part PB1 (third conductive part) to the conductive part PA1 (first conductive part) is the conductive path X from the conductive part PB1 to the connection part RB, the metal plate MP, And a path reaching the conductive portion PA1 via the connection portion RA.
  • the current path A and the conductive path X where the current I flowing between the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part) flows through the metal plate MP overlap each other. Therefore, the conductive part PB1 (third conductive part), PA1 (first conductive part), and PF1 (second conductive part) do not satisfy the second condition.
  • the conductive part PE1 (fourth conductive part) is a conductive part different from the conductive part PA1 (first conductive part) and the conductive part PF1 (second conductive part), the first condition is satisfied.
  • the shortest conductive path from the conductive part PE1 (fourth conductive part) to the conductive part PF1 (second conductive part) is the conductive part Y, the conductive part Y of the metal plate MP, the conductive path Y, And a path that reaches the conductive portion PF1 via the connection portion RF.
  • the resistance calculator 22 calculates the resistance value Ra of the connection portion RA and the resistance value Rf of the connection portion RF based on the following formulas (5) and (6) (step S28: resistance calculation step). ).
  • Ra V1 / Ic (5)
  • Rf V2 / Ic (6)
  • the resistance values of the connection portions RA and RF can be individually measured.
  • the voltages V1 and V2 measured in steps S26 and S27 include the voltage generated by the current I flowing through the conductive paths X and Y of the metal plate MP as described above.
  • the resistance values Ra and Rf calculated by the equations (5) and (6) include the resistance values Rx and Ry as errors. However, as described above, the resistance values Rx and Ry are minute and can be substantially ignored.
  • a planar conductor such as a conductive intermediate substrate B spreading in a planar shape, a substrate surface BS1 facing the planar conductor, and a conductive portion PA1 provided on the substrate surface BS1.
  • Resistance values Ra to Rf of the connection portions RA to RF of the substrate to be measured such as the intermediate substrate B having a pair of connection portions RA to RF that electrically connect the conductive portions PA1 to PF1 to the planar conductors Can be measured individually.
  • one conductive part may serve as the third conductive part and the fourth conductive part, that is, the third conductive part and the fourth conductive part may be the same conductive part.
  • the conductive portion selection unit 21 satisfies the first and second conditions for the third conductive portion and satisfies the first and second conditions for the fourth conductive portion. You may select as an electroconductive part which serves as a part.
  • FIG. 10 is an explanatory diagram for explaining the operation of the resistance measuring apparatus when the third conductive portion and the fourth conductive portion are the same conductive portion.
  • the conductive part PA1 serves as the first conductive part
  • the conductive part PC1 serves as the second conductive part
  • the conductive part PB1 serves as the third conductive part and the fourth conductive part. That is, the third conductive portion and the fourth conductive portion are the same conductive portion PB1.
  • the voltage detection unit VM1 measures the voltage between the conductive part PA1 (first conductive part) and the conductive part PB1 (third and fourth conductive parts) as the voltage V1.
  • the voltage detection unit VM2 measures the voltage between the conductive part PB1 (third and fourth conductive parts) and the conductive part PC1 (second conductive part) as the voltage V2.
  • the resistance calculation unit 22 calculates the resistance value Ra of the connection portion RA and the resistance value Rc of the connection portion RC based on the following formulas (7) and (8) (resistance calculation step).
  • Ra V1 / Ic (7)
  • Rc V2 / Ic (8)
  • the resistance calculation unit 22 can individually calculate the resistance value Ra of the connection part RA and the resistance value Rc of the connection part RC.
  • the current supply part CS, the current detection part AM, The voltage detection units VM1 and VM2 may be electrically connected to the conductive unit.
  • the resistance measuring device 1 may not include the voltage detection unit VM2, and the conductive unit selection unit 21 may be configured not to select the fourth conductive unit.
