CN102645586B - 玻璃基板、过孔电阻测量方法和金属线电阻的测量方法 - Google Patents
玻璃基板、过孔电阻测量方法和金属线电阻的测量方法 Download PDFInfo
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- CN102645586B CN102645586B CN201110153757.0A CN201110153757A CN102645586B CN 102645586 B CN102645586 B CN 102645586B CN 201110153757 A CN201110153757 A CN 201110153757A CN 102645586 B CN102645586 B CN 102645586B
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- 239000011521 glass Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000012360 testing method Methods 0.000 claims abstract description 135
- 238000005259 measurement Methods 0.000 claims abstract description 51
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CN201110153757.0A CN102645586B (zh) | 2011-06-09 | 2011-06-09 | 玻璃基板、过孔电阻测量方法和金属线电阻的测量方法 |
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CN201110153757.0A CN102645586B (zh) | 2011-06-09 | 2011-06-09 | 玻璃基板、过孔电阻测量方法和金属线电阻的测量方法 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106018965B (zh) * | 2016-05-16 | 2018-11-23 | 云南瑞博检测技术股份有限公司 | 一种光学玻璃上制备的精密电阻的检测方法 |
CN106324349B (zh) * | 2016-08-25 | 2019-01-11 | 浪潮电子信息产业股份有限公司 | 一种耐电性能测试方法及系统 |
KR102416052B1 (ko) * | 2016-12-01 | 2022-07-04 | 니혼덴산리드가부시키가이샤 | 저항 측정 장치 및 저항 측정 방법 |
CN115096946B (zh) * | 2022-06-20 | 2024-08-09 | 南京固体器件有限公司 | 氧化铝htcc金属化方阻和过孔阻值的测试方法 |
Citations (6)
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---|---|---|---|---|
JP2003241216A (ja) * | 2002-02-14 | 2003-08-27 | Nec Kagoshima Ltd | 液晶表示装置 |
JP2004228220A (ja) * | 2003-01-21 | 2004-08-12 | Alps Electric Co Ltd | Ledホルダ及びそれを用いたled取付構造 |
CN1584608A (zh) * | 2003-08-19 | 2005-02-23 | 友达光电股份有限公司 | 测量玻璃基板与驱动ic导通率的方法与结构 |
CN1767163A (zh) * | 2004-10-25 | 2006-05-03 | 中芯国际集成电路制造(上海)有限公司 | 测试半导体器件内的通孔中的残留物的测试结构 |
CN101441339A (zh) * | 2008-12-18 | 2009-05-27 | 友达光电股份有限公司 | 液晶显示模块及其中电路板间接触阻抗的测量方法 |
CN101582424A (zh) * | 2009-06-11 | 2009-11-18 | 深圳莱宝高科技股份有限公司 | 一种顶栅结构薄膜晶体管及其制造方法 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003241216A (ja) * | 2002-02-14 | 2003-08-27 | Nec Kagoshima Ltd | 液晶表示装置 |
JP2004228220A (ja) * | 2003-01-21 | 2004-08-12 | Alps Electric Co Ltd | Ledホルダ及びそれを用いたled取付構造 |
CN1584608A (zh) * | 2003-08-19 | 2005-02-23 | 友达光电股份有限公司 | 测量玻璃基板与驱动ic导通率的方法与结构 |
CN1767163A (zh) * | 2004-10-25 | 2006-05-03 | 中芯国际集成电路制造(上海)有限公司 | 测试半导体器件内的通孔中的残留物的测试结构 |
CN101441339A (zh) * | 2008-12-18 | 2009-05-27 | 友达光电股份有限公司 | 液晶显示模块及其中电路板间接触阻抗的测量方法 |
CN101582424A (zh) * | 2009-06-11 | 2009-11-18 | 深圳莱宝高科技股份有限公司 | 一种顶栅结构薄膜晶体管及其制造方法 |
Non-Patent Citations (4)
Title |
---|
"双电测组合法测试半导体电阻率的研究";宿昌厚等;《半导体学报》;20030308;第24卷(第3期);第298-306页 * |
"常规四探针法和双位四探针法测量半导体薄片电阻率的比较与探讨";鲁效明;《计量技术》;19940428(第4期);第24-26页 * |
宿昌厚等."双电测组合法测试半导体电阻率的研究".《半导体学报》.2003,第24卷(第3期),第298-306页. |
鲁效明."常规四探针法和双位四探针法测量半导体薄片电阻率的比较与探讨".《计量技术》.1994,(第4期),第24-26页. |
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