  • the conductive part selection unit 21 may select the first, second, third, and fourth conductive parts regardless of whether or not the second condition is satisfied. In addition, when selecting the new third and fourth conductive parts, the conductive part selection unit 21 may select a conductive part that satisfies the first condition different from the new first and second conductive parts. The same conductive parts as the third and fourth conductive parts may be selected as new third and fourth conductive parts. Moreover, the resistance measuring apparatus 1 does not include the conductive part selection unit 21, and the first, second, third, and fourth conductive parts may be appropriately set.
  • the resistance measuring apparatus includes a conductive planar conductor that extends in a planar shape, a substrate surface that faces the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion.
  • a resistance measuring device for measuring the resistance of the connection part of the substrate to be measured which has a pair of connection parts electrically connected to the planar conductor and has three or more pairs.
  • a current supply section for passing a current through the planar conductor between a first conductive section which is one of the conductive sections and a second conductive section which is a conductive section different from the first conductive section;
  • a first voltage detection unit for detecting a voltage between the third conductive unit and the first conductive unit, which is a conductive unit different from the first and second conductive units among the conductive units, and the current Based on the current passed by the supply unit and the voltage detected by the first voltage detection unit
  • a resistance calculation unit for calculating the resistance value of the connection portion to be the first conductive portion and the pair.
  • the current supply unit causes the connection part that is paired with the third conductive part in the path connecting the third conductive part and the first conductive part to be voltage-measured by the first voltage detection unit. Current does not flow.
  • the voltage measured by the first voltage detection unit includes the voltage drop of the connection part paired with the first conductive part, while the voltage drop of the connection part paired with the third conductive part is included. Absent.
  • the resistance value calculated by the resistance calculation unit based on the current supplied by the current supply unit and the voltage detected by the first voltage detection unit is the resistance value of the connection unit paired with the first conductive unit. Almost equal. Thereby, the resistance value of the connection part which becomes a pair with a 1st electroconductive part can be measured separately.
  • the resistance measuring device detects a voltage between a fourth conductive part and a second conductive part, which are conductive parts different from the first and second conductive parts among the conductive parts.
  • the resistance calculation unit further includes a voltage detection unit, and the resistance calculation unit is further paired with the second conductive unit based on a current passed by the current supply unit and a voltage detected by the second voltage detection unit. It is preferable to calculate the resistance value of the connection portion.
  • the current supply unit passes the connection part paired with the fourth conductive part in the path connecting the fourth conductive part and the second conductive part whose voltage is measured by the second voltage detection part. Current does not flow.
  • the voltage measured by the second voltage detection unit includes the voltage drop of the connection part paired with the second conductive part, while the voltage drop of the connection part paired with the fourth conductive part is included. Absent.
  • the resistance value calculated by the resistance calculation unit based on the current passed by the current supply unit and the voltage detected by the second voltage detection unit is the resistance value of the connection unit paired with the second conductive unit. Almost equal.
  • each connection part which makes a pair with the 1st and 2nd electroconductive part can be measured separately. Since the voltage measurement by the first and second voltage detectors can be performed in parallel and the resistance value of each connection part paired with the first and second conductive parts can be measured individually, the resistance measurement time is reduced. It becomes possible to do.
  • the fourth conductive part is preferably the same conductive part as the third conductive part.
  • one conductive portion serves as both the third conductive portion and the fourth conductive portion.
  • the resistance values of two connecting portions that are paired with two conductive portions (first and second conductive portions) among the three conductive portions that are the first, second, third, and fourth conductive portions are measured. can do. Therefore, in addition to the two conductive parts to be measured for resistance, another conductive part only needs to be secured, so that resistance measurement is facilitated.
  • a conductive part that is paired with a connection part different from the connection part for which the resistance value is calculated is selected as a new first conductive part, and the new conductive part among the conductive parts is selected.
  • a conductive part selection unit that selects a conductive part satisfying a first condition different from the first conductive part as a new second and third conductive part; and the current supply unit further includes the new first conductive part.
  • the resistance calculation unit further includes a resistance value of a connection unit paired with the new first conductive unit based on a current passed by the current supply unit and a voltage detected by the first voltage detection unit. Is preferably calculated.
  • the conductive part selection unit sequentially selects the conductive part paired with the connection part whose resistance value has not yet been measured as the first conductive part, so that each conductive part provided on the measurement target substrate. It is possible to sequentially measure the resistance values of the two.
  • a conductive part paired with a connection part different from the connection part for which the resistance value is calculated is selected as a new first and second conductive part
  • a conductive portion selecting section that selects a conductive portion that satisfies a first condition different from the new first and second conductive portions as a new third and fourth conductive portion
  • the current supply portion further includes: A current is caused to flow between the new first conductive part and the new second conductive part via the planar conductor, and the first voltage detection unit further includes the new third conductive part and the new third conductive part. A voltage between the first conductive part is detected, and the second voltage detection part further detects a voltage between the new fourth conductive part and the new second conductive part, and calculates the resistance.
  • the unit further detects the current passed by the current supply unit and the first and second voltage detection units. Based on the voltage and that, it is preferable to calculate the resistance value of said a new resistance value of the first conductive portion and the paired connection portions become new second conductive portion and the pair connection.
  • the conductive part selection unit is provided on the measured substrate by sequentially selecting the conductive parts that form a pair with the connection part whose resistance value has not been measured as the first and second conductive parts. It is possible to sequentially measure two resistance values of each conductive part.
  • the third conductive portion is a conductive portion different from the first conductive portion and the second conductive portion among the conductive portions, and is the shortest conductive portion from the third conductive portion to the first conductive portion. It is preferable that the path is a conductive part that does not overlap a current path that flows through the planar conductor of a current that is supplied by the current supply part.
  • the fourth conductive portion is a conductive portion different from the first and second conductive portions of the conductive portions, and is the shortest conductive portion from the fourth conductive portion to the second conductive portion. It is preferable that the path is a conductive part that does not overlap a current path that flows through the planar conductor of a current that is supplied by the current supply part.
  • the conductive part selection unit selects, as the first first conductive part, a conductive part paired with a connection part different from the connection part for which the resistance value has been calculated among the conductive parts,
  • the first condition that is different from the new first conductive part among the conductive parts and the shortest conductive path from the new third conductive part to the new first conductive part are caused to The new second conductive portion and the new second conductive portion so as to satisfy a second condition that does not overlap with a current path flowing through the planar conductor of a current flowing between the one conductive portion and the new second conductive portion. It is preferable to select three conductive parts.
  • the conductive part selection unit sequentially selects the conductive part paired with the connection part whose resistance value has not yet been measured as the first conductive part, so that each conductive part provided on the measurement target substrate. It becomes possible to measure the resistance value of each in turn.
  • the measurement accuracy of the voltage generated at the connection unit paired with the new first conductive unit As a result, the resistance calculation accuracy of the connection portion paired with the new first conductive portion by the resistance calculation portion is improved.
  • the conductive part selection unit satisfies the first condition and does not satisfy the second condition. It is preferable to select the third conductive portion.
  • the resistance calculation unit can also calculate the resistance value of the connection part paired with the conductive part that does not satisfy the second condition.
  • the conductive part selection unit selects, as the first and second conductive parts, a conductive part paired with a connection part different from the connection part for which the resistance value has been calculated among the conductive parts.
  • the shortest conductive path from the conductive part to the new second conductive part is the shortest conductive path of the current conductor flowing between the new first conductive part and the new second conductive part by the current supply part. It is preferable to select the new third conductive part and the new fourth conductive part so as to satisfy the second condition that does not overlap the flowing current path.
  • the conductive part selection unit is provided on the measured substrate by sequentially selecting the conductive parts that form a pair with the connection part whose resistance value has not been measured as the first and second conductive parts. Two resistance values of each conductive part can be sequentially measured.
  • the connection part paired with the new first and second conductive parts As a result of improving the measurement accuracy of the generated voltage, the calculation accuracy of the resistance value of the connection portion paired with the new first and second conductive portions by the resistance calculation portion is improved.
  • the conductive part selecting unit when there are no two or more conductive parts that satisfy the first and second conditions, the conductive part selecting unit satisfies the first condition and does not satisfy the second condition. It is preferable to select at least one of the second and third conductive parts.
  • the resistance calculation unit can also calculate the resistance value of the connection part paired with the conductive part that does not satisfy the second condition.
  • the resistance measuring method includes a conductive planar conductor extending in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion.
  • a resistance measurement method for measuring the resistance of the connection portion of the substrate to be measured which has a pair with a connection portion electrically connected to the planar conductor and includes three or more pairs.
  • a current supplying step of passing a current between a first conductive part that is one of the parts and a second conductive part that is a different conductive part from the first conductive part, and the first of the conductive parts A first voltage detecting step for detecting a voltage between the first conductive portion and the third conductive portion, which is a conductive portion different from the first and second conductive portions, and the current passed through the current supply step and the first Based on the voltage detected by the one voltage detecting step. And a resistance calculation step of calculating a resistance value of the connection portion.
  • the current supply step causes the connection portion that is paired with the third conductive portion in the path connecting the third conductive portion and the first conductive portion to be voltage-measured in the first voltage detection step. Current does not flow.
  • the voltage measured by the first voltage detection step includes the voltage drop of the connection part paired with the first conductive part, while the voltage drop of the connection part paired with the third conductive part is included. Absent.
  • the resistance value calculated based on the current passed in the current supply step and the voltage detected in the first voltage detection step is the resistance of the connection portion paired with the first conductive portion. Almost equal to the value. Thereby, the resistance value of the connection part which becomes a pair with a 1st electroconductive part can be measured separately.
  • the resistance measuring device and the resistance measuring method having such a configuration include a conductive planar conductor spreading in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion. It is possible to individually measure the resistance of the connection portion of the substrate to be measured having a pair with a connection portion that is electrically connected to the planar conductor.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Dans la présente invention, un substrat intermédiaire B comprend : une plaque métallique MP qui est étalée à plat ; des surfaces de substrat BS1 faisant face à la plaque métallique MP ; et des paires de sections d'électroconduction PA1-PF1 disposées sur les surfaces de substrat BS1 et des sections de connexion RA-RF connectant électriquement les sections d'électroconduction à la plaque métallique MP, trois ou plusieurs de ces paires étant disposées. En ce qui concerne le substrat intermédiaire, les éléments suivants sont fournis : une unité de distribution de courant CS pour permettre à un courant de circuler par l'intermédiaire de la plaque métallique MP entre la section d'électroconduction PB1 (première section d'électroconduction) et la section d'électroconduction PC1 (deuxième section d'électroconduction), parmi les sections d'électroconduction PA1-PF1 ; une unité de détection de tension VM1 pour détecter une tension entre la section d'électroconduction PA1 (troisième section d'électroconduction) et la section d'électro-conduction PB1 (première section d'électroconduction) ; et une unité de calcul de résistance 22 pour calculer une valeur de résistance de la section de connexion RB qui est appariée à la section d'électroconduction PB1 (première section d'électroconduction) sur la base d'un courant I transmis par l'unité de distribution de courant CS et de la tension détectée par l'unité de détection de tension VM1.
PCT/JP2017/042511 2016-12-01 2017-11-28 Dispositif de mesure de résistance et procédé de mesure de résistance WO2018101234A1 (fr)

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JP2018554147A JP6829371B2 (ja) 2016-12-01 2017-11-28 抵抗測定装置及び抵抗測定方法
CN201780073089.6A CN110023768B (zh) 2016-12-01 2017-11-28 电阻测量装置和电阻测量方法
KR1020197014672A KR102416052B1 (ko) 2016-12-01 2017-11-28 저항 측정 장치 및 저항 측정 방법

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095810A1 (fr) * 2018-11-09 2020-05-14 日本電産リード株式会社 Dispositif de génération d'informations d'instructions d'inspection, système d'inspection de cartes, procédé et programme de génération d'informations d'instructions d'inspection
TWI834728B (zh) 2018-11-09 2024-03-11 日商日本電產理德股份有限公司 檢查指示資訊產生裝置、基板檢查系統、檢查指示資訊產生方法以及檢查指示資訊產生程式

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112763802B (zh) * 2019-11-04 2023-04-25 航天科工惯性技术有限公司 一种电阻检测装置及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013051355A (ja) * 2011-08-31 2013-03-14 Fujikura Ltd 貫通配線の検査方法、貫通配線基板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771083B1 (en) * 2002-03-19 2004-08-03 Sandia Corporation Poole-frenkel piezoconductive element and sensor
JP2004101453A (ja) * 2002-09-12 2004-04-02 Ngk Spark Plug Co Ltd 特性測定方法及び装置
JP2006047172A (ja) * 2004-08-06 2006-02-16 Nidec-Read Corp 基板検査装置、基板検査プログラム及び基板検査方法
JP2007178318A (ja) * 2005-12-28 2007-07-12 Nidec-Read Corp 基板検査装置及び方法
US20100045311A1 (en) * 2008-08-20 2010-02-25 Jaycee Howard Chung Dual Electrical Current Sourcing-piezoresistive Material Self-Sensing (DEC-PMSS) System
JP2011185702A (ja) * 2010-03-08 2011-09-22 Yamaha Fine Technologies Co Ltd 回路基板の電気検査方法及び電気検査装置
TW201142310A (en) * 2010-05-21 2011-12-01 Yageo Corp Method for measuring the resistance of a chip resistor having a low resistance
KR101849248B1 (ko) * 2010-07-20 2018-04-16 히오끼 덴끼 가부시끼가이샤 회로 기판 검사 장치
JP5507430B2 (ja) * 2010-12-03 2014-05-28 日置電機株式会社 回路基板検査装置
KR20120090490A (ko) * 2011-02-08 2012-08-17 주식회사 지.엠 기판 검사장치
CN102645586B (zh) * 2011-06-09 2014-07-09 北京京东方光电科技有限公司 玻璃基板、过孔电阻测量方法和金属线电阻的测量方法
JP6311223B2 (ja) * 2013-06-07 2018-04-18 日本電産リード株式会社 検査装置、検査装置のキャリブレーション方法及び検査方法
JP6229876B2 (ja) * 2013-08-27 2017-11-15 日本電産リード株式会社 検査装置
JP6375661B2 (ja) * 2014-03-26 2018-08-22 日本電産リード株式会社 抵抗測定装置、基板検査装置、検査方法、及び検査用治具のメンテナンス方法
JP6592885B2 (ja) * 2014-10-08 2019-10-23 日本電産リード株式会社 基板検査方法及び基板検査装置
US10302677B2 (en) * 2015-04-29 2019-05-28 Kla-Tencor Corporation Multiple pin probes with support for performing parallel measurements

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013051355A (ja) * 2011-08-31 2013-03-14 Fujikura Ltd 貫通配線の検査方法、貫通配線基板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095810A1 (fr) * 2018-11-09 2020-05-14 日本電産リード株式会社 Dispositif de génération d'informations d'instructions d'inspection, système d'inspection de cartes, procédé et programme de génération d'informations d'instructions d'inspection
CN112969925A (zh) * 2018-11-09 2021-06-15 日本电产理德股份有限公司 检查指示信息产生装置、基板检查系统、检查指示信息产生方法以及检查指示信息产生程序
JP7384169B2 (ja) 2018-11-09 2023-11-21 ニデックアドバンステクノロジー株式会社 検査指示情報生成装置、基板検査システム、検査指示情報生成方法、及び検査指示情報生成プログラム
TWI834728B (zh) 2018-11-09 2024-03-11 日商日本電產理德股份有限公司 檢查指示資訊產生裝置、基板檢查系統、檢查指示資訊產生方法以及檢查指示資訊產生程式

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TW201821811A (zh) 2018-06-16
JPWO2018101234A1 (ja) 2019-10-24
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JP6829371B2 (ja) 2021-02-10
TW202234077A (zh) 2022-09-01

